CN100541211C - Integrated circuit testing device and method and manufacturing method of testing device - Google Patents

Abstract

The invention provides an integrated circuit testing device and method and a manufacturing method of the testing device, and relates to a device and method for testing an integrated circuit on a target electronic application. The method of testing an integrated circuit includes placing the integrated circuit into a socket coupled to a circuit board that is substantially identical to a circuit board of a commercial electronic product that includes the integrated circuit but does not include the integrated circuit, and testing the integrated circuit. The method of manufacturing the tester includes mechanically attaching the socket to the retrofitted commercial electronic product and electrically connecting the integrated circuit with the retrofitted commercial electronic product. The present invention allows for cheaper, more extensive and more accurate testing of integrated circuits.

Description

Integrated circuit testing device and method, and manufacturing method of testing device

technical field

The present invention relates to the field of integrated circuits, in particular to devices and methods for testing integrated circuits. The apparatus for testing an integrated circuit may include a socket, a modified commercial electronic product, and an electrical connection between the socket and the modified commercial electronic product.

Background technique

Integrated circuits (Integrated Circuit, IC) are used in a wide variety of commercial electronic products, such as mobile phones, personal digital assistants (Personal Digital Assistant, PDA), digital cameras and so on. Typically, integrated circuits within electronic devices are designed to perform specific purposes. For example, a mobile phone may include integrated circuits for power management, integrated circuits for radio frequency processing, and integrated circuits for multimedia applications. However, depending on the commercial electronic product comprising an integrated circuit, an integrated circuit designed to perform a specific purpose may contain many functions. Some mobile phones have peripheral components such as image sensors, MP3 encoders, and LCD displays. In addition, these peripheral components may have different versions or forms (for example, an image sensor may include Charge Coupled Device (CCD) technology or Complementary Metal Oxide Semiconductor (CMOS) technology, or a liquid crystal display may also include There may be different hardware versions or manufacturers. Therefore, a single integrated circuit needs to be compatible with many different forms and versions of peripheral components.

In addition to the many environments in which integrated circuits are known to operate, there are other considerations when manufacturing commercial electronic products. An integrated circuit may contain tens to millions of electronic components, such as transistors and capacitors on a semiconductor substrate. Furthermore, during the manufacturing process, thousands of die (unpackaged integrated circuits) are included in a semiconductor wafer. The wafer fabrication process is complex and may consist of many steps such as: imaging, deposition, doping, etching, planarization, and cleaning. After wafer fabrication is complete, the wafer is singulated into individual dies, then wire bonded and packaged, with the result that tens of thousands of integrated circuit products are ready for inclusion in commercial products. The process of producing integrated circuits is not perfect, and many die and/or packaged integrated circuits may contain defects or errors.

In many commercial electronic products, integrated circuits are mounted on a printed circuit board (PCB) along with other electronic, mechanical or electromechanical components. Some integrated circuits are much more expensive than others. Because the process of fixing other components to the printed circuit board may cause damage to some temperature-sensitive integrated circuits, manufacturers may fix temperature-sensitive integrated circuits at the last manufacturing stage. However, if a defective integrated circuit is fixed on the printed circuit board, it may cause damage to other components or peripheral components when power is supplied. This renders other components mounted on the printed circuit board, peripheral components attached to the printed circuit board, or even the printed circuit board itself useless. Even if a defective integrated circuit does not cause damage to other components or peripheral components, manufacturing and engineering time and money will be wasted testing and repairing printed circuit boards. Therefore, there needs to be sufficient assurance that any integrated circuit is free from defects before the integrated circuit is mounted on a printed circuit board.

There are many prior art methods for testing integrated circuits. Wafers may be tested at different manufacturing steps to ensure that the wafer has not been damaged in previous manufacturing steps. In addition, fabs can perform component testing on individual dies after wafer fabrication is complete. This is to ensure that some of the many components within the die perform correctly. Generally, this service is charged to the customer. A fab's calculated die as a percentage of all die manufactured (volume production) for any given wafer run. Many fabs also test packaged integrated circuits to ensure that the integrated circuits are bonded and packaged without damage. Customers may also be charged for this service. However, given the number of components on a typical integrated circuit and the many circumstances in which an integrated circuit is known to operate, prior art testing procedures may be inadequate and cost prohibitive.

Accordingly, there is a need for an apparatus and method for testing integrated circuits that are cost-effective and substantially fully perform the intended functions of the integrated circuit.

