CN100581338C - Electronics Mounting Device - Google Patents

Abstract

An electronic device mounting device. Through the first optical system (5b, 5a), the images of the devices (9A, 9B) sucked by the suction nozzles (6A, 6B) are introduced into the field of view of the recognition camera (7), and the images are carried out by the camera under the most suitable lighting conditions. shoot. Through the second optical system (5d, 5c, 5a), the image of the device (9C, 9D) sucked by the suction nozzle (6C, 6D) is introduced into the field of view of the recognition camera, and the camera takes pictures under the most suitable lighting conditions . By sequentially acquiring and processing images of the devices captured by the respective optical systems, variations in adsorption of the devices are recognized. Since the photographing can be sequentially performed the number of times corresponding to the number of devices, and the photographing can be performed under the lighting conditions most suitable for each device, it is possible to perform photographing under the optimum conditions in a short time. Therefore, efficient and high-precision photographing and identification as well as correct installation of multiple electronic devices can be performed.

Description

Electronics Mounting Device

technical field

The invention relates to an electronic device mounting device, in particular to a multi-nozzle type electronic device mounting device with a plurality of suction nozzles on a mounting head.

Background technique

This electronic device mounting device uses a camera to identify the electronic device sucked by the suction nozzle, and detects the deviation of the suction position of the electronic device (the position deviation between the center position of the suction nozzle and the center position of the device being sucked) and the suction position of the electronic device. Angle deviation (inclination) is corrected for each of these adsorption deviations, and the electronic device is mounted on a predetermined position on the substrate. In such a conventional multi-nozzle type electronic component mounting apparatus, there are structures described in, for example, the following Patent Documents 1 to 5 for imaging and identification of electronic components.

[Patent Document 1]

JP-A-4-74497 (Claim 1)

[Patent Document 2]

Japanese Patent Laid-Open Publication No. 3-74497

[Patent Document 3]

Japanese Patent Application Laid-Open No. 7-307598 (Claim 1, paragraphs 6 and 11)

[Patent Document 4]

Japanese Patent Laid-Open Publication No. 6-196546 (Claim 1)

[Patent Document 5]

JP-A-62-179602 Bulletin (Figure 2, Figure 3, Figure 4)

The invention of Patent Document 1 is to provide a recognition device that recognizes the positional deviation of the device relative to the suction nozzle based on the photographed images taken by the camera at the same time of a plurality of devices adsorbed to the plurality of suction nozzles. Because this method is to shoot multiple devices at the same time, although the devices with different lighting conditions recognized by the devices are picked up at one time, since only one lighting condition can be used for lighting, it cannot be carried out under the most suitable lighting conditions. Recognition will lead to the occurrence of recognition errors. Therefore, the following problems exist: devices with different lighting conditions cannot be adsorbed and identified at one time, and cannot be mounted in an optimal mounting sequence, which reduces the production efficiency of the substrate.

In the configuration described in Patent Document 2, one component recognition CCD camera is provided for each component mounting head. In this case, if the number of mounting heads is large, it is necessary to install as many cameras as the number of mounting heads. Therefore, there is a disadvantage in that the size of the mounting head is large, and it is necessary to make the moving shaft of the mounting head have a longer stroke, resulting in an increase in the size of the device. Moreover, since a plurality of CCD cameras are set, it is necessary to identify the positional relationship between each mounting head and each CCD camera installed on each mounting head, and must also have device correction parameters as correction values. Each of the CCD cameras acquires and manages the correction parameters. In addition, there is also a problem of an increase in device cost due to the installation of a plurality of CCD cameras.

The device described in Patent Document 3 uses a camera to simultaneously recognize a plurality of devices adsorbed on the suction nozzle, but in this method, the devices are photographed outside the center of the field of view of the camera. The problem with this method is that in the periphery of the field of view, distortion such as straight lines changing into curves occurs due to lens distortion or the like, and the brightness of the periphery is darker than that of the center, so accurate recognition cannot be performed. In addition, in order to capture all the devices adsorbed on the nozzle, it is necessary to have a large field of view. However, the pixels of the CCD camera are limited. If the field of view is increased, the resolution will decrease, especially for small When identifying a device with a small size, the problem of decreased accuracy due to poor resolution will occur.

