CN100563801C - A kind of preparation method of multi-channel hydrogen permeable palladium composite membrane - Google Patents
A kind of preparation method of multi-channel hydrogen permeable palladium composite membrane Download PDFInfo
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技术领域: Technical field:
本发明涉及一种多通道型钯复合膜的制备方法,所制备的钯膜能提供更大的膜面积,特别适用于氢气膜分离器。The invention relates to a method for preparing a multi-channel palladium composite membrane. The prepared palladium membrane can provide a larger membrane area and is especially suitable for a hydrogen membrane separator.
背景技术: Background technique:
钯及钯合金膜具有优良的氢渗透性能,可用于氢气的分离和纯化。例如,钯银合金膜过滤法制取高纯氢的工艺已经有几十年的历史。近年的研发主要集中于钯复合膜,即将超薄钯膜沉积在多孔材料上以取代传统的自支持型钯膜。这样一方面可以大大降低膜厚度,节约了贵金属钯;另一方面还使氢气的渗透率得到大幅提高[黄彦,李雪,范益群,徐南平.透氢钯复合膜的研究进展:原理、制备与表征.化学进展,2006,18(2-3):230-238]。钯膜的载体材料有很多,但主要是多孔陶瓷管和多孔不锈钢管,其中又以前者应用最为广泛,这主要归功于其优异的化学稳定性和成熟的制备工艺。目前,多孔陶瓷管的主要用途是滤芯,它有单通道和多通道两种,其中,大规模商业过滤器所用的多孔陶瓷滤芯主要是多通道型,这显然是由于其单位体积滤芯能提供更高的过滤面。现有文献及专利报道中所涉及的钯膜陶瓷载体几乎都是单通道型的,钯膜或镀在陶瓷管外侧或镀在内侧。由于每根单通道型钯复合膜的膜面积有限,虽然可以简单通过增加膜管的数量来增大膜面积,但这又增大了膜管所占据的空间,提高了设备投资并增加了安装和监测的困难。基于以上原因,以多通道型多孔陶瓷为载体的新型钯膜将有更好的应用前景,其工作方式一般如图1所示。高压混合气从孔道的一端通入,氢气透过钯膜沿载体孔道壁逸出得到纯氢,残余气体从孔道另一端排出。Palladium and palladium alloy membranes have excellent hydrogen permeability and can be used for the separation and purification of hydrogen. For example, the process of producing high-purity hydrogen by palladium-silver alloy membrane filtration has a history of decades. Research and development in recent years has mainly focused on palladium composite membranes, that is, ultrathin palladium membranes deposited on porous materials to replace traditional self-supporting palladium membranes. In this way, on the one hand, the thickness of the membrane can be greatly reduced, saving precious metal palladium; on the other hand, the permeability of hydrogen gas has been greatly improved [Huang Yan, Li Xue, Fan Yiqun, Xu Nanping. Research progress of hydrogen permeable palladium composite membrane: principle, preparation and Characterization. Advances in Chemistry, 2006, 18(2-3): 230-238]. There are many carrier materials for palladium membranes, but they are mainly porous ceramic tubes and porous stainless steel tubes, among which the former is the most widely used, which is mainly due to its excellent chemical stability and mature preparation process. At present, the main use of porous ceramic tubes is filter elements, which have two types of single-channel and multi-channel. Among them, the porous ceramic filter elements used in large-scale commercial filters are mainly multi-channel, which is obviously due to the filter element per unit volume. High filter surface. The palladium film ceramic carriers involved in the existing literature and patent reports are almost all single-channel type, and the palladium film is either plated on the outside or inside of the ceramic tube. Since the membrane area of each single-channel palladium composite membrane is limited, although the membrane area can be increased simply by increasing the number of membrane tubes, this increases the space occupied by the membrane tubes, increases equipment investment and increases installation costs. and monitoring difficulties. Based on the above reasons, the new palladium membrane with multi-channel porous ceramics as the carrier will have a better application prospect, and its working method is generally shown in Figure 1. The high-pressure mixed gas is introduced from one end of the channel, the hydrogen gas escapes through the palladium membrane along the channel wall of the carrier to obtain pure hydrogen, and the residual gas is discharged from the other end of the channel.