Contents of the invention

The present invention proposes a device and method for testing integrated circuits aimed at the defects in the above-mentioned prior art. Devices are generally designed to emulate the operating environment of the target electronic application using the integrated circuit. With this approach, the environment in which the integrated circuit is tested will also emulate the target electronic application.

In one embodiment, the present invention relates to an apparatus for testing an integrated circuit, comprising: a socket for receiving said integrated circuit; a modified commercial electronic product including a circuit board, said modified commercial electronic product substantially the same as a commercial electronic product including the above-mentioned integrated circuit, wherein the above-mentioned modified commercial electronic product does not include the above-mentioned integrated circuit; and a plurality of wires electrically connecting at least one electronic contact of the above-mentioned integrated circuit and the above-mentioned modified commercial electronic At least one electronic contact of the product.

In another embodiment, the present invention relates to an apparatus for testing an integrated circuit comprising: a power supply; a switch; a tester including a socket for receiving said integrated circuit, a circuit board substantially identical to said A commercial electronic product of an integrated circuit, a plurality of wires electrically connecting at least one electronic contact of the integrated circuit and at least one electronic contact of the circuit board; and a circuit for detecting (i) whether the integrated circuit is correctly aligned with the socket and/or (ii) voltage at and/or current through at least one given terminal of said tester. Wherein, the above-mentioned switch is arranged between the above-mentioned power supply and the above-mentioned tester, and is used for controlling whether the above-mentioned power supply supplies power to the tester.

In another embodiment, the present invention relates to a method of testing an integrated circuit, comprising: placing the integrated circuit in a socket, the socket mechanically coupled to a modified commercial electronic product, the modified commercial electronic product The product includes a circuit board, the modified commercial electronic product substantially identical to a commercial electronic product including the integrated circuit, wherein the modified commercial electronic product does not include the integrated circuit; and testing the integrated circuit.

In another embodiment, the present invention relates to a method of manufacturing a tester for testing an integrated circuit, comprising: mechanically attaching a socket to a modified commercial electronic product, the modified commercial electronic product including a circuit board, said modified commercial electronic product substantially identical to a commercial electronic product including said integrated circuit, wherein said modified commercial electronic product does not include said integrated circuit; The above-mentioned socket is used to electrically connect at least one electronic contact of the above-mentioned integrated circuit and at least one electronic contact of the above-mentioned modified commercial electronic product.

The present invention advantageously provides an economical and commercially viable method for testing integrated circuits. The method of the present invention reduces the need for extensive and expensive device testing in a fab, and provides a more comprehensive testing environment for integrated circuits after packaging. Because the integrated circuit can be tested within the actual target application, test accuracy can be improved. Furthermore, the present invention advantageously provides novel implementations of apparatus for testing integrated circuits. These and other advantages of the present invention will become readily apparent from the following detailed description of the preferred embodiments.

Description of drawings

FIG. 1 is a top view showing a commercial electronic product.

FIG. 2 is a schematic diagram of an embodiment of a device for testing integrated circuits according to the present invention.

3A and 3B are schematic diagrams showing other embodiments of the device for testing integrated circuits of the present invention.

FIG. 4 is a schematic diagram showing a single chip socket of the present invention.

FIG. 5 is a schematic diagram showing a multi-chip socket of the present invention.

FIG. 6A, FIG. 6B, FIG. 6C and FIG. 6D show exemplary detection circuits of the present invention.

FIG. 7 is a circuit diagram showing an embodiment of a detection circuit.

Figure 8 is a top view showing an embodiment of a receptacle connected to a modified commercial electronic product.

FIG. 9 is a side view showing the apparatus of FIG. 8 .

10A and 10B show another embodiment of the device for testing integrated circuits of the present invention.

FIG. 11 is a schematic diagram showing another embodiment of the device for testing integrated circuits of the present invention.

FIG. 12 is a schematic diagram showing another embodiment of the device for testing integrated circuits of the present invention.

FIG. 13 is a partial view showing area A of FIG. 12 .

14A and 14B show yet another embodiment of the device for testing integrated circuits of the present invention.

FIG. 15 shows yet another exemplary device for testing integrated circuits according to the present invention.

FIG. 16 shows yet another exemplary device for testing integrated circuits according to the present invention.

FIG. 17 shows yet another exemplary device for testing integrated circuits according to the present invention.

