CN100552941C - Image sensing module - Google Patents
Image sensing module Download PDFInfo
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- CN100552941C CN100552941C CN200610063634.7A CN200610063634A CN100552941C CN 100552941 C CN100552941 C CN 100552941C CN 200610063634 A CN200610063634 A CN 200610063634A CN 100552941 C CN100552941 C CN 100552941C
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- image sensing
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- 239000000758 substrate Substances 0.000 claims abstract description 84
- 239000011521 glass Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- -1 and adapter Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
An image sensing module comprises a substrate, an image signal processor, a supporting plate, an image sensing chip and a cover body. Wherein, the surface of the substrate is provided with a groove; the image signal processor is arranged in the groove of the substrate and is electrically connected with the substrate; the supporting plate is arranged on the surface of the substrate and covers the groove; the image sensing chip is arranged on the supporting plate and electrically connected with the substrate; the cover body is arranged on the substrate and covers the image sensing chip.
Description
Technical field
The present invention relates to a sensing module, relate in particular to an image sensing module.
Background technology
CMOS image sensor (CMOS Image Sensor, CIS) with the processing procedure compatibility of CMOS, because this image sensor can be incorporated on the same chip with other peripheral circuit at an easy rate, therefore, can significantly reduce the cost and the consumed power of image sensor.In addition, in the application in low price field, the CMOS image sensor has become the substitute of Charged Coupled Device in recent years, and then makes the importance of CMOS image sensor grow with each passing day.
Fig. 1 is the schematic diagram of an image sensing module in the prior art.This image sensing module 100 comprise substrate 110, image processor (Image Signal Processor, ISP) 120, image sensing chip (CIS) 130 and brake (Actuator) 140.Substrate 110 has lower surface 110a and upper surface 110b corresponding with it.Image processor 120 is disposed on the lower surface 110a of substrate 110, and electrically connects with substrate 110.Image sensing chip 130 is disposed on the upper surface 110b of substrate 110, and with the pick-up image data, wherein image sensing chip 130 electrically connects by the mode and the substrate 110 of routing.Brake 140 is disposed on the substrate 110 upper surface 110b, and cover covers image sensing chip (CIS) 130; Brake 140 comprises several optical lenses 142, and finishing the automatically action of focusing of image by the control of image processor 120, and filter 144 is arranged at optical lens 142 belows, with the unnecessary light of filtering.Above-mentioned image sensing module 100 electrically connects with soft circuit base plate 10, is passed to chip 12 on the soft circuit base plate 10 with the signal of video signal that image sensing module 100 is captured, and handles to carry out signal of video signal.
Yet, because existing image processor 120 is disposed on the lower surface 110a of substrate 110 with the form of module, therefore, can make whole image sensing module 100 have thicker thickness, and can't meet the demand compact and easy to carry of present electronic product.
Please refer to Fig. 2, it is the schematic diagram of another image sensing module in the prior art.In image sensing module shown in Figure 2 200, image processor 220 is disposed on the substrate 210, and is connected with substrate 210 electric wires by lead 260; Image sensing chip 230 is disposed on the image processor 220 in the mode of storehouse by a sept (spacer) 250, and electrically connects by lead 270 and substrate 210 equally.Identical with above-mentioned image sensing module 100 (please refer to Fig. 1), image sensing module 200 also can electrically connect with a soft circuit base plate 20, be passed to chip 22 on the soft circuit base plate 20 with the signal of video signal that image sensing module 200 is captured, handle to carry out signal of video signal.
Yet, in image sensing module 200, because image sensing chip 230 is disposed at image processor 220 tops in the mode of storehouse, therefore image sensing chip 230 has overheated problem easily with image processor 220, and then causes the operating efficiency or the reduction in useful life of image sensing module 200.In addition, because therefore the general design of brake 140 internal height, in height has certain restriction only in order to put image sensing chip 230.When brake 140 was assembled on the substrate 210, brake 140 easy crushings caused the telecommunication conduction failure of 210 of image processor 220 and substrates to the lead 270 that electrically connects between image processor 220 and the substrate 210.
Summary of the invention
One of purpose of the present invention provides an image sensing module, to reduce the thickness of image sensing module.
Another object of the present invention provides an image sensing module, to solve the heat dissipation problem of image sensing module inside.
Another purpose of the present invention provides an image sensing module, so that keep the excellent electrical property annexation between image processor and substrate.