The structure of Patent Document 4 is that a device holding head having a plurality of device holders holding electronic devices is provided; A line sensor that shoots electronic devices in a line with multiple light-receiving elements. Moreover, during a relative movement of the linear sensor and the device holding head, the imaging data obtained by the linear sensor for each unit of relative movement distance are collected to obtain a two-dimensional image of the entire electronic device data. However, the problem with this method is that since the device is recognized while moving the device, when the moving speed is uneven, the distance and size of the image in the direction of device movement will be inconsistent, resulting in inability to perform correct determination. In order to prevent this phenomenon, it is necessary to input the code signal of the axis that moves the device, detect the unevenness of the speed based on the code signal, use it as a correction value, and use this value to correct the acquired image, so there is a Problems that complicate the structure and software and increase the cost.

In addition, Patent Document 5 is a method of recognizing a device with multiple fields of view, that is, recognizing each part of the device with a different field of view. However, this method cannot complete the identification at one time when identifying multiple devices, so there is a problem that it takes time to identify all the devices.

Contents of the invention

Therefore, the present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component mounting apparatus capable of efficiently and accurately imaging and recognizing a plurality of electronic components, and enabling accurate mounting of the components.

In order to solve the above-mentioned problems, the electronic device mounting device proposed by the present invention is used to photograph and identify the electronic devices adsorbed by a plurality of suction nozzles, and install each electronic device on the circuit board. In the same field of view, multiple electronic devices absorbed by the suction nozzle are photographed; the switching unit controls the field of view of the photographing device to switch multiple optical components; the control unit controls the photographing device to make it Sequentially photographing each electronic device of each electronic device within the same field of view of the photographing device; and an identification unit that sequentially acquires images of the photographed electronic devices and performs processing to identify each electronic device Adsorption deviation relative to the nozzle.

In addition, the present invention also adopts the following structure, namely:

The switching unit has a first optical system for introducing images of a plurality of electronic devices absorbed by the suction nozzle into the field of view of the photographing device, and a first optical system for introducing images of other electronic devices absorbed by the suction nozzle into the imaging device. a second optical system within the field of view of the device, and capable of switching between the first and second optical systems,

The control unit controls the photographing device so that it sequentially photographs each electronic device introduced into the photographing device through the first optical system, and then continuously captures the electronic devices introduced into the photographing device through the second optical system. The various electronic devices in the film are shot sequentially,

The identification unit may also sequentially obtain images of the electronic components captured by the first and second optical systems, and perform image processing to identify deviations in the adsorption of the electronic components relative to the suction nozzle.

And, the present invention also adopts following structure, namely:

The switching unit has a first optical system for introducing the image of the electronic device sucked by the suction nozzle into the field of view of the shooting device, and leading the images of other electronic devices sucked by the suction nozzle into the field of view of the shooting device. The second optical system within the range, and can switch between the first and second optical systems,

The control unit controls the photographing device so that the electronic device introduced into the photographing device is photographed under the most suitable photographing conditions for the electronic device through the first optical system, and then the electronic device is captured through the second optical system. The electronic device that is continuously introduced into the shooting device is taken under the shooting conditions most suitable for the electronic device,

The identifying unit may also sequentially obtain images of the electronic components captured by the first and second optical systems, and perform image processing to identify deviations in the adsorption of each electronic component relative to the suction nozzle.

Since any structure can sequentially perform shootings corresponding to the number of devices picked up by multiple suction nozzles, and can shoot with the lighting conditions most suitable for each device at that time, it is possible to accurately and optimally capture images in a short period of time. Each device is photographed under the best conditions, so that the recognition accuracy of each device can be improved.

Description of drawings

FIG. 1 is a perspective view showing an overall schematic configuration of an electronic component mounting device according to the present invention.

2 is a perspective view showing a mounting head of the electronic component mounting apparatus and a configuration for recognizing components.

Fig. 3 is an explanatory view showing a state of recognizing components picked up by a plurality of suction nozzles.

Fig. 4 is a block diagram showing the configuration of a control system of the component mounting apparatus.

Fig. 5 is a flow chart showing the flow of device identification.