由于多通道型钯膜的单位体积能提供更大的膜面积,从而可使氢气分离器在保证氢通量的同时体积更为小巧,尤其适用于便携式或现场制氢装置。另外,多通道型钯膜是内膜型,其超薄金属层在安装操作过程中不容易受损。但是,多通道陶瓷载体的通道具有巨大的长径比(即孔道长度与孔道直径之比),给钯膜的制备带来了巨大困难,因此,多通道型钯膜的制备是其能否得到成功应用的关键。Since the unit volume of the multi-channel palladium membrane can provide a larger membrane area, the hydrogen separator can be made smaller while ensuring the hydrogen flux, and is especially suitable for portable or on-site hydrogen production devices. In addition, the multi-channel type palladium membrane is an inner membrane type, and its ultra-thin metal layer is not easily damaged during mounting operations. However, the channel of the multichannel ceramic carrier has a huge aspect ratio (that is, the ratio of the length of the channel to the diameter of the channel), which brings great difficulties to the preparation of the palladium membrane. Therefore, the preparation of the multichannel palladium membrane is whether it can be obtained. key to successful application.
文献中关于负载型钯膜的制备工艺有很多,如化学镀法、电镀法、PVD法、CVD法、高速氧焰(HVOF)热喷涂法、磁控溅射法、等离子喷涂法、光催化法等等,其中,化学镀法已被公认为是最为成功的工艺。其原理是先在多孔陶瓷表面沉积一层金属微粒作为催化剂(即表面活化),浸入镀液后,在还原剂的作用下,这些催化剂可催化镀液中钯离子的还原并使生成的金属钯覆盖在这些催化剂微粒的表面,已生成的金属钯层仍可以继续催化上述反应从而引起钯层的生长增厚,直至反应停止。因此,化学镀又被称为自催化镀。化学镀一般包含载体的预处理、表面活化、化学镀、后处理等四个步骤。表面活化方法有很多,但绝大多数是在载体表面沉积金属钯微粒,比较常用的是SnCl2/PdCl2法。文献中多数采用了较高的化学镀温度,一方面会导致镀液中的氨水快速分解,另一方面会造成氨气和有毒联氨蒸汽的排放,造成环境污染;本专利针对多通道钯膜的化学镀制备中的关键问题,提出了行之有效的制备工艺。There are many preparation techniques for supported palladium films in the literature, such as electroless plating, electroplating, PVD, CVD, high velocity oxygen flame (HVOF) thermal spraying, magnetron sputtering, plasma spraying, and photocatalytic methods. etc. Among them, electroless plating has been recognized as the most successful process. The principle is to first deposit a layer of metal particles on the surface of porous ceramics as a catalyst (i.e., surface activation), and after immersing in the plating solution, under the action of a reducing agent, these catalysts can catalyze the reduction of palladium ions in the plating solution and make the generated metal palladium Covering the surface of these catalyst particles, the generated metal palladium layer can still continue to catalyze the above reaction, thereby causing the growth and thickening of the palladium layer until the reaction stops. Therefore, electroless plating is also called self-catalytic plating. Electroless plating generally includes four steps of carrier pretreatment, surface activation, electroless plating, and post-treatment. There are many surface activation methods, but most of them are to deposit metal palladium particles on the surface of the carrier, and the more commonly used method is the SnCl 2 /PdCl 2 method. Most of the literature adopts higher electroless plating temperature, on the one hand, it will lead to the rapid decomposition of ammonia water in the plating solution, on the other hand, it will cause the discharge of ammonia gas and toxic hydrazine vapor, causing environmental pollution; this patent is aimed at multi-channel palladium membrane The key issues in the preparation of electroless plating and an effective preparation process are proposed.
多孔陶瓷载体是多通道型,其通道细而长,镀膜难度大。所面临的问题主要有:钯离子和还原剂的传质问题容易导致钯膜孔口厚而中间薄、局部反应过速而导致钯沉淀的后果;反应过程中生成的大量氮气气泡附着于钯层表面,妨碍钯层的均匀生长;多孔载体在接触镀液后,其孔壁内会有镀液的进入,而且镀液中产生的气体如果不能及时排出,则会对通道表面的钯膜带来压力,轻则损害钯膜的附着力,重则导致钯膜的起泡甚至破裂。The porous ceramic carrier is a multi-channel type, and its channels are thin and long, making it difficult to coat. The main problems are: the mass transfer of palladium ions and reducing agents can easily lead to the thick orifice of the palladium membrane and the thin middle, and the local reaction is too fast, resulting in the precipitation of palladium; a large number of nitrogen bubbles generated during the reaction process adhere to the palladium layer surface, which hinders the uniform growth of the palladium layer; after the porous carrier contacts the plating solution, the plating solution will enter the hole wall, and if the gas generated in the plating solution cannot be discharged in time, it will bring the palladium film on the surface of the channel. The pressure will damage the adhesion of the palladium membrane in light cases, and cause blistering or even rupture of the palladium film in severe cases.