For reaching above-mentioned or other purpose, the present invention proposes an image sensing module, and it comprises substrate, image processor, supporting bracket, image sensing chip and lid, and wherein the surface of substrate has groove, and image processor is disposed in the groove of substrate, and electrically connects with substrate.Supporting bracket then is disposed on the surface of substrate and cover covers groove, and image sensing chip is disposed on the supporting bracket and electrically connect with substrate, and lid then is disposed on the substrate and cover covers image sensing chip.
In one embodiment of this invention, lid comprises adapter (adapter), glass cover-plate and brake.Adapter is disposed on the substrate, and has upper end and lower end.Wherein, the upper end has accommodation space, and end shield covers image sensing chip down.Glass cover-plate then is disposed at the accommodation space of adapter, and brake is disposed on the glass cover-plate.Brake has the optical lens more than, with by the moving of image processor control brake device, and then finishes automatic focusing.
In one embodiment of this invention, glass cover-plate can be a filter.
In one embodiment of this invention, image sensing module comprises a housing, and its middle shell is disposed on the substrate, and adapter, glass cover-plate and brake are placed in the housing.
In one embodiment of this invention, substrate more comprises more than one location pins, and has on the housing more than one corresponding to the location hole of location pins, and location pins is inserted in the location hole, to carry out the location of housing and substrate.
In one embodiment of this invention, the degree of depth of groove is greater than the thickness of image processor.
In one embodiment of this invention, substrate has more more than one air vent hole, and air vent hole is formed at bottom portion of groove, and runs through substrate.
In one embodiment of this invention, substrate is suitable for electrically connecting with a soft circuit base plate.
In one embodiment of this invention, image processor comprises a signal of video signal process chip, most bar routing lead and a packing colloid, the signal of video signal process chip electrically connects by these routing leads and substrate, and packing colloid covers signal of video signal process chip and these routing leads.
In one embodiment of this invention, substrate has more detent, and detent is positioned at the outer peripheral edges of groove, with by detent supported plate.
In one embodiment of this invention, supporting bracket can be a fin.
In one embodiment of this invention, image sensing module also comprises most bar routing leads, and wherein image sensing chip electrically connects by these routing leads and substrate.
In the present invention, image processor is disposed in the groove of substrate to reduce the module height of image sensing module.In addition, image sensing chip configurable on fin to reduce the temperature of chip internal.Moreover because the bottom portion of groove of substrate has more than one air vent hole, so the heat in the image sensing module can be by air vent hole to flowing to context, and then reduce the internal temperature of image sensing module.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, elaborate.
Description of drawings
Fig. 1 is the schematic diagram of an image sensing module in the prior art.
Fig. 2 is the schematic diagram of another image sensing module in the prior art.
Fig. 3 is the schematic diagram of an image sensing module of preferred embodiment of the present invention.
Fig. 4 is the top view of substrate shown in Figure 3.
Embodiment
Fig. 3 is the schematic diagram of an image sensing module of preferred embodiment of the present invention.Please refer to Fig. 3, image sensing module 300 comprises substrate 310, image processor 320, supporting bracket 330, image sensing chip 340 and lid 350, wherein the surperficial 310a of substrate 310 has groove 312, and image processor 320 is disposed in the groove 312 of substrate 310, and electrically connect with substrate 310, the degree of depth of its further groove 312 is greater than the thickness of image processor 320.In an embodiment of the present invention, image processor 320 comprises signal of video signal process chip 322, most bar routing lead 324 and packing colloid 326.And signal of video signal process chip 322 electrically connects by these routing leads 324 and substrate 310; 326 of packing colloids cover signal of video signal process chip 322 and these routing leads 324, make moist to prevent that it from being undermined.Yet, except the electric connection of carrying out signal of video signal process chip 322 and substrate 310 in the routing mode, signal of video signal process chip 322 also can be by chip bonding (Flip Chip) technology or alternate manner and substrate 310 electric connections, and the present invention does not impose any restrictions for the mode that electrically connects between signal of video signal process chip 322 and the substrate 310.What deserves to be mentioned is that because the image processor 320 of present embodiment is disposed in the groove 312 of substrate 310, so image processor 320 can additionally not increase the module height of image sensing module 300.