Description of main component symbols:

10, 110, 210a, 210b, 210c, 910, 910b, 1010, 1110, 1310～chassis;

11, 13a, 30b, 35, 130b, 135, 235, 1634, 1636～input/output ports;

1161, 1361～the first supporting structure;

1162, 1362～second support structure;

1165～step; 1166～through hole;

1430, 1630～tester; 1440, 1640～circuit;

1542～control computer;

1551, 1650～automatic chip loader;

1552, 1652～loading box; 1653～unloading box;

1554, 1555a, 1555b, 1555c～box;

1642～logic unit; 1643～memory element;

1651～mechanical device;

12, 551g, 603, 1420, 1620 ~ switch;

120, 220a, 220b, 320, 420, 520, 720, 920, 920b, 1020, 1120, 1320, 1631～socket;

13, 602, 1450, 1641, 1644 ~ indicator;

137, 137a, 137b, 1660a, 1660b ~ integrated circuits;

14, 601, 1410, 1610～power supply;

140, 240a, 240b, 1633 ~ multiple wires;

142～terminal;

230, 1638～modified commercial electronic products;

30, 130～commercial electronic products;

31, 131, 231, 731, 931, 931b, 1031a, 1031b, 1031c, 1131, 1331, 1632～circuit board;

33, 133, 233, 133a, 133b, 133c, 1635～electronic contacts;

34～LCD display screen;

36～image sensor;

37, 38a, 38b, 38c, 38d, 38e ~ electronic components;

321, 421a, 421b, 521, 721, 1021, 1637～terminal support;

322, 422a, 422b, 522, 722, 922a, 922b, 922c, 1022, 1123～seat;

323, 423, 523, 723, 923, 1023, 1122 to the base;

324, 424, 524, 724, 924, 1124～top cover;

523a, 524a ~ top;

523b～recessed side wall;

524b~movable side portion; 552a, 552b, 552c~conductor;

551, 551a, 551b, 551c, 551d, 551e, 551f~conduction terminal;

604～other components;

761, 961, 961b, 1061～support structure;

839 ~ the installation area of the support structure;

841, 941a, 941b, 941c, 1132 ~ adapter.

Detailed ways

In order to make the above-mentioned and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments are listed below, together with the accompanying drawings, and are described in detail as follows:

The present invention will be disclosed with preferred embodiments, but they are not intended to limit the scope of the present invention. On the contrary, there are certain changes and modifications that may be made within the spirit and scope of the present invention, as defined in the appended claims. Furthermore, the following detailed description of the invention is set forth in numerous specific details in order to provide a thorough understanding of the invention. However, one skilled in the art can readily practice the invention without these specific details. In other instances, well-known methods, procedures, components and circuits have not been described in detail so as not to unnecessarily obscure the practice of the present invention.

For convenience and simplification, the terms "conductor", "wire", "pin", "trace", "wire", "bus", "copper foil", "via", "plug" "plug", "contact", "pad", "electronic contact", "lead" and "thru-hole" are used interchangeably, such as the terms "support", "bracket", "construction", " "step" and "fixture", but these terms generally have their art-recognized meanings. Likewise, for convenience and simplicity, the terms "circuit board" and "printed circuit board" are used interchangeably and generally relate to a device for electrically connecting to one or more electronic components, components and/or conductors. The terms "electronic product" and "commercial electronic product" are also used interchangeably. For convenience and simplification, the terms "socket", "test socket", "stand" and "fixing device" are further used interchangeably, and generally refer to a device on which an integrated circuit chip can be placed and fixed. Such devices (in particular sockets or test sockets) may have multiple electrical connections to entire rows of input and/or output pins of an integrated circuit. However, these terms also have their art-recognized meanings.

The present invention relates to devices and methods for testing integrated circuits. The device includes a socket, a modified commercial electronic product, and an electrical connection between the socket and the modified commercial electronic product. In one embodiment, the invention relates to an apparatus for testing an integrated circuit comprising: a socket for receiving said integrated circuit; a modified commercial electronic product comprising a circuit board substantially The same as a circuit board in a commercial electronic product including the above-mentioned integrated circuit, wherein the above-mentioned modified commercial electronic product does not include the above-mentioned integrated circuit; and a plurality of wires for electrically connecting at least one electronic contact of the above-mentioned integrated circuit and the above-mentioned modified At least one electronic contact of a commercially available electronic product.

