CN100573820C - Substrate board treatment - Google Patents

Abstract

The invention provides a kind of substrate board treatment that substrate is handled.This substrate board treatment is by mutually side by side and the protractor district, first treatment region and second treatment region that are provided with constitute.Be provided with the protractor manipulator in the protractor district.Be provided with a plurality of back sides cleaning unit and first master manipulator at first treatment region.Be provided with a plurality of end face cleaning units, a plurality of surface clean unit and second master manipulator at second treatment region.

Description

Substrate processing equipment

technical field

The invention relates to a substrate processing device for processing a substrate.

Background technique

Conventionally, substrate processing equipment has been used for various processing of substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal display devices, and substrates for optical disks.

For example, JP-A-2004-146708 describes a substrate processing apparatus including an inversion unit that inverts the front and back surfaces of a substrate. In such a substrate processing apparatus, a central robot (transfer unit) for transferring a substrate is disposed substantially in the center of a rectangular processing unit.

In the processing section, a plurality of (for example, four) backside cleaning units for cleaning the backside of the substrate are arranged so as to surround the central robot. Furthermore, in the processing unit, a reversing unit is arranged at a position accessible by the central robot.

An indexer unit including a plurality of storage containers for storing substrates is provided on one end side of the processing unit. The indexer unit is provided with a substrate transfer robot that takes out the unprocessed substrate from the storage container or stores the processed substrate in the storage container.

In the above structure, the substrate transfer robot takes out the unprocessed substrate from any storage container and transfers it to the central robot, and receives the processed substrate from the central robot and stores it in the storage container.

When the central robot receives the unprocessed substrate from the substrate transfer robot, it transfers the received substrate to the inverting unit. The flip unit flips the substrate received from the central robot so that the surface faces downward. Then, the central robot receives the substrate turned over by the turning unit, and carries the substrate into an arbitrary backside cleaning unit.

Next, if the processing in any of the above-mentioned backside cleaning units ends, the central robot unloads the substrate from the backside cleaning unit and transfers it to the inversion unit again. The inverting unit inverts the substrate processed in the backside cleaning unit so that the surface faces upward.

Then, the central robot receives the substrates flipped by the flipping unit and transfers them to the substrate handling robot. The substrate transfer robot stores the processed substrates received from the central robot in a storage container.

However, in the conventional substrate processing apparatus described above, since the number of substrate transfer steps is large, the operation of the central robot becomes complicated. In addition, in recent years, it is required to perform cleaning treatment also on the outer peripheral end surface of the substrate. If an end surface cleaning unit for cleaning the outer peripheral end surface of the substrate is further provided on the basis of the above structure, the operation of the central robot becomes more complicated. In this case, it is difficult to efficiently convey a plurality of substrates, and thus the throughput in substrate processing is significantly reduced.

In addition, there is a substrate processing apparatus including a surface processing unit for processing a substrate surface, a rear surface processing unit for processing a substrate back surface, and an inversion unit for inverting the substrate surface and the back surface. In such a substrate processing apparatus, a central robot for transferring substrates is arranged substantially in the center of the rectangular processing unit.

In the processing section, a surface processing unit and a rear surface processing unit are arranged so as to surround the central robot. Furthermore, in the processing unit, a reversing unit is arranged at a position accessible by the central robot.

An indexer unit including a plurality of storage containers for storing substrates is provided on one end side of the processing unit. The indexer unit is provided with a substrate transfer robot that takes out the unprocessed substrate from the storage container or stores the processed substrate in the storage container.

In the above configuration, the substrate transfer robot takes out unprocessed substrates from any storage container and transfers them to the central robot, and receives the processed substrates from the central robot and stores them in the storage container.

When the central robot receives the unprocessed substrate from the substrate transfer robot, it carries the received substrate into the surface cleaning unit. When the processing in the surface cleaning unit is completed, the central robot unloads the substrate from the surface cleaning unit, and then transfers it to the inverting unit. The flip unit flips the substrate received from the central robot so that the surface faces downward. Then, the central robot receives the substrate flipped by the flip unit, and carries the substrate into the backside cleaning unit.

When the processing in the backside cleaning unit is completed, the central robot unloads the substrate from the backside cleaning unit and transfers it to the inverting unit again. The inverting unit inverts the substrate processed in the backside cleaning unit so that the surface faces upward.

Then, the central robot receives the substrates flipped by the flipping unit and transfers them to the substrate handling robot. The substrate transfer robot stores the processed substrates received from the central robot in a storage container.

In this way, the transfer of the substrate between the surface treatment unit, the back surface treatment unit, and the inversion unit is performed by one central robot. As a result, the number of substrate transfer steps increases, and the operation of the central robot becomes complicated. Therefore, it is difficult to efficiently transport a plurality of substrates, and thus the throughput in substrate processing decreases.

Contents of the invention

An object of the present invention is to provide a substrate processing apparatus capable of improving processing capacity.

The above object of the present invention can be achieved in the following ways.

(1) The present invention provides a substrate processing apparatus for processing a substrate having a front surface and a back surface, the substrate processing apparatus having: first and second processing regions arranged adjacent to each other and used for processing the substrate; The loading and unloading area, which carries and unloads substrates from the first processing area; the first delivery area, which is set between the loading and unloading area and the first processing area; the second delivery area, which is set between the first processing area and the second processing area; Between areas, wherein, the first processing area has: a first processing unit; a first transport device, which transports the substrate between the first transfer area, the first processing unit and the second transfer area, and the second processing area has: the first transfer device The second processing unit; the second transport device, which transports the substrate between the second transfer area and the second processing unit, and the loading and unloading area has: a container loading unit, which loads a storage container for storing the substrate; a third transporting device, which The substrate is conveyed between the storage container loaded on the container loading part and the first transfer area, and either one of the first and second processing parts has a back cleaning processing part for cleaning the back surface of the substrate, the first transfer area, the second At least one of the second transfer area and the area on the opposite side of the second transfer area in the second transport device has an inverting device for inverting the front and back of the substrate.

In this substrate processing apparatus, substrates are loaded and unloaded from the loading and unloading area to the first processing area, and the substrates are processed in the first processing area and the second processing area. In the first processing area, the substrate is transferred between the first transfer area, the first processing unit, and the second transfer area by the first transfer device. In the second processing area, the substrate is transferred between the second transfer area and the second processing unit by the second transfer device. In addition, in the loading and unloading area, the substrate is transported between the storage container mounted on the container loading unit and the first transfer area by the third transport device.

In at least one of the first handover area, the second handover area, and the area on the opposite side of the second handover area in the second transfer device, the substrate is turned over by an inverting device so that the back side faces upward, and the substrate is turned over in the first transfer device. And one of the second processing parts cleans the back surface of the substrate by the back cleaning processing part.

With such a configuration, in the first processing area and the second processing area, substrate transfer by the first transfer device and substrate transfer by the second transfer device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Accordingly, the substrate transfer time in the first processing area and the second processing area can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

(2) Either one of the first and second processing units may have an end surface cleaning treatment unit that cleans the outer peripheral end of the substrate while maintaining the back surface of the substrate, and the inverting device passes through the end surface. The front surface and the back surface of the substrate cleaned by the cleaning processing unit are turned over, and the back surface cleaning processing unit cleans the back surface of the substrate turned over by the turning device.

In this case, either one of the first and second processing units cleans the outer peripheral end portion of the substrate by the end surface cleaning processing unit while holding the back surface of the substrate. The substrate cleaned by the end surface cleaning processing unit is turned over by an inversion device in at least one of the first delivery area, the second delivery area, and the area on the opposite side to the second delivery area in the second transfer device. . In either one of the first and second processing units, the back surface of the substrate inverted by the inversion device is cleaned by the back cleaning processing unit.

In this way, after the outer peripheral end portion of the substrate is cleaned by the end surface cleaning treatment unit, the back surface of the substrate is cleaned by the back surface cleaning treatment unit. As a result, even if the back surface of the substrate is contaminated by holding the back surface of the substrate in the end surface cleaning treatment section, the contamination on the back surface of the substrate can be removed in the back surface cleaning treatment section. Accordingly, the substrate can be cleaned sufficiently and cleanly.

(3) The end surface cleaning unit may include a plurality of end surface cleaning units arranged in multiple layers, and the back cleaning unit may include a plurality of rear surface cleaning units arranged in multiple layers.

In this case, by arranging a plurality of end surface cleaning units and a plurality of back cleaning units in multiple layers, the occupied area can be reduced, and the outer peripheral ends of a plurality of substrates and the back surfaces of a plurality of substrates can be cleaned efficiently. Therefore, the throughput of the substrate processing apparatus can be further improved.

(4) Either one of the first and second processing units may include a surface cleaning treatment unit for cleaning the surface of the substrate.

In this case, in either one of the first and second processing units, the surface of the substrate is cleaned by the surface cleaning processing unit.

(5) The surface cleaning unit may include a plurality of surface cleaning units arranged in multiple layers.

In this case, by arranging a plurality of surface cleaning units in multiple layers, the occupied area can be reduced, and the surfaces of a plurality of substrates can be cleaned efficiently. Therefore, the throughput of the substrate processing apparatus can be further improved.

(6) It is also possible that the reversing device has first and second reversing devices, the first transfer area has a first substrate loading part and a first reversing device for loading substrates, and the second transfer area has a first substrate loading part for loading substrates. Two substrate loading parts and the second overturning device, the first processing part has a back cleaning processing part, the second processing part has an end face cleaning processing part and a surface cleaning processing part, and the first transport device is loaded on the first substrate loading part and the second substrate loading part. The substrate is transported between the first inversion unit, the second inversion unit, and the back cleaning unit, and the second transport unit is used to transport the substrate between the second substrate loading unit, the second inversion unit, the end face cleaning unit, and the surface cleaning unit. , the third transport device transports the substrate between the storage container, the first substrate loading unit, and the first inverting device.

In this case, the unprocessed substrate is taken out of the storage container by the third transfer device, and loaded on the first substrate loading unit. The substrate loaded on the first substrate loading unit is loaded on the second substrate loading unit by the first transfer device. The substrate loaded on the second substrate loading unit is carried into one of the end surface cleaning treatment unit and the surface cleaning treatment unit by the second transport device.

The substrate cleaned by one of the end surface cleaning unit and the surface cleaning unit is carried into the other of the end surface cleaning unit and the surface cleaning unit by the second transport device. The substrates cleaned by the surface cleaning unit and the end surface cleaning unit are carried into the second inverting unit by the second transfer unit. The substrate, which has been inverted by the second inversion device so that the back surface faces upward, is carried into the back surface cleaning processing unit by the first transfer device. The substrate cleaned by the backside cleaning processing unit is carried into the first inversion device by the first transfer device. The substrate, which has been turned over by the first turning device so that the surface faces upward, is returned to the storage container by the third transporting device.

With such a configuration, the substrate conveyance by the first conveyance device and the substrate conveyance by the second conveyance device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Accordingly, the transfer time of the substrate in the substrate processing apparatus can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

In addition, after cleaning the outer peripheral end of the substrate by the end surface cleaning processing part, the back surface of the substrate is cleaned by the back surface cleaning processing part, so that even if the back surface of the substrate is contaminated in the end surface cleaning processing part, the back surface contamination of the substrate can be eliminated. It is removed in the back cleaning processing part. Accordingly, the substrate can be cleaned sufficiently and cleanly.

In addition, in the second delivery area, the substrate can be transferred from the second transfer device to the first transfer device while the substrate is reversed by the second reversing device. In addition, in the first delivery area, the substrate can be transferred from the first transfer device to the third transfer device while the substrate is reversed by the first reversing device. Thereby, the conveyance time of a board|substrate can be shortened further, and the processing capacity in a board|substrate processing apparatus can be further improved.

(7) It is also possible that the first overturning device turns the substrate around the rotation axis, and the rotation axis intersects the connecting line between the position of the first transport device and the position of the third transport device when the substrate is handed over; and the second overturn The device inverts the substrate about an axis of rotation that intersects a line connecting the position of the first handling device and the position of the second handling device when delivering the substrate.

In this case, the first reversing device can transfer substrates between the first and third transfer devices without changing directions, and the second reversing device can transfer substrates between the first and third transfer devices without reversing directions. Hand over the substrate between the two handling devices. Therefore, the structure of the first and second inverting devices can be simplified, and at the same time, the cost can be reduced. In addition, since the first and second inverting devices do not need to switch directions, the throughput of the substrate processing apparatus is improved.

(8) It is also possible that the first transfer area has a first substrate loading part for loading substrates, the second transfer area has a second substrate loading part and a turning device for loading substrates, and the first processing part has a surface cleaning treatment part, the second processing part has an end face cleaning processing part and a back cleaning processing part, the first transport device transports the substrate between the first substrate loading part, the second substrate loading part, the turning device, and the surface cleaning processing part, and the second transporting device The device transports the substrate between the second substrate loading unit, the flipping device, the end cleaning treatment unit, and the back cleaning treatment unit, and the third transportation device transports the substrate between the storage container and the first substrate loading unit.

In this case, the unprocessed substrate is taken out of the storage container by the third transfer device, and loaded on the first substrate loading unit. The substrate loaded on the first substrate loading unit is loaded on the second substrate loading unit by the first transfer device. The substrate loaded on the second substrate loading unit is carried into the end surface cleaning treatment unit by the second transport device.

The substrate cleaned by the end surface cleaning processing unit is carried into the inversion device by the second transfer device. The substrate, which has been inverted by the inverting device so that the back surface faces upward, is carried into the back surface cleaning processing unit by the second transport device. The substrate cleaned by the backside cleaning processing unit is carried into the inversion device by the second transfer device. The substrate, which has been inverted by the inverting device so that the surface faces upward, is carried into the surface cleaning treatment section by the first transport device. The substrate cleaned by the surface cleaning treatment unit is loaded on the first substrate loading unit by the first transfer device. The substrate loaded on the first substrate loading unit is returned to the storage container by the third transfer device.

With such a configuration, the substrate conveyance by the first conveyance device and the substrate conveyance by the second conveyance device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Accordingly, the transfer time of the substrate in the substrate processing apparatus can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

In addition, after the outer peripheral end portion of the substrate is cleaned by the end surface cleaning treatment unit, the back surface of the substrate is cleaned by the back surface cleaning treatment unit. Accordingly, even if the back surface of the substrate is contaminated in the end face cleaning processing section, the contamination on the back surface of the substrate can be removed in the rear surface cleaning processing section. Accordingly, the substrate can be cleaned sufficiently and cleanly.

In addition, in the second delivery area, the substrate can be transferred from the second transfer device to the first transfer device while the substrate is reversed by the reversing device. Thereby, the conveyance time of a board|substrate can be shortened further, and the processing capacity in a board|substrate processing apparatus can be improved further.

In addition, in the above configuration, after the surface of the substrate is cleaned by the surface cleaning treatment unit, the end surface cleaning treatment unit and the back surface cleaning treatment unit may clean the outer peripheral end portion and the back surface of the substrate.

(9) The inverting device may invert the substrate around a rotation axis that intersects a line connecting the position of the first transport device and the position of the second transport device when delivering the substrate.

In this case, the inverting device can transfer the substrate between the first and second transfer devices without switching directions. Therefore, it is possible to achieve cost reduction while realizing simplification of the structure of the inverting device. In addition, since the inverting device does not have to switch directions, the processing capacity in the substrate processing apparatus is improved.

(10) The other of the first and second processing units may include a surface cleaning processing unit for cleaning the surface of the substrate.

In this case, in at least one of the first transfer area, the second transfer area, and the area opposite to the second transfer area in the second transfer device, the substrate is inverted by the inversion device so that its back faces upward. , and in one of the first and second processing units, the back surface of the substrate is cleaned by the back cleaning processing unit. The substrate cleaned by the backside cleaning unit is turned over again by the turning device so that its surface faces upward. In the other of the first and second processing units, the surface of the substrate is cleaned by the surface cleaning processing unit.

