CN100573339C - The real-time detecting and correcting device and the method for object plane image planes position - Google Patents
The real-time detecting and correcting device and the method for object plane image planes position Download PDFInfo
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- CN100573339C CN100573339C CNB200810032842XA CN200810032842A CN100573339C CN 100573339 C CN100573339 C CN 100573339C CN B200810032842X A CNB200810032842X A CN B200810032842XA CN 200810032842 A CN200810032842 A CN 200810032842A CN 100573339 C CN100573339 C CN 100573339C
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Abstract
The invention provides the real-time detecting and correcting device and the method for a kind of object plane image planes position, described device comprises luminous source system, the projection objective imaging system, be used to support and the mask platform of permanent mask version and be used to support and the work stage of fixed wafer, described detecting and correcting device also comprises the projection objective imaging system top sensor that is used to monitor the object plane position, and the projection objective imaging system bottom sensor that is used to monitor the image planes position, described method monitoring different projection objective imaging system top sensor and bottom sensor measurement results constantly, by comparing object plane image planes position constantly with initial alignment, calculating can get different moment object plane image planes drift values, and optical projection system object plane image planes position is proofreaied and correct in real time.By detecting and correcting device of the present invention and method, can measure the relative position of object plane to be measured, image planes and lens, effectively revise projection objective system object plane and image planes drift value in the lithographic equipment.
Description
Technical field
The present invention relates to lithographic equipment, specifically, is a kind of real-time detecting and correcting device and method of object plane image planes position of lithographic equipment.
Background technology
Lithographic equipment is mainly used in the manufacturing of integrated circuit (IC) or other microdevice.By lithographic equipment, mask graph can be imaged on the wafer that is coated with photoresist, for example semiconductor wafer or LCD plate.Lithographic equipment exposes by projection objective, the mask graph of design is transferred on the photoresist, and as the core parts of lithographic equipment, the object plane of projection objective and mirror position has material impact to the optical patterning quality.
In order to obtain best imaging effect, in the time of exposure, the mask graph lower surface need place object lens optimal object plane height, and the upper wafer surface that scribbles photoresist need place best image planes height.Therefore, in the system integration stage, need critically to determine object lens optimal object plane and best image planes position.
General known method is the precision that guarantees object plane or image planes by mechanical frock mode.For example, introduced by designing special mask in No. 20030211411 patent of the U.S. and determined the position of image planes.Similarly, also disclosed the relevant information of more determining the image planes position in the U.S. No. 20040241558, No. 20060103836 and No. 20060250598 patent by the method for exposure.In addition, No. 20070260419 patent of the U.S. also introduced the position of determining object plane by the method for measuring the position of the aerial image of specific markers on the mask.Yet mechanical installation accuracy is generally micron dimension, for further improving precision, can increase the processed complex degree, also can significantly increase manufacturing cost.Utilize the method for exposure or measurement space image position,, can get the preferable relatively object plane of image quality (or image planes) position by step-searching in certain scope.But it is exposure method process complexity, and time-consuming longer.What is more important, it is all relatively poor that mechanical means or exposure method are measured real-time, particularly for object plane or the comparatively frequent application scenario of image planes shift in position, integrated debugging stage for example, this shortcoming is particularly evident, not only reduce production efficiency greatly, also the lithographic equipment image quality is affected greatly.
Summary of the invention
Fundamental purpose of the present invention is to provide the real-time detecting and correcting method and the device of a kind of object plane image planes position, it is by placing the vertical position survey sensor of projection objective top and bottom respectively, measure the relative position of object plane to be measured, image planes and lens, effectively revise projection objective system object plane, image planes drift value in the lithographic equipment, thereby measure optical projection system object plane, image planes position comparatively easily in real time, and proofread and correct object plane, image planes deviation.
For achieving the above object, the invention provides the real-time detecting and correcting device of a kind of object plane image planes position, it comprises luminous source system, projection objective imaging system, be used to support and the mask platform of permanent mask version and be used to support and the work stage of fixed wafer, it is characterized in that, the real-time detecting and correcting device of described object plane image planes position also comprises the projection objective imaging system top sensor that is used to monitor the object plane position, and the projection objective imaging system bottom sensor that is used to monitor the image planes position.Wherein, described top sensor is drifted about with respect to the projection objective top by monitoring the vertical zero plane of described mask platform in real time, thereby proofreaies and correct the object plane deviation; Described bottom sensor is drifted about with respect to the projection objective bottom by monitoring the vertical zero plane of described work stage in real time, thereby proofreaies and correct the image planes deviation.
The present invention also provides the real-time detecting and correcting method of a kind of object plane image planes position, it is by monitoring different projection objective imaging system top sensor and bottom sensor measurement results constantly, by comparing object plane image planes position constantly with initial alignment, calculating can get different moment object planes and image planes drift value, and optical projection system object plane and image planes position are proofreaied and correct in real time.
