CN100569059C - electronic device with wireless communication function - Google Patents

Abstract

An electronic device with wireless communication function comprises a first circuit board and a second circuit board. The first circuit board has a first feed pad and a first short-circuit pad on its first surface, and has a signal conductor and a grounding area, wherein the first feed pad is electrically connected to the signal conductor, and the first short-circuit pad is electrically connected to the grounding area. In addition, the second circuit board has a second feed pad and a second short-circuit pad on its second surface, and the second surface faces the first surface, and a radiation conductor is provided on a third surface of the second circuit board opposite to the second surface, wherein the second feed pad is electrically connected to the radiation conductor and is bonded to the first feed pad, and the second short-circuit pad is electrically connected to the radiation conductor and is bonded to the first short-circuit pad.

Description

Electronic device with wireless communication function

technical field

The invention relates to an electronic device, and in particular to an electronic device with a wireless communication function.

Background technique

In recent years, with the rapid development of electronic technology, the size of electronic devices and electronic components has become smaller and smaller. As far as wireless communication technology is concerned, in order to meet the requirements of miniaturization and high-efficiency resonance bandwidth (large effect resonant bandwidth), antennas (antenna) used in wireless communication functions must be reduced in size and improved in performance.

A known conventional antenna is usually printed directly on the motherboard, or connected to the motherboard through an additional metal sheet protruding from the antenna itself. However, the above-mentioned conventional antennas still have a large size or occupy a large space, and the performance is not ideal.

In order to reduce the size of the antenna, a planar inverted-F antenna (Planer Inverted-F Antenna, hereinafter referred to as PIFA) has also been developed in the known technology. The above-mentioned PIFA includes a radiating patch, a feed via, a shorting via and a ground plane, wherein the radiating patch is a signal source (such as a signal wire) connected to the main board through the feeding channel. , and connected to the ground plane via a short circuit.

As far as a known PIFA is concerned, the radiation sheet, short-circuit channel and ground plane of the PIFA are composed of a single metal piece. Since there must be a predetermined distance between the radiation sheet and the ground plane, when the ground plane of the metal piece is joined When it comes to the circuit board, if you want to increase the operating bandwidth of the PIFA, you must increase the distance between the radiation sheet and the ground plane, and thus increase the thickness of the electronic device, which is not conducive to the thinning of the electronic device.

Contents of the invention

The purpose of the present invention is to provide an electronic device with a wireless communication function to increase the bandwidth of the wireless communication.

Another object of the present invention is to provide an electronic device with wireless communication function for reducing the thickness of its antenna element.

Based on the above and other objectives of the present invention, the present invention provides an electronic device with a wireless communication function, which includes a first circuit board and a second circuit board. The first surface of the first circuit board has a first feeding pad and a first shorting pad, and has a signal wire and a grounding area, wherein the first feeding pad is electrically connected to the signal wire, and the first shorting pad is electrically connected to the grounding pad. area. In addition, a second feed-in pad and a second shorting pad are provided on the second surface of the second circuit board, and the second surface faces the first surface, and a third surface of the second circuit board opposite to the second surface has The radiating wire, wherein the second feeding pad is electrically connected to the radiating wire and bonded to the first feeding pad, and the second shorting pad is electrically connected to the radiating wire and bonded to the first shorting pad. Wherein, the first circuit board also has a first feed-in channel, and the first feed-in pad is electrically connected to the signal wire via the first feed-in channel, the first circuit board also has a first short-circuit channel, and The first short-circuit pad is electrically connected to the grounding area through the first short-circuit channel, the second circuit board also has a second feed-in channel, and the second feed-in pad is electrically connected to the ground area through the second feed-in channel. The radiating wire, the second circuit board further has a second short circuit, and the second short pad is electrically connected to the radiating wire through the second short circuit.

According to an embodiment of the present invention, the above-mentioned grounding area may be located on a fourth surface of the first circuit board opposite to the first surface.