FIG. 6 is an explanatory diagram showing the imaging timing of the device and the transmission timing of the image.

FIG. 7 is an explanatory diagram showing a state of recognizing a large device.

Fig. 8 is a perspective view showing the configuration of a suction nozzle and an identification device of another embodiment.

FIG. 9 is a perspective view illustrating a state when device recognition is performed using the optical system of FIG. 8 .

FIG. 10 is a layout diagram of an optical system showing the internal structure of the optical unit of FIG. 8 .

In the figure: 1-mounting head; 2-X-axis moving beam; 3-Y-axis moving beam; 4-electronic device supply device; 6A～6D-suction nozzle; 9A～9D-device; 20-controller; 21-X Axis motor; 22-Y-axis motor; 23-Z-axis motor; 24-θ-axis motor; 26-vacuum mechanism; 27-image recognition device.

Detailed ways

Hereinafter, referring to the drawings, the present invention will be described in detail in combination with the embodiments shown in the drawings.

[Example 1]

Fig. 1 shows a schematic structure of a multi-nozzle type electronic component mounting apparatus according to Embodiment 1 of the present invention. 1 is a mounting head, which has a plurality of suction nozzles for sucking and holding individual electronic components (hereinafter referred to as devices) as described later, and an imaging device for taking pictures in order to identify components sucked by the suction nozzles. The photographing device is composed of a recognition camera, which is fixedly arranged on the base of the installation device below the optical assembly 5 in FIG. 1 , and is not shown in FIG. 1 .

The mounting head 1 is provided so as to be able to slide on the X-axis moving beam 2 and to be able to move along the X-axis direction on the X-axis moving beam 2 by the drive of the X-axis moving mechanism. The X-axis moving beam 2 is movably arranged on two Y-axis moving beams 3 arranged in parallel. Driven by the Y-axis moving mechanism, it can move along the Y-axis moving beam 3 in the Y-axis direction, thereby making the installation The head 1 is movable in the Y-axis direction. In addition, in the electronic component mounting apparatus, an electronic component supply device 4 that supplies components to be mounted to a circuit board (hereinafter referred to simply as a substrate) 16 is provided.

2 shows a plurality of (four) suction nozzles 6A to 6D arranged at equal intervals on the mounting head 1 and an optical unit 5 for introducing images of components sucked on the respective suction nozzles into a recognition camera (camera) 7 . The identification camera 7 is composed of an interlaced camera having a photographing lens, and the optical unit 5 includes optical elements such as a mirror, a half mirror, and an illumination light source, as will be described in detail below.

FIG. 3 shows the detailed structure of the optical unit 5. In the optical unit 5, image acquisition parts 5A and 5B having openings are formed corresponding to the arrangement intervals of the suction nozzles 6A to 6D. A non-polarized half mirror 5a is arranged on the optical axis of the identification camera 7 to divide the photographing optical path into the vertical upward direction and the horizontal left direction.

The optical path branched in the horizontal left direction is bent vertically upward by the reflection mirror 5b provided on the optical path. On the upper part of the optical unit 5 above the reflecting mirror 5b, a left side illuminator 5C composed of a light source for illuminating the device 9A and the device 9B is provided. The devices 9A, 9B sucked by the left suction nozzle 6A and suction nozzle 6B of the mounting head 1 face the opening 5A of the optical assembly 5, and are illuminated by the lighting device 5C, so that the images of the two devices 9A, 9B pass through the mirror 5b, The non-polarizing half mirror 5 a is introduced into the identification camera 7 so that the two devices 9A and 9B can be received in the field of view of the identification camera 7 and photographed by the identification camera 7 . The first optical system is constituted by the illuminating device 5C, the image acquisition unit 5A, the mirror 5b, and the half mirror 5a.

Also, the optical path branched vertically upward by the non-polarizing half mirror 5a is bent horizontally to the right by the mirror 5c provided on the optical path, and bent vertically upward by the mirror 5d. On the upper part of the optical assembly 5 above the reflecting mirror 5d, a right side lighting device 5D composed of light sources of the lighting devices 9C, 9D is provided to illuminate the devices 9C, 9C, 9D. The images of the two devices 9C, 9D are introduced into the recognition camera 7 through the mirrors 5d, 5c and the non-polarized half mirror 5a, so that the two devices 9C, 9D can be received in the field of view of the recognition camera 7, and the recognition camera 7 shots. The second optical system is constituted by the illuminating device 5D, the image acquisition unit 5B, the mirrors 5d and 5c, and the half mirror 5a.

