CN100552983C - Microlens module of photoelectric component and manufacturing method thereof - Google Patents

Abstract

A photoelectric assembly micro-lens module and a manufacturing method thereof can be applied to manufacturing a plurality of groups of micro-lenses on a photoelectric assembly; the method is characterized in that the self-assembly monomolecular material is printed on the substrate by adopting a printing technology, so that a preset layout area and a range of the micro-lenses are defined on the substrate, and the light-transmitting material solution is sprayed and printed on the preset layout area of the micro-lenses on the substrate by utilizing a spraying and printing technology, so that the required micro-lenses can be formed. Compared with the prior art, the manufacturing method of the photoelectric assembly micro-lens does not need to adopt the manufacturing process technology with complex manufacturing process and high cost, so that the manufacturing process is simpler and has higher cost and economic benefits.

Description

Photoelectric component microlens module and manufacturing method thereof

technical field

The invention relates to a photoelectric component manufacturing technology, in particular to a photoelectric component microlens module and a manufacturing method thereof, which can be applied to a photoelectric component to manufacture multiple groups of microlenses (microlens).

Background technique

A microlens is an extremely small lens that can be applied to optoelectronic components, such as image sensors of digital cameras, light-emitting diodes, or solar cells, to provide focusing functions for the light beams received by the optoelectronic components , or the light beam emitted by the photoelectric component provides a diffusion function.

For example, adding a microlens to the light-emitting surface of a light-emitting diode can effectively reduce total reflection and waveguide effect, thereby improving the light-emitting efficiency of a light-emitting diode; adding a microlens to the light-receiving surface of a solar cell can improve Light absorption efficiency and improvement of photoelectric conversion efficiency; adding a microlens to the photodetector can concentrate the signal light in the photosensitive area through focusing, thereby improving the utilization rate of light and improving the signal of the photodetector Ratio to noise, faster response time, and less distortion.

In the manufacture of microlenses, related patent technologies include, for example, the following US patents:

US Patent No. 6,171,833 "IMAGE ARRAY OPTOELECTRONICMICROELECTRONIC FABRICATION WITH ENHANCED OPTICALSTABILITY AND METHOD FOR FABRICATION THEREOF";

US Patent No. 6,570,324 "IMAGE DISPLAY DEVICE WITHARRAY OF LENS-LETS";

US Patent No. 6,048,623 "METHOD OF CONTACT PRINTING ONGOLD COATED FILMS";

US Patent No. 6,020,047 "POLYMER FILMS HAVING A PRINTEDSELF-AS SEMBLING MONOLAYER".

To simplify the description, please refer to the patent specification for the detailed content of the above-mentioned patented technology. The manufacturing process technologies adopted in the above-mentioned US patents include photoresist hot-melt method, thermal compression molding method, photomask lithography method, laser lithography method, and ink-jet printing method. However, because these manufacturing process technologies are quite complicated in operation procedures and need to use expensive manufacturing process equipment, the cost of the manufacturing process is relatively high, which is not cost-effective.

Contents of the invention

In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a micro-lens module of an optoelectronic component and a manufacturing method thereof, which is simpler and more cost-effective in implementation than the prior art.

The microlens manufacturing method of the optoelectronic component of the present invention is designed to be applied to the optoelectronic component to manufacture multiple groups of microlenses, and the optoelectronic component it is suitable for includes, for example, an image sensor of a digital camera, a light emitting diode, and a solar cell.

The photoelectric sensor microlens manufacturing method of the present invention at least includes: (1) prefabricating a substrate and an embossing mold respectively, wherein the substrate defines at least one microlens predetermined layout area and a surrounding area, and the embossing mold defines at least one convex a protruding portion and a groove portion, wherein one of the protruding portion and the groove portion is selectively used as a feature structure area, and the feature structure area is defined to correspond to a predetermined layout area of the microlens on the substrate; (2) disposing the self-assembled monomolecular material on the protrusion of the imprinting mold; (3) performing an imprinting process, wherein the characteristic structure area on the imprinting mold is aligned with the microlens predetermined layout on the substrate area, so that the self-assembled monomolecular material arranged on the protruding part of the mold is imprinted onto the substrate to form a self-assembled thin film layer of a predetermined pattern; Spray printing onto the predetermined layout area of the microlens on the substrate in a liquid state, so that the liquid light-transmitting material is self-attached to within the range of the predetermined layout area of the microlens on the substrate due to the confinement of the self-assembled thin film layer Inside.