In another embodiment, the present invention relates to an apparatus for testing an integrated circuit comprising: a power supply; a switch; a tester including a socket for receiving said integrated circuit, a circuit board substantially identical In a circuit board in a commercial electronic product including the above-mentioned integrated circuit, a plurality of wires are used to electrically connect at least one electronic contact of the above-mentioned integrated circuit and at least one electronic contact of the above-mentioned circuit board; and a circuit for detecting (i) Whether the integrated circuit is properly aligned into the socket and/or (ii) voltage at and/or current through at least one given terminal of the tester.

In another embodiment, the present invention relates to a method of testing an integrated circuit, comprising: placing the integrated circuit in a socket, the socket mechanically coupled to a modified commercial electronic product, the modified The commercial electronic product includes a circuit board substantially identical to a circuit board in a commercial electronic product including the integrated circuit, wherein the modified commercial electronic product does not include the integrated circuit; and testing the integrated circuit.

In another embodiment, the present invention relates to a method of manufacturing an integrated circuit tester, which includes: mechanically attaching a socket to a modified commercial electronic product, the modified commercial electronic product including a circuit board , the circuit board being substantially the same as a circuit board in a commercial electronic product including said integrated circuit, wherein said modified commercial electronic product does not include said integrated circuit; and electrically connecting at least one electronic contact of the integrated circuit and at least one electronic contact of the modified commercial electronic product.

Various embodiments of the invention are described in detail below.

In one embodiment, an exemplary apparatus for testing an integrated circuit includes: a socket for receiving an integrated circuit; a modified commercial electronic product including a circuit board substantially identical to a circuit board including an integrated circuit; A circuit board in a commercial electronic product, wherein the modified commercial electronic product does not include an integrated circuit; and a plurality of wires electrically connecting at least one electronic contact of the integrated circuit and at least one electronic contact of the modified commercial electronic product.

Commercial electronic products as described above may contain a number of electronic, mechanical or electromechanical components required to perform one or more intended functions. For example, FIG. 1 shows a commercial electronic product 30 including a casing 10 . The commercial electronic product 30 may include peripheral components, such as a liquid crystal display screen 34, an image sensor 36, and/or a speaker (not shown in FIG. 1 ), and one or more input/output ports (eg, port 30b). In addition, the commercial electronic product 30 may include a circuit board 31 , and the circuit board 31 is generally packaged in the casing 10 . The circuit board 31 can be electrically connected to peripheral components, and can further contain additional electronic, mechanical or electromechanical components. For example, circuit board 31 may be configured with electrical contacts 33 for attaching electronic components 37 . The electronic component 37 can be an active component, a passive component or a combination of both. The electronic component 37 can further be packaged or unpackaged, and can also be a multi-chip module or some other electronic component with connectors. For the purposes of this discussion, the electronic component being tested (electronic component 37) is a packaged integrated chip. However, those skilled in the art may recognize the need to test other forms of electronic components, and further rewrite the description of the present invention to include such components. In addition to the integrated chip 37, the circuit board 31 also includes a plurality of electronic components 38a, 38b and 38c, which are required to perform the intended functions of commercial electronic products. The circuit board 31 also includes one or more input/output ports, such as port 35 for transmitting and/or receiving data. In FIG. 1, port 30b and port 35 contain electrical contacts, which can be used to connect cables or other wires. However, the port 30b and the port 35 may also be functional ports, such as ports capable of transmitting and/or receiving information without connecting wires (eg, infrared or radio frequency ports).

FIG. 2 is a diagram showing an embodiment of a testing device for an integrated circuit of the present invention. The modified commercial electronic product 130 includes a circuit board 131 , wherein the circuit board 131 includes a plurality of electronic components 38 a , 38 b , 38 c and an input/output port 135 . Although the circuit board 131 includes electronic contacts 133 for attaching the DUT (integrated circuit), the integrated circuit 137 (integrated circuit to be tested) is not mounted on the circuit board 131 . More specifically, the integrated circuit 137 is placed in the socket 120 and is electrically connected to substantially the same electrical contacts of the circuit board 131 . Thus, the modified commercial electronic product 130 includes a circuit board 131 that is substantially the same as the circuit board in the commercial electronic product of FIG. 1 ; however, the modified commercial electronic product 130 does not include the integrated circuit 137 . It will be appreciated that modifications may be made to the circuit board 131 without departing from the scope of the invention. The plurality of wires 140 electrically connect one or more (usually plural) electrical contacts 133 of the modified commercial electronic product 130 to one or more (usually plural) electrical contacts (not shown) of the integrated circuit 137 . In this way, the integrated circuit 137 can be tested in an environment similar to that in which the final integrated circuit will actually work. This embodiment provides a more complete environment for testing the integrated circuit and provides a greater degree of confirmation of the test results, because the test results will reflect the actual results of placing the tested integrated circuit on the predetermined position of the circuit board. The present invention is also less expensive than prior art mass component testing in a wafer fab.