In addition, the optical path lengths from the respective devices 9A to 9D to the recognition camera 7 are set to be equal, so that when one device forms an image, the other devices can also form a clear image.

FIG. 4 shows the structure of the control system of the electronic component mounting apparatus. 20 denotes a controller composed of a microprocessor (CPU), RAM, ROM, etc., which control the entire device, and is connected to the following mechanisms 21 to 31 to control them.

The X-axis motor 21 is a drive source of the X-axis moving mechanism of the mounting head 1 , and moves the mounting head 1 in the X-axis direction on the X-axis moving beam 2 . In addition, the Y-axis motor 22 is a drive source of the Y-axis moving mechanism of the mounting head 1 , and moves the X-axis moving beam 2 in the Y-axis direction on the Y-axis moving beam 3 . This enables the mounting head 1 to move in the X-axis direction and the Y-axis direction.

The Z-axis motor 23 is a drive source of the Z-axis elevating mechanism for elevating the suction nozzle, and elevates the suction nozzle in the Z-axis direction. In addition, the θ-axis motor 24 is a drive source of the θ-axis rotation mechanism of the suction nozzle, and rotates the suction nozzle around the suction nozzle central axis. In addition, in FIG. 4 , although only one is shown in the figure for the Z-axis motor 23 and theta-axis motor 24, a plurality (in the example of FIG. 4), in Fig. 4, only one suction nozzle (6A) and the device (9A) sucked by it are illustrated.

The illumination control circuit 25 is used to control the on/off of each illumination light source and the amount of light emitted by the illumination devices 5C, 5D of the optical assembly 5 .

The vacuum mechanism 26 is used to generate a vacuum, and a vacuum negative pressure is supplied to each of the suction nozzles 6A to 6D of the mounting head 1 through a vacuum switch (not shown).

The image recognition device (recognition unit) 27 recognizes the images of the devices 9A to 9D captured by the recognition camera 7 picked up by the suction nozzle, and is composed of an A/D converter 27a, a memory 27b, and a CPU 27c. The image recognition device 27 sequentially acquires image signals of each device captured by the recognition camera through the signal line 27d, converts each image signal into a digital signal through the A/D converter 27a, and stores it in a predetermined area of the memory 27b. The CPU 27c calculates the adsorption position deviation and angular deviation of each device to be adsorbed based on the image data of each device acquired sequentially, and recognizes the adsorption deviation of the device with respect to the suction nozzle. As will be described later, the identification camera 7 is sequentially controlled so that under the control of the CPU 27c (control unit) through the signal line 27e, the devices within the field of view of the identification camera 7 are photographed sequentially in the order shown in FIG. 5 .

The keyboard 28 and the mouse 29 are used to input data such as device data.

The storage device 30 is composed of a flash memory, a hard disk, and the like, and stores device data input through the keyboard 28 and mouse 29 or device data supplied from a host computer (not shown).

The monitor (display device) 31 is used to display device data, calculation data, device images captured by the recognition camera 7, and the like.

In addition, FIG. 4 is a diagram showing the configuration of the control system, and the arrangement of each part does not necessarily match the actual structure. For example, only one of the suction nozzle and the device is shown.

Next, the operation of the device having the above-mentioned structure from suction of the device, image recognition, and placement on the substrate will be described. The following actions are performed under the control of the controller 20 .

First, by driving the X-axis motor 21 and the Y-axis motor 22 , the mounting head 1 is moved in the X-axis direction and the Y-axis direction until it reaches a predetermined component supply position on the electronic component supply device 4 . Then, by operating the Z-axis motor 23 , the suction nozzle 6A of the mounting head 1 is lowered onto the component 9A on the electronic component supply device 4 , and is sucked and held by the negative pressure provided by the vacuum mechanism 26 .