发明内容: Invention content:
本发明的目的为了克服现有技术化学镀需要较高的温度、有毒联氨蒸汽的排放、镀膜难度大等问题而提出了一种将载体外部包裹,镀液置于载体通道内侧的鼓泡式多通道型钯复合膜的制备方法。The purpose of the present invention is to overcome the problems of high temperature, toxic hydrazine vapor discharge, and difficult coating in the prior art, and propose a bubbling method in which the carrier is wrapped outside and the plating solution is placed inside the carrier channel. A method for preparing a multi-channel palladium composite membrane.
本发明的技术方案为:在化学镀过程中,反应生成氮气的排除可通过对镀液的强烈搅拌来实现,方法有机械搅拌,镀液的泵循环、载体的旋转。但是,常规的搅拌方式无法使细长通道内的镀液得到搅拌,显然不如载体沿轴向方向在镀液中往复运动造成的搅拌效果更好,因为这可以造成镀液对载体通道的快速冲刷,不仅保证了镀液浓度的均一性,更有利于反应生成的氮气气泡迅速离开金属表面。在化学镀期间,将载体外部包裹,镀液置于载体通道内侧,使镀液与载体通道形成良好的接触,镀液对载体孔道壁产生一定压力。The technical scheme of the present invention is: during the electroless plating process, the removal of the nitrogen generated by the reaction can be realized by vigorously stirring the plating solution, and the methods include mechanical stirring, pump circulation of the plating solution, and rotation of the carrier. However, the conventional stirring method cannot stir the plating solution in the elongated channel, which is obviously not as good as the stirring effect caused by the reciprocating movement of the carrier in the plating solution in the axial direction, because this can cause the plating solution to quickly wash the carrier channel , not only ensures the uniformity of the concentration of the plating solution, but also helps the nitrogen bubbles generated by the reaction to leave the metal surface quickly. During electroless plating, the carrier is wrapped outside, and the plating solution is placed inside the channel of the carrier, so that the plating solution forms a good contact with the channel of the carrier, and the plating solution exerts a certain pressure on the channel wall of the carrier.
本发明中,还原剂联氨事先不与钯络离子镀液混合,而是用泵缓慢添加到镀液中。在反应初期,镀液中钯络离子浓度高,需要控制还原剂的加入量,以防止反应速度过快生成钯沉淀。随着反应的进行,钯络离子浓度下降,可适当加快还原剂的加入量,以维持较快的反应速度。反应最后,钯络离子被消耗殆尽,可加入过量的还原剂,以保证钯的转化率。实验发现,这种方法几乎可实现100%的钯转化率,避免了贵金属钯的浪费,而且膜层中钯的总量可根据镀液的投料量来估计,由此可进一步估算出膜厚度。In the present invention, the reducing agent hydrazine is not mixed with the palladium complex ion plating solution in advance, but slowly added to the plating solution with a pump. In the initial stage of the reaction, the concentration of palladium complex ions in the plating solution is high, and the addition of reducing agent needs to be controlled to prevent the reaction speed from being too fast to generate palladium precipitation. As the reaction progresses, the concentration of palladium complex ions decreases, and the addition of the reducing agent can be appropriately accelerated to maintain a faster reaction rate. At the end of the reaction, palladium complex ions are exhausted, and excess reducing agent can be added to ensure the conversion rate of palladium. Experiments have found that this method can achieve almost 100% palladium conversion rate, avoiding the waste of precious metal palladium, and the total amount of palladium in the film layer can be estimated according to the feeding amount of the plating solution, so that the film thickness can be further estimated.