In terms of the physical structure of the product, the microlens module of the photoelectric component of the present invention at least includes: (A) a substrate, which is pre-defined with at least one microlens predetermined layout area and a surrounding area; (B) a self-assembled monomolecular material layer, which is pressed Printed on the surrounding area of the substrate to form a self-assembled thin film layer; and (C) a light-transmitting material layer attached to the predetermined layout area of the microlens on the substrate and limited by the blocking effect of the self-assembled thin film layer within the range of the predetermined layout area of the microlens.

The feature of the photoelectric component microlens module and its manufacturing method of the present invention is that the predetermined layout area and range of the microlens are defined on the substrate by imprinting technology, and the solution of light-transmitting material is spray-printed on the substrate by using the printing technology The predetermined layout area of the microlens can form the desired microlens. Compared with the prior art, since the manufacturing method of the microlens of the optoelectronic component does not need to adopt complicated and expensive manufacturing process technology, the manufacturing process can be simpler and have higher cost-effectiveness.

Description of drawings

FIG. 1A is a schematic diagram of a top view structure, which is used to show the top view structure of the substrate used in the present invention;

FIG. 1B is a schematic cross-sectional structure, used to show the cross-sectional structure of the substrate used in the present invention;

Fig. 2 is a schematic cross-sectional structure, used to show the cross-sectional structure of the embossing mold used in the present invention;

Fig. 3 is a schematic cross-sectional structure, used to show the cross-sectional structure of the embossing mold used in the present invention after coating the self-assembled monomolecular material;

4A to 4B are cross-sectional schematic diagrams for illustrating the embodiment of the embossing process adopted by the present invention;

5A to 5B are side view structural schematic diagrams for showing two implementations of the jet printing process used in the present invention;

6A to 6D are cross-sectional schematic diagrams for illustrating an embodiment of the present invention for making an imprint mold.

[Description of main component symbols]

10 Substrate

11 Microlens predetermined layout area

12 Surrounding area

20 imprint molds

21 Groove

22 protrusion

30 Self-Assembled Monomolecular Materials

31 self-assembled film layers

40 jet printing device

50 translucent material

60 microlenses (small curvature)

61 microlens (large curvature)

70 templates

71 raised part

72 Groove

Detailed ways

Embodiments of the photoelectric component microlens module and its manufacturing method of the present invention will be described in detail below in conjunction with the accompanying drawings.

First, as shown in Figures 1A and 1B, the initial step of the microlens manufacturing method for optoelectronic components of the present invention is to prefabricate the substrate 10, and pre-define a plurality of groups of microlens predetermined layout areas 11 on the substrate 10 (Note: Figures 1A and 1B The substrate 10 shown only exemplarily shows two predetermined layout areas of microlenses; however, in actual implementation, it may include tens of thousands or millions of predetermined layout areas of microlenses). The substrate 10 can be, for example, an image sensor chip component of a digital camera, a light emitting diode chip component, or a solar cell chip component. As shown in FIG. 1A , the predetermined layout area 11 of these microlenses is, for example, in the shape of a circle, and the area outside it is defined as the surrounding area 12 . In a specific implementation, the material of the substrate 10 must have high affinity with the light-transmitting material. Since the light-transmitting material usually adopts epoxy resin, optical glue, acrylic material (Polymethylmethacrylate, PMMA), polyurethane plastic material (Polyurethane, PU), silicone material (polydimethylsiloxane, PDMS), photoresist material (such as SU8); therefore The material of the substrate 10 can be, for example, metal (gold, silver, copper, aluminum, iron, nickel, zirconium, or platinum), metal oxide, semiconductor, semiconductor oxide, silicon dioxide (SiO2), glass, quartz, or high molecular material.

Then, as shown in FIG. 2 , the next step of the microlens manufacturing method for optoelectronic components of the present invention is to prefabricate the imprinting mold 20; wherein the imprinting mold 20 is formed with at least one groove portion 21 and a protruding portion 22, and the The size and position of the groove portion 21 correspond to the predetermined microlens predetermined layout area 11 on the above-mentioned substrate 10, and the protruding portion 22 surrounds the groove portion 21 and corresponds to the surrounding area on the above-mentioned substrate 10 12. In practice, the material of the imprinting mold 20 is best to use polydimethylsiloxane (PDMS); and it can be made by various methods. Figures 6A to 6D show one possible fabrication. At first as shown in Figure 6A, the first step is to prefabricate a template 70, such as a template made of silicon; part (that is, the part corresponding to the surrounding area 12 of the above-mentioned substrate 10), so the raised portion 71 and the grooved portion 72 are formed on the template 70; then as shown in FIG. 6C, the PDMS silicone material 80 is evenly coated Clothed on the upper surface of the template 70, and the PDMS silica gel material 80 must fill the groove portion 72 and cover the top of the raised portion 71 to a predetermined thickness; finally, as shown in Figure 6D, after the PDMS silica gel material 80 is solidified, That is, the cured PDMS silica gel block can be taken out, and the desired imprinting mold 20 can be obtained. In addition to the manufacturing methods shown in FIGS. 6A to 6D , other different manufacturing methods are possible for the imprint mold 20 .