Then, the mounting head 1 is moved to the next component suction position, and the suction nozzle 6B is similarly lowered to pick up the component 9B. Then, suction nozzles 6C, 6D are made to suck devices 9C, 9D in the same manner. In this way, the devices 9A, 9B, 9C, and 9D are sucked to all the suction nozzles 6A, 6B, 6C, and 6D arranged on the mounting head 1 .

Then, by driving the X-axis motor 21 and the Y-axis motor 22, the mounting head 1 is moved as shown in FIG. , and then start a series of device identification actions as shown in FIG. 5 .

First, control the left lighting device 5C located on the lower side of the devices 9A, 9B through the lighting control circuit 25 to achieve the best shooting conditions suitable for the device 9A, that is, turn on the light source for the device 9A and control its light quantity to achieve the best shooting conditions. Lighting conditions (step S1). The image of the device 9A illuminated under this lighting condition is reflected by the reflector 5b, then reflected by the non-polarized reflector 5a, and introduced into the recognition camera 7, which takes it as a first image (step S2). Under the control of the CPU 27c, the following imaging operations are performed in the imaging sequence shown in FIG. 6 .

As shown in FIG. 6, since the identification camera 7 uses an interlaced scanning camera, the images of the odd-numbered base lines and the even-numbered lines of the device 9A are respectively obtained every 16.5 msec. In order to obtain all the pixels of the device 9A, 33 msec of shooting is required. time. The images of the odd and even lines of the device 9A are transmitted to the image recognition device 27 with a delay of 16.5 msec. Therefore, the transmission time of all pixels in the odd and even lines requires a transmission time of 33 msec.

Thus, the image of the device 9A is transmitted to the image recognition device 27, and stored in the memory 27b after being converted into a digital signal. The CPU 27c takes out the image of the device 9A and its peripheral portion stored in the memory 27b, and by processing the image, calculates the adsorption deviation (position deviation and angle deviation) of the device 9A relative to the suction nozzle 6A (step A3). Its offset value is stored in the RAM of the controller 20 .

In addition, in the time chart of FIG. 6, in the lighting switching time (10 msec) after the shooting time of the device 9A has elapsed and the shooting of the device 9A is completed, the lighting source for the device 9A is turned off by the lighting control circuit 25 (step S4 ), simultaneously turn on the lighting source for the device 9B and control its light quantity (step S11), and adjust the lighting to the best lighting condition suitable for the device 9B. Then, the image of the device 9B illuminated under the lighting condition is captured by the recognition camera 7 as a second image in the same manner as above (step S12). The shooting time of this device 9B and its image transfer time are the same as those of the device 9A, and the respective times are illustrated on the right side of FIG. 6 . Thus, the time required to sequentially photograph the devices 9A, 9B located in the same field of view of the recognition camera 7 is 33msec+33msec+16.5msec=82.5msec.

In addition, the image of the device 9B is sent to the image recognition device 27 and stored in the memory 27b, and then the image of the device 9B and its peripheral portion is taken out, and the image is subjected to image processing, similar to the device 9A, to calculate The adsorption deviation of the device 9B relative to the suction nozzle 6B (step S13 ), and store the deviation value in the RAM of the controller 20 .

Then, turn off the lighting source for the device 9B (step S14), and then control the right side lighting device 5D, turn on the lighting source for the device 9C and control the amount of light to obtain the best lighting conditions suitable for the device 9C (step S21). The image of the device 9C illuminated under this condition is reflected by the mirrors 5d and 5c, passed through the non-polarizing half mirror 5a, and guided to the recognition camera 7, and is photographed by the camera as a third image (step S22). The image recognition device 27 similarly obtains the third image, performs image processing on the image of the device 9C and its peripheral portion, calculates the adsorption deviation of the device 9C relative to the suction nozzle 6C (step S23), and stores the deviation value in the RAM of the controller 20 .

Then, turn off the illuminating light source for device 9C (step S24), and at the same time turn on the illuminating light source for device 9D and control the amount of light to obtain the best lighting conditions for device 9D (step S31). The image of the device 9D is photographed by the camera as a fourth image (step S32). The image recognition device 27 obtains the fourth image, performs image processing on the image of the device 9D and its peripheral portion, calculates the adsorption deviation of the device 9D relative to the suction nozzle 6D (step S33 ), and stores the deviation value in the RAM of the controller 20 . In step S34, the illuminating light source for the device 9D is turned off, and the identification of each of the devices 9A to 9D is thus completed.

