CN100563406C - The associated methods of soft and hard printed circuit board - Google Patents
The associated methods of soft and hard printed circuit board Download PDFInfo
- Publication number
- CN100563406C CN100563406C CNB200710170701XA CN200710170701A CN100563406C CN 100563406 C CN100563406 C CN 100563406C CN B200710170701X A CNB200710170701X A CN B200710170701XA CN 200710170701 A CN200710170701 A CN 200710170701A CN 100563406 C CN100563406 C CN 100563406C
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- circuit board
- hard
- soft
- coverlay
- printed circuit
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Abstract
The associated methods of soft and hard printed circuit board of the present invention, main flexible circuit board, the hard circuit board that all has line layer that provide earlier, and have on the flexible circuit board of coverlay in pressing, utilize joint glue hard circuit board to be pressure bonded on the coverlay of flexible circuit board, then when finishing successive process, just get rid of second substrate of non-genus calmodulin binding domain CaM in hard circuit board and the 3rd joint glue, the outer layer metal layer on the relative position, to expose coverlay.Thus, in whole cohesive process, not only can protect the line layer of flexible circuit board, problem such as simultaneously also do not have glass fibre to pull, Copper Foil exposes.
Description
Technical field
The present invention relates to a kind of associated methods, relate in particular to a kind of associated methods of soft and hard printed circuit board.
Background technology
In simple terms, Rigid Flex (Rigid-Flex Printed Board) is combined into soft board and hardboard the electronic component of identical product exactly, and its development course is above 20 years.Early stage purposes is many in fields such as military affairs, medical treatment, industrial instrumentations, begins to be applied to mobile communication and consumption electronic products end products such as (digital camera DSC, digital camera DV etc.) between in recent years.The application of rigid-flex in mobile phone, the common turning point that the folding type mobile phone is arranged, image module, button and radio-frequency module etc.
Mobile phone uses the advantage of Rigid Flex, comprises allowing the easier integration of part of mobile phone and higher signal transmission quantity reliability.Use Rigid Flex, can replace the combination that original 2 connectors add soft board, can increase the durability and the long-term use reliability of mobile phone folding place moving point.
Yet, general rigid-flex in conjunction with processing procedure in, all be direct combination usually, and do not have any safeguard measure, this makes soft board be damaged easily, the calmodulin binding domain CaM between the rigid-flex is also smooth inadequately simultaneously, even also has fiber and pull problem.
Summary of the invention
Main purpose of the present invention is; a kind of associated methods of soft and hard printed circuit board is provided; it mainly is to utilize the pressing joint glue; fill the stamp line of hard circuit board; make that the part that has been cut temporarily is fixed on the flexible circuit board; thereby in whole cohesive process, not only can protect the line layer of flexible circuit board, problem such as simultaneously also do not have glass fibre to pull, Copper Foil exposes.
The present invention mainly provides all flexible circuit board, hard circuit boards to have line layer earlier, and have on the flexible circuit board of coverlay in pressing, utilize joint glue hard circuit board to be pressure bonded on the coverlay of flexible circuit board, then when finishing successive process, just get rid of second substrate of non-genus calmodulin binding domain CaM in hard circuit board and the 3rd joint glue, the outer layer metal layer on the relative position, to expose coverlay.Thus, in whole cohesive process, not only can protect the line layer of flexible circuit board, problem such as simultaneously also do not have glass fibre to pull, Copper Foil exposes.
Be described in further detail below in conjunction with accompanying drawing and the specific embodiment of the present invention.
Description of drawings
Fig. 1～Fig. 5 is a schematic diagram of the present invention.
Accompanying drawing primary clustering symbol description:
10 first substrates, 11 first line layers
12 power/ground, 13 circuit leads
20 coverlays, 21,22,23 joint glues
30 hard circuit boards, 31 second line layers
32 stamp lines, 40,50 outer layer metal layers
Embodiment
See also Fig. 1～Fig. 5, Fig. 1～Fig. 5 is a schematic diagram of the present invention.Before carrying out combination process, be ready to earlier as shown in Figure 1 flexible circuit board and the hard circuit board with second line layer 31 30 shown in Figure 2.As shown in Figure 1, have first line layer 11 and power/ground 12 on first substrate 10 of flexible circuit board.First line layer 11 comprises circuit lead 13.