With such a configuration, in the first processing area and the second processing area, the substrate transfer by the first transfer device and the substrate transfer by the second transfer device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Accordingly, the substrate transfer time in the first processing area and the second processing area can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

(11) The back cleaning unit may include a plurality of rear cleaning units arranged in multiple layers, and the surface cleaning unit may include a plurality of surface cleaning units arranged in multiple layers.

In this case, by arranging a plurality of back cleaning units and a plurality of surface cleaning units in multiple layers, the occupied area can be reduced, and the back cleaning of a plurality of substrates and the surface cleaning of a plurality of substrates can be performed efficiently. Therefore, the throughput of the substrate processing apparatus can be further improved.

(12) It is also possible that the reversing device has first and second reversing devices, the first transfer area has a first substrate loading part and a first reversing device for loading substrates, and the second transfer area has a first substrate loading part for loading substrates. Two substrate loading parts and the second overturning device, the first processing part has a back cleaning processing part, the second processing part has a surface cleaning processing part, and the first conveying device is in the first substrate loading part, the second substrate loading part, the first turning over The substrate is transported between the device, the second inverting device, and the backside cleaning processing unit, the second transporting device is transporting the substrate between the second substrate loading unit, the second inverting device, and the surface cleaning process unit, and the third transporting device is loaded on the container The substrate is transported between the storage container of the first substrate loading unit and the first inverting device.

In this case, in the first processing area, the substrate is conveyed between the first substrate loading unit, the second substrate loading unit, the first inverting device, the second inverting device, and the backside cleaning processing unit by the first conveying device. In the second processing area, the substrate is transferred between the second substrate loading part, the second turning device and the surface cleaning processing part by the second transfer device. In the loading/unloading area, the substrate is conveyed between the storage container mounted on the container loading unit, the first substrate loading unit, and the first inverting device by the third transportation device.

With such a configuration, in the first processing area and the second processing area, the substrate transfer by the first transfer device and the substrate transfer by the second transfer device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Accordingly, the substrate transfer time in the first processing area and the second processing area can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

In addition, in the first delivery area, the substrate can be transferred between the first transfer device and the third transfer device while the substrate is reversed by the first reversing device. Furthermore, in the second delivery area, the substrate can be transferred between the first transfer device and the second transfer device while the substrate is reversed by the second reversing device. Thereby, the conveyance time of a board|substrate can be shortened further, and the processing capacity in a board|substrate processing apparatus can be improved further.

(13) It is also possible that the first overturning device turns the substrate around the rotation axis, and the rotation axis intersects the connecting line between the position of the first conveying device and the position of the third conveying device when the substrate is handed over; The device inverts the substrate about an axis of rotation that intersects a line connecting the position of the first handling device and the position of the second handling device when delivering the substrate.

In this case, the first inverting device can deliver substrates between the first and third transfer devices without changing directions, and the second inverting device can transfer substrates between the first and second transfer devices without changing directions. Transfers substrates between transfer devices. Therefore, it is possible to realize the simplification of the structure of the first and second inverting devices, and at the same time reduce the cost. In addition, since the first and second inverting devices do not need to switch directions, the throughput of the substrate processing apparatus is improved.

(14) It is also possible that the first transfer area has a first substrate loading part for loading substrates, the second transfer area has a turning device, the first processing part has a surface cleaning processing part, and the second processing part has a back cleaning processing part , the first transport device transports the substrate between the first substrate loading unit, the inversion device and the surface cleaning treatment unit, the second transport device transports the substrate between the inversion unit and the back cleaning treatment unit, and the third transport device loads the substrate in the container The substrate is conveyed between the storage container of the first substrate loading part and the first substrate loading part.

In this case, in the first processing area, the substrate is transferred between the first substrate loading unit, the inverting device, and the surface cleaning treatment unit by the first transfer device. In the second processing area, the substrate is transferred between the inverting device and the backside cleaning processing unit by the second transfer device. In the loading/unloading area, the substrate is conveyed between the storage container mounted on the container loading unit and the first substrate loading unit by the third transportation device.

With such a configuration, in the first processing area and the second processing area, the substrate transfer by the first transfer device and the substrate transfer by the second transfer device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Accordingly, the substrate transfer time in the first processing area and the second processing area can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

In addition, in the second delivery area, the substrate can be transferred between the first transfer device and the second transfer device while the substrate is reversed by the reversing device. Thereby, the conveyance time of a board|substrate can be shortened further, and the processing capacity in a board|substrate processing apparatus can be improved further.

(15) The inverting device may invert the substrate around a rotation axis that intersects a line connecting the position of the first transport device and the position of the second transport device when delivering the substrate.

In this case, the inverting device can transfer the substrate between the first and second transfer devices without switching directions. Therefore, it is possible to achieve cost reduction while realizing simplification of the structure of the inverting device. In addition, since the inverting device does not have to switch directions, the processing capacity in the substrate processing apparatus is improved.

(16) It is also possible that the first delivery area has a first substrate loading portion for loading substrates, the second delivery area has a second substrate loading portion for loading substrates, and the area on the opposite side of the second delivery area has an inverted device, the first processing section has a surface cleaning section, the second processing section has a backside cleaning section, the first transport device transports the substrate between the first substrate loading section, the second substrate loading section, and the surface cleaning section, and the second The transfer device transfers the substrate between the second substrate loading unit, the inverting device, and the backside cleaning unit, and the third transfer device transfers the substrate between the container loaded on the container loading unit and the first substrate loading unit.

In this case, in the first processing area, the substrate is conveyed between the first substrate loading unit, the second substrate loading unit, and the surface cleaning treatment unit by the first transportation device. In the second processing area, the substrate is transferred between the second substrate loading unit, the inverting device, and the backside cleaning processing unit by the second transfer device. In the loading/unloading area, the substrate is conveyed between the storage container mounted on the container loading unit and the first substrate loading unit by the third transportation device.

With such a configuration, in the first processing area and the second processing area, the substrate transfer by the first transfer device and the substrate transfer by the second transfer device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Therefore, the transfer time of the substrate in the first processing area and the second processing area can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

(17) The reversing device may have first and second reversing devices arranged up and down.

In this case, the substrate before being cleaned by the back surface cleaning unit is turned over by the first inversion device, and the substrate cleaned by the back side cleaning unit is turned over by the second inversion unit. Therefore, even if the back surface of the substrate before being cleaned by the back cleaning processing unit is contaminated, the contamination can be prevented from being transferred to the substrate after the back cleaning processing via the inverting device. Therefore, it is possible to keep the substrate cleaned by the back surface cleaning processing unit in a clean state.

(18) The first inverting device may be used to invert the substrate before being cleaned by the back cleaning processing section, and the second inverting device may be used to invert the substrate after being cleaned by the back cleaning processing section.

In this case, even if the back surface of the substrate before being cleaned by the back cleaning processing unit is contaminated, it is possible to prevent contamination from being transferred to the substrate after the back cleaning processing via the inverting device. Therefore, it is possible to keep the substrate cleaned by the back surface cleaning processing unit in a clean state.

(19) The reversing device may also have: a first holding mechanism that holds the substrate in a state perpendicular to the first axis; a second holding mechanism that holds the substrate in a state perpendicular to the first axis; a member supporting the first and second holding mechanisms so as to overlap in the direction of the first axis; a rotating device for integrally rotating the supporting member and the first and second holding members around the second axis, the The second axis is substantially perpendicular to the first axis.

In this case, the substrate is held in a state perpendicular to the first axis by at least one of the first and second holding mechanisms. In this state, the first and second holding mechanisms are integrally rotated by the rotating device around a second axis substantially perpendicular to the first axis. As a result, the substrate held by the first holding mechanism or the second holding mechanism is turned over.

Here, each of the first to third transport devices has two transport holding units, and when the substrates are carried in and out of the inversion device using the two transport holding units, the two transport holding units are arranged so as to be opposite to each other. The directions parallel to the first axes overlap, whereby two substrates can be carried into the first and second holding mechanisms at the same time through the two conveyance and holding parts, and the two substrates can be simultaneously transferred from the first to the second holding mechanism through the two conveyance and holding parts. And the second holding mechanism moves out. Therefore, it is possible to efficiently perform inversion of a plurality of substrates while carrying in and out of the substrates to the inversion device quickly.

(20) It is also possible that the first and second holding mechanisms have a common turning and holding member, and the common turning and holding member has one side and the other side perpendicular to the first axis, and the first holding mechanism has: a plurality of first support parts, It is arranged on one side of the common inversion holding member for supporting the outer peripheral portion of the substrate; the first inversion holding member is arranged opposite to one side of the common inversion holding member; The surface of the first inversion holding member opposite to the inversion holding member is used to support the outer peripheral portion of the substrate; the first drive mechanism moves at least one of the first inversion holding member and the common inversion holding member, so that in the following two The two states refer to the state where the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis, and the first inversion holding member and the common inversion holding member are mutually separated. approaching state, and the second holding mechanism has: a plurality of third supporting parts, which are arranged on the other side of the common turning and holding member, for supporting the outer peripheral portion of the substrate; The other face is arranged facing each other; a plurality of fourth supporting parts are arranged on the surface of the second turning holding member opposite to the common turning holding member, and are used to support the outer peripheral portion of the substrate; the second driving mechanism makes the At least one of the second inversion holding member and the common inversion holding member moves so as to be selectively transferred between the following two states, the two states refer to the second inversion holding member and the common inversion holding member in the first axis The state in which they are separated from each other in the direction of , and the state in which the second inversion holding member and the common inversion holding member are close to each other.

In this case, in a state where the first inversion holding member and the common inversion holding member are separated from each other, the substrate is carried in between the plurality of first support parts and the plurality of second support parts, wherein the plurality of first support parts The plurality of second support portions are provided on one surface of the common inversion holding member, and the plurality of second support portions are arranged on the surface of the first inversion holding member opposite to the common inversion holding member. In this state, at least one of the first inversion holding member and the common inversion holding member is moved by the first drive mechanism, so that the first inversion holding member and the common inversion holding member approach each other. Thus, the outer peripheral portion of the substrate is held by the plurality of first and second support portions.

In this state, the first inversion holding member, the second inversion holding member, and the common inversion holding member are integrally rotated around the second shaft by the rotating device. Thereby, the substrate held by the first inversion holding member and the common inversion holding member is inverted.

In addition, in a state where the second inversion holding member and the common inversion holding member are separated from each other, the substrate is carried in between a plurality of third support parts and a plurality of fourth support parts, wherein the plurality of third support parts are arranged on Sharing the other surface of the overturning holding member, the plurality of fourth support portions are arranged on the surface of the second overturning holding member opposite to the common overturning holding member. In this state, at least one of the second inversion holding member and the common inversion holding member is moved by the second driving mechanism, so that the second inversion holding member and the common inversion holding member approach each other. Thus, the outer peripheral portion of the substrate is held by the plurality of third and fourth support portions.

In this state, the first inversion holding member, the second inversion holding member, and the common inversion holding member are integrally rotated around the second shaft by the rotating device. Thereby, the substrate held by the second inversion holding member and the common inversion holding member is inverted.

(21) The present invention provides another substrate processing apparatus for processing a substrate having a front surface and a back surface, the substrate processing apparatus having: first and second processing areas, the first and second processing areas being arranged adjacent to each other , for processing the substrate; the loading and unloading area, which carries and unloads the substrate from the first processing area; the first delivery part, which transfers the substrate between the loading and unloading area and the first processing area, and the second delivery part, which Substrates are transferred between the first processing area and the second processing area, wherein the first processing area has: a first processing part; a first transport device, which is between the first transfer part, the first processing part and the second transfer part To transport the substrate, the second processing area has: a second processing unit; a second transport device, which transports the substrate between the second transfer unit and the second processing unit, and the loading and unloading area has: a container loading unit, which is used to load and store the substrate the storage container; the third transfer device, which transfers the substrate between the storage container loaded on the container loading unit and the first transfer unit, and one of the first and second processing units has a back cleaning processing unit for cleaning the back surface of the substrate , at least one of the first transfer unit and the second transfer unit has an inversion mechanism, and the inversion mechanism performs substrate transfer between the first transfer device and the third transfer device, or between the first transfer device and the second transfer device At the same time, the front and back of the substrate are turned over.

In this substrate processing apparatus, substrates are loaded and unloaded from the loading and unloading area to the first processing area, and the substrates are processed in the first processing area and the second processing area. In addition, the substrate is delivered between the loading and unloading area and the first processing area by the first delivery unit, and the substrate is delivered between the first processing area and the second processing area by the second delivery unit.

In the first processing area, the substrate is transferred between the first transfer unit, the first processing unit, and the second transfer unit by the first transfer device. In the second processing area, the substrate is transferred between the second transfer unit and the second processing unit by the second transfer device. In addition, in the loading and unloading area, the substrate is transported between the storage container mounted on the container loading unit and the first transfer unit by the third transport device.

In this case, in the first processing area and the second processing area, the substrate transfer by the first transfer device and the substrate transfer by the second transfer device can be performed simultaneously. Accordingly, a plurality of substrates can be efficiently conveyed. Therefore, the transfer time of the substrate in the first processing area and the second processing area can be shortened. As a result, the throughput of the substrate processing apparatus can be improved.

In addition, in at least one of the first transfer unit and the second transfer unit, the substrate is transferred between the first transfer device and the third transfer device or between the first transfer device and the second transfer device by the inverting mechanism. Simultaneously, the front and back sides of the substrate are turned over. The back surface of the inverted substrate is cleaned by the back surface cleaning treatment unit in one of the first and second treatment units.

In this case, the transfer time of the substrate can be further shortened by inverting the substrate while transferring the substrate. Therefore, the throughput of the substrate processing apparatus can be further improved.

(22) It is also possible that one or the other of the first and second processing units has an end cleaning treatment unit that cleans the outer peripheral end of the substrate while maintaining the back surface of the substrate, and the turning mechanism passes through the end cleaning treatment unit. The front and back of the cleaned substrate are turned over, and the back cleaning processing unit cleans the back of the substrate turned over by the turning mechanism.

In this case, one or the other of the first and second processing units cleans the outer peripheral end portion of the substrate by the end surface cleaning processing unit while holding the back surface of the substrate. The substrate cleaned by the end face cleaning processing unit is turned over by the turning mechanism at least one of the first delivery unit and the second delivery unit. Then, in one of the first and second processing sections, the back surface of the substrate inverted by the inversion mechanism is cleaned by the back surface cleaning processing section.

In this way, after the outer peripheral end of the substrate is cleaned by the back cleaning processing part, the back surface of the substrate is cleaned by the back cleaning processing part, so that even if the back surface of the substrate is polluted by holding the back surface of the substrate in the end surface cleaning processing part, The contamination on the back surface of the substrate can also be removed in the back cleaning treatment section. Therefore, the substrate can be kept in a clean state.

(23) The other of the first and second processing units may include a surface cleaning treatment unit for cleaning the surface of the substrate.

In this case, in at least one of the first delivery unit and the second delivery unit, the substrate is turned over by the turning mechanism so that the back side faces upward, and in one of the first and second processing units, the substrate is turned over. The back surface of the finished substrate is cleaned by the back surface cleaning processing unit. The substrate cleaned by the backside cleaning unit is turned over again by the turning mechanism so that the surface faces upward. In the other of the first and second processing sections, the surface of the substrate is cleaned by the surface cleaning processing section. Thereby, the front surface and the back surface of a board|substrate can be cleaned sufficiently and cleanly.

Description of drawings

FIG. 1 is a diagram showing the configuration of a substrate processing apparatus in a first embodiment.

FIG. 2 is a diagram showing the structure of a substrate processing apparatus in the first embodiment.

FIG. 3 is a diagram showing the structure of a substrate processing apparatus in the first embodiment.

4A and 4B are diagrams showing the structure of the first master manipulator.

5A and 5B are diagrams showing the structure of the flipping unit.

FIG. 6 is a diagram showing the structure of an inversion unit.