In addition, the shooting timing, image transmission timing and its shooting time, transmission time, and lighting switching time of the devices 9C, 9D are the same as those for the devices 9A, 9B shown in FIG. Control the above time.

When imaging of each device is completed, the mounting head 1 is moved toward the substrate 16 by driving the X-axis motor 21 and the Y-axis motor 22 . During this movement, by driving the θ-axis motor 24 to rotate the suction nozzles 6A to 6D along the θ-axis, the angular deviation among the adsorption deviations is corrected. Then, the position deviation of each device is corrected at the mounting position of each device, and then each device is mounted on the substrate 16 . After each component is mounted, the mounting head 1 moves to the electronic component supply device 4 again, picks up the component with each suction nozzle 6A-6D, and then repeats the above-mentioned operation to mount each component on the substrate.

FIG. 7 shows an example of a case where large-sized devices 50A, 50C larger than the device 9A etc. are recognized. In the case of sucking large devices 50A and 50C, the suction nozzles 6B and 6D are raised, the devices 50A and 50C are sucked by the suction nozzles 6A and 6C, and the mounting head 1 is moved to the position of the recognition camera 7 so that the suction nozzles 6A and 6C The axis and the shooting optical axis of the identification camera 7 reach substantially the same.

Firstly, the lighting control circuit 25 controls the left side lighting device 5C to turn on the lighting source for the device 50A and control its light intensity to obtain the best lighting conditions most suitable for the device 50A. The image of the device 50A illuminated under this lighting condition is reflected by the mirror 5b, and then reflected by the non-polarized half mirror 5a, and then introduced into the recognition camera 7, and the image is captured by the camera as the first image. The photographed image of the device 50A is input to the image processing device 27 , image processing is performed, and the suction deviation of the device 50A relative to the suction nozzle 6A is calculated, and the deviation value is stored in the RAM of the controller 20 .

Then, turn off the lighting source for the device 50A, control the right side lighting device 5D, turn on the lighting source for the device 50C and control the amount of light to obtain the best lighting conditions most suitable for the device 50C. The image of the device 50C illuminated under this lighting condition is reflected by the mirrors 5d and 5c, passes through the non-polarizing half mirror 5a, and is introduced into the recognition camera 7, where the image is captured by the camera as the second image. Similarly, the captured image of the device 50C is input to the image processing device 27 , image processing is performed to calculate the adsorption deviation of the device 50C relative to the suction nozzle 6C, and the deviation value is stored in the RAM of the controller 20 .

In this way, after the device recognition is completed, the correction of the adsorption deviation and the mounting process on the substrate are the same as the above-mentioned process.

In addition, in the above-mentioned embodiment, the left side lighting device 5C and the right side lighting device 5D respectively arrange a plurality of light sources in a ring shape, and have components such as a diffuser plate and a lighting plate, and the lighting control circuit 25 controls the opening of each light source. And the adjustment of the amount of light, as well as the closing of each light source, to obtain the best shooting conditions for each device, that is, the lighting conditions such as the amount of light. Through input devices (setting devices) such as the keyboard 28 and the mouse 29, the lighting conditions for each device are respectively set. When shooting, reflective lighting, transmission lighting, and The lighting mode such as side lighting, the color of the lighting light, or the brightness of the lighting realize optimal lighting suitable for each of the devices 9A to 9D (or 50A, 50C).

In addition, in the above-mentioned embodiment, although the non-polarizing half mirror 5a is used, a red reflective dichroic mirror whose designed incident angle is 45° may also be used. In this case, the lighting control circuit 25 adopts red as the lighting color of the left side lighting device 5C and blue as the lighting color of the right side lighting device 5D. And when the device located in the left field of view is imaged, the left side illuminating device 5C is made to illuminate red. The image of the device illuminated with red is reflected by the mirror 5b, and enters the dichroic mirror. Since the dichroic mirror reflects the light of the red component, the light is reflected so that the device is captured by the recognition camera 7 as a red image. When photographing a device located in the right field of vision, the right side lighting device 5D is made to perform blue lighting. The image of the device illuminated by the blue illumination light is reflected by the mirrors 5d and 5c, and enters the dichroic mirror. Since the dichroic mirror transmits light of the blue component, the device is captured by the recognition camera 7 as a blue image.