The real-time detecting and correcting method of object plane image planes of the present invention position and device are by measuring the relative position of object plane to be measured, image planes and lens, effectively revise projection objective system object plane, image planes drift value in the lithographic equipment, thereby measure optical projection system object plane, image planes position comparatively easily in real time, and proofread and correct object plane, image planes deviation.
Description of drawings
To the description of a preferred embodiment of the present invention, can further understand purpose, specific structural features and the advantage of its invention by following in conjunction with its accompanying drawing.Wherein, accompanying drawing is:
Fig. 1 is for using an example of lithographic apparatus structural drawing of the present invention;
Fig. 2 is for using an example of projection objective object plane image planes location measurement method of the present invention;
Fig. 3 is for using another example of projection objective object plane location measurement method of the present invention.
Embodiment
Fig. 1 is the synoptic diagram of the real-time detecting and correcting device of the object plane image planes position that gets of preferred embodiment according to the present invention, the real-time detecting and correcting device of object plane image planes of the present invention position comprises: produced and the transmission electromagnetic energy by lighting source 1, expose to the mask 2 of mask platform 3 clampings.Through projection objective 5, the circuitous pattern on the mask 2 images in the photoresist of wafer 7 upper surfaces, work stage 8 clampings and drive wafer 7 finish level to and catenary motion.The wafer 7 of finishing exposure is behind chemical treating process, and the figure transfer on the mask 2 is to the photoresist on wafer 7 surfaces.Projection objective top sensor 4 can be measured the relative distance at mask platform 3 and projection objective 5 tops, but the relative distance of projection objective bottom sensor 6 measuring workpieces platforms 8 and projection objective 5 bottoms.Mask platform motion controller 9 and work stage motion controller 10 are handled mask platform 3 and work stage 8 three-dimensional motions respectively.Known for the skilled person of relevant field of lithography, for obtaining expectation exposure result,, need to select the kind of photoresist at the certain electric magnetic energy that lighting source 1 produces, and the processing procedure after the strict control exposure.
In the real-time detecting and correcting device of object plane image planes of the present invention position, vertical zero plane with mask platform controller 9 is a benchmark, can describe the optimal object plane position of projection objective 5, be benchmark with the vertical zero plane of work stage controller 10, can describe the best image planes position of projection objective 5.In the actual light etching system, be subjected to the influence such as working environments such as temperature, pressure, the position of the vertical zero plane of controller may drift about, and causes thus the object plane and the image planes location of optical projection system are produced error.The real-time detecting and correcting device of object plane image planes of the present invention position is characterised in that: by projection objective top sensor 4, monitor mask platform 3 vertical zero planes in real time with respect to the drift of lens top, thereby proofread and correct the object plane deviation; By projection objective bottom sensor 6, monitoring workpiece platform 8 vertical zero planes drift about with respect to the lens bottom in real time, thereby proofread and correct the image planes deviation.
Fig. 2 is according to a preferred embodiment of the invention and the synoptic diagram of the real-time detecting and correcting method of the object plane image planes position that gets.Utilize exposure method can determine projection objective object plane 12 and image planes 18, if initial alignment (t0 constantly) optimal object plane height (being positioned at optimal object plane position mask platform with respect to vertical sensor zero plane 14 distances of mask platform motion controller) constantly is u0, best image planes height (being positioned at best image planes position work stage with respect to vertical sensor zero plane 20 distances of work stage motion controller) is v0, the mask platform lower surface position that top sensor zero plane 15 records is b0, and the work stage upper surface position that bottom sensor zero plane 16 records is c0.After experience a period of time (t1 constantly), the vertical controller of mask platform is measured zero plane and is drifted to plane 13, and the vertical controller of work stage is measured zero plane and drifted to plane 19.Control mask platform and the vertical height of work stage respectively with aforementioned measurement result u0, v0, then the mask platform physical location is 11, and the work stage physical location is 17.The mask platform lower surface position 11 that this moment, top sensor recorded is b1, and the work stage upper surface position 16 that bottom sensor records is c1.Draw easily, this moment, the object plane position excursion was (b1-b0), and the image planes position excursion is (c1-c0), therefore, and the corresponding u0-(b1-b0) of actual object plane, the corresponding v0+ (c1-c0) of actual image planes.
Although the present invention is especially in conjunction with utilizing Apparatus and method for of the present invention in the integrated circuit manufacturing, for the personnel institute of relevant field of lithography is understood easily, this Apparatus and method for can be widely used in the optical system that other can be integrated.