FIG. 7 is a diagram showing the structure of a flipping unit.

FIG. 8 is a diagram showing the structure of an end surface cleaning unit SSB.

9A and 9B are diagrams showing the configuration of the end face cleaning device of the end face cleaning unit SSB.

FIG. 10 is a diagram showing the structure of the surface cleaning unit SS.

FIG. 11 is a diagram showing the structure of the back surface cleaning unit SSR.

FIG. 12 is a diagram showing a structure of a substrate processing apparatus in a second embodiment.

13A and 13B are diagrams showing the structure of the flipping unit in the second embodiment.

14A, 14B, 14C, and 14D are diagrams showing the operation of the reversing unit in the second embodiment.

15E, 15F, and 15G are diagrams showing the operation of the reversing unit in the second embodiment.

FIG. 16 is a diagram showing a structure of a substrate processing apparatus in a third embodiment.

FIG. 17 is a diagram showing the structure of a substrate processing apparatus in a third embodiment.

FIG. 18 is a diagram showing the structure of a substrate processing apparatus in a fourth embodiment.

FIG. 19 is a diagram showing the structure of a substrate processing apparatus in a fourth embodiment.

FIG. 20 is a diagram showing the structure of a substrate processing apparatus in a fifth embodiment.

21A, 21B, 21C, and 21D are diagrams showing the operation of the reversing unit in the fifth embodiment.

22E, 22F, and 22G are diagrams showing the operation of the reversing unit in the fifth embodiment.

FIG. 23 is a diagram showing the configuration of a substrate processing apparatus in a sixth embodiment.

FIG. 24 is a diagram showing the configuration of a substrate processing apparatus in a sixth embodiment.

FIG. 25 is a diagram showing the structure of a substrate processing apparatus in a seventh embodiment.

FIG. 26 is a diagram showing the structure of a substrate processing apparatus in a seventh embodiment.

Detailed ways

Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disc, and the like.

In addition, in the following description, the surface of the board|substrate on which various patterns, such as a circuit pattern, are formed is called a front surface, and the surface on the opposite side is called a back surface. In addition, the surface of the substrate facing downward is referred to as a lower surface, and the surface of the substrate facing upward is referred to as an upper surface.

(1) First Embodiment

(1-1) Structure of substrate processing apparatus

1 to 3 are schematic diagrams showing the configuration of a substrate processing apparatus in the first embodiment. FIG. 1 is a plan view of a substrate processing apparatus, and FIG. 2 is a side view of the substrate processing apparatus in FIG. 1 viewed from the direction of arrow B1. In addition, FIG. 3 is a sectional view taken along line A1-A1 in FIG. 1 .

As shown in FIG. 1 , the substrate processing apparatus 100 is composed of an indexer block 10 , a first processing block 11 , and a second processing block 12 arranged side by side. In the indexer block 10, a plurality of carrier loading tables 40, an indexer robot IR, and a control unit 4 are provided. A carrier C for storing a plurality of substrates W in multiple layers is mounted on each carrier loading table 40 .

The indexer robot IR is configured to be movable in the arrow U direction, rotatable around a vertical axis, and movable up and down. On the indexer robot IR, hands IRH1 and IRH2 for transferring the substrate W are provided up and down. The hands IRH1 and IRH2 hold the peripheral portion and the outer peripheral end portion of the lower surface of the substrate W. As shown in FIG. The control unit 4 is constituted by a computer including a CPU (Central Processing Unit), and controls each structural unit in the substrate processing apparatus 100 .

As shown in FIGS. 1 and 2 , in the first processing area 11 , a plurality of backside cleaning units SSR (four in FIG. 2 ) and a first master robot MR1 are provided. A plurality of backside cleaning units SSR are stacked up and down on one side surface of the first processing area 11 (see FIG. 2 ). The first master manipulator MR1 is installed substantially in the center of the processing area 11, and is configured to be rotatable around a vertical axis and vertically ascendable and downward.

On the first main robot MR1 , hands MRH1 and MRH2 for transferring the substrate W are arranged up and down. The hands MRH1 and MRH2 hold the peripheral portion and the outer peripheral end portion of the lower surface of the substrate W. As shown in FIG.

In the second processing area 12, a plurality of surface cleaning units SS (four in FIG. 2 ), a plurality of end surface cleaning units SSB (four in FIG. 2 ), and a second master robot MR2 are provided. A plurality of surface cleaning units SS are stacked up and down on one side of the second processing area 12, and a plurality of end surface cleaning units SSB are stacked up and down on the other side of the second processing area 12. (Refer to Figure 2). The second main manipulator MR2 is installed substantially in the center of the second processing area 12, and is configured to be rotatable about a vertical axis and vertically ascendable and downward.

As shown in FIG. 3 , between the indexer area 10 and the first processing area 11, there are up and down a reversing unit RT1 for inverting the substrate W, and a reversing unit RT1 for transferring the substrate between the indexer manipulator IR and the first main manipulator MR1. W's substrate loading section PASS1. Between the first processing area 11 and the second processing area 12, a turnover unit RT2 for turning over the substrate W and a substrate loader for transferring the substrate W between the first main robot MR1 and the second main robot MR2 are arranged up and down. Department PASS2. Details of the reversing units RT1 and RT2 will be described later.

Optical sensors (not shown) for detecting the presence of the substrate W are provided in the substrate loading sections PASS1 and PASS2 . Thereby, it can be determined whether or not the substrate W is loaded on the substrate loading portions PASS1 and PASS2 . In addition, a plurality of support pins 51 for supporting the lower surface of the substrate W are provided in the substrate mounting portions PASS1 and PASS2 . When transferring the substrate W between the indexer robot IR and the first main robot MR1 and between the first main robot MR1 and the second main robot MR2 , the substrate W is temporarily placed on the support pins 51 of the substrate mounts PASS1 and PASS2 .

(1-2) Outline of operation of substrate processing equipment

Next, the operation of the substrate processing apparatus 100 will be described with reference to FIGS. 1 to 3 . In addition, the operation of each component of the substrate processing apparatus 100 described below is controlled by the control unit 4 in FIG. 1 .

First, in the indexer area 10 , the indexer robot IR takes out an unprocessed substrate W from one carrier C loaded on the carrier loading table 40 . The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and loads the substrate W on the substrate mounting part PASS1 . The substrate W loaded on the substrate mount PASS1 is received by the first master robot MR1 of the first processing block 11, and then placed on the substrate mount PASS2. The substrate W loaded on the substrate loading unit PASS2 is received by the second master robot MR2 of the second processing block 12, and then carried into the end surface cleaning unit SSB.

In the end surface cleaning unit SSB, the end surface of the substrate W is cleaned. Hereinafter, the cleaning treatment of the end surface of the substrate W will be referred to as end surface cleaning treatment. In addition, the end face cleaning process by the end face cleaning unit SSB will be described in detail later.

The substrate W subjected to the end surface cleaning process is carried out from the end surface cleaning unit SSB by the second main machine MR2, and then carried into the surface cleaning unit SS. In the surface cleaning unit SS, the surface of the substrate W is cleaned. Hereinafter, the cleaning treatment on the surface of the substrate W is referred to as surface cleaning treatment. In addition, the surface cleaning process by the surface cleaning unit SS will be described in detail later.

The substrate W after the surface cleaning process is carried out from the surface cleaning unit SS by the second main robot MR2, and then carried into the reversing unit RT2. In the reversing unit RT2 , the substrate W whose surface faces upward is reversed so that its back face faces upward. The reversed substrate W is carried out from the reversing unit RT2 by the first main robot MR1 in the first processing area 11, and then carried into the rear surface cleaning unit SSR.

In the back surface cleaning unit SSR, the back surface of the substrate W is cleaned. Hereinafter, the cleaning treatment on the back surface of the substrate W will be referred to as back cleaning treatment. In addition, the backside cleaning process by the backside cleaning unit SSR will be described in detail later. The substrate W after the backside cleaning process is carried out from the backside cleaning unit SSR by the first main robot MR1, and then carried into the reversing unit RT1. In the reversing unit RT1 , the substrate W whose rear surface faces upward is reversed so that the front face faces upward.

The inverted substrate W is carried out from the inversion unit RT1 by the indexer robot IR of the indexer block 10 , and stored in the carrier C on the carrier loading table 40 .

(1-3) The specific structure of the main manipulator

(1-3-1) Structure of the first main manipulator and the second main manipulator

Next, detailed configurations of the first and second master manipulators MR1 and MR2 will be described. Here, the detailed configuration of the first master robot MR1 will be described. The configuration of the second master robot MR2 is also the same as that of the first master robot MR1 described below. FIG. 4A is a side view of the first master manipulator MR1 , and FIG. 4B is a top view of the first master manipulator MR1 .

As shown in FIGS. 4A and 4B , the first master manipulator MR1 includes a base portion 21 , and is provided with an elevating and rotating portion 22 so as to be liftable and rotatable with respect to the base portion 21 . The elevating and rotating unit 22 is connected to the hand MRH1 through the multi-joint arm AM1, and is connected to the hand MRH2 through the multi-joint arm AM2.

The elevating and rotating part 22 is raised and lowered in the vertical direction by an elevating drive mechanism 25 provided in the base part 21 , and rotates around a vertical axis by a rotating drive mechanism 26 provided in the base part 21 .

The multi-joint arms AM1 and AM2 are independently driven by a drive mechanism not shown, and advance and retreat in the horizontal direction while keeping the hands MRH1 and MRH2 in a fixed posture.

The hands MRH1 and MRH2 are respectively installed at a constant height with respect to the elevating and rotating unit 22 , and the hand MRH1 is installed higher than the MRH2 . The height difference M1 (FIG. 4A) of the hand MRH1 and the hand MRH2 remains constant.

The hands MRH1 and MRH2 have the same shape and are each formed in a roughly U-shape. The hand MRH1 has two claws H11 extending substantially parallel, and the hand MRH2 has two claws H12 extending substantially parallel.

In addition, a plurality of support pins 23 are respectively attached to the hands MRH1 and MRH2. In the present embodiment, four support pins 23 are attached approximately uniformly along the outer circumference of the substrate W mounted on the upper surface of the hands MRH1 and MRH2 . The peripheral portion and the outer peripheral end portion of the lower surface of the substrate W are held by the four support pins 23 .

(1-3-2) Operation example of the first master robot

Next, a specific operation example of the first master robot MR1 will be described with reference to FIG. 1 .

First, the first master robot MR1 receives an unprocessed substrate W from the substrate loading unit PASS1 through the hand MRH2. Next, the first main robot MR1 unloads the substrate W with the back surface facing upward from the reversing unit RT2 by the hand MRH1 . This substrate W is a substrate W subjected to end face cleaning treatment and surface cleaning treatment. Next, the unprocessed substrate W held by the hand MRH2 is loaded on the substrate mounting part PASS2.

Next, the first main robot MR1 unloads the substrate W subjected to the back cleaning process from an arbitrary back cleaning unit SSR through the hand MRH2, and carries the substrate W held by the hand MRH1 into the back cleaning unit SSR. Next, the first master robot MR1 carries the substrate W, which has undergone the backside cleaning process, held by the hand MRH2 into the reversing unit RT1 .

The first master robot MR1 continuously performs such a series of operations. In addition, in the above operation example, the operation of the hand MRH1 and the operation of the hand MRH2 may be reversed.

The number of transfer procedures for a substrate W by the first main robot MR1 is the following three procedures: transfer from the substrate loading unit PASS1 to the substrate loading unit PASS2; transfer from the reversing unit RT2 to the rear cleaning unit SSR; and transfer from the rear cleaning unit Handling of SSR to flipping unit RT1.

(1-3-3) Action of the second main manipulator

Next, a specific operation example of the second master manipulator MR2 will be described with reference to FIG. 1 .

The second main robot MR2 first receives the unprocessed substrate W from the substrate loading unit PASS2 through the hand MRH4. Next, the second main robot MR2 unloads the substrate W subjected to the end surface cleaning process from an arbitrary end surface cleaning unit SSB through the hand MRH3, and carries the substrate W held by the hand MRH4 into the end surface cleaning unit SSB. Next, the second master robot MR2 unloads the surface-cleaning-processed substrate W from an arbitrary surface cleaning unit SS through the hand MRH4, and carries the substrate W held by the hand MRH3 into the surface cleaning unit SS. Next, the second main robot MR2 carries the substrate W held by the hand MRH4 into the reversing unit RT2.

The second master manipulator MR2 continuously performs such a series of operations. In addition, in the above-mentioned operation example, the operation of the hand MRH3 and the operation of the hand MRH4 may be reversed.

The number of transfer processes for a substrate W by the second main manipulator MR2 is the following three processes: transfer from the substrate loading part PASS2 to the end cleaning unit SSB; transfer from the end cleaning unit SSB to the surface cleaning unit SS; and cleaning from the surface Transfer of unit SS to flipping unit RT2. Such an operation of the second master robot MR2 is performed simultaneously with the above-described operation of the first master robot MR1.

(1-4) The structure and operation of the flipping unit

Next, the configuration of the reversing units RT1 and RT2 will be described. In addition, the flipping units RT1 and RT2 have the same structure.

FIG. 5A and FIG. 5B are structural schematic diagrams of the flip units RT1 and RT2 in FIG. 1 . FIG. 5A is a side view of the reversing units RT1 and RT2 , and FIG. 5B is a top view of the reversing units RT1 and RT2 . In addition, FIG. 6 is a perspective view showing the appearance of main parts of the reversing units RT1 and RT2 , and FIG. 7 is a perspective view showing the appearance of a part of the reversing units RT1 and RT2 .

As shown in Fig. 5A and Fig. 5B, the turnover units RT1 and RT2 include a first support member 41, a second support member 42, a plurality of substrate support pins 43a and 43b, a first movable member 44, a second movable member 45, a fixed plate 46, link mechanism 47 and rotation mechanism 48.

As shown in FIG. 6 , the first supporting member 41 is composed of six rod-shaped members extending radially. Substrate support pins 43 a are respectively provided at the front ends of the six rod-shaped members. Likewise, as shown in FIG. 7 , the second supporting member 42 is also composed of six rod-shaped members extending radially. Substrate support pins 43b are respectively provided at the front ends of the six rod-shaped members.

In addition, in this embodiment, the first and second support members 41, 42 are composed of six rod-shaped members, but not limited thereto, the first and second support members 41, 42 are composed of any other number of rod-shaped members or other Member configurations of arbitrary shapes are also possible, for example, shapes such as disks or polygons along the outer peripheries of the plurality of substrate support pins 43a and 43b.

The first movable member 44 in FIG. 6 is formed in a "U" shape, one end and the other end extend in the vertical direction, and the middle part extends in the arrow U direction. The first support member 41 is fixed on one end of the first movable member 44 . The other end of the first movable member 44 is connected with a link mechanism 47 . Similarly, the second movable member 45 in FIG. 7 is formed in a “U” shape, and the second supporting member 42 is fixed on one end of the second movable member 45 . The other end of the second movable member 45 is connected with a link mechanism 47 . The link mechanism 47 is mounted on the rotation shaft of the rotation mechanism 48 . The link mechanism 47 and the rotation mechanism 48 are mounted on the fixed plate 46 .

A cylinder or the like is built into the link mechanism 47 in FIG. 6 , so that the first movable member 44 and the second movable member 45 can be selectively moved to be in a relatively separated state or a close state. In addition, a motor or the like is incorporated in the rotation mechanism 48 , and the first movable member 44 and the second movable member 45 can be rotated about a horizontal axis, for example, by 180 degrees, through the link mechanism 47 .

Here, operations of the reversing units RT1 and RT2 will be described with reference to the drawings. First, the substrate W is carried into the reversing units RT1 and RT2 by the first or second master manipulator MR1 and MR2 ( FIG. 1 ). In the state where the first movable member 44 and the second movable member 45 are separated from each other in the vertical direction, the substrate W is moved and loaded on the plurality of substrate supports of the second support member 42 by the first or second master manipulator MR1, MR2. pin 43b.