Next, as shown in FIG. 3 , after the imprinting mold 20 is made, the next step is to apply a self-assembling monolayer (SAM) 30 to the protrusion 22 of the above-mentioned imprinting mold 20 . In practice, the material of the self-assembled monomolecular material 30 must have low affinity with the light-transmitting material. Since the light-transmitting material is usually epoxy resin, optical glue, PMMA, PU, PDMS, SU8; therefore, the material of the self-assembled monomolecular material 30 can be, for example, a silane compound or a thiol compound.

Then, as shown in FIGS. 4A to 4B , the next step is to perform an embossing procedure; wherein, the groove portion 21 of the above-mentioned embossing mold 20 is aligned with the microlens predetermined layout area 11 on the substrate 10, and then the embossing is performed. The protruding part 22 of the mold 20 is imprinted to the surrounding area 12 other than the predetermined layout area 11 of the microlens on the substrate 10, so that the SAM self-assembled monomolecular material 30 coated on the protruding part 22 is shown in FIG. 4B is generally imprinted onto the substrate 10 , thereby forming a self-assembled thin film layer 31 on the surrounding area 12 of the substrate 10 .

Next, as shown in FIG. 5A , the next step is to execute the jet printing process; wherein the jet printing device 40 is used to jet-print the light-transmitting material 50 in a liquid state onto the microlens predetermined layout area 11 on the substrate 10 . Due to the lyophilicity between the light-transmitting material 50 and the material of the substrate 10, the liquid light-transmitting material 50 printed on the substrate 10 can be attached to the predetermined layout area 11 of the microlens on the substrate 10 by itself, and then Diffusion outward in the predetermined microlens predetermined layout area 11 . However, due to the liquid repellency between the light-transmitting material 50 and the self-assembled film layer 31 formed by the SAM self-assembled monomolecular material, the liquid light-transmitting material 50 will be blocked by the self-assembled film layer 31 from the predetermined layout of the microlens Within the scope of area 11. After the light-transmitting material 50 printed on is solidified, the desired microlens 60 can be formed. In specific implementation, the material of the light-transmitting material 50 can be, for example, epoxy resin, optical glue, acrylic material (Polymethylmethacrylate, PMMA), polyurethane plastic material (Polyurethane, PU), silicone material (polydimethylsiloxane, PDMS), light Resistive material (such as SU8); and the printing device 40 can be piezoelectric (piezo), thermal bubble (Thermal Bubble), or acoustic (acoustic) printing device, for example.

In addition, as shown in FIG. 5B , if a microlens 61 with a larger curvature needs to be fabricated, the number of drops of the translucent material 50 can be increased. Because the light-transmitting material 50 can be completely blocked by the self-assembled thin film layer 31 within the scope of the predetermined layout area 11 of the microlens under a certain amount; has a greater curvature.

In addition to the above-mentioned embodiments, the present invention can also be changed to adopt lyophilic self-assembled single molecules instead, and change the material of the substrate 10 to be liquid-repellent. Broadly speaking, one of the groove portion 21 and the protruding portion 22 on the imprint mold 20 is selectively defined as a feature structure area, and the feature structure area is defined to correspond to the predetermined microlens on the substrate 10 The layout area 11; while the aforementioned embodiment selects the groove portion 21 as the characteristic structure area, but in this embodiment, the protruding portion 22 is selected as the characteristic structure area. In this case, the imprinting procedure is changed to align the protrusions 22 of the imprinting mold 20 with the microlens predetermined layout area 11 on the substrate 10, and at the same time make the grooves 21 of the imprinting mold 20 imprint on the substrate. 10, so that the lyophilic self-assembled monomolecular material coated on the protrusion 22 is imprinted onto the microlens predetermined layout area 11 of the substrate 10, so that the microlens predetermined layout area 11 is lyophilic. The rest of the program steps are exactly the same as the aforementioned embodiment.