A circuit board to which a plurality of electronic components (such as integrated circuits) are attached may contain various electronic contacts. Electronic components are usually contained in a package, and may also contain a plurality of electronic contacts for electrically connecting external components. Generally, electronic components are secured to circuit boards by soldering the electronic contacts of the electronic components to the electronic contacts of the circuit board. One embodiment of the present invention includes a socket for mounting and receiving electronic components (such as integrated circuits), a circuit board including bonding pads (such as electronic contacts) corresponding to electronic contacts of the electronic components, and a plurality of wires for electrically connecting electronic components. Electronic contacts of components and bonding pads of circuit boards. In one embodiment, the integrated circuit includes electrical leads, and the circuit board includes electrical bonding pads corresponding to the electrical leads of the integrated circuit. The plurality of wires can electrically connect one or more electrical leads to one or more electrical bonding pads. Each wire of the plurality of wires may comprise a copper wire having one end attached to an electrical contact on the circuit board and the other end attached to other terminals. The terminals can be clamped by the socket to physically and electrically connect to the electronic contacts of the electronic components. In another embodiment, one of the plurality of wires may include a pin, one end of which is physically placed and soldered to a thru-hole of the circuit board, and the other end is physically and electrically connected to An adapter, wherein the adapter is further used to be electrically connected to the terminal. Accordingly, any or all of the plurality of conductors of the present invention may include various conductive portions (ie, pins, wires, adapters and/or terminals). Furthermore, the conducting portion of the one or more pluralities of wires may further include copper wires, enamel-coated wires, a wire of a multi-wire cable, traces, and/or embedded in or located on a printed circuit board. Other conductive films, etc. Fabricating a single wire comprising various parts is a well known art.

In one embodiment, the modified commercial electronic product 130 includes substantially all electronic, mechanical, and/or electromechanical components when coupled to the integrated circuit 137 to perform the intended functions of the commercial electronic product. The modified commercial electronic product 130 may include peripheral components such as a liquid crystal display screen 34 , an image sensor 36 and/or a speaker (not shown). The modified commercial electronic product 130 may also include an input/output port 130b. When a large number of peripheral components are included in a modified commercial electronic product, the test environment more accurately reflects the actual operating environment of the integrated circuit 137 .

In another embodiment, the testing device further includes a housing containing or supporting the circuit board. As shown in FIG. 2 , the circuit board 131 is included in the casing 110 . The casing 110 can also provide mechanical support for the modified commercial electronic product 130 and peripheral components, such as the LCD screen 34 and the image sensor 36 . FIG. 3A shows another exemplary case, wherein the circuit board 231 is supported by the case 210a. The housing 210a may also support the receptacle 220a and/or the wires 240a. In another embodiment, the enclosure shown in FIG. 3B includes enclosure 210b, wherein enclosure 210b supports enclosure 210c that includes a circuit board (not shown). Likewise, the housing 210b can also support the receptacle 220b and/or the wire 240b. In addition, the housing 210a and the housing 210b shown in FIG. 3A and FIG. 3B may also include other components, such as ports 11, switches 12, indicators 13, power supplies 14 and/or other components 13a, and the functions of each component will be described below. describe.

As previously described, integrated circuits are tested on sockets. FIG. 4 shows the receptacle 320 . In one embodiment, the socket 320 includes a seat 322 for clamping and aligning the integrated circuit 137 , and a base 323 for providing mechanical support to the seat 322 . The seat 322 may be a recessed portion of the base 323 such that the seat 322 is lower than the top end of the base 323 . Please note: "lower", "higher", "higher", "top", "bottom", "bottom", "upward", "downward", "side" and other such terms are relative , and for illustrative purposes. The seat 322 may also consist of a mechanical structure protruding from the base 323 having internal dimensions approximately equal to the external dimensions of the integrated circuit 137 . In this case, the protrusion will be taller than both the seat 322 and the base 323, where the seat 322 and the base 323 are about the same height.