Next, as shown in FIG. 5A , the first movable member 44 and the second movable member 45 are moved to a state close to each other in the vertical direction by the operation of the link mechanism 47 . Accordingly, both surfaces of the substrate W are supported by the plurality of substrate support pins 43a, 43b, respectively.

Next, the first movable member 44 and the second movable member 45 are rotated by 180 degrees about an axis parallel to the direction of the arrow U by the action of the rotation mechanism 48 . Thus, the substrate W is rotated by 180 degrees while being held by the plurality of substrate support pins 43a, 43b provided on the first support member 41 and the second support member 42 together with the first movable member 44 and the second movable member 45. . As a result, the substrate W is turned over.

Next, the first movable member 44 and the second movable member 45 are moved to a state separated from each other in the vertical direction by the operation of the link mechanism 47 . In this state, the substrate W is carried out from the reversing units RT1 and RT2 by the indexer robot IR or the first master robot MR1 .

(1-5) The specific structure of the end face cleaning unit

FIG. 8 is a diagram for explaining the configuration of an end surface cleaning unit SSB. As shown in FIG. 8 , the end surface cleaning unit SSB has a spin chuck 201 for holding the substrate W horizontally and rotating the substrate W around a vertical rotation axis passing through the center of the substrate W.

The spin chuck 201 is fixed to an upper end of a rotation shaft 203 rotated by a chuck rotation drive mechanism 204 . In addition, a suction path (not shown) is formed on the spin chuck 201, and the back surface of the substrate W is vacuumed by exhausting the gas in the suction path while the substrate W is placed on the spin chuck 201. Since it is attracted to the spin chuck 201, the substrate W can be held in a horizontal posture.

On the side of the spin chuck 201 and at the upper part in the end surface cleaning unit SSB, an end surface cleaning device moving mechanism 230 is provided. A rod-shaped support member 220 extending downward is attached to the end surface cleaning device moving mechanism 230 . The supporting member 220 is moved in the horizontal direction (refer to arrow M in FIG. 8 ) by the end surface cleaning device moving mechanism 230 .

A substantially cylindrical end surface cleaning device 210 is attached to a lower end portion of the supporting member 220 so as to extend in the horizontal direction. Therefore, the end surface cleaning device 210 moves together with the supporting member 220 by the end surface cleaning device moving mechanism 230 .

The end surface cleaning device 210 is located at substantially the same height as the substrate W held by suction on the spin chuck 201 . Thus, one end of the end surface cleaning device 210 faces the end surface R of the substrate W. As shown in FIG. In the following description, one end of the end surface cleaning device 210 facing the end surface R of the substrate W is referred to as the front.

When the end surface cleaning process of the substrate W is started, the end surface cleaning device 210 is moved to the end surface position of the substrate W by the end surface cleaning device moving mechanism 230 . In addition, when the end surface cleaning process of the substrate W is completed, the end surface cleaning device 210 is moved to a position separated from the end surface R of the substrate W by the end surface cleaning device moving mechanism 230 .

The end face cleaning device 210 is connected to a cleaning liquid supply pipe 241 and an exhaust pipe 244 . The cleaning liquid is supplied to the internal space (cleaning chamber 211 described later) of the end surface cleaning device 210 through the cleaning liquid supply pipe 241 . In addition, the exhaust pipe 244 is connected to the exhaust unit 245 . The exhaust unit 245 sucks the air in the inner space of the end surface cleaning device 210 and exhausts it through the exhaust pipe 244 .

Hereinafter, the end surface cleaning device 210 will be described in detail. 9A and 9B are diagrams for explaining the structure of the end surface cleaning device 210 of the end surface cleaning unit SSB in FIG. 8 . FIG. 9A shows a longitudinal sectional view of the end surface cleaning device 210 , and FIG. 9B shows a front view of the end surface cleaning device 210 .

As shown in FIG. 9A , a cleaning chamber 211 is formed inside a substantially cylindrical casing 210 a of the end surface cleaning device 210 . In addition, as shown in FIGS. 9A and 9B , an opening 212 communicating with the cleaning chamber 211 and the outside is formed on the front side of the casing 210 a. The opening 212 has arc-shaped upper and lower surfaces such that the vertical width gradually increases from the central portion to both sides. In the end surface cleaning process of the substrate W, the end surface R of the substrate W held by the spin chuck 201 is inserted into the opening 212 .

In the cleaning chamber 211, a brush 213 having a substantially cylindrical shape is arranged to extend in the vertical direction. On the outer peripheral surface of the brush 213, a V-shaped groove portion 213a is formed over the entire circumferential direction. The brush 213 is mounted on a rotating shaft 214 extending vertically. The upper and lower ends of the rotation shaft 214 are rotatably installed on rotation bearings formed at the upper and lower portions of the cleaning chamber 211 . Thus, the brush 213 is rotatably supported by the cleaning chamber 211 and the rotation shaft 214 .

When the end surface sharpening process of the substrate W is performed, the groove portion 213a formed on the brush 213 is in contact with the end surface R of the substrate W which is rotating. Thus, the brush 213 cleans the end surface R of the substrate W. As shown in FIG.

The upper part of the end surface cleaning device 210 is connected to the cleaning liquid supply pipe 241 and the exhaust pipe 244 . The cleaning liquid supply pipe 241 is connected to cleaning liquid supply paths 241a, 241b formed in the housing 210a. As shown in FIG. 9A , the cleaning liquid supply path 241 a extends from the outside of the housing 210 a to the upper inner surface of the cleaning chamber 211 . In addition, the cleaning liquid supply path 241b extends from the outside of the casing 210a to the lower inner surface of the cleaning chamber 211 . Only a part of the cleaning liquid supply path 241b is shown in FIG. 9A.

Therefore, during the end surface cleaning process of the substrate W, the cleaning liquid supplied to the end surface cleaning device 210 is sprayed from the vertical direction to the end surface R of the substrate W, and the end surface R of the substrate W is in contact with the brush 213 in the cleaning chamber 211 . Thereby, the end surface R of the board|substrate W is cleaned efficiently.

The exhaust pipe 244 is inserted into the cleaning chamber 211 through a hole provided in the upper portion of the housing 210a. Thus, the air in the cleaning chamber 211 is sucked by the exhaust unit 245 in FIG. 8 and exhausted through the exhaust pipe 244 . In this way, in the cleaning chamber 211, the internal air is exhausted through the exhaust unit 245, so that the volatilized cleaning liquid and the mist of the cleaning liquid are efficiently discharged.

(1-6) Detailed description of surface cleaning unit and back cleaning unit

Next, each configuration of the surface cleaning unit SS and the back surface cleaning unit SSR in FIG. 1 will be described.

FIG. 10 is a schematic diagram showing the structure of the surface cleaning unit SS, and FIG. 11 is a schematic diagram showing the structure of the rear surface cleaning unit SSR. In the surface cleaning unit SS and the rear surface cleaning unit SSR shown in FIG. 10 , cleaning processing (hereinafter referred to as scrubbing processing) of the substrate W using a brush is performed, respectively.

As shown in FIG. 10 , the surface cleaning unit SS includes a spin chuck 61 for rotating the substrate W around a vertical axis passing through the center of the substrate W while keeping the substrate W horizontal. The spin chuck 61 is fixed to an upper end of a rotation shaft 63 that is rotated by a chuck rotation drive mechanism 62 . In addition, like the spin chuck 201 of the above-mentioned end surface cleaning unit SSB, the spin chuck 61 holds the substrate W by vacuum suctioning the lower surface of the substrate W. In addition, the surface cleaning unit SS may use a mechanical spin chuck (see FIG. 11 described later) that holds the outer peripheral end of the substrate W instead of the suction spin chuck 61 .

As described above, the substrate W with the surface facing upward is carried into the surface cleaning unit SS. When scrubbing and rinsing are performed, the back surface of the substrate W is sucked and held by the spin chuck 61 .

A motor 64 is provided outside the spin chuck 61 . The motor 64 is connected to the rotation shaft 65 . An arm 66 is connected to the rotation shaft 65 so as to extend in the horizontal direction, and a substantially cylindrical brush cleaner 70 is provided at the tip of the arm 66 .

In addition, above the spin chuck 61 is provided a liquid discharge nozzle 71 for supplying a cleaning liquid or a rinse liquid (pure water) to the surface of the substrate W held by the spin chuck 61 . A supply pipe 72 is connected to the liquid discharge nozzle 71 , and a washing liquid and a rinse liquid are selectively supplied to the liquid discharge nozzle 71 through the supply pipe 72 .

During the scrubbing process, the motor 64 rotates the rotary shaft 65 . Accordingly, the arm 66 rotates in the horizontal plane, and the brush cleaner 70 moves between a position outside the substrate W and a position above the center of the substrate W around the rotation shaft 65 . An elevating mechanism (not shown) is provided on the motor 64 . The raising and lowering mechanism lowers and raises the brush cleaning tool 70 at a position outside the substrate W and at a position above the center of the substrate W by raising and lowering the rotating shaft 65 .

When the scrubbing process is started, the substrate W with the surface facing upward is rotated by the spin chuck 61 . In addition, a cleaning liquid or a rinse liquid is supplied to the liquid discharge nozzle 71 through the supply pipe 72 . Thus, the cleaning liquid or the rinsing liquid is supplied to the surface of the substrate W that is rotating. In this state, the brush cleaning tool 70 is shaken and raised and lowered by the rotating shaft 65 and the arm 66 . Thus, the surface of the substrate W is scrubbed. In addition, since the suction type spin chuck 61 is used in the surface cleaning unit SS, the peripheral portion and the outer peripheral end portion of the substrate W can be cleaned simultaneously.

Next, differences between the back surface cleaning unit SSR and the surface cleaning unit SS in FIG. 10 will be described using FIG. 11 . As shown in FIG. 11 , the backside cleaning unit SSR includes a mechanical spin chuck 81 that holds the outer peripheral end of the substrate W instead of the suction spin chuck 61 that holds the substrate by vacuum suctioning the lower surface of the substrate W. During scrubbing and rinsing, the substrate W is rotated while maintaining a horizontal posture while holding the peripheral portion and outer peripheral end portion of the lower surface of the substrate by the rotary support pins 82 on the spin chuck 61 .

The substrate W with the back side facing upward is carried into the back side cleaning unit SSR. As a result, the substrate W is held in the spin chuck 81 with the back surface facing upward. Then, the same scrubbing process as above is performed on the back surface of the substrate W.

However, in the above-mentioned end surface cleaning unit SSB and surface cleaning unit SS, the back surface of the substrate W is sucked by the suction-type spin chucks 201 and 61 . At this time, suction marks may be formed on the back surface of the substrate W. In the back surface cleaning unit SSR, by cleaning the back surface of the substrate W, suction marks formed in the end surface cleaning process and the surface cleaning process can be eliminated.

(1-7) Effects of the first embodiment

In this embodiment, a first master manipulator MR1 is disposed on the first processing area 11 , and a second master manipulator MR2 is disposed on the second processing area 12 . In this case, the transfer of the substrate W in the first processing area 11 and the transfer of the substrate W in the second processing area 12 can be performed simultaneously. As a result, the transfer time of the substrate W can be shortened, and thus the throughput of the substrate processing apparatus 100 can be improved.

In addition, in the substrate processing apparatus 100 of the present embodiment, after the end face cleaning process and the surface cleaning process are performed on the substrate W, the back surface cleaning process is performed on the substrate W by the back surface cleaning unit SSR. At this time, even in the end surface cleaning unit SSB or the surface cleaning unit SS, suction marks on the back surface of the substrate W are formed by the suction-type spin chucks 201 and 61, but the suction marks on the back surface of the substrate W can be eliminated by the subsequent back cleaning process. . Thereby, the substrate W can be cleaned sufficiently and cleanly.

In addition, in this embodiment, the reversing unit RT1 is disposed between the indexer robot IR and the first master manipulator MR1, and the reversing unit RT2 is disposed between the first master manipulator MR1 and the second master manipulator MR2. In this case, the substrate W can be transferred from the second main robot MR2 to the first main robot MR1 while inverting the substrate W. Likewise, the substrate W can be transferred from the first master robot MR1 to the indexer robot IR while inverting the substrate W. Accordingly, the transfer steps of the first and second master robots MR1 and MR2 can be reduced, and the processing capacity of the substrate processing apparatus 100 can be further improved.

In addition, in this embodiment, the number of conveyance processes of the substrate W performed by the first main robot MR1 is the same as the number of conveyance processes of the substrate W performed by the second main robot MR2 . At this time, it hardly happens that one of the first and second master manipulators MR1 and MR2 is put on standby in order to cooperate with the operation of the other master manipulator. Accordingly, the substrate W can be efficiently conveyed, and the processing capacity of the substrate processing apparatus 100 can be further improved.

In addition, in the substrate processing apparatus 100 of the present embodiment, a plurality of back surface cleaning units SSR are arranged in multiple layers on one side surface of the first processing area 11 . A plurality of surface cleaning units SS and end surface cleaning units SSB are respectively arranged in multiple layers on one side surface and the other side surface of the second processing area 12 . As a result, compared with the case where a plurality of cleaning units are arranged in a planar manner, the substrate processing apparatus 100 can be greatly reduced in size and space-saving.

In addition, in this embodiment, the substrate W before the backside cleaning process and the substrate W after the backside cleaning process are turned over by mutually different reversing units RT1 and RT2 . At this time, even if the back surface of the substrate W before the back cleaning process is contaminated, the contaminants are not transferred to the substrate W after the back cleaning process. Thereby, the back surface of the substrate W after the back cleaning process can be kept in a clean state.

In addition, in the present embodiment, the structure of the substrate processing apparatus 100 (so-called platform structure) can be realized by stacking and installing a plurality of surface cleaning units SS and a plurality of back surface cleaning units SSR in the height direction in multiple layers. Structure) miniaturization, and by arranging the surface cleaning unit SS, the back surface cleaning unit SSR and the end surface cleaning unit SSB in the above-mentioned height direction, it is possible to easily install a required number of surface cleaning units SS and a required number of back cleaning units. unit SSR and the required number of end cleaning units SSB.

(2) Second Embodiment

Next, differences from the first embodiment described above will be described with respect to the substrate processing apparatus in the second embodiment of the present invention.

FIG. 12 is a schematic diagram showing the structure of a substrate processing apparatus in a second embodiment. As shown in FIG. 12, the substrate processing apparatus 100a in 2nd Embodiment is equipped with the following reversing units RT1a, RT2a instead of reversing units RT1, RT2. In addition, two substrate mounts PASS1 and PASS2 are respectively provided.

(2-1) Flip unit

FIG. 13A is a side view of the reversing units RT1a, RT2a, and FIG. 13B is a perspective view of the reversing units RT1a, RT2a. In addition, the reversing units RT1a, RT2a have the same structure.

As shown in Figure 13A, the turning unit RT1a, RT2a includes a support plate 31, a fixed plate 32, a pair of linear guide rails 33a and 33b, a pair of support members 35a and 35b, a pair of cylinders 37a and 37b, a first movable plate 36a, a second Two movable plates 36b and a rotary driver 38 .

The support plate 31 is provided so as to extend in the vertical direction, and the fixing plate 32 is attached so as to extend in the horizontal direction from the center of one surface of the support portion 31 . In the region of the support plate 31 on one face side of the fixed plate 32 , a linear guide rail 33 a extending in a direction perpendicular to the fixed plate 32 is provided. In addition, in the region of the support plate 31 on the other surface side of the fixed plate 32 , a linear guide rail 33 b extending in a direction perpendicular to the fixed plate 32 is provided. The linear guide rails 33 a, 33 b are provided symmetrically with respect to the fixed plate 32 .