本发明的具体技术方案为:Concrete technical scheme of the present invention is:
一种多通道型透氢钯复合膜的制备方法,具体步骤包括载体的预处理、表面活化、化学镀、后处理四个步骤,其特征在于多通道载体内表面进行活化后,先将载体外侧用塑料或橡胶材料进行包裹来防止镀液的泄漏,然后将镀液置于载体的通道内;再将还原剂添加到镀液中;通过气体鼓泡穿过通道对镀液进行搅拌。A method for preparing a multi-channel hydrogen-permeable palladium composite membrane. The specific steps include four steps of carrier pretreatment, surface activation, electroless plating, and post-treatment. It is characterized in that after the inner surface of the multi-channel carrier is activated, the outer surface of the carrier is first Wrapping with plastic or rubber material to prevent the leakage of the plating solution, and then placing the plating solution in the channel of the carrier; then adding the reducing agent to the plating solution; stirring the plating solution by bubbling the gas through the channel.
其中所述多通道载体为多通道型陶瓷载体;多通道载体的通道数目和形状不限,载体的长度和直径之比在1-60之间,优选1-30。Wherein the multi-channel carrier is a multi-channel ceramic carrier; the number and shape of the channels of the multi-channel carrier are not limited, and the ratio of the length to the diameter of the carrier is between 1-60, preferably 1-30.
所述的气体为氮气、压缩空气、氧气或氩气等,通过鼓泡穿过通道的方式实现镀液的搅拌。The gas is nitrogen, compressed air, oxygen or argon, etc., and the stirring of the plating solution is realized by bubbling through the channels.
本发明中还原剂不是在化学镀开始之前添加到镀液中,而是在载体通道内镀液加完后用泵将其添加到镀液中。还原剂的加入速度控制在0.05-5ml/min。在商业化制备过程中,为了节省时间,还原剂的加入速度可以不像实验室那样恒速,在反应初期,镀液中钯络离子浓度高,需要控制还原剂的加入量,以防止反应速度过快生成钯沉淀。随着反应的进行,钯络离子浓度下降,可适当加快还原剂的加入量,以维持较快的反应速度。反应最后,钯络离子被消耗殆尽,可加入过量的还原剂,以保证钯的转化率。In the present invention, the reducing agent is not added to the plating solution before the electroless plating starts, but is added to the plating solution with a pump after the plating solution is added in the carrier channel. The adding speed of reducing agent is controlled at 0.05-5ml/min. In the commercial preparation process, in order to save time, the addition rate of the reducing agent may not be as constant as that in the laboratory. In the initial stage of the reaction, the concentration of palladium complex ions in the plating solution is high, so it is necessary to control the amount of the reducing agent added to prevent the reaction speed. Palladium precipitates too quickly. As the reaction progresses, the concentration of palladium complex ions decreases, and the addition of the reducing agent can be appropriately accelerated to maintain a faster reaction rate. At the end of the reaction, palladium complex ions are exhausted, and excess reducing agent can be added to ensure the conversion rate of palladium.
本发明的所述的钯镀液为:以镀液总体积为基准,Pd2+的加入量为0.006-0.06mol/L的钯盐,30-100g/L的乙二胺四乙酸盐,100-500ml/L的氨水;所述的还原剂为N2H4,浓度为0.2-2M;上述钯盐为氯化钯、醋酸钯、硝酸钯或硫酸钯;所述的乙二胺四乙酸盐为乙二胺四乙酸二钠、乙二胺四乙酸二钾或乙二胺四乙酸二铵。The palladium plating solution of the present invention is: based on the total volume of the plating solution, the addition of Pd 2+ is the palladium salt of 0.006-0.06mol/L, the ethylenediaminetetraacetic acid salt of 30-100g/L, 100-500ml/L ammonia water; the reducing agent is N 2 H 4 with a concentration of 0.2-2M; the above-mentioned palladium salt is palladium chloride, palladium acetate, palladium nitrate or palladium sulfate; the ethylenediaminetetraethylene The acid salt is disodium edetate, dipotassium edetate or diammonium edetate.
化学镀膜也可重复多次,一般分2-10次进行,更新镀液之前将载体上下颠倒,以保证镀膜均匀。化学镀的温度为10-50℃Electroless coating can also be repeated many times, generally divided into 2-10 times. Before updating the plating solution, turn the carrier upside down to ensure uniform coating. The temperature of electroless plating is 10-50°C
本发明的预处理、表面活化和后处理工序按现有技术操作,本发明与其它化学镀工艺一样,对载体的预处理和表面活化并无特殊要求。表面活化选用比较常用的是SnCl2/PdCl2法;或者是我们研究组发明的一种Pd(OH)2胶体活化法[黄彦,范菁菁,胡小娟,专利申请号200710022996.6]。The pretreatment, surface activation and posttreatment procedures of the present invention are operated according to the prior art, and the present invention, like other electroless plating processes, has no special requirements for the pretreatment and surface activation of the carrier. The most commonly used surface activation method is the SnCl 2 /PdCl 2 method; or a Pd(OH) 2 colloid activation method invented by our research group [Huang Yan, Fan Jingjing, Hu Xiaojuan, patent application number 200710022996.6].