According to an embodiment of the present invention, the above-mentioned second feeding pad can be joined to the first feeding pad by welding. In addition, the above-mentioned second shorting pad can be joined to the first shorting pad by welding.

According to the embodiment of the present invention, the above-mentioned second circuit board can also be disposed on the first surface of the first circuit board by welding.

According to the embodiment of the present invention, the above-mentioned signal wires may be high-frequency signal wires, and are electrically connected to the high-frequency signal area of the first circuit board.

Based on the above, the present invention integrates a plurality of components of the PIFA into two overlapping circuit boards, and makes the maximum distance between the radiating wire and the grounding area (that is, the grounding plane of the known PIFA) equal to that of these circuit boards. Thickness and, and by adjusting the thickness of these circuit boards to change the spacing between the radiator and the grounding area, in order to achieve the required operating bandwidth.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are described below in detail with accompanying drawings.

Description of drawings

FIG. 1 is an exploded perspective view of parts of an electronic device with a wireless communication function according to an embodiment of the present invention.

FIG. 2 is a three-dimensional assembled view of parts of the electronic device of FIG. 1 .

Instructions for marking of main components

100: Electronics

110: First circuit board

110a: first surface

110b: fourth surface

112a: First Feed Pad

112b: first shorting pad

114: signal wire

116: Grounding area

118a: first feed channel

118b: first short-circuit channel

120: Second circuit board

120a: second surface

120b: third surface

122a: Second Feed Pad

122b: second shorting pad

124: Radiating wire

128a: Second feed channel

128b: Second short-circuit channel

Detailed ways

FIG. 1 is an exploded perspective view of parts of an electronic device with a wireless communication function according to an embodiment of the present invention, and FIG. 2 is a perspective assembly diagram of parts of the electronic device of FIG. 1 . Please refer to FIG. 1 and FIG. 2, the electronic device 100 with wireless communication function of the present embodiment includes a first circuit board 110 and a second circuit board 120, wherein the first circuit board 110 can be used as a component carrier, and The second circuit board 120 is used as an antenna component.

The first surface 110a of the first circuit board 110 has a first feed pad 112a and a first shorting pad 112b. In addition, the first circuit board 110 also has a signal wire 114 , and the first feeding pad 112 a is also electrically connected to the signal wire 114 . The above-mentioned signal wire 114 is, for example, a high-frequency signal wire, and is electrically connected to a high-frequency signal area (not shown in the figure) of the first circuit board 110 . In order to electrically connect the first feed-in pad 112a to the signal conductor 114, the first circuit board 110 may also have a first feed-in channel (feed via) 118a, and the first feed-in pad 112a is electrically connected via the first feed-in channel 118a. Connect to signal lead 114 .

The first circuit board 110 also has a ground plane 116 , which may be a ground plane already present on the first circuit board 110 , and the first short pad 112 b is also electrically connected to the ground plane 116 . In this embodiment, the ground area 116 is located on the fourth surface 110 b of the first circuit board 110 opposite to the first surface 110 a, or may be located inside the first circuit board 110 . In order to electrically connect the first shorting pad 112b to the grounding area 116, the first circuit board 110 may also have a first shorting via (shorting via) 118b, and the first shorting pad 112b is electrically connected to the grounding area via the first shorting via 118b 116.

The second surface 120 a of the second circuit board 120 has a second feeding pad 122 a and a second shorting pad 122 b , wherein the surface 120 a of the second circuit board 120 is opposite to the first surface 110 a of the first circuit board 110 . In addition, the third surface 120 b of the second circuit board 120 opposite to the second surface 120 a further has a radiating patch 124 , and the second feeding pad 122 a is also electrically connected to the radiating patch 124 . In this embodiment, the radiating wire 124 may be curved or in other shapes, and the shape or pattern of the radiating wire 124 will be determined according to the required performance of wireless communication.

In order to electrically connect the second feeding pad 122a to the radiation wire 124, the second circuit board 120 may further have a second feeding channel 128a, and the second feeding pad 122a is electrically connected to the radiation wire through the second feeding channel 128a. 124. In addition, in order to electrically connect the second shorting pad 122b to the radiation wire 124, the second circuit board 120 further has a second shorting channel 128b, and the second shorting pad 122b is electrically connected to the radiation wire 124 through the second shorting channel 128b.