Supporting bracket 330 is disposed on the surperficial 310a of substrate 310, and cover covers groove 312; And image sensing chip 340 is disposed on the supporting bracket 330 carrying out the acquisition of image, and electrically connects by routing lead 342 and substrate 310.By above as can be known, because image processor 320 is disposed in the groove 312 of substrate 310, and supporting bracket 330 is covered again and is covered groove 312, and therefore the image processor 320 that is disposed in the groove 312 is not vulnerable to outside destroy, and then makes image processor 320 normal operations.And detent 314 more can be set at the outer peripheral edges place of the groove 312 of substrate 310, to support above-mentioned supporting bracket 330, reach locating effect.For reaching better radiating effect, in an embodiment of the present invention, supporting bracket 330 can be a fin, the heat that the feasible image sensing chip 340 that is disposed on the supporting bracket 330 is produced when running can be passed to chip exterior, and then make image sensing chip 340 be in suitable working temperature, prolong its useful life.
Please also refer to Fig. 3 and Fig. 4, Fig. 4 is the top view of substrate shown in Figure 3.In the present embodiment, because image sensing module 300 has higher working temperature in inside when running, cause image sensing module 300 operating efficiencies to reduce easily or shorten useful life, therefore the bottom of the groove 312 of substrate 310 can further set several air vent holes 316 (Fig. 4 illustrates 4), wherein air vent hole 316 can run through substrate 310, and is equipped on around the image processor 320.Thus, present embodiment can reduce the internal temperature of image sensing module 300 by the convection action between between air vent hole 316 and context, makes image sensing module 300 can stablize and running normally.
The lid 350 of present embodiment is disposed on the substrate 310, and cover covers image sensing chip 340.Lid 350 mainly comprises adapter 352, glass cover-plate 354 and brake 356.Wherein, adapter 352 is disposed on the substrate 310, and has upper end 352a and lower end 352b.Upper end 352a has accommodation space, and lower end 352b then covers and covers image sensing chip 340.Glass cover-plate 354 is disposed in the accommodation space of adapter 352 upper end 352a, and brake 356 then is disposed on the glass cover-plate 354, and wherein glass cover-plate 354 can be filter, with the unnecessary light of filtering.In addition, for the light that enters image sensing module 300 can be focused on the image sensing chip 340, brake 356 can have the optical lens 356a (illustrating 3 optical lens 356a among Fig. 3) more than, can successfully focus on the image sensing chip 340 after the feasible light that enters image sensing module 300 passes through optical lens 356a.In addition, present embodiment image sensing module 300 can move by image processor 320 control brake devices 356, and then finishes automatic focusing.
Because image sensing module 300 intrawares are precision optical block; therefore be not subjected to outside destroy for protection image sensing module 300 intrawares; image sensing module 300 can further comprise the housing 360 that is disposed on the substrate 310 in the present embodiment; adapter 352, glass cover-plate 354 then are to be placed in the housing 360 with brake 356, to be subjected to the protection of housing 360.Above-mentioned housing 360 also can position by more than one positioning hole 362 and location pins 318 on the substrate 310.So, housing 360 can be accurately and firmly is inserted on the substrate 310.
In preferred embodiment, substrate 310 is suitable for and a soft circuit base plate 370 electrically connects, and is passed to chip 380 on the soft circuit base plate 370 with the signal of video signal that image sensing module 300 is captured, and handles to carry out signal of video signal.
In sum, image sensing module of the present invention is that groove is set on substrate, and image processor is disposed in the groove of substrate, to reduce the integral thickness of image sensing module.And the air vent hole that utilizes fin and bottom portion of groove makes the internal temperature of image sensing module be in normal working temperature, to promote its heat sinking benefit.Compared to prior art, image sensing module of the present invention has following advantage:
(1) because image processor is disposed in the substrate recess, image processor can additionally not increase the module height of image sensing module.Therefore, image sensing module of the present invention promptly has thin module thickness, to meet present electronic product demand compact and easy to carry.
(2) because image sensing chip is configurable on fin, therefore the heat of the image sensing chip inside under the operating state can be passed to chip exterior by fin, reason is overheated and cause and lost efficacy or damage to make image sensing chip, thus the useful life of improving image sensing module.
(3) because the present invention disposes air vent hole in the bottom portion of groove of substrate, therefore image sensing chip, image processor or other assembly in the image sensing module can make image sensing module that preferable operating efficiency be arranged by the thermal convection effect dissipation between air vent hole and context because of the heat that running produces.
(4) be disposed in the groove of substrate owing to image processor, image sensing chip is covered by the lid cover, therefore image processor and image sensing chip can be subjected to good structural shielding, that is image processor and image sensing chip is difficult for being damaged and cause image sensing module to lose efficacy.