In simple terms; as shown in Figure 4; associated methods of the present invention mainly utilizes pressing joint glue 23; fill the stamp line 32 (as shown in Figure 3) of hard circuit board 30; make the part that hard circuit board 30 has been cut; temporarily be fixed on the flexible circuit board, thereby in whole cohesive process, not only can be protected the line layer of flexible circuit board, problem such as also do not have glass fibre to pull simultaneously, Copper Foil exposes.Flexible circuit board 10 is double sided board with hard circuit board 30.
Specifically, as shown in Figure 2,, utilize first joint glue 21 that coverlay 20 is pressure bonded on first substrate 10 with first line layer 11 in order to protect flexible circuit board.
As shown in Figure 3, prepare the hard circuit board of pressing, on second substrate, have second line layer 31, and the position of second line layer 31 is with respect to the calmodulin binding domain CaM between the soft and hard printed circuit board.
Actual carrying out before the rigid-flex pressing must cut away second substrate of non-genus calmodulin binding domain CaM in hard circuit board 30 earlier, and constitutes stamp line 32 as shown in Figure 3.
Actual when carrying out the rigid-flex pressing, utilize second joint glue 22 that hard circuit board 30 is pressure bonded on the coverlay 20 of flexible circuit board, and utilize the 3rd joint glue 23 that outer layer metal layer 40 is pressure bonded on the hard circuit board 30.What must pay special attention to is, can utilize two second joint glues 22 that two hard circuit boards 30 are pressure bonded to respectively on the coverlay 20 of flexible circuit board on two-sided.
When finishing pressing; as shown in Figure 4; in hard circuit board 30; second substrate that has cut; when being pressure bonded to the coverlay 20 of flexible circuit board, by being fills up to the 3rd joint glue 23 in the stamp line 32 and second joint glue 22 on coverlay 20, and temporarily be fixed on the coverlay 20 along with hard circuit board 30; and in whole cohesive process, not only can protect the line layer of flexible circuit board, problem such as also do not have glass fibre to pull simultaneously, Copper Foil exposes.
As shown in Figure 5, when finishing successive process, get rid of second substrate of non-genus calmodulin binding domain CaM in hard circuit board 30, and the 3rd joint glue 23 on the relative position and outer layer metal layer 40,50, exposing coverlay 20, thereby finish the purpose of uncapping.In other words, the two ends of flexible circuit board are all by the clamping of hard circuit board institute, and this makes flexible circuit board become the signal bridge of rolling over of two ends hard circuit board, thereby realizes for example folding effect of folding type mobile phone.
Successive process includes the via that gets out between first line layer 11 and second line layer 31 at least and via is electroplated.
In addition, coverlay 20 can be the adhering substance that produces cross-linking reaction after exposing.
The above only is preferred embodiment of the present invention, and purpose is to wish to know more to describe feature of the present invention and content, and is not in order to restriction protection scope of the present invention.All various changes of being done according to the present patent application claim and the arrangement with equality all should belong to covering scope of the present invention.
Claims (6)
1. the associated methods of a soft and hard printed circuit board is characterized in that, may further comprise the steps:
One flexible circuit board is provided, has one first line layer on one first substrate of this flexible circuit board;
Utilize one first joint glue one coverlay to be pressure bonded on this first substrate with this first line layer;
One hard circuit board is provided, has one second line layer on one second substrate of this hard circuit board, the position of this second line layer is with respect to the calmodulin binding domain CaM between the soft and hard printed circuit board;
This second substrate that cuts described hard circuit board with between form the stamp line, second substrate zone is divided into respect to one of the calmodulin binding domain CaM of soft and hard printed circuit board is cut the district, with a cutting area with respect to the non-genus calmodulin binding domain CaM of soft and hard printed circuit board;
Utilize one second joint glue to comprise to be cut district and this hard circuit board of cutting area to be pressure bonded on this coverlay of flexible circuit board, and utilize one the 3rd joint glue that one outer layer metal layer is pressure bonded on the hard circuit board; And
When finishing successive process, get rid of the 3rd joint glue, outer layer metal layer in this hard circuit board cutting area second substrate and the relative position, to expose this coverlay.
2. the associated methods of soft and hard printed circuit board according to claim 1 is characterized in that, described successive process includes the via that gets out between this first line layer and this second line layer at least and this via is electroplated.
3. the associated methods of soft and hard printed circuit board according to claim 1, it is characterized in that, wherein in this hard circuit board, this that cuts second substrate, when being pressure bonded to this coverlay of this flexible circuit board along with this hard circuit board, by being fills up to the 3rd joint glue in the stamp line and this second joint glue on this coverlay, and temporarily be fixed on this coverlay.