下面对本发明所提供多通道型钯复合膜的制备方法的具体步骤作一下描述:The concrete steps of the preparation method of the multi-channel type palladium composite membrane provided by the present invention are described below:
A.选用的通道多孔陶瓷载体,采用常规方法对载体通道的内表面进行活化;A. The selected channel porous ceramic carrier adopts conventional methods to activate the inner surface of the carrier channel;
B.如图2所示,将活化后的载体1外侧用塑料或橡胶材料缠绕,两端各连接一段硅橡胶管2、3,管3的下端密封并与管线4连接,后者气源7连接,并通过针形阀5控制氮气流量为20-200ml/min。将镀液6(长度不同,镀液量不同)由硅橡胶管2的管口注入,使载体通道中全部充满镀液6。由于底部气体7的鼓泡作用,镀液6得到了良好的搅拌。还原剂8通过泵9添加到镀液6中;B. As shown in Figure 2, wrap the outside of the activated carrier 1 with plastic or rubber material, connect a section of
C.在一次镀膜结束后,将载体1颠倒过来,更新镀液6进行化学镀反应。以后每次更新镀液6前都将载体1颠倒一次,以保证镀膜均匀;也可一次镀膜就完成;C. After the primary coating is finished, the carrier 1 is turned upside down, and the plating solution 6 is renewed to carry out the electroless plating reaction. In the future, the carrier 1 will be turned upside down once before the plating solution 6 is updated each time to ensure uniform coating; it can also be completed in one coating;
D.将制得的钯膜用去离子水充分漂洗后,再用乙醇浸泡20-100min,最后在100-200℃干燥过夜。D. After fully rinsing the prepared palladium membrane with deionized water, soak it in ethanol for 20-100 min, and finally dry it overnight at 100-200°C.
本发明所提出的技术思路不仅仅局限于金属钯膜的制备,还可用于其它金属膜或合金膜的制备,如Ag、Pt、Cu、Ni膜,Ni-P、Ni-B合金膜等。本发明不仅可以制备致密复合膜,还可以得到多孔复合膜,用作催化剂。The technical ideas proposed by the present invention are not limited to the preparation of metal palladium films, but can also be used in the preparation of other metal films or alloy films, such as Ag, Pt, Cu, Ni films, Ni-P, Ni-B alloy films, etc. The invention can not only prepare dense composite membranes, but also obtain porous composite membranes, which can be used as catalysts.
这里需要强调的是,本专利所涉及的多通道陶瓷载体不包括长径比小的那种短粗型载体。尽管采用本发明制备短粗多通道型钯膜相对更为容易,但每个膜组件所能提供的膜面积有限,而且传质阻力较大,很难具有商业上的实用价值。What needs to be emphasized here is that the multi-channel ceramic carrier involved in this patent does not include the short and thick carrier with a small aspect ratio. Although it is relatively easier to prepare short, thick and multi-channel palladium membranes by using the present invention, each membrane module can provide limited membrane area and relatively large mass transfer resistance, making it difficult to have commercial practical value.
有益效果:Beneficial effect:
本发明提供的化学镀方法解决了多通道型钯复合膜的制备难题。化学镀反应可在室温下进行,不仅使操作更为方便,更减少了有毒气体的排放。本发明还有效地实现了膜层的均匀生长,保证了钯膜的致密性和附着力。镀液中钯的转化率接近于100%。The electroless plating method provided by the invention solves the difficult problem of preparing multi-channel palladium composite membranes. The electroless plating reaction can be carried out at room temperature, which not only makes the operation more convenient, but also reduces the emission of toxic gases. The invention also effectively realizes the uniform growth of the film layer and ensures the compactness and adhesion of the palladium film. The conversion rate of palladium in the plating solution is close to 100%.