In addition, in the above-mentioned embodiments, although one lighting device (5C, 5D) is provided for each field of view (SA, 5B), a mobile structure in which one lighting device can move between the fields of view may also be adopted. , move to the position of the field of view for recognition during recognition, and turn on the lighting sources for each device.

In each of the embodiments described above, when performing recognition of each component, multiple shots corresponding to the number of components can be sequentially performed without moving the mounting head. In this case, by switching the shooting screen for each device, it is possible to shoot with different screens, and since the shooting conditions (illumination conditions) for each device can be set to the optimum conditions most suitable for the device, Each device can be photographed under correct and optimal conditions in a short time, thereby improving the recognition accuracy of each device.

[Example 2]

8 to 10 show Embodiment 2 of the present invention. In the present embodiment 2, the difference from the embodiment 1 is that the optical assembly 40 constituted can guide all the devices sucked by the respective suction nozzles 6A-6D of the mounting head 1 into the field of view of the recognition camera 7, Since the other structures are the same as those of the first embodiment, description thereof will be omitted.

In the optical unit 40, there is formed an identification window 40A for photographing each device sucked by the left two suction nozzles 6A, 6B, and a recognition window 40A is formed for photographing each device sucked by the left two suction nozzles 6C, 6D. The identification window 40B where each device is photographed.

As shown in FIGS. 9 and 10 , inside the optical unit 40 , a reflection mirror 40 a is disposed below the identification window 40A. Then, the reflection mirror 40 a bends the optical path at 90 degrees, and the reflection mirror 40 b bends the optical path at 90 degrees again, and then guides the optical path into the upper field of view 7A of the recognition camera 7 . As a result, images of devices 9A and 9B sucked by suction nozzles 6A and 6B are introduced into field of view 7A of recognition camera 7 and can be photographed by recognition camera 7 .

In addition, a reflecting mirror 40c is arranged below the identification window 40B to bend the optical path by 90 degrees, and then the optical path is bent by 90 degrees by the reflecting mirror 40d, and the reflecting mirrors 40e to 40h are used (due to the complexity, they are indicated by dotted lines in FIG. 9 ). Frames) are sequentially bent by 90 degrees and introduced into the lower field of view 7B of the recognition camera 7 . As a result, images of devices 9C and 9D picked up by suction nozzles 6C and 6D are introduced into field of view 7B of recognition camera 7 and can be photographed by recognition camera 7 . Also, the optical path length for identifying devices 9A, 9B picked up by left suction nozzles 6A, 6B and the optical path length for recognizing devices 9C, 9D picked up by right suction nozzles 6C, 6D are set to be the same.

With such a configuration, by dividing the elongated recognition range of the suction nozzles 6A to 6D arranged in a straight line and overlapping them vertically, it is possible to capture them within the single field of view of the recognition camera 7 .

Recognition of each device sucked by each suction nozzle 6A to 6D is the same as that of Embodiment 1. When recognizing each device, the photographing screen is changed in order of the number of times corresponding to the number of devices and photographed. In this case, since the imaging conditions (illumination conditions) for each device can be set to the optimum conditions most suitable for the device, similar to Example 1, it is possible to use correct and optimal conditions in a short time. Each device is photographed, thereby improving the recognition accuracy of each device.

In addition, in Embodiment 1 and Embodiment 2, although the lighting conditions are switched for each device, it is also possible to keep the lighting conditions constant without switching the lighting conditions. The number of shots corresponding to the number of devices is used to identify the device. In this case, since there is no lighting switching time, the installation time can be shortened compared with the case where lighting switching is required.