Claims (9)
1. an image sensing module comprises a substrate, an image processor and an image sensing chip, and described image processor and image sensing chip all electrically connect with described substrate, it is characterized in that:
The surface of described substrate has a groove, and described image processor is disposed in the groove of described substrate;
Dispose a supporting bracket on the surface of described substrate, described supporting bracket cover covers groove, and described image sensing chip is disposed on the described supporting bracket;
Described substrate also has more than one air vent hole, and described air vent hole is formed at described bottom portion of groove, and runs through described substrate;
Described image sensing module also disposes a lid, and described lid is disposed on the described substrate and cover covers described image sensing chip.
2. image sensing module as claimed in claim 1 is characterized in that, described lid comprises:
One adapter, it is disposed on the described substrate, and described adapter has a upper end and a lower end, it is characterized in that, and described upper end has an accommodation space, and described end shield down covers described image sensing chip;
One glass cover-plate, it is disposed in the accommodation space of described adapter; And
One brake, it is disposed on the described glass cover-plate, and described brake has several optical lenses, controls moving of described brake to utilize described image processor, and then finishes automatic focusing.
3. image sensing module as claimed in claim 2 is characterized in that, described glass cover-plate is a filter.
4. image sensing module as claimed in claim 2 also comprises a housing, it is characterized in that, described housing is disposed on the described substrate, and described adapter, described glass cover-plate and described brake are placed in the described housing.
5. image sensing module as claimed in claim 4, it is characterized in that, described substrate also comprises several location pins, and has more than one location hole on the described housing corresponding to described location pins, described location pins is inserted in the described location hole, to carry out the location of described housing and described substrate.
6. image sensing module as claimed in claim 1 is characterized in that, described substrate is suitable for electrically connecting with a soft circuit base plate.
7. image sensing module as claimed in claim 1, it is characterized in that, described image processor comprises a signal of video signal process chip, some routing leads and a packing colloid, described signal of video signal process chip electrically connects by described routing lead and described substrate, and described packing colloid covers described signal of video signal process chip and described routing lead.
8. image sensing module as claimed in claim 1 is characterized in that, described substrate also has a location groove, and described detent is positioned at the outer peripheral edges of described groove, supports described supporting bracket to utilize described detent.
9. image sensing module as claimed in claim 1 is characterized in that, described supporting bracket is a fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610063634.7A CN100552941C (en) | 2006-12-27 | 2006-12-27 | Image sensing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610063634.7A CN100552941C (en) | 2006-12-27 | 2006-12-27 | Image sensing module |
Publications (2)
| Publication Number | Publication Date |
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| CN101211896A CN101211896A (en) | 2008-07-02 |
| CN100552941C true CN100552941C (en) | 2009-10-21 |
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| CN200610063634.7A Active CN100552941C (en) | 2006-12-27 | 2006-12-27 | Image sensing module |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009055717A1 (en) * | 2009-11-26 | 2011-06-01 | Continental Automotive Gmbh | Sensor module and manufacturing method of a sensor module |
| KR101334219B1 (en) * | 2013-08-22 | 2013-11-29 | (주)실리콘화일 | An image sensor with 3d stacking structure |
| US9258465B2 (en) * | 2014-01-09 | 2016-02-09 | Omnivision Technologies, Inc. | Image device having efficient heat transfer, and associated systems |
| TWI564610B (en) * | 2015-09-18 | 2017-01-01 | 正崴精密工業股份有限公司 | Camera module and method for fabricating the same |
| CN105448944B (en) * | 2015-12-29 | 2019-09-17 | 苏州晶方半导体科技股份有限公司 | Image sensing chip-packaging structure and its packaging method |
| JP2018531525A (en) * | 2015-12-29 | 2018-10-25 | チャイナ ウェーハ レベル シーエスピー カンパニー リミテッド | Image sensing chip package structure and packaging method thereof |
| CN112151564A (en) * | 2020-11-06 | 2020-12-29 | 积高电子(无锡)有限公司 | Stacked packaging structure and packaging method applied to image sensor |
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| CN2459831Y (en) * | 2001-01-22 | 2001-11-14 | 胜开科技股份有限公司 | Image sensor |
| US6521881B2 (en) * | 2001-04-16 | 2003-02-18 | Kingpak Technology Inc. | Stacked structure of an image sensor and method for manufacturing the same |
| CN2599757Y (en) * | 2002-12-27 | 2004-01-14 | 胜开科技股份有限公司 | Image sensor stack structure |
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| CN101211896A (en) | 2008-07-02 |
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