附图说明: Description of drawings:
图1是基于多通道型钯复合膜的氢分离器工作原理图,其中A为进料气,B为氢气,C为尾气。Figure 1 is a working principle diagram of a hydrogen separator based on a multi-channel palladium composite membrane, where A is feed gas, B is hydrogen, and C is tail gas.
图2是本发明所用的化学镀装置图,其中1为多通道陶瓷载体,2、3、4为硅橡胶管,5为针形阀,6为镀液,7为气体,8为还原剂,9为蠕动泵。Fig. 2 is the used electroless plating device figure of the present invention, and wherein 1 is a multichannel ceramic carrier, 2, 3, 4 are silicon rubber tubes, 5 is a needle valve, 6 is a plating solution, 7 is a gas, and 8 is a reducing agent, 9 is a peristaltic pump.
图3是显示本发明所制备出的多通道钯复合膜照片,其中D为孔道,E为钯膜层,F为载体层。Fig. 3 is a photo showing the multi-channel palladium composite membrane prepared by the present invention, wherein D is a channel, E is a palladium film layer, and F is a carrier layer.
图4是显示本发明所制备出的多通道钯复合膜的断面金相显微图。Fig. 4 is a metallographic micrograph showing the section of the multi-channel palladium composite membrane prepared by the present invention.
图5是显示本发明所制备出的多通道钯复合膜的表面电子显微图。Fig. 5 is a surface electron micrograph showing the multi-channel palladium composite membrane prepared by the present invention.
具体实施方式: Detailed ways:
本发明所适用的多通道型多孔陶瓷通道数目和形状不限,市场上典型的多孔陶瓷管有7、19、34通道等,通道形状有圆形、六方形等。The number and shape of multi-channel porous ceramic channels applicable to the present invention are not limited. Typical porous ceramic tubes on the market have 7, 19, 34 channels, etc., and the channel shapes are circular, hexagonal, etc.
实施例一:Embodiment one:
(1).选用的多孔陶瓷载体平均孔径为0.2μm,19通道,外径30mm,长度为5cm,通道呈圆形,通道直径4mm。(1). The selected porous ceramic carrier has an average pore diameter of 0.2 μm, 19 channels, an outer diameter of 30 mm, and a length of 5 cm. The channels are circular and the channel diameter is 4 mm.
(2).将多通道陶瓷载体用市售洗洁精溶液清洗,然后用水漂洗。(2). Wash the multi-channel ceramic carrier with a commercially available detergent solution, and then rinse with water.
(3).采用常规的SnCl2/PdCl2法对通道的内表面进行活化,其中敏化液含SnCl2·2H2O 5g/L,浓盐酸1ml/L;活化液含PdCl2 0.2g/L,浓盐酸1ml/L。将载体外表面用聚四氟乙烯带缠绕,先在敏化液中浸一下并用水冲洗,再在活化液中浸一下并用水冲洗。敏化——活化处理5次后,将聚四氟乙烯带拆开,用水浸泡1小时。(3). Use the conventional SnCl 2 /PdCl 2 method to activate the inner surface of the channel, wherein the sensitization solution contains SnCl 2 ·2H 2 O 5g/L, concentrated hydrochloric acid 1ml/L; the activation solution contains PdCl 2 0.2g/L L, concentrated hydrochloric acid 1ml/L. Wrap the outer surface of the carrier with polytetrafluoroethylene tape, first dip in the sensitizing solution and rinse with water, then dip in the activation solution and rinse with water. Sensitization——After 5 times of activation treatment, disassemble the PTFE tape and soak it in water for 1 hour.
(4).如图2所示,化学镀反应温度为20℃。将活化后的载体1外侧重新用聚四氟乙烯带缠绕,两端各连接一段硅橡胶管2、3,管3的下端密封并与管线4连接,后者与氮气钢瓶连接,并通过针形阀5控制氮气流量为60ml/min。将65ml镀液6由硅橡胶管2的管口注入,使载体通道中全部充满镀液6。镀液6的组成为:PdCl2 5g/L,浓氨水250ml/L,Na2EDTA 70g/L。由于底部氮气7的鼓泡作用,镀液6得到了良好的搅拌。还原剂8为0.2mol/L的N2H4溶液,还原剂的加入速度为0.08ml/min,通过蠕动泵9添加到镀液6中,直至镀液中的钯离子被完全转化。(4). As shown in Figure 2, the electroless plating reaction temperature is 20°C. Wrap the outside of the activated carrier 1 with polytetrafluoroethylene tape again, and connect a section of
(5).将载体1颠倒过来,更新镀液6进行化学镀反应。以后每次更新镀液6前都将载体1颠倒一次,以保证镀膜均匀。(5). The carrier 1 is turned upside down, and the plating solution 6 is renewed to carry out the electroless plating reaction. Afterwards, the carrier 1 is inverted once before the plating solution 6 is updated each time, so as to ensure uniform coating.