Similar to Example 1, the another kind of possible case that embodiment 2 considers in the actual light engraving device, the lens top sensor is measured zero plane and actual object plane is offset synchronously, Fig. 3 is according to another embodiment of the present invention and the synoptic diagram of the real-time detecting and correcting method of the object plane position that gets, wherein, 21 planes are corresponding to t2 object plane position constantly, and 22 planes are corresponding to the vertical zero-plane position of mask platform motion controller.In the t2 moment, to t0 moment optimal object plane, the height tolerance that this moment, the lens top sensor recorded is (b2-b0) with the vertical sensor location mask of mask platform platform height, so the constantly actual object plane correspondence of t2 u0-(b2-b0).
Similarly, the correcting lens bottom sensor is measured the drift value of zero plane and actual image planes in real time, and measuring method does not repeat them here with top description.
In conjunction with the embodiments 1 and embodiment 2, the image error that can proofread and correct the measuring error that produces because of the drift of the vertical sensor measurement zero plane of mask platform simultaneously and produce because of actual object plane position excursion, the also measuring error that produces because of the vertical sensor measurement zero plane drift of work stage of recoverable and the image error that produces because of actual image planes position excursion.Measuring method does not repeat them here with top description.
Of particular note, the real-time detecting and correcting device of object plane image planes of the present invention position and method are not limited to step execution sequence defined in the foregoing description, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement the present invention, and not breaking away from the spirit and scope of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (2)
1, the real-time detecting and correcting device of a kind of object plane image planes position, it comprises luminous source system, the projection objective imaging system, be used to support and the mask platform of permanent mask version and be used to support and the work stage of fixed wafer, it is characterized in that, the real-time detecting and correcting device of described object plane image planes position also comprises the projection objective imaging system top sensor that is used to monitor the object plane position, and the projection objective imaging system bottom sensor that is used to monitor the image planes position, described top sensor is drifted about with respect to the projection objective top by monitoring the vertical zero plane of described mask platform in real time, thereby proofread and correct the object plane deviation, described bottom sensor is drifted about with respect to the projection objective bottom by monitoring the vertical zero plane of described work stage in real time, thereby proofreaies and correct the image planes deviation.
2, the real-time detecting and correcting method of a kind of object plane image planes position, it is characterized in that: the real-time detecting and correcting device that utilizes the described object plane image planes of claim 1 position, monitoring different projection objective imaging system top sensor and bottom sensor measurement results constantly, by comparing object plane image planes position constantly with initial alignment, calculate different object plane and image planes drift values constantly, and optical projection system object plane and image planes position are proofreaied and correct in real time.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102169293B (en) * | 2010-02-26 | 2012-11-14 | 上海微电子装备有限公司 | Method for adjusting parallelism of measurement light paths of workpiece table and mask table |
| CN102566296B (en) * | 2010-12-31 | 2014-07-16 | 上海微电子装备有限公司 | Integration assembly method for photoetching exposure system |
| CN102289153B (en) * | 2011-05-31 | 2013-03-13 | 合肥芯硕半导体有限公司 | Method for measuring steady state stability of plate-making etching equipment |
| CN104901586B (en) * | 2014-03-03 | 2018-01-19 | 上海微电子装备（集团）股份有限公司 | Levitation planar motor |
| CN104977809B (en) * | 2014-04-08 | 2017-06-27 | 上海微电子装备有限公司 | A kind of vertical control parameter calibration method of litho machine |
| CN109425292B (en) * | 2017-08-29 | 2020-06-16 | 西安知微传感技术有限公司 | Three-dimensional measurement system calibration device and method based on one-dimensional line structured light |
| CN111624731B (en) * | 2019-02-28 | 2021-12-10 | 上海微电子装备（集团）股份有限公司 | Objective lens device |
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|---|---|---|---|---|
| US5894132A (en) * | 1996-03-22 | 1999-04-13 | Nikon Corporation | Charged-particle-beam projection-exposure apparatus with focus and tilt adjustments |
| CN1348602A (en) * | 1998-11-18 | 2002-05-08 | 株式会社尼康 | Exposure method and device |
| CN101042539A (en) * | 2006-12-22 | 2007-09-26 | 上海微电子装备有限公司 | Hanger bearing image-forming system and light scribing device |
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- 2008-01-21 CN CNB200810032842XA patent/CN100573339C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5894132A (en) * | 1996-03-22 | 1999-04-13 | Nikon Corporation | Charged-particle-beam projection-exposure apparatus with focus and tilt adjustments |
| CN1348602A (en) * | 1998-11-18 | 2002-05-08 | 株式会社尼康 | Exposure method and device |
| CN101042539A (en) * | 2006-12-22 | 2007-09-26 | 上海微电子装备有限公司 | Hanger bearing image-forming system and light scribing device |
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Address after: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Zhangjiang High Tech Park, Shanghai, Zhang Dong Road, No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |
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