In another embodiment, the socket 320 may also include a terminal support 321 corresponding to the electronic contacts of the integrated circuit 137, so that when the integrated circuit 137 is placed on the seat portion 322, the terminals in the terminal support 321 are in contact with the electronic contacts of the integrated circuit 137. . The terminal may be a part of a plurality of wires 140 . As shown in FIG. 2 , the plurality of wires 140 are electrically connected to at least one electrical contact of the integrated circuit 137 and at least one electrical contact 133 of the modified commercial electronic product 130 . The plurality of wires 140 may be enamel or copper wires, conductive pins, cables containing multiple wires, and/or combinations thereof. In one embodiment, one end of the enamel wire or copper wire 140 may be soldered to the electrical contact 133 , and the other end may be soldered to the conductive terminal on the terminal support 321 of the socket 120 . In another embodiment, the first adapter is soldered to the electrical contact 133, the second adapter is used to connect to the terminal on the terminal support 321 of the socket 120, and a cable electrically connects the first and second Adapter. In yet another embodiment, the electrical contacts 133 are via holes, and the conductive pins are connected at one end to terminals on the terminal support 321 of the socket 120 , and the conductive pins are soldered into the via holes 133 .

Please refer to FIG. 4 , the integrated circuit 137 is located in or on the seat portion 322 . Socket 320 may also include other configurations to more tightly seat integrated circuit 137 in the seat. According to one embodiment, the socket 320 includes a cover 324 for contacting the seat 322 and securing the integrated circuit 137 in the seat 322 . In one embodiment, the upper cover 324 may be mechanically coupled to the base 323 through a hinge (not shown). The upper cover 324 can be locked on the base 323 so that the integrated circuit 137 is tightly closed in the seat 322 . Additionally, the upper cover 324 may not be locked to the base 323 so that the seat 322 is accessible and the integrated circuit 137 can be placed therein.

In another embodiment, a socket may be used to accept more than one integrated circuit. As shown in FIG. 5 , the base 423 can provide mechanical support to the seat 422a and the seat 422b. The socket 420 may be configured with multiple sets of terminal support 421a and terminal support 421b. The integrated circuit 137a is located in or on the seat portion 422a, so that the terminals in the terminal support 421a contact the electrical contacts of the integrated circuit 137a. Similarly, the integrated circuit 137b is located in or on the seat portion 422b such that the terminals in the terminal support 421b contact the electrical contacts of the integrated circuit 137b. As previously described, the socket 420 may also include a cover 424 that may be used to contact the one or more seats 422a, 422b and secure the one or more integrated circuits 137a, 137b therein. In this embodiment, it is understood that the cover may be a single cover that contacts all of the seats, or that there may be multiple covers, each contacting one or more seats. Although this embodiment shows a simple two-chip socket, it is understood from this example that the socket can be used to accept any number of integrated circuits, and that the invention is not limited to such configurations.

In another embodiment, the socket may include a circuit to detect whether the device under test is correctly aligned with the seat. 6A-6D show an embodiment of a socket 520 including a detection circuit. As shown in FIG. 6A, the base 523 may include a top 523a and a recessed sidewall 523b. The upper cover 524 can include a top 524 a and a movable side portion 524 b, wherein the movable side portion 524 b can be closed to be locked in the recessed side wall 523 b of the base 523 . Such a configuration is exemplary and it will be appreciated that the base need not have recessed side walls and the lid need not have removable side portions. The present invention is contemplated to be applicable to any base and lid configuration such that in one embodiment a first portion of the circuitry is contained in the base and a second portion of the circuitry is contained in the lid, wherein a closure is formed when the lid is closed. circuit. In another embodiment, when the cover is closed and the integrated circuit is properly aligned or mounted on the seat 522, a closed circuit is formed. According to one embodiment, more than two electrically conductive terminals ( 551 a , 551 b ) are fixed on the recessed sidewall 523 b of the base 523 . The conductor 552a is mounted in or on the movable side portion 524b of the upper cover 524 . When the upper cover is closed and locked to the base, a conductive circuit is formed: conductive terminal 551a, conductor 552a, and conductive terminal 551b.