When the second circuit board 120 is arranged on the first surface 110a of the first circuit board 110, and the second surface 120a of the second circuit board 120 is attached to the first surface 110a of the first circuit board 110, the second feed The input pad 122a is bonded to the first feed-in pad 112a, and the second shorting pad 122b is also bonded to the first shorting pad 112b. In this embodiment, the second circuit board 120 can be disposed on the first surface 110a of the first circuit board 110 by soldering, and the second feed-in pad 122a can also be joined to the first feed-in pad 112a by soldering. , and the second shorting pad 122b can also be joined to the first shorting pad 112b by welding.

After the second circuit board 120 is assembled to the first circuit board 110, the radiation wire 124 will pass through the second feeding channel 128a, the second feeding pad 122a, the first feeding pad 112a and the first feeding channel 118a in sequence. , and is electrically connected to the signal wire 114 . At the same time, the radiation wire 124 can also be electrically connected to the grounding area 116 through the second short circuit 128b, the second short pad 122b, the first short pad 112b and the first short circuit 118b in sequence.

In summary, compared with a known design form in which metal parts constitute the radiating sheet, short-circuit channel and ground plane of the PIFA, and the ground plane of the metal part is bonded to the circuit board, the present invention combines multiple PIFA The components are integrated into two overlapping circuit boards, and the maximum distance between the radiating conductor and the grounding area (that is, the ground plane of the known PIFA) can be equal to the sum of the thicknesses of these circuit boards, and can be adjusted by adjusting the thickness of these circuit boards. Vary the spacing between the radiator and the ground plane to achieve the desired operating bandwidth.

In addition, the present invention can also set the grounding area inside the circuit board, or on one side of the circuit board. Under the condition of the same operating bandwidth, compared with the conventional design of PIFA with metal parts, the distance between the radiation wire and the grounding area of the present invention is smaller, thus contributing to the thinning of the electronic device.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (6)

1. An electronic device with a wireless communication function, characterized in that it comprises: The first circuit board has a signal wire and a grounding area, and has a first feeding pad and a first shorting pad on the first surface of the first circuit board, wherein the first feeding pad is electrically connected to the signal wire, and the the first shorting pad is electrically connected to the ground area; and The second circuit board has a second feeding pad and a second shorting pad on the second surface of the second circuit board, and the second surface faces the first surface, and the second circuit board is opposite to the The third surface of the second surface has a radiating wire, wherein the second feeding pad is electrically connected to the radiating wire and bonded to the first feeding pad, and the second shorting pad is electrically connected to the radiating wire and bonded to the first feeding pad. to the first shorting pad, Wherein, the first circuit board also has a first feed-in channel, and the first feed-in pad is electrically connected to the signal wire via the first feed-in channel, the first circuit board also has a first short-circuit channel, and The first short-circuit pad is electrically connected to the grounding area through the first short-circuit channel, the second circuit board also has a second feed-in channel, and the second feed-in pad is electrically connected to the ground area through the second feed-in channel. The radiating wire, the second circuit board further has a second short circuit, and the second short pad is electrically connected to the radiating wire through the second short circuit. 2. The electronic device with wireless communication function according to claim 1, wherein the grounding area is located on a fourth surface of the first circuit board opposite to the first surface. 3. The electronic device with wireless communication function as claimed in claim 1, wherein the second feeding pad is soldered to the first feeding pad. 4. The electronic device with wireless communication function according to claim 1, wherein the second shorting pad is welded to the first shorting pad. 5. The electronic device with wireless communication function according to claim 1, wherein the second circuit board is soldered to the first surface of the first circuit board. 6 . The electronic device with wireless communication function according to claim 1 , wherein the signal wire is a high-frequency signal wire and is electrically connected to the high-frequency signal area of the first circuit board.

Images