As described above, according to the present invention, when each device is recognized, it is not necessary to move each suction nozzle to take pictures corresponding to the number of suction devices. In this case, it is possible to switch the shooting screen for each device to Take different pictures. In addition, since imaging conditions can be set for each device to the optimum conditions most suitable for the device, imaging can be performed under correct and optimal conditions in a short time, and the recognition accuracy for each device can be improved.

In addition, in the present invention, since the suction nozzle does not need to be moved when identifying each device, there will be no positional deviation due to the movement and no increase in operation tact due to the movement. In addition, according to the present invention, since one device can be imaged within one field of view by changing the position of the device on the recognition camera, it is possible to recognize a plurality of large devices with high precision.

Claims (6)

1. An electronic device mounting device, which photographs and identifies electronic devices adsorbed by a plurality of suction nozzles, and installs each electronic device on a circuit substrate, characterized in that it has: A photographing device capable of photographing multiple electronic devices absorbed by the suction nozzle in the same field of view; The mounting head (1) is equipped with the plurality of suction nozzles (6-6D), wherein the mounting head is used to move the plurality of electronic components absorbed by the plurality of suction nozzles into the same field of view of the photographing device ; The optical assembly (5) includes a first image acquisition part (5A) and a second image acquisition part (5B), and the first image acquisition part (5A) and the second image acquisition part (5B) are formed with openings to communicate with the Corresponding to the above-mentioned multiple suction nozzles; a switching unit, by controlling the optical system, switching the first image acquisition part and the second image acquisition part of the optical assembly for the field of view of the photographing device; a control unit, controlling the photographing device so that it sequentially photographs each electronic device within the same field of view of the photographing device; and The identification unit sequentially acquires the images of the electronic components that are photographed, and recognizes the adsorption deviation of each electronic component relative to the suction nozzle by performing processing, Wherein, when identifying each electronic component, the mounting head does not need to be moved, and the photographing device sequentially performs multiple photographs corresponding to the number of components. 2. The electronic device mounting device according to claim 1, wherein: The switching unit has a first optical system that guides the images of the multiple electronic devices that are sucked by the suction nozzle into the field of view of the shooting device through the first image acquisition unit; and other multiple electronic devices that are sucked by the suction nozzle The image is introduced into the second optical system within the field of view of the shooting device through the second image acquisition unit, and the switching between the first and second optical systems can be performed, The control unit controls the photographing device so that it sequentially photographs each electronic device introduced into the photographing device through the first optical system, and then continuously captures the electronic devices introduced into the photographing device through the second optical system. The various electronic devices in the film are shot sequentially, The recognition unit sequentially obtains the images of the electronic components captured by the first and second optical systems, performs image processing, and recognizes the adsorption deviation of each electronic component relative to the suction nozzle. 3. The electronic device mounting device according to claim 2, wherein the second optical system guides the images of other multiple electronic devices into the same field of view of the shooting device and the electrons introduced by the first optical system. The view position of the device is different from the view position. 4. The electronic device mounting device according to any one of claims 1 to 3, wherein a setting unit for setting shooting conditions for each electronic device is set, and when each electronic device is photographed, each electronic device is The imaging conditions are set for each device, and imaging is performed for each electronic device under the imaging conditions set for the electronic device. 5. The electronic device mounting device according to claim 1, wherein: The switching unit has a first optical system for introducing the image of the electronic device picked up by the suction nozzle into the field of view of the shooting device through the first image acquisition unit, and a first optical system for passing the image of other electronic devices picked up by the suction nozzle. The second image acquisition unit introduces a second optical system within the field of view of the imaging device, and is capable of switching between the first and second optical systems, The control unit controls the photographing device to photograph the electronic device introduced into the photographing device under conditions most suitable for the electronic device through the first optical system, and then photographs the electronic device introduced into the photographing device through the second optical system. Continue to import the electronic device in the shooting device to shoot under the conditions most suitable for the electronic device, The recognition unit sequentially obtains the images of the electronic components captured by the first and second optical systems, performs image processing, and recognizes the adsorption deviation of each electronic component relative to the suction nozzle. 6. The electronic device mounting device according to claim 1, further comprising: A θ-axis motor that rotates the suction nozzle around the central axis of the suction nozzle, and corrects angular deviation in suction deviation by driving the θ-axis motor to rotate the suction nozzle.

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