In another embodiment, as shown in FIG. 6B , the conductive terminal 551c, the conductive terminal 551d, the conductive terminal 551e, and the conductive terminal 551f can be placed on the top 523a of the base 523, and the conductor 552b can be placed on the top of the upper cover 524. on top 524a. Alternatively, as shown in FIG. 6C , the conductive terminals 551 c and 551 d can be placed on the top 523 a of the base 523 , and the conductor 552 c can be placed on the top 524 a of the upper cover 524 . Although the conductor 552c is shown as a single conductor, it is understood that the conductor 552c may include multiple conductors, the particular configuration being that corresponding to the configuration of the conductive terminals. As previously described, conductor 552c may be "L" shaped (as shown in FIG. 6C ), looped (as shown in FIG. 6B ), multi-striped, or capable of forming an electrical connection between two or more conductive terminals. any other geometry. Furthermore, one or more conductive terminals 551 may be placed on the top 523a and the recessed sidewall 523b of the base 523, and one or more conductors may be placed on the top 524a and the movable side portion 524b of the upper cover 524 .

In yet another embodiment of the circuit for detecting whether the integrated circuit is correctly positioned on the seat, an electromechanical switch as shown in FIG. 6D can replace the conductive terminals in FIGS. 6A , 6B and 6C. When the upper cover 524 is used to close the integrated circuit 137 on the seat 522, the switch 551g is used to open or close (ie conduct or not conduct from one terminal of the switch to the other terminal). Therefore, no conductors are required on the part of the socket facing the switch (either on the top cover or the base, as shown in the embodiment). Although the exemplary circuit shown in FIG. 6D includes one switch, it is understood that more than one switch may be included. In accordance with the foregoing and FIGS. 6A , 6B, 6C, and 6D, one or more switches may be disposed on the top 523a and/or recessed sidewall portion 523b of the base 523 . Additionally, one or more switches may be included on top 524a or movable side portion 524b of upper cover 524, or any combination of the foregoing. In another embodiment, the socket may include more than two conductive terminals as shown in Figures 6A, 6B and 6C, and one or more switches on the base and/or cover as shown in Figure 6D.

Another embodiment of the present invention includes an indicator to indicate whether the integrated circuit is properly seated. The indicator may be a visual display including one or more liquid crystal displays or Light Emitting Diodes (LEDs), for example: a red LED to indicate a negative result and a green LED to indicate a correct result; or Can be an audio indicator, such as a buzzer or a speaker. Alternatively, the indicator may be an electronic signal of a circuit to be coupled to a controller or processor. In one embodiment, the indicator may be part of a circuit that detects that the integrated circuit is properly seated in the seat, or the indicator may be connected to a circuit that detects that the integrated circuit is correctly seated in the seat.

FIG. 7 shows an exemplary circuit for detecting whether the integrated circuit is correctly aligned with the seat. The detection circuit may include a power source 601 and an indicator 602 . The indicator 602 can be the light emitting diode shown in the figure, or any other components for indicating. Switch 603 is used to execute an electrical circuit when the integrated circuit is properly placed in the socket and may include conductive terminals, conductors, and/or electromechanical switches as previously described. The circuit may also include other elements 604, the structures of which are well known in the related art. In one embodiment, when the integrated circuit is properly aligned with the seat, the switch is closed to provide current to the indicator 602 . It will be appreciated that this is a simple example of a detection circuit, and that a person skilled in the art may perceive more complex detection circuits, which may include logic units and/or other components.

In one embodiment, the support structure mechanically attaches the socket to the retrofit commercial electronic product. FIG. 8 is a top view showing receptacle 720 connected to a modified commercial electronic product, wherein the modified commercial electronic product contains a circuit board. The support structure 761 extends from the base 723 to the circuit board 731 . Terminal support 721 provides mechanical support to the terminals at the ends of the plurality of wires. In one embodiment, the base 723 includes a hole through which the support structure 761 can pass. In another embodiment, the support structure 761 is part of the receptacle 720 . However, it is understood that the support structure 761 may be affixed to the outside of the base 723 .