In a word, the present invention provides a method for manufacturing microlenses of optoelectronic components, which can be applied to manufacture multiple groups of microlenses on optoelectronic components; In this way, the predetermined microlens layout area and its range are defined on the substrate, and the solution of the light-transmitting material is spray-printed to the predetermined microlens layout area on the substrate by using the jet printing technology. After the light-transmitting material is cured, desired microlenses can be formed. Compared with the prior art, since the manufacturing method of the microlens of the optoelectronic component does not need to adopt complicated and expensive manufacturing process technology, the manufacturing process can be simpler and have higher cost-effectiveness. The present invention is therefore more progressive and practical than the prior art.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the substantive technical content of the present invention. The essential technical content of the present invention is broadly defined in the scope of the following patent applications. If the technical entity or method completed by any other person is exactly the same as that defined in the following patent application scope, or is an equivalent change, it will be deemed to be covered by the patent application scope of the present invention.

Claims (14)

1. A method for manufacturing a photoelectric component microlens, which at least comprises: Prefabricating the substrate and the imprinting mold respectively, wherein the substrate defines at least one microlens predetermined layout area and at least one surrounding area; and the imprinting mold defines at least one protrusion and at least one groove, wherein the One of the protrusion and the groove is selectively used as a feature structure area, and the feature structure area is defined to correspond to a predetermined layout area of microlenses on the substrate; disposing a self-assembled monomolecular material on a protrusion of the imprint mold; performing an embossing procedure, wherein the feature structure area on the imprinting mold is aligned with the microlens predetermined layout area on the substrate, so that the self-assembled monomolecular material arranged on the protruding part of the mold is imprinted onto the a substrate, forming a predetermined pattern of self-assembled thin film layers; and Executing a jet printing procedure; wherein, the light-transmitting material is jet-printed to the predetermined layout area of the microlens on the substrate in a liquid state, and the self-assembly is selected according to whether the characteristic structure area is the protrusion or the groove The material of the film layer and the light-transmitting material have lyophilicity or liquid repellency, so that the liquid light-transmitting material is limited by the self-assembled film layer, thereby self-attaching to the predetermined layout of the microlens on the substrate within the range of the region. 2. The manufacturing method of microlenses for optoelectronic components as claimed in claim 1, wherein the protrusions on the embossing mold are selected as its characteristic structure area, so that the predetermined layout area of the microlenses corresponds to the protrusions of the embossing area of the mould. In this case, the self-assembled monomolecular material is selected from a material having a lyophilicity to the light-transmitting material liquid. 3. The method for manufacturing microlenses of optoelectronic components as claimed in claim 1, wherein the groove portion on the embossing mold is selected as its characteristic structure area, so that the predetermined layout area of the microlens is corresponding to the concave of the embossing area of the mould. Groove portion; in this case, the self-assembled monomolecular material is selected from a material having liquid repellency to the light-transmitting material liquid. 4. The method for manufacturing the microlens of an optoelectronic component as claimed in claim 1, wherein the material of the imprinting mold is selected from one of silica gel-based polymers and ether-ester copolymers. 5. The method for manufacturing microlenses of optoelectronic components as claimed in claim 1, wherein the self-assembled monomolecular material is selected from one of silane compounds, thiol compounds, organic carboxylic acids, organic phosphoric acids and polymer polyelectrolytes. 6. The photoelectric module microlens manufacturing method as claimed in claim 1, wherein the translucent material is selected from the group consisting of epoxy resin, optical glue, acrylic material, polyurethane plastic material, silica gel material and photoresist material one of them. 7. The photoelectric module microlens manufacturing method as claimed in claim 1, wherein, in the jet printing procedure, change the formed microlens by increasing or decreasing the number of jet printing drops of the light-transmitting material in a liquid state curvature. 8. The method for manufacturing a microlens of an optoelectronic component as claimed in claim 1, wherein the printing device is a piezoelectric printing device. 9. The method for manufacturing the microlens of an optoelectronic component as claimed in claim 1, wherein the jet printing device is a thermal bubble jet printing device. 10. The method for manufacturing a microlens of an optoelectronic component as claimed in claim 1, wherein the printing device is a voice-activated printing device. 11. The method for manufacturing a microlens of an optoelectronic component as claimed in claim 1, wherein the substrate is an image sensor chip component of a digital camera. 12. The method for manufacturing micro-lenses of optoelectronic components as claimed in claim 1, wherein the substrate is a light emitting diode chip component. 13. The method for manufacturing the microlens of an optoelectronic component as claimed in claim 1, wherein the substrate is a solar cell chip component. 14. The method for manufacturing microlenses of optoelectronic components as claimed in claim 1, wherein the material of the substrate is selected from one of metals, metal oxides, semiconductors, semiconductor oxides, glass, quartz and polymer materials.

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