On one side of the fixing plate 32 , a support member 35 a is provided so as to extend in a direction parallel to the fixing plate 32 . The supporting member 35a is slidably attached to the linear guide rail 33a via the coupling member 34a. An air cylinder 37a is connected to the supporting member 35a, and the supporting member 35a is raised and lowered along the linear guide rail 33a by this air cylinder 37a. At this time, the support member 35a moves in a direction perpendicular to the fixed plate 32 while maintaining a certain posture. Moreover, the 1st movable plate 36a is attached to the support member 35a so that it may oppose one side of the fixed plate 32. As shown in FIG.

On the other side of the fixing plate 32 , a supporting member 35 b is provided so as to extend in a direction parallel to the fixing plate 32 . The supporting member 35b is slidably mounted on the linear guide rail 33b via the coupling member 34b. A cylinder 37b is connected to the support member 35b, and the support member 35b is raised and lowered along the linear guide rail 33b by this cylinder 37b. At this time, the support member 35b moves in a direction perpendicular to the fixed plate 32 while maintaining a certain posture. Moreover, the 2nd movable plate 36b is attached to the support member 35b so that it may oppose the other surface of the fixed plate 32. As shown in FIG.

In this embodiment, when the first movable plate 36a and the second movable plate 36b are farthest away from the fixed plate 32, the distance M2 between the first movable plate 36a and the fixed plate 32 and the second movable plate 36b and the fixed plate The distance M3 between the plates 32 is set to the height difference between the hand MRH1 and the hand MRH2 of the first master manipulator MR1 shown in FIGS. 4A and 4B (the hand MRH3 and the hand MRH3 of the second master manipulator MR2 The height difference between MRH4) M1 is approximately equal.

The rotary driver 38 makes the support plate 31 rotate around the horizontal axis HA parallel to the direction of the arrow U (Fig. The horizontal axis HA rotates (in the direction of θ).

As shown in FIG. 13B , the first movable plate 36a, the fixed plate 32, and the second movable plate 36b are each formed in a flat plate shape.

In addition, as shown in FIG. 13A, a plurality of support pins 39a are provided on one surface of the fixed plate 32 facing the first movable plate 36a, and a plurality of support pins 39b are provided on the other surface thereof. Also, a plurality of support pins 39c are provided on one surface of the first movable plate 36a facing the fixed plate 32 , and a plurality of support pins 39d are provided on one surface of the second movable plate 36b facing the fixed plate 32 .

In this embodiment, six support pins 39a, 39b, 39c, and 39d are provided, respectively. These support pins 39a, 39b, 39c, and 39d are arranged along the outer periphery of the substrate W carried into the reversing units RT1, RT2. In addition, the support pins 39a, 39b, 39c, 39d have the same length. Thus, in the state where the first movable plate 36a and the second movable plate 36b are farthest from the fixed plate 32, the distance between the front end of the support pin 39a and the front end of the support pin 39d and the distance between the front end of the support pin 39b and the support pin 39c The distance between the front ends of the main manipulator is roughly equal to the height difference between the hand MRH1 and the hand MRH2 of the first main manipulator MR1 shown in FIGS. 4A and 4B (between the hand MRH3 and the hand MRH4 of the second main manipulator MR2 ). height difference between) M1.

In addition, the distance M2 between the first movable plate 36 a and the fixed plate 32 and the distance M3 between the second movable plate 36 b and the fixed plate 32 can also be appropriately changed. However, in the state where the first movable plate 36a and the second movable plate 36b are farthest away from the fixed plate 32, the distance between the front end of the support pin 39c and the front end of the support pin 39d is set to be greater than that of the hand MRH1 and the hand. The height difference between the hand MRH2 (the height difference between the hand MRH3 and the hand MRH4) M1.

(2-2) Outline of operation of substrate processing equipment

Next, an outline of the operation of the substrate processing apparatus 100a will be described with reference to FIGS. 1 and 12 .

First, in the indexer block 10 , the indexer robot IR takes out two unprocessed substrates W from one of the carriers C placed on the carrier loading table 40 with the hands IRH1 and IRH2 . Next, the indexer robot IR sequentially transfers the two substrates W held by the hands IRH1 , IRH2 to the two substrate mounts PASS1 .

Next, the first main robot MR1 of the first processing block 11 sequentially receives two substrates W from the two substrate mounts PASS1 with the hands MRH1 and MRH2 , and sequentially loads the two substrates W on the two substrate mounts PASS2 . Next, the second main robot MR2 in the second processing area 12 uses the hands MRH3 and MRH4 to sequentially receive two substrates W from the two substrate loading parts PASS2, and sequentially carry the two substrates W into the two end surface cleaning units SSB. .

Next, the second main manipulator MR2 uses the hands MRH3 and MRH4 to sequentially unload the two substrates W after the end surface cleaning process from the two end surface cleaning units SSB, and sequentially carry the two substrates W into the two surface cleaning units SS . Next, the second main robot MR2 uses the hands MRH3 and MRH4 to sequentially unload the two substrates W after surface cleaning from the two surface cleaning units SS, and simultaneously carry the two substrates W into the reversing unit RT2a.

In the reversing unit RT2a, the two substrates W whose surfaces face upward are reversed so that their back faces face upward. The operation of the reversing unit RT2a will be described later.

Next, the first main robot MR1 of the first processing area 11 uses the hands MRH1 and MRH2 to simultaneously unload the two substrates W with the back facing upward from the reversing unit RT2a, and sequentially load the two substrates W into the back cleaning unit SSR. Next, the first main robot MR1 sequentially unloads the two substrates W after the back cleaning process from the two back cleaning units SSR, and simultaneously carries the two substrates W into the reversing unit RT1a.

In the reversing unit RT1a, the two substrates W whose rear surfaces face upward are reversed so that the surfaces thereof face upward. The operation of the reversing unit RT1a will be described later. Next, the indexer robot IR of the indexer block 10 sequentially unloads the two inverted substrates W from the inverting unit RT1 a using the hands IRH1 and IRH2 , and stores the two substrates W in the carrier C on the carrier stage 40 . This completes a series of operations of the substrate processing apparatus 100a in the second embodiment.

Also, by setting the height difference between the hand IRH1 and the hand IRH2 of the indexer robot IR to be approximately equal to the height difference between the hand MRH1 and the hand MRH2 (the height difference between the hand MRH3 and the hand MRH4) M1 , so that the indexer robot IR can simultaneously carry out the two substrates W from the reversing unit RT1a.

In addition, by setting the interval between the two substrate mounts PASS1 and the interval between the two substrate mounts PASS2 to be approximately equal to the height difference between the hand MRH1 and the hand MRH2 as shown in FIGS. 4A and 4B (hand The height difference between the MRH3 and the hand MRH4) M1 enables the first main robot MR1 to simultaneously receive two substrates W from the two substrate loading parts PASS1. In addition, the first main robot MR1 can simultaneously load two substrates W on the two substrate loading parts PASS2. Furthermore, the second main robot MR2 is enabled to simultaneously receive two substrates W from the two substrate mounts PASS2. Also, if the height difference between the hand IRH1 and the hand IRH2 of the indexer robot IR is set to be approximately equal to the height difference between the hand MRH1 and the hand MRH2 (the height difference between the hand MRH3 and the hand MRH4) M1 , the indexer robot IR can simultaneously load two substrates W on the two substrate loading parts PASS1.

(2-3) Operation of flip unit

Next, the configuration of the reversing units RT1a, RT2a will be described. FIG. 14A, FIG. 14B, FIG. 14C, FIG. 14D, FIG. 15E, FIG. 15F, FIG. 15G are diagrams for explaining the operation of reversing means RT1a, RT2a. In addition, since the operations of each process of the reversing unit RT1a and RT2b are the same, the operation of the reversing unit RT2a will be described as an example in FIGS.

As shown in FIG. 14A , between the first movable plate 36 a and the fixed plate 32 and between the second movable plate 36 b and the fixed plate 32 , the hands MRH3 , MRH4 of the second master robot MR2 holding the substrate W advance simultaneously. In addition, the advancing and retreating directions of the hands MRH3 and MRH4 of the second master manipulator MR2 perpendicularly intersect with the direction of the arrow U ( FIGS. 13A and 13B ). The support pins 39a, 39b, 39c, and 39d of the reversing units RT1a, RT2a are provided at positions where they do not come into contact with the hands IRH1, IRH2, MRH1, MRH2, and hands MRH3, MRH4, respectively, when loading and unloading the substrate W.

Then, as shown in FIG. 14B , the hands MRH3 and MRH4 move backward while falling simultaneously. Thus, the substrate W is loaded on the support pins 39a, 39d. At this time, in the reversing unit RT2a, the substrate W whose upper surface faces upward is loaded on the support pins 39a, 39d.

Next, as shown in FIG. 14C, the air cylinder 37a (FIG. 13A) lowers the supporting member 35a, and at the same time, the air cylinder 37b (FIG. 13A) raises the supporting member 35b. Thus, one substrate W is held by the support pins 39c of the first movable plate 36a and the support pins 39a of the fixed plate 32, and the other substrate W is supported by the support pins 39d of the second movable plate 36b and the fixed plate 32. Pin 39b is held.

In this state, as shown in FIG. 14D , the first movable plate 36 a , the fixed plate 32 and the second movable plate 36 b are driven by the rotary driver 38 to integrally rotate 180 degrees in the θ direction (around the horizontal axis HA). Thereby, the substrate W held by the support pins 39 a and 39 c and the substrate W held by the support pins 39 b and 39 d are turned over. In this case, in the reversing unit RT2a, the back surface of the board|substrate W faces upward.

Next, as shown in FIG. 15E, the air cylinder 37a lowers the supporting member 35a, and at the same time, the air cylinder 37b raises the supporting member 35b. Accordingly, the second movable plate 36b rises while the first movable plate 36a descends. Therefore, one substrate W is supported by the support pins 39 c of the first movable plate 36 a, and the other substrate W is supported by the support pins 39 b of the fixed plate 32 .

In this state, as shown in FIG. 15F , the hands MRH1 and MRH2 of the first master robot MR1 ( FIG. 10 ) move downwards of the substrate W supported by the support pin 39 b and downward of the substrate W supported by the support pin 39 c. Rising while advancing. Accordingly, the substrate W supported by the support pins 39 b is received by the hand MRH1 , and the substrate W supported by the support pins 39 c is received by the hand MRH2 . In addition, the advance and retreat directions of the hands MRH1 and MRH2 of the first master manipulator MR1 perpendicularly intersect with the direction of the arrow U ( FIG. 1 ).

Then, as shown in FIG. 15G , the hands MRH1 and MRH2 move backward simultaneously, and two substrates W are carried out from the reversing unit RT2a.

(2-4) Effects of the second embodiment

In the present embodiment, the first and second main robots MR1 and MR2 simultaneously carry out and carry in and out two substrates W with respect to the reversing units RT1a and RT2a. Furthermore, the reversing units RT1a and RT2a reverse the two substrates W at the same time. Thereby, a plurality of substrates can be turned over efficiently. As a result, the throughput of the substrate processing apparatus 100a can be improved.

In addition, the processing capability of the substrate processing apparatus 100 a can be further improved by simultaneously transporting two substrates by the indexer robot IR, the first main robot MR1 , and the second main robot MR2 .

In addition, similarly to the first embodiment, after the substrate W is subjected to the end surface cleaning treatment and the surface cleaning treatment, the substrate W is subjected to the back surface cleaning treatment. Therefore, even if suction marks are formed on the back surface of the substrate W by the suction-type spin chucks 201 and 61, the suction marks can be eliminated by the back surface cleaning process. Therefore, the substrate W can be cleaned sufficiently and cleanly.

(3) The third embodiment

Next, differences from the first embodiment described above will be described with respect to the substrate processing apparatus in the third embodiment of the present invention.

(3-1) Structure of substrate processing apparatus

16 and 17 are schematic diagrams showing the structure of a substrate processing apparatus in a third embodiment. FIG. 16 is a plan view of the substrate processing apparatus, and FIG. 17 is a sectional view taken along line A2-A2 of FIG. 16 .

As shown in FIG. 16 , in the substrate processing apparatus 100b of the third embodiment, a plurality of (for example, four) surface cleaning units SS are provided on one side of the first processing area 11 . In addition, a plurality of (for example, four) backside cleaning units SSR are arranged on one side of the second processing area 12, and a plurality (for example, four) of end surface cleaning units are arranged on the other side of the second processing area 12. Unit SSB. In addition, as shown in FIG. 17 , between the indexer area 10 and the first processing area 11, there are substrate loading parts PASS1 and PASS2 up and down, and between the first processing area 11 and the second processing area 12, an overturning unit is arranged up and down. RT1, RT2, and substrate mount PASS3.

In addition, in the surface cleaning unit SS of the substrate processing apparatus 100b, a mechanical spin chuck (see FIG. 11 ) for holding the outer peripheral end of the substrate W is employed.

(3-2) Outline of operation of substrate processing equipment

Next, an outline of the operation of the substrate processing apparatus 100b will be described with reference to FIGS. 16 and 17 .

First, in the indexer area 10 , the indexer robot IR takes out an unprocessed substrate W from one carrier C loaded on the carrier loading table 40 . The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and loads the substrate W on the substrate loading unit PASS1 .

The substrate W loaded on the substrate mounting part PASS1 is received by the first master robot MR1 of the first processing block 11, and then loaded on the substrate mounting part PASS3. The substrate W placed on the substrate loading unit PASS3 is received by the second main robot MR2 of the second processing block 12, and then carried into the end surface cleaning unit SSB. Then, the substrate W after the end surface cleaning process is carried out from the end surface cleaning unit SSB by the second main robot MR2 , and then carried into the reversing unit RT1 .

In the reversing unit RT1 , the substrate W whose surface faces upward is reversed so that the back surface of the substrate faces upward. The reversed substrate W is carried out from the reversing unit RT1 by the second main robot MR2, and then carried into the rear surface cleaning unit SSR. Then, the substrate W after the backside cleaning process is carried out from the backside cleaning unit SSR by the second main robot MR2, and then carried into the reversing unit RT2.

In the reversing unit RT2 , the substrate W whose rear surface faces upward is reversed so that the surface of the substrate faces upward. The reversed substrate W is carried out from the reversing unit RT2 by the first master robot MR1 in the first processing area 11, and then carried into the surface cleaning unit SS. The substrate W subjected to the surface cleaning process is carried out from the surface cleaning unit SS by the first main robot MR1 , and then loaded on the substrate loading unit PASS2 . The substrate W loaded on the substrate loading unit PASS2 is received by the indexer robot IR of the indexer block 10 and accommodated in the carrier C. As shown in FIG.

In the substrate processing apparatus 100b, the number of transfer processes for a substrate W by the first main robot MR1 is the following three processes: the transfer from the substrate loading part PASS1 to the substrate loading part PASS3; the transfer from the reversing unit RT2 to the surface cleaning unit SS. transport; and transport from the surface cleaning unit SS to the substrate loading unit PASS2.

In addition, the number of conveying procedures for a substrate W by the second master manipulator MR2 is as follows: conveying from the substrate loading part PASS3 to the end surface cleaning unit SSB; conveying from the end surface cleaning unit SSB to the reversing unit RT1; transferring from the reversing unit Transfer from RT1 to back cleaning unit SSR; and transfer from back cleaning unit SSR to turning unit RT2.

At this time, the number of transfer steps of the second main robot MR2 is larger than the number of transfer steps of the first main robot MR1 . Therefore, the processing capacity of the entire substrate processing apparatus 100b depends on the transfer speed of the substrate W by the second master robot MR2.

(3-3) Effects of the third embodiment

Similar to the first embodiment, in this embodiment, the substrate W transfer time can be shortened by simultaneously performing the transfer of the substrate W in the first processing area 11 and the transfer of the substrate W in the second processing area 12 . Thereby, the processing capacity in the substrate processing apparatus 100b can be improved.