4. the associated methods of soft and hard printed circuit board according to claim 1 is characterized in that, described flexible circuit board and hard circuit board are double sided board.
5. the associated methods of soft and hard printed circuit board according to claim 1 is characterized in that, wherein utilizes two second joint glues that two these hard circuit boards are pressure bonded to respectively on this flexible circuit board this coverlay on two-sided.
6. the associated methods of soft and hard printed circuit board according to claim 1 is characterized in that, described coverlay can be the adhering substance that produces cross-linking reaction after exposing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710170701XA CN100563406C (en) | 2007-11-21 | 2007-11-21 | The associated methods of soft and hard printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200710170701XA CN100563406C (en) | 2007-11-21 | 2007-11-21 | The associated methods of soft and hard printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101170877A CN101170877A (en) | 2008-04-30 |
| CN100563406C true CN100563406C (en) | 2009-11-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200710170701XA Expired - Fee Related CN100563406C (en) | 2007-11-21 | 2007-11-21 | The associated methods of soft and hard printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100563406C (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631432B (en) * | 2008-07-14 | 2011-07-27 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
| CN101631431B (en) * | 2008-07-18 | 2011-05-04 | 欣兴电子股份有限公司 | Rigid-flex board structure and manufacturing method thereof |
| CN101977486B (en) * | 2010-10-29 | 2012-02-29 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102497746B (en) * | 2011-12-05 | 2015-11-18 | 深圳市五株科技股份有限公司 | The manufacture method of circuit board |
| CN103313529B (en) * | 2012-03-07 | 2015-12-16 | 宏恒胜电子科技（淮安）有限公司 | The manufacture method of rigid-flexible circuit board |
| CN103313530B (en) * | 2012-03-08 | 2016-03-30 | 宏恒胜电子科技（淮安）有限公司 | The manufacture method of rigid-flexible circuit board |
| KR101343217B1 (en) * | 2012-05-07 | 2013-12-18 | 삼성전기주식회사 | Rigid-flexible printed circuit board and method for manufacturing thereof |
| CN102724813B (en) * | 2012-07-06 | 2014-11-05 | 广州美维电子有限公司 | Cover opening method of rigid and flexible plate |
| KR101363075B1 (en) * | 2012-10-10 | 2014-02-14 | 삼성전기주식회사 | The method of manufacturing rigid-flexible printed circuit board |
| TWI578857B (en) * | 2013-06-19 | 2017-04-11 | Adv Flexible Circuits Co Ltd | Flexible circuit board differential mode signal transmission line anti - attenuation grounding structure |
| TWI573498B (en) * | 2013-07-26 | 2017-03-01 | Adv Flexible Circuits Co Ltd | The flattened cladding structure of soft circuit board |
| CN104470250A (en) * | 2013-09-25 | 2015-03-25 | 富葵精密组件(深圳)有限公司 | Rigid-flex circuit board manufacturing method |
| CN105472906A (en) * | 2014-09-11 | 2016-04-06 | 富葵精密组件(深圳)有限公司 | Flexible and hard combined circuit board and manufacturing method thereof |
| JP6505841B2 (en) * | 2014-12-01 | 2019-04-24 | カーディアック ペースメイカーズ， インコーポレイテッド | Implantable medical device |
| CN106879164A (en) * | 2017-02-23 | 2017-06-20 | 维沃移动通信有限公司 | A kind of Rigid Flex preparation method and Rigid Flex |
| CN108207092A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board laser takes off lid cut wound flex plate |
| WO2020093400A1 (en) * | 2018-11-09 | 2020-05-14 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex circuit board and manufacturing method therefor |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114531793A (en) * | 2022-02-25 | 2022-05-24 | 黄石西普电子科技有限公司 | Manufacturing method of eight-layer HDI board combining softness and hardness |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1809251A (en) * | 2005-01-20 | 2006-07-26 | 三星电机株式会社 | Method of fabricating rigid flexible printed circuit board |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for manufacturing rigid-flex circuit board |
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2007
- 2007-11-21 CN CNB200710170701XA patent/CN100563406C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1809251A (en) * | 2005-01-20 | 2006-07-26 | 三星电机株式会社 | Method of fabricating rigid flexible printed circuit board |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for manufacturing rigid-flex circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101170877A (en) | 2008-04-30 |
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Granted publication date: 20091125 Termination date: 20191121 |