(6).理论计算钯膜厚度为6μm时,停止化学镀。将制得的钯膜用去离子水充分漂洗,再用无水乙醇浸泡半小时,最后在120℃干燥过夜。采用氮气测量钯膜的气密性,1bar压力下,氮气通量接近于0。(6). When the theoretically calculated palladium film thickness is 6 μm, stop the electroless plating. The prepared palladium membrane was fully rinsed with deionized water, soaked in absolute ethanol for half an hour, and finally dried overnight at 120°C. The airtightness of the palladium membrane is measured by nitrogen gas, and the nitrogen flux is close to 0 under the pressure of 1 bar.
实施例二:Embodiment two:
操作方式同实施例一,但选用的多孔陶瓷载体长度为11cm,镀液的组成为:Pd(C2H3O2)23g/L,浓氨水150ml/L,K2EDTA 50g/L。镀液总使用量为530ml,所制得的钯膜厚度约为5μm。The operation method is the same as in Example 1, but the length of the porous ceramic carrier selected is 11 cm, and the composition of the plating solution is: Pd(C 2 H 3 O 2 ) 2 3g/L, concentrated ammonia water 150ml/L, K 2 EDTA 50g/L. The total amount of plating solution used is 530ml, and the thickness of the palladium film produced is about 5 μm.
实施例三:Embodiment three:
同实施例一,但选用的多孔陶瓷载体长度为50cm,化学镀反应温度为35℃,还原剂为0.2mol/L的N2H4溶液,气体流速为70ml/min,还原剂加入速度为0.1ml/min,底部鼓泡气体为氩气,镀液总使用量为3000ml,所制得的钯膜厚度约为6.2μm。Same as Example 1, but the length of the porous ceramic carrier selected is 50cm, the electroless plating reaction temperature is 35°C, the reducing agent is 0.2mol/L N2H4 solution, the gas flow rate is 70ml/min, and the reducing agent addition rate is 0.1 ml/min, the bubbling gas at the bottom is argon, the total usage of the plating solution is 3000ml, and the thickness of the prepared palladium film is about 6.2 μm.
实施例四:Embodiment four:
同实施例一,但选用的多孔陶瓷载体长度为20cm,37通道,通道直径为40mm,单孔直径3.6mm;还原剂为0.5mol/L的N2H4,加入速度为0.12ml/min;在一次镀膜后期,还原剂的加入速度为0.5ml/min。镀液总使用量为1850ml,所制得的钯膜厚度约为5.5μm。Same as Example 1, but the selected porous ceramic carrier has a length of 20 cm, 37 channels, a channel diameter of 40 mm, and a single hole diameter of 3.6 mm; the reducing agent is 0.5 mol/L N 2 H 4 , and the addition rate is 0.12 ml/min; In the later stage of a coating, the adding rate of the reducing agent is 0.5ml/min. The total amount of plating solution used is 1850ml, and the thickness of the palladium film produced is about 5.5 μm.
实施例五:Embodiment five:
同实施例一,但选用的多孔陶瓷载体长度为20cm,7通道,通道直径为30mm,单孔直径6mm。镀液总使用量为630ml,所制得的钯膜厚度约为6um。Same as Example 1, but the selected porous ceramic carrier has a length of 20 cm, 7 channels, a channel diameter of 30 mm, and a single hole diameter of 6 mm. The total amount of plating solution used is 630ml, and the thickness of the palladium film produced is about 6um.
以上实施例仅是用来说明本发明,在没有脱离本发明精神的情况下所做的任何等效的变化,都属于本发明权利要求的范围。The above embodiments are only used to illustrate the present invention, and any equivalent changes made without departing from the spirit of the present invention belong to the scope of the claims of the present invention.
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CN105039944B (en) * | 2015-09-15 | 2017-10-13 | 南京工业大学 | Preparation of palladium or palladium alloy membrane module |
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