In addition, in the present embodiment, after the substrate W is subjected to the end surface cleaning treatment, the substrate W is subjected to the back surface cleaning treatment. As a result, even if suction marks are formed on the back surface of the substrate W during the end surface treatment, the suction marks can be eliminated by the subsequent back cleaning process. In addition, since the mechanical spin chuck is used in the surface cleaning unit SS, even if the surface cleaning treatment is performed after the back surface cleaning treatment, no suction marks are formed again on the back surface of the substrate W.

(3-4) Modified example of the third embodiment

In the substrate processing apparatus 100b of the third embodiment, the reversing units RT1a, RT2a shown in the above-mentioned second embodiment may be used instead of the reversing units RT1, RT2. In this case, since a plurality of substrates W can be efficiently reversed, it is possible to improve the throughput of the substrate processing apparatus 100b.

In addition, by providing two substrate mounts PASS1 , PASS2 , and PASS3 , and simultaneously transporting two substrates W similarly to the above-mentioned second embodiment, the throughput of the substrate processing apparatus 100 b can be further improved.

(4) Fourth Embodiment

Next, differences from the first embodiment described above will be described with respect to the substrate processing apparatus in the fourth embodiment of the present invention.

(4-1) Structure of substrate processing apparatus

18 and 19 are schematic diagrams showing the structure of a substrate processing apparatus in a fourth embodiment. Fig. 18 is a plan view of the substrate processing apparatus. FIG. 19 is a side view of the substrate processing apparatus in FIG. 18 viewed from the direction of arrow B2.

As shown in FIGS. 18 and 19 , in the substrate processing apparatus 100c in the fourth embodiment, a plurality (eight in FIG. 19 ) of backside cleaning units SSR are provided in the first processing area 11 . A plurality of back cleaning units SSR are arranged in four stacked layers on one side and the other side of the first processing block 11 , respectively.

A plurality of (eight in FIG. 19 ) surface cleaning units SS are provided in the second processing area 12 . The plurality of surface cleaning units SS are arranged in four stacked layers on one side and the other side of the second processing block 12 , respectively.

(4-2) Outline of operation of substrate processing equipment

Next, the operation of the substrate processing apparatus 100c will be described with reference to FIGS. 18 and 19 .

First, in the indexer area 10 , the indexer robot IR takes out an unprocessed substrate W from one carrier C loaded on the carrier loading table 40 . The indexer robot IR rotates around the vertical axis while moving in the arrow U direction, and transfers the substrate W to the reversing unit RT1. At this moment, the surface of the substrate W faces upward.

In the reversing unit RT1 , the substrate W is reversed so that its back faces upward. The reversed substrate W is carried out from the reversing unit RT1 by the first master robot MR1 of the first processing area 11, and then carried into the rear surface cleaning unit SSR. Then, the substrate W is subjected to a backside cleaning process in the backside cleaning unit SSR. The substrate W after the backside cleaning process is carried out from the backside cleaning unit SSR by the first main robot MR1, and then carried into the reversing unit RT2.

In the reversing unit RT2 , the substrate W whose rear surface faces upward is reversed so that the front face faces upward. The flipped substrate W is carried out from the flipping unit RT2 by the second master robot MR2 in the second processing area 12, and then carried into the surface cleaning unit SS. Then, the substrate W is subjected to surface cleaning treatment in the surface cleaning unit SS. In addition, in the surface cleaning unit SS, either one of the suction type spin chuck 61 ( FIG. 10 ) and the mechanical type spin chuck 81 ( FIG. 11 ) may be used. However, by employing the suction-type spin chuck 61, the peripheral portion and the outer peripheral end portion of the substrate W can be simultaneously cleaned in the surface cleaning unit SS.

The substrate W after the surface cleaning process is carried out from the surface cleaning unit SS by the second main robot MR2, and then loaded on the substrate loading part PASS2. The substrate W loaded on the substrate mounting part PASS2 is received by the main robot MR1 in the first processing area, and then loaded on the substrate mounting part PASS1 . The substrate W loaded on the substrate loading unit PASS1 is received by the indexer robot IR of the indexer block 10 and accommodated in the carrier C. As shown in FIG.

(4-3) Action of the main manipulator

(4-3-1) Operation example of the first master robot

Next, a specific operation example of the first master robot MR1 will be described with reference to FIG. 18 .

First, the first master robot MR1 unloads the unprocessed substrate W with the back facing upward from the reversing unit RT1 by the hand MRH2. Next, the first master robot MR1 unloads the substrate W after the backside cleaning process from any one of the backside cleaning units SSR through the hand MRH1, and carries the above-mentioned unprocessed substrate W held by the hand MRH2 into the backside cleaning unit SSR. . Next, the first main robot MR1 uses the hand MRH2 to carry out the substrate W with the surface facing upward from the substrate mounting part PASS2 . This substrate W is a substrate W that has undergone a backside cleaning process and a surface cleaning process.

Next, the first master robot MR1 carries the substrate W held by the hand MRH1 after the backside cleaning process into the reversing unit RT2. Next, the first master robot MR1 loads the substrate W that has undergone the backside cleaning process and the surface cleaning process held by the hand MRH2 on the substrate mounter PASS1 .

The first master robot MR1 continuously performs such a series of operations. In addition, in the above operation example, the operation of the hand MRH1 and the operation of the hand MRH2 may be reversed.

The number of transfer procedures for a substrate W by the first master manipulator MR1 is the following three procedures: transfer from the reversing unit RT1 to the rear cleaning unit SSR; transfer from the rear cleaning unit SSR to the reversing unit RT2; and transfer from the substrate loading unit PASS2 to Transport of board loading section PASS1.

(4-3-2) Action of the second main manipulator

Next, a specific operation example of the second master manipulator MR2 will be described with reference to FIG. 18 .

The second main robot MR2 first unloads the substrate W after the backside cleaning process with the surface facing upward from the reversing unit RT2 by the hand MRH4. Next, the second main robot MR2 unloads the substrate W subjected to the surface cleaning process from any one of the surface cleaning units SS through the hand MRH3, and carries the substrate W held by the hand MRH4 into the surface cleaning unit SS. Next, the second main robot MR2 loads the surface-cleaned substrate W held by the hand MRH3 on the substrate mounting unit PASS2 .

The second master manipulator MR2 continuously performs such a series of operations. In addition, in the above-mentioned operation example, the operation of the hand MRH3 and the operation of the hand MRH4 may be reversed.

The number of transfer processes for one substrate W by the second main robot MR2 is the following two processes: transfer from the reversing unit RT2 to the surface cleaning unit SS; and transfer from the surface cleaning unit SS to the substrate loading unit PASS2.

Such an operation of the second master robot MR2 is performed simultaneously with the above-mentioned operation of the first master robot MR1. In this embodiment, the number of conveyance steps of the substrate W by the second main robot MR2 is smaller than the number of conveyance steps of the substrate W by the first main robot MR1 . Therefore, the processing capacity of the entire substrate processing apparatus 100c depends on the transfer speed of the substrate W by the first master robot MR1.

(4-4) Effects of the fourth embodiment

In this embodiment, a first master manipulator MR1 is set in the first processing area 11 , and a second master manipulator MR2 is set in the second processing area 12 . In this case, the transfer of the substrate W in the first processing area 11 and the transfer of the substrate W in the second processing area 12 can be performed simultaneously. As a result, the transport time of the substrate W can be shortened, and thus the processing capacity of the substrate processing apparatus 100c can be improved.

In addition, the reversing unit RT1 is disposed between the indexer robot IR and the first main manipulator MR1 , while the reversing unit RT2 is disposed between the first main manipulator MR1 and the second main manipulator MR2 . In this case, the substrate W can be transferred from the indexer robot IR to the first main robot MR1 while inverting the substrate W. Similarly, the substrate W can be transferred from the first main robot MR1 to the second main robot MR2 while inverting the substrate W. Thereby, compared with the case where the first and second main robots MR1 and MR2 respectively load and unload substrates to the reversing units RT1 and RT2 , it is possible to reduce the transport steps of the first and second main robots MR1 and MR2 . Therefore, the processing capacity of the substrate processing apparatus 100c can be further improved.

In addition, in the substrate processing apparatus 100c of this embodiment, a plurality of backside cleaning units SSR are arranged in multiple layers on one side surface and the other side surface side of the first processing area 11, and on one side surface of the second processing area 12 A plurality of surface cleaning units SS are arranged in multiple layers on one side and the other side surface. Thereby, compared with the case where a plurality of cleaning units are arranged in a planar manner, further miniaturization and space saving of the substrate processing apparatus 100c can be achieved.

In addition, in this embodiment, the substrate W before the backside cleaning process and the substrate W after the backside cleaning process are turned over by mutually different reversing units RT1 and RT2 . At this time, even if the back surface of the substrate W before the back cleaning process is contaminated, the contaminants are not transferred to the substrate W after the back cleaning process. Thereby, the back surface of the substrate W after the back cleaning process can be maintained in a clean state.

In addition, in this embodiment, by stacking a plurality of surface cleaning units SS and a plurality of back surface cleaning units SSR in the height direction, it is possible to realize the structure of the substrate processing apparatus 100c (so-called stage structure) and at the same time, since the surface cleaning unit SS and the back surface cleaning unit SSR are arranged in the above-mentioned height direction, the required number of surface cleaning units SS and the required number of rear surface cleaning units SSR can be easily provided.

(5) Fifth Embodiment

Next, differences from the above-mentioned fourth embodiment will be described with respect to the substrate processing apparatus in the fifth embodiment of the present invention.

20 is a schematic cross-sectional view of a substrate processing apparatus in a fifth embodiment. As shown in FIG. 20 , a substrate processing apparatus 100 d in the fifth embodiment includes reversing units RT1 a and RT2 a shown in FIGS. 13A and 13B instead of reversing units RT1 and RT2 . In addition, two substrate mounts PASS1 and PASS2 are respectively provided.

(5-1) Outline of operation of substrate processing equipment

Next, an outline of the operation of the substrate processing apparatus 100d will be described with reference to FIG. 20 .

First, in the indexer area, the indexer robot IR takes out two unprocessed substrates W from one of the carriers C loaded on the carrier loading table 40 using the hands IRH1 and IRH2 . Next, the indexer mechanical IR sequentially transfers the two substrates W held by the hands IRH1 and IRH2 to the reversing unit RT1a.

In the reversing unit RT1a, the two unprocessed substrates W whose surfaces face upward are reversed so that their back faces face upward. The operation of the reversing unit RT1a will be described later.

Next, the first main robot MR1 in the first processing block 11 simultaneously unloads the two substrates W whose back faces are facing upward from the reversing unit RT1 a by using the hands MRH1 and MRH2 . Next, the first main robot MR1 sequentially carries the two substrates W held by the hands MRH1 and MRH2 into the two rear surface cleaning units SSR ( FIG. 18 ). Next, the first main robot MR1 uses the hands MRH1 and MRH2 to sequentially unload the two substrates W after the back cleaning process from the two back cleaning units SSR.

Next, the first main robot MR1 simultaneously carries the two substrates W, which have undergone the backside cleaning process, held by the hands MRH1 and MRH2 into the reversing unit RT2a. In the reversing unit RT2a, the two substrates W whose back faces are turned upward are turned so that the surfaces thereof face upward. The operation of the reversing unit RT2a will be described later.

Next, the second main robot MR2 in the second processing block 12 simultaneously unloads the two substrates W whose surfaces face upward from the reversing unit RT2 a by using the hands MRH3 and MRH4 . Next, the second main robot MR2 sequentially carries the two substrates W held by the hands MRH3 and MRH4 into the two surface cleaning units SS ( FIG. 18 ). Next, the second main robot MR2 uses the hands MRH3 and MRH4 to sequentially unload the two substrates W subjected to the surface cleaning process from the two surface cleaning units SS.

Next, the second main robot MR2 sequentially loads the two substrates W held by the hands MRH3 and MRH4 on the two substrate mounts PASS2 . Next, the first main robot MR1 of the first processing block 11 sequentially receives the two substrates W loaded on the two substrate loading parts PASS2 with the hands MRH1 and MRH2 . Next, the first main robot MR1 sequentially loads two substrates W on the two substrate loading parts PASS1. Next, the indexer robot IR of the indexer block 10 receives the two substrates W loaded on the two substrate loading parts PASS1, and accommodates them in the carrier C. FIG. Thus, a series of operations of the substrate processing apparatus 100d in the fifth embodiment is completed.

(5-2) Operation of flip unit

Next, the operation of the reversing units RT1a, RT2a will be described. 21A, 21B, 21C, 21D, and 22E, 22F, and 22G are diagrams for explaining the operation of the reversing units RT1a and RT2a. In addition, since the actions of each process of the reversing unit RT1a and RT2a are the same, in FIG. 21A, FIG. 21B, FIG. 21C, FIG. 21D, and FIG. 22E, FIG. 22F, and FIG. illustrate.

As shown in FIG. 21A , the hands MRH1 , MRH2 of the first master robot MR1 holding the substrate W advance between the first movable plate 36 a and the fixed plate 32 and between the second movable plate 36 b and the fixed plate 32 simultaneously. In addition, the advancing and retreating directions of the hands MRH1 and MRH2 of the first master manipulator MR1 perpendicularly intersect with the direction of the arrow U ( FIG. 18 ). In addition, the support pins 39a, 39b, 39c, and 39d of the reversing units RT1a, RT2a are provided at positions where they do not come into contact with the hands IRH1, IRH2, MRH1, MRH2, and hands MRH3, MRH4, respectively, when loading and unloading the substrate W.

Then, as shown in FIG. 21B , the hands MRH1 , MRH2 move backward while falling simultaneously. Thus, the substrate W is loaded on the support pins 39a, 39d. At this time, in the reversing unit RT2a, the substrate W whose back surface faces upward is loaded on the support pins 39a, 39d.

Next, as shown in FIG. 21C, the air cylinder 37a (FIG. 13A) lowers the supporting member 35a, and at the same time, the air cylinder 37b (FIG. 13A) raises the supporting member 35b. Thus, one substrate W is held by the support pins 39c of the first movable plate 36a and the support pins 39a of the fixed plate 32, while the other substrate W is held by the support pins 39d of the second movable plate 36b and the support pins of the fixed plate 32. 39b remains.

In this state, as shown in FIG. 21D , the first movable plate 36 a , the fixed plate 32 and the second movable plate 36 b are driven by the rotary driver 38 to integrally rotate 180 degrees in the θ direction (around the horizontal axis HA). Thereby, the substrate W held by the support pins 39a and 39c and the substrate W held by the support pins 39b and 39d are turned over. In this case, in the reversing unit RT2a, the surface of the substrate W faces upward.

Next, as shown in FIG. 22E, the air cylinder 37a lowers the supporting member 35a, and at the same time, the air cylinder 37b raises the supporting member 35b. Accordingly, the second movable plate 36b rises while the first movable plate 36a descends. Therefore, one substrate W is supported by the support pins 39 c of the first movable plate 36 a, and the other substrate W is supported by the support pins 39 b of the fixed plate 32 .

In this state, as shown in FIG. 22F , the hands MRH3 and MRH4 of the second master robot MR2 move upward while advancing downward of the substrate W supported by the support pin 39 b and downward of the substrate W supported by the support pin 39 c. . Accordingly, the substrate W supported by the support pins 39 b is received by the hand MRH3 , and the substrate W supported by the support pins 39 c is received by the hand MRH4 . In addition, the advancing and retreating directions of the hands MRH3 and MRH4 of the second master manipulator MR2 perpendicularly intersect with the direction of the arrow U ( FIG. 18 ).

Then, as shown in FIG. 22G , the two substrates W are carried out from the reversing unit RT2 a by moving the hands MRH3 and MRH4 back simultaneously.

(5-3) Effects of the fifth embodiment

In this embodiment, the first and second main robots MR1 and MR2 simultaneously carry in and out two substrates W to the reversing units RT1a and RT2a. Furthermore, the reversing units RT1a and RT2a reverse the two substrates W at the same time. Accordingly, it is possible to efficiently invert a plurality of substrates. As a result, the throughput of the substrate processing apparatus 100d can be improved.

In addition, since the indexer robot IR, the first main robot MR1 , and the second main robot MR2 simultaneously transport two substrates W, the processing capacity of the substrate processing apparatus 100 d can be further improved.

(6) Sixth Embodiment

Next, differences from the aforementioned fourth embodiment will be described with respect to the substrate processing apparatus in the sixth embodiment of the present invention.

(6-1) Structure of substrate processing apparatus

23 and 24 are schematic diagrams showing the configuration of a substrate processing apparatus in a sixth embodiment. FIG. 23 is a plan view of the substrate processing apparatus, and FIG. 24 is a sectional view taken along line A3-A3 of FIG. 23 .

As shown in FIG. 23 , in the substrate processing apparatus 100e of the sixth embodiment, a plurality of (for example, eight) surface cleaning units SS are provided in the first processing area 11 . In addition, multiple (for example, 8) backside cleaning units SSR are provided in the second processing area 12 . In addition, as shown in FIG. 24 , between the indexer area 10 and the first processing area 11, there are substrate loading parts PASS1 and PASS2 up and down, and between the first processing area 11 and the second processing area 12, an inverting unit is arranged up and down. RT1, RT2.

(6-2) Outline of operation of substrate processing equipment

Next, an outline of the operation of the substrate processing apparatus 100e will be described with reference to FIGS. 23 and 24 .

First, in the indexer area 10 , the indexer robot IR takes out an unprocessed substrate W from one carrier C loaded on the carrier loading table 40 . The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and loads the substrate W on the substrate loading unit PASS1 .

The substrate W loaded on the substrate loading unit PASS1 is received by the first master robot MR1 of the first processing block 11, and then carried into the surface cleaning unit SS. Then, the substrate W after the surface cleaning process is carried out from the surface cleaning unit SS by the first main robot MR1 , and then carried into the reversing unit RT1 .

In the reversing unit RT1 , the substrate W whose surface faces upward is reversed so that the back surface of the substrate faces upward. The reversed substrate W is carried out from the reversing unit RT1 by the second master robot MR2 in the second processing area 12, and then carried into the rear surface cleaning unit SSR. Then, the substrate W after the backside cleaning process is carried out from the backside cleaning unit SSR by the second main robot MR2, and then carried into the reversing unit RT2.

In the reversing unit RT2 , the substrate W whose rear surface faces upward is reversed so that the surface of the substrate faces upward. The reversed substrate W is carried out from the reversing unit RT2 by the first main robot MR1 of the first processing area 11 , and then loaded on the substrate loading part PASS2 . The substrate W loaded on the substrate loading unit PASS2 is received by the indexer robot IR of the indexer block 10 and accommodated in the carrier C. As shown in FIG.

In the substrate processing apparatus 100e, the number of transfer processes for a substrate W by the first master robot MR1 is as follows: the transfer from the substrate loading part PASS1 to the surface cleaning unit SS; the transfer from the surface cleaning unit SS to the reversing unit RT1 transport; and transport from the reversing unit RT2 to the substrate loading section PASS2.

In addition, the number of transfer processes for one substrate W by the second main robot MR2 is the following two processes: transfer from the reversing unit RT1 to the back cleaning unit SSR; and transfer from the back cleaning unit SSR to the reversing unit RT2.

Similar to the fourth embodiment described above, the number of conveyance steps of the substrate W by the second main robot MR2 is smaller than the number of conveyance steps of the substrate W by the first main robot MR1 . Therefore, the processing capacity of the entire substrate processing apparatus 100 e depends on the transfer speed of the substrate W by the first master robot MR1 .

(6-3) Effects of the sixth embodiment

In this embodiment, the transfer of the substrate W in the first processing area 11 and the transfer of the substrate W in the second processing area 12 can be performed simultaneously, thereby shortening the transfer time of the substrate W and improving the performance of the substrate processing apparatus 100e. processing power.

In addition, by installing the reversing units RT1 and RT2 at positions between the first main robot MR1 and the second main robot MR2, it is possible to turn over the substrate W while turning over the substrate W between the first main robot MR1 and the second main robot MR2. Hand over the substrate W. Thereby, compared with the case where the first and second main manipulators MR1 and MR2 carry in and out the substrate W to and from the reversing units RT1 and RT2, respectively, the number of transport steps of the first and second main manipulators MR1 and MR2 can be further reduced. Therefore, the processing capability of the substrate processing apparatus 100e can be further improved.

(6-4) Modification of the sixth embodiment

In the substrate processing apparatus 100e of the sixth embodiment, the reversing units RT1a, RT2a shown in the above-mentioned second embodiment may be used instead of the reversing units RT1, RT2. In this case, since a plurality of substrates W can be efficiently reversed, the processing capacity of the substrate processing apparatus 100e can be improved.

In addition, by providing two substrate loading parts PASS1 and PASS2 respectively, and transporting two substrates W at the same time as in the above-mentioned second embodiment, the processing capacity of the substrate processing apparatus 100e can be further improved.

(7) Seventh Embodiment

Next, differences from the above-mentioned fourth embodiment will be described with respect to the substrate processing apparatus in the seventh embodiment of the present invention.

(7-1) Structure of substrate processing apparatus

25 and 26 are schematic diagrams showing the structure of a substrate processing apparatus in a seventh embodiment. FIG. 25 is a plan view of the substrate processing apparatus, and FIG. 26 is a sectional view taken along line A4-A4 of FIG. 25 . As shown in FIG. 25 and FIG. 26 , in the substrate processing apparatus 100f of the seventh embodiment, substrate loading parts PASS1 and PASS2 are arranged up and down between the indexer block 10 and the first processing block 11 , and between the first processing block 11 and the first processing block 11 . Between the second processing area 12, substrate mounting parts PASS3 and PASS4 having the same structure as the substrate mounting parts PASS1 and PASS2 are arranged up and down. In addition, on one side of the first processing area 11 and the second processing area 12, reversing units RT1 and RT2 are arranged up and down.

(7-2) Outline of operation of substrate processing equipment

Next, an outline of the operation of the substrate processing apparatus 100f will be described with reference to FIGS. 25 and 26 . First, in the indexer area 10 , the indexer robot IR takes out an unprocessed substrate W from one carrier C loaded on the carrier loading table 40 . The indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and loads the substrate W on the substrate loading unit PASS1 .

The substrate W loaded on the substrate mount PASS1 is received by the first master robot MR1 of the first processing block 11 , and then loaded on the substrate mount PASS3 . The substrate W loaded on the substrate loading unit PASS3 is received by the second master robot MR2 of the second processing area 12, and then carried into the reversing unit RT1.

In the reversing unit RT1 , the substrate W whose surface faces upward is reversed so that the back surface of the substrate faces upward. The reversed substrate W is carried out from the reversing unit RT1 by the second main robot MR2, and then carried into the rear surface cleaning unit SSR. Then, the substrate W after the backside cleaning process is carried out from the backside cleaning unit SSR by the second main robot MR2, and then carried into the reversing unit RT2.

In the reversing unit RT2 , the substrate W whose rear surface faces upward is reversed so that the surface of the substrate faces upward. The reversed substrate W is carried out from the reversing unit RT2 by the second main robot MR2 , and then placed on the substrate loading unit PASS4 . The substrate W loaded on the substrate loading unit PASS4 is received by the first master robot MR1 of the first processing block 11, and then carried into the surface cleaning unit SS.

Then, the substrate W subjected to the surface cleaning process is carried out from the surface cleaning unit SS by the first main robot MR1 , and then loaded on the substrate loading unit PASS2 . The substrate W loaded on the substrate loading unit PASS2 is received by the indexer robot IR of the indexer block 10 and accommodated in the carrier C. As shown in FIG.

(7-3) Effects of the seventh embodiment

In this embodiment, the transfer of the substrate W in the first processing area 11 and the transfer of the substrate W in the second processing area 12 can be performed simultaneously. Accordingly, since the conveyance time of the substrate W can be shortened, the processing capacity of the substrate processing apparatus 100f can be improved.

(7-4) Modified example of the seventh embodiment

In the substrate processing apparatus 100f of the seventh embodiment, the reversing units RT1a, RT2a shown in the above-mentioned second embodiment may be used instead of the reversing units RT1, RT2. In this case, since a plurality of substrates W can be efficiently reversed, the throughput of the substrate processing apparatus 100f can be improved.

In addition, by providing two substrate loaders PASS1 , PASS2 , PASS3 , and PASS4 , and simultaneously transporting two substrates W similarly to the second embodiment, the throughput of the substrate processing apparatus 100 f can be further improved.

(8) Other implementations

In the above-mentioned first embodiment, the unprocessed substrate W is transported from the indexer area 10 to the second processing area 12 via the substrate loading parts PASS1 and PASS2, but it is not limited thereto, and may be transferred from the indexer area via the reversing units RT1 and RT2. 10 is transported to the second processing area 12.

In addition, in the above-mentioned third embodiment, the surface cleaning treatment of the substrate W is performed after the end surface cleaning treatment and the back surface cleaning treatment of the substrate W are performed, but it is not limited to this, and the substrate W is cleaned after the surface treatment of the substrate W. End surface cleaning treatment and back surface cleaning treatment of the substrate W are also possible.

In addition, in the above-mentioned third, sixth and seventh embodiments, the substrate W before the back cleaning treatment is turned over by the turning unit RT1, and the substrate W after the back cleaning treatment is turned over by the turning unit RT2, but Not only limited thereto, the substrate W before the backside cleaning process and the substrate W after the backside cleaning process may be turned over by a common inversion unit.

In addition, in the first to third embodiments described above, the arrangement of the surface cleaning unit SS, the back surface cleaning unit SSR, and the end surface cleaning unit SSB can be appropriately changed according to the processing speed. For example, the end surface cleaning unit SSB may be installed in the first processing area 11, or the surface cleaning unit SS and the back surface cleaning unit SSR may be installed in a common processing area.

In addition, in the above-mentioned fourth embodiment, the substrate W after the surface cleaning process is transported from the second processing area 12 to the indexer area 10 via the substrate loading parts PASS1 and PASS2, but it is not limited thereto, and may be transferred via the reversing unit RT1, RT2 is transported from the second processing area 12 to the indexer area 10 .

In addition, in the fourth to seventh embodiments described above, the order of the surface cleaning treatment and the back surface cleaning treatment may be reversed.

In addition, in the above-mentioned fourth to seventh embodiments, the action sequence of the indexer robot IR and the main robots MR1 and MR2 can be adjusted according to the processing speeds of the reversing units RT1 and RT2, the surface cleaning unit SS, the back surface cleaning unit SSR and the end surface cleaning unit SSB. Appropriate changes.

In addition, the respective numbers of the reversing units RT1, RT2, RT1a, RT2a, the surface cleaning unit SS, the back surface cleaning unit SSR, and the end surface cleaning unit SSB can be appropriately changed according to the processing speed.

In addition, in the above-mentioned first to seventh embodiments, as the indexer robot IR and the main robots MR1 and MR2 , the articulated transfer robot in which the hands move forward and backward along a straight line by moving the joints is used, but the present invention is not limited to Here, a direct motion transfer robot that moves forward and backward by sliding its hand along a straight line with respect to the substrate W may be used.

(9) Correspondence between each constituent element of the present invention and each element of the embodiment

Hereinafter, an example of correspondence between each component of the present invention and each component of the embodiment will be described, but the present invention is not limited thereto.

In the above-described embodiment, the first processing area 11 is an example of the first processing area, the second processing area 12 is an example of the second processing area, and the indexer area 10 is an example of the loading and unloading area. The indexer 10 and the first The area between the processing areas 11 is an example of a first transfer area or a first transfer portion, and the area between the first processing area 11 and the second processing area 12 is an example of a second transfer area or a second transfer portion.

In addition, an example in which at least one of the surface cleaning unit SS, the back surface cleaning unit SSR, and the end surface cleaning unit SSB is the first or second processing unit is shown. The first master robot MR1 is an example of the first transport device, and the second The master robot MR2 is an example of the second conveying device, the carrier C is an example of a storage container, the carrier loading table 40 is an example of a container loading unit, and the indexer robot IR is an example of a third conveying device.

In addition, an example in which the end face cleaning unit SSB is an end face cleaning processing part is shown, a back cleaning unit SSR is an example in which a back cleaning processing part is shown, a surface cleaning unit SS is an example in which a surface cleaning processing part is performed, and the reversing units RT1, RT2, RT1a, RT1b is an example of a (first or second) inversion device or an inversion mechanism, and the substrate loading sections PASS1 , PASS2 , PASS3 , and PASS4 (first or second) are examples of substrate loading sections.

In addition, an example in which the fixed plate 32, the first movable plate 36a, the support pins 39a, 39c, and the cylinder 37a are the first holding mechanism is shown, and the fixed plate 32, the second movable plate 36b, the support pins 39b, 39d, and the cylinder 37b are As an example of the second holding mechanism, the supporting plate 31 is an example of a supporting member, the rotary driver 38 is an example of a rotating device, the fixed plate 32 is an example of a common flip holding member, the supporting pin 39a is an example of a first supporting part, the first The movable plate 36a is an example of a first flip holding member, the support pin 39c is an example of a second support portion, the cylinder 37a is an example of a first drive mechanism, the support pin 39b is an example of a third support portion, and the second movable plate 36b is an example of a second inversion holding member, the support pin 39d is an example of a fourth support portion, and the cylinder 37b is an example of a second drive mechanism.

In addition, as each constituent element of the present invention, other various elements having the structure or performance described in the present invention can also be adopted.

Claims (26)

1. A substrate processing apparatus for processing a substrate having a front surface and a back surface, comprising:

first and second processing regions disposed adjacent to each other for processing a substrate;

a carrying-in and carrying-out area for carrying in and carrying out the substrate to and from the first processing area;

a first delivery area provided between the carry-in/out area and the first processing area;

a second handover area provided between the first processing area and the second processing area; wherein,

the first processing region includes:

a first processing unit;

a first transfer device that transfers substrates among the first transfer area, the first processing unit, and the second transfer area;

the second processing region includes:

a second processing unit;

a second transfer device that transfers the substrate between the second transfer area and the second processing unit;

the carrying-in and carrying-out area includes:

a container loading section for loading a receiving container for receiving a substrate;

a third conveyance device that conveys a substrate between the accommodation container loaded on the container loading unit and the first transfer area;

the first transfer area includes a first substrate loading unit for loading a substrate and a first inverting device for inverting the front and back surfaces of the substrate,

the second transfer area has a second substrate loading part for loading the substrate and a second reversing device for reversing the front and back surfaces of the substrate,

the first processing unit has a back surface cleaning processing unit for cleaning the back surface of the substrate,

the second processing unit has an end surface cleaning processing unit for cleaning the outer peripheral end of the substrate while holding the back surface of the substrate and a surface cleaning processing unit for cleaning the surface of the substrate,

the first transfer device transfers substrates among the first substrate loading unit, the second substrate loading unit, the first inverting device, the second inverting device, and the back surface cleaning unit,

the second transfer device transfers substrates among the second substrate loading unit, the second inverting unit, the end surface cleaning unit, and the surface cleaning unit,

the third transfer device transfers substrates among the storage container, the first substrate loading unit, and the first inverting device,

the second inverting unit inverts the front surface and the back surface of the substrate after the cleaning by the end surface cleaning processing unit,

the back surface cleaning processing unit cleans the back surface of the substrate after the inversion by the second inverting unit.

2. The substrate processing apparatus of claim 1,

the end surface cleaning processing section includes a plurality of end surface cleaning units arranged in a multi-layer form, and the back surface cleaning processing section includes a plurality of back surface cleaning units arranged in a multi-layer form.

3. The substrate processing apparatus of claim 1,

the surface cleaning treatment section includes a plurality of surface cleaning units arranged in a multi-layer form.

4. The substrate processing apparatus of claim 1,

the first reversing device reverses the substrate around a rotation axis intersecting a connecting line between a position of the first conveying device and a position of the third conveying device when the substrate is transferred; the second inverting unit inverts the substrate around a rotation axis intersecting with a connection line between the position of the first conveying unit and the position of the second conveying unit when the substrate is transferred.

5. The substrate processing apparatus according to claim 1, wherein the inverting device comprises:

a first holding mechanism for holding the substrate in a state perpendicular to a first axis;

a second holding mechanism for holding the substrate in a state perpendicular to the first axis;

a support member for supporting the first and second holding mechanisms so as to overlap each other in the direction of the first axis;

and a rotating device that integrally rotates the support member together with the first and second holding members around a second axis that is substantially perpendicular to the first axis.

6. The substrate processing apparatus of claim 5,

the first and second holding mechanisms have a common reverse holding member having one surface perpendicular to the first axis and the other surface,

the first holding mechanism includes:

a plurality of first support portions provided on the one surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a first inversion holding member provided to face the one surface of the common inversion holding member;

a plurality of second support portions provided on a surface of the first inversion holding member facing the common inversion holding member, and configured to support an outer peripheral portion of the substrate;

a first drive mechanism that moves at least one of the first inversion holding member and the common inversion holding member so as to selectively shift between a state in which the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the first inversion holding member and the common inversion holding member are close to each other; and also

The second holding mechanism includes:

a plurality of third support portions provided on the other surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a second inversion holding member provided to face the other surface of the common inversion holding member;

a plurality of fourth support portions provided on a surface of the second inversion holding member facing the common inversion holding member, the fourth support portions supporting an outer peripheral portion of the substrate;

and a second driving mechanism that moves at least one of the second inversion holding member and the common inversion holding member so as to selectively shift between a state in which the second inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the second inversion holding member and the common inversion holding member are close to each other.

7. A substrate processing apparatus for processing a substrate having a front surface and a back surface, comprising:

first and second processing regions disposed adjacent to each other for processing a substrate;

a carrying-in and carrying-out area for carrying in and carrying out the substrate to and from the first processing area;

a first delivery area provided between the carry-in/out area and the first processing area;

a second handover area provided between the first processing area and the second processing area; wherein,

the first processing region includes:

a first processing unit;

a first transfer device that transfers substrates among the first transfer area, the first processing unit, and the second transfer area;

the second processing region includes:

a second processing unit;

a second transfer device that transfers the substrate between the second transfer area and the second processing unit;

the carrying-in and carrying-out area includes:

a container loading section for loading a receiving container for receiving a substrate;

a third conveyance device that conveys a substrate between the accommodation container loaded on the container loading unit and the first transfer area;

the first cross-connecting area has a first substrate loading part for loading a substrate,

the second transfer area has a second substrate loading part for loading the substrate and a reversing device for reversing the front and back surfaces of the substrate,

the first processing unit has a surface cleaning processing unit for cleaning the surface of the substrate,

the second processing unit has an end surface cleaning processing unit for cleaning the outer peripheral end of the substrate while holding the back surface of the substrate and a back surface cleaning processing unit for cleaning the back surface of the substrate,

the first transfer device transfers substrates among the first substrate loading unit, the second substrate loading unit, the inverting device, and the surface cleaning unit,

the second transfer device transfers substrates among the second substrate loading unit, the reversing device, the end surface cleaning unit, and the back surface cleaning unit,

the third transfer device transfers the substrate between the storage container and the first substrate loading part,

the inverting device inverts the front surface and the back surface of the substrate after the cleaning by the end surface cleaning processing section,

the back surface cleaning processing unit cleans the back surface of the substrate after the inversion by the inverting unit.

8. The substrate processing apparatus of claim 7,

the turnover device turns over the substrate around a rotation axis intersecting with a connection line between the position of the first conveyance device and the position of the second conveyance device when the substrate is transferred.

9. The substrate processing apparatus according to claim 7, wherein the inverting device comprises:

a first holding mechanism for holding the substrate in a state perpendicular to a first axis;

a second holding mechanism for holding the substrate in a state perpendicular to the first axis;

a support member for supporting the first and second holding mechanisms so as to overlap each other in the direction of the first axis;

and a rotating device that integrally rotates the support member together with the first and second holding members around a second axis that is substantially perpendicular to the first axis.

10. The substrate processing apparatus of claim 9,

the first and second holding mechanisms have a common reverse holding member having one surface perpendicular to the first axis and the other surface,

the first holding mechanism includes:

a plurality of first support portions provided on the one surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a first inversion holding member provided to face the one surface of the common inversion holding member;

a plurality of second support portions provided on a surface of the first inversion holding member facing the common inversion holding member, and configured to support an outer peripheral portion of the substrate;

a first drive mechanism that moves at least one of the first inversion holding member and the common inversion holding member so as to selectively shift between a state in which the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the first inversion holding member and the common inversion holding member are close to each other; and also

The second holding mechanism includes:

a plurality of third support portions provided on the other surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a second inversion holding member provided to face the other surface of the common inversion holding member;

a plurality of fourth support portions provided on a surface of the second inversion holding member facing the common inversion holding member, the fourth support portions supporting an outer peripheral portion of the substrate;

and a second driving mechanism that moves at least one of the second inversion holding member and the common inversion holding member so as to selectively shift between a state in which the second inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the second inversion holding member and the common inversion holding member are close to each other.

11. A substrate processing apparatus for processing a substrate having a front surface and a back surface, comprising:

first and second processing regions disposed adjacent to each other for processing a substrate;

a carrying-in and carrying-out area for carrying in and carrying out the substrate to and from the first processing area;

a first delivery area provided between the carry-in/out area and the first processing area;

a second handover area provided between the first processing area and the second processing area; wherein,

the first processing region includes:

a first processing unit;

a first transfer device that transfers substrates among the first transfer area, the first processing unit, and the second transfer area;

the second processing region includes:

a second processing unit;

a second transfer device that transfers the substrate between the second transfer area and the second processing unit;

the carrying-in and carrying-out area includes:

a container loading section for loading a receiving container for receiving a substrate;

a third conveyance device that conveys a substrate between the accommodation container loaded on the container loading unit and the first transfer area;

the first interface area has a first substrate loading part for loading a substrate and a first reversing device for reversing the front and back surfaces of the substrate,

the second transfer area has a second substrate loading part for loading the substrate and a second inverting device for inverting the front and back surfaces of the substrate,

the first processing unit has a back surface cleaning processing unit for cleaning the back surface of the substrate,

the second processing unit has a surface cleaning processing unit for cleaning the surface of the substrate,

the first transfer device transfers substrates among the first substrate loading unit, the second substrate loading unit, the first inverting device, the second inverting device, and the back surface cleaning unit,

the second transfer device transfers substrates among the second substrate loading unit, the second inverting device, and the surface cleaning unit,

the third transfer device transfers substrates among the storage containers loaded on the container loading unit, the first substrate loading unit, and the first inverting unit.

12. The substrate processing apparatus of claim 11,

the back surface cleaning processing part comprises a plurality of back surface cleaning units arranged in a multi-layer form, and the surface cleaning processing part comprises a plurality of surface cleaning units arranged in a multi-layer form.

13. The substrate processing apparatus of claim 11,

the first inverting device inverts the substrate around a rotation axis intersecting with a connecting line between a position of the first carrying device and a position of the third carrying device at the time of transferring the substrate,

the second inverting unit inverts the substrate around a rotation axis intersecting with a connection line between the position of the first conveying unit and the position of the second conveying unit when the substrate is transferred.

14. The substrate processing apparatus according to claim 11, wherein the inverting device comprises:

a first holding mechanism for holding the substrate in a state perpendicular to a first axis;

a second holding mechanism for holding the substrate in a state perpendicular to the first axis;

a support member for supporting the first and second holding mechanisms so as to overlap each other in the direction of the first axis;

and a rotating device that integrally rotates the support member together with the first and second holding members around a second axis that is substantially perpendicular to the first axis.

15. The substrate processing apparatus of claim 14,

the first and second holding mechanisms have a common reverse holding member having one surface perpendicular to the first axis and the other surface,

the first holding mechanism includes:

a plurality of first support portions provided on the one surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a first inversion holding member provided to face the one surface of the common inversion holding member;

a plurality of second support portions provided on a surface of the first inversion holding member facing the common inversion holding member, and configured to support an outer peripheral portion of the substrate;

a first drive mechanism that moves at least one of the first inversion holding member and the common inversion holding member so as to selectively shift between a state in which the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the first inversion holding member and the common inversion holding member are close to each other; and also

The second holding mechanism includes:

a plurality of third support portions provided on the other surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a second inversion holding member provided to face the other surface of the common inversion holding member;

a plurality of fourth support portions provided on a surface of the second inversion holding member facing the common inversion holding member, the fourth support portions supporting an outer peripheral portion of the substrate;

and a second driving mechanism that moves at least one of the second inversion holding member and the common inversion holding member so as to selectively shift between a state in which the second inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the second inversion holding member and the common inversion holding member are close to each other.

16. A substrate processing apparatus for processing a substrate having a front surface and a back surface, comprising:

first and second processing regions disposed adjacent to each other for processing a substrate;

a carrying-in and carrying-out area for carrying in and carrying out the substrate to and from the first processing area;

a first delivery area provided between the carry-in/out area and the first processing area;

a second handover area provided between the first processing area and the second processing area; wherein,

the first processing region includes:

a first processing unit;

a first transfer device that transfers substrates among the first transfer area, the first processing unit, and the second transfer area;

the second processing region includes:

a second processing unit;

a second transfer device that transfers the substrate between the second transfer area and the second processing unit;

the carrying-in and carrying-out area includes:

a container loading section for loading a receiving container for receiving a substrate;

a third conveyance device that conveys a substrate between the accommodation container loaded on the container loading unit and the first transfer area;

the first cross-connecting area has a first substrate loading part for loading a substrate,

the second interface area has a turnover device for turning over the front and back surfaces of the substrate,

the first processing unit has a surface cleaning processing unit for cleaning the surface of the substrate,

the second processing unit has a back surface cleaning processing unit for cleaning the back surface of the substrate,

the first transfer device transfers substrates among the first substrate loading unit, the inverting device, and the surface cleaning unit,

the second transfer device transfers the substrate between the reversing device and the back surface cleaning processing part,

the third transfer device transfers substrates between the accommodating containers loaded on the container loading unit and the first substrate loading unit.

17. The substrate processing apparatus of claim 16,

the turnover device turns over the substrate around a rotation axis intersecting with a connection line between the position of the first conveyance device and the position of the second conveyance device when the substrate is transferred.

18. The substrate processing apparatus of claim 16,

the turning device has a first and a second turning device arranged up and down.

19. The substrate processing apparatus of claim 18,

the first inverting unit inverts the substrate before the substrate is cleaned by the backside cleaning processing unit, and the second inverting unit inverts the substrate after the substrate is cleaned by the backside cleaning processing unit.

20. The substrate processing apparatus according to claim 16, wherein the inverting device comprises:

a first holding mechanism for holding the substrate in a state perpendicular to a first axis;

a second holding mechanism for holding the substrate in a state perpendicular to the first axis;

a support member for supporting the first and second holding mechanisms so as to overlap each other in the direction of the first axis;

and a rotating device that integrally rotates the support member together with the first and second holding members around a second axis that is substantially perpendicular to the first axis.

21. The substrate processing apparatus of claim 20,

the first and second holding mechanisms have a common reverse holding member having one surface perpendicular to the first axis and the other surface,

the first holding mechanism includes:

a plurality of first support portions provided on the one surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a first inversion holding member provided to face the one surface of the common inversion holding member;

a plurality of second support portions provided on a surface of the first inversion holding member facing the common inversion holding member, and configured to support an outer peripheral portion of the substrate;

a first drive mechanism that moves at least one of the first inversion holding member and the common inversion holding member so as to selectively shift between a state in which the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the first inversion holding member and the common inversion holding member are close to each other; and also

The second holding mechanism includes:

a plurality of third support portions provided on the other surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a second inversion holding member provided to face the other surface of the common inversion holding member;

a plurality of fourth support portions provided on a surface of the second inversion holding member facing the common inversion holding member, the fourth support portions supporting an outer peripheral portion of the substrate;

and a second driving mechanism that moves at least one of the second inversion holding member and the common inversion holding member so as to selectively shift between a state in which the second inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the second inversion holding member and the common inversion holding member are close to each other.

22. A substrate processing apparatus for processing a substrate having a front surface and a back surface, comprising:

first and second processing regions disposed adjacent to each other for processing a substrate;

a carrying-in and carrying-out area for carrying in and carrying out the substrate to and from the first processing area;

a first delivery area provided between the carry-in/out area and the first processing area;

a second handover area provided between the first processing area and the second processing area; wherein,

the first processing region includes:

a first processing unit;

a first transfer device that transfers substrates among the first transfer area, the first processing unit, and the second transfer area;

the second processing region includes:

a second processing unit;

a second transfer device that transfers the substrate between the second transfer area and the second processing unit;

the carrying-in and carrying-out area includes:

a container loading section for loading a receiving container for receiving a substrate;

a third conveyance device that conveys a substrate between the accommodation container loaded on the container loading unit and the first transfer area;

the first cross-connecting area has a first substrate loading part for loading a substrate,

the second interface area has a second substrate loading part for loading a substrate,

the second transfer device has a reversing device for reversing the front and back surfaces of the substrate in a region opposite to the second transfer region,

the first processing unit has a surface cleaning processing unit for cleaning the surface of the substrate,

the second processing unit has a back surface cleaning processing unit for cleaning the back surface of the substrate,

the first transfer device transfers substrates among the first substrate loading unit, the second substrate loading unit, and the surface cleaning unit,

the second transfer device transfers substrates among the second substrate loading unit, the reversing device, and the back surface cleaning unit,

the third transfer device transfers substrates between the accommodating containers loaded on the container loading unit and the first substrate loading unit.

23. The substrate processing apparatus of claim 22,

the turning device has a first and a second turning device arranged up and down.

24. The substrate processing apparatus of claim 23,

the first inverting unit inverts the substrate before the substrate is cleaned by the backside cleaning processing unit, and the second inverting unit inverts the substrate after the substrate is cleaned by the backside cleaning processing unit.

25. The substrate processing apparatus according to claim 22, wherein the inverting device comprises:

a first holding mechanism for holding the substrate in a state perpendicular to a first axis;

a second holding mechanism for holding the substrate in a state perpendicular to the first axis;

a support member for supporting the first and second holding mechanisms so as to overlap each other in the direction of the first axis;

and a rotating device that integrally rotates the support member together with the first and second holding members around a second axis that is substantially perpendicular to the first axis.

26. The substrate processing apparatus of claim 25,

the first and second holding mechanisms have a common reverse holding member having one surface perpendicular to the first axis and the other surface,

the first holding mechanism includes:

a plurality of first support portions provided on the one surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a first inversion holding member provided to face the one surface of the common inversion holding member;

a plurality of second support portions provided on a surface of the first inversion holding member facing the common inversion holding member, and configured to support an outer peripheral portion of the substrate;

a first drive mechanism that moves at least one of the first inversion holding member and the common inversion holding member so as to selectively shift between a state in which the first inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the first inversion holding member and the common inversion holding member are close to each other; and also

The second holding mechanism includes:

a plurality of third support portions provided on the other surface of the common inversion holding member and supporting an outer peripheral portion of the substrate;

a second inversion holding member provided to face the other surface of the common inversion holding member;

a plurality of fourth support portions provided on a surface of the second inversion holding member facing the common inversion holding member, the fourth support portions supporting an outer peripheral portion of the substrate;

and a second driving mechanism that moves at least one of the second inversion holding member and the common inversion holding member so as to selectively shift between a state in which the second inversion holding member and the common inversion holding member are separated from each other in the direction of the first axis and a state in which the second inversion holding member and the common inversion holding member are close to each other.

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