FIG. 9 is a side view showing the socket of FIG. 8 and a modified commercial electronic product. In this embodiment, the receptacle is secured directly to the modified commercial electronic product by a support structure mounted on the interior area of the circuit board. The circuit board 731 may include a plurality of electronic components, such as the component 38a, the component 38b and the component 38c. The circuit board 731 also includes electronic contacts 133 , wherein the electronic contacts 133 are electronic contacts corresponding to the device under test (integrated circuit 137 ). The receptacle 720 including a terminal support (not shown), a seat 722 , a base 723 and a cover 724 is mounted on the circuit board 731 via one or more support structures 761 . As shown in the figure, the plurality of wires 140 are electrically connected to at least one electrical contact of the integrated circuit 137 and at least one electrical contact 133 of the circuit board 731 . The plurality of wires 140 can be mounted on the adapter 841 of the circuit board 731 and terminals (not shown) contained in or on the terminal support. The plurality of wires can be conductive pins as shown, enamel or copper wires, or any other wires. The support structure 761 can be mounted alongside the base 723 as shown, or can be mounted to connect to the bottom of the base 723 . In addition, the supporting structure 761 can be installed on the surface of the circuit board 731 or pass through holes on the circuit board 731 . Preferably, the mounting area 839 of the supporting structure 761 is larger than the supporting structure 761, wherein the mounting area 839 of the supporting structure 761 has no electronic components or wires. Accordingly, support structure 761 may be mounted on circuit board 731 in a non-conductive and/or passive manner.

In other applications, however, there may not be enough mounting area for the support structure to allow the support structure to be mounted on or through the circuit board in a non-conductive and/or passive manner. Even in other applications, it is not satisfactory to modify the components and/or conductors arranged on the circuit board, eg radio frequency circuits. These applications therefore require the socket to be held in place by means of a support structure which is either mounted on the outer confines of the circuit board or is not connected to the circuit board.

In an embodiment, the support structure may be mounted to an external area of the circuit board. As shown in FIG. 10A , the circuit board 931 includes an electronic component 38d, an electronic component 38e, and electrical contacts 133a, 133b, and 133c respectively corresponding to the electronic component 38a, the electronic component 38b, and the integrated circuit 137. The socket 920 includes a seat 922 a , a seat 922 b , a seat 922 c , a base 923 and a cover 924 . Although the socket of this example supports multiple seats, the scope of the invention is not so limited, and examples may include sockets in which the base provides mechanical support to a single seat. As shown in FIG. 10A , the support structure 961 is mounted on the socket 920 and has a mechanism for securing the circuit board 931 . The support structure 961 may include an extended portion opposite to the side where the socket is attached, wherein the circuit board 931 is secured between the housing 910 and the extended portion of the support structure 961 . The plurality of wires 140 are electrically connected to each electronic component 38a, electronic component 38b and at least one electronic contact of the integrated circuit 137 and at least one electronic contact of the circuit board (electronic contact 133a, electronic contact 133b and electronic contact 133c). The plurality of wires 140 can be connected to the adapter 941a, the adapter 941b, and the adapter 941c and/or terminals (not shown) included in the terminal support.

Figure 10B shows an embodiment of securing a circuit board between the housing and the extension of the support structure. The cabinet 910b may include a case having an upper portion and a lower portion. The circuit board is secured between the upper portion of the housing 910b and the extended portion of the support structure 961b at a location indicated by dashed line 931b. The support structure 961b is further attached with a socket 920b, wherein the socket 920b is disposed on the other side of the upper part of the housing 910b. In this embodiment, it may be desirable to modify the circuit board such that extensions of the support structure 961b and the chassis 910b can contact the circuit board in passive and/or non-conductive areas. In one embodiment, if the enclosure and/or support structure are conductive, a non-conductive film or gasket can be placed over the enclosure, support structure, and/or circuit board so that the non-conductive film Or a spacer between the circuit board and the case and/or support structure.

In another embodiment, the support structure may be housed in a housing containing the circuit board. Referring to FIG. 11 , the socket 1020 is mounted on the casing 1010 through a supporting structure 1061 . The casing 1010 further includes or supports a circuit board 1031a and may also include or support additional circuit boards 1031b and 1031c.

A further embodiment of the present invention includes a stage for mechanically attaching receptacles and modified commercial electronic products. The step may consist of a configuration parallel to the circuit board of the retrofit commercial electronic product and provide mechanical support to the socket. In one embodiment, the first plurality of support structures mechanically attach the modified commercial electronic product to the step. The first plurality of support structures may be mounted directly to the modified commercial electronic product, or the support structure may be mounted to a housing, wherein the modified commercial electronic product is also mounted to the housing as described above. Sockets can be mounted directly on the steps. In another embodiment, the second plurality of support structures mechanically attach the steps to the receptacle. In this embodiment, the second plurality of support structures can suspend the receptacle above the step, or can secure the receptacle to the step. Referring to FIG. 12 , the circuit board 1131 is installed in the housing 1110 and contains the electronic component 38 a , the electronic component 38 b , the electronic component 38 c and the electronic contact 133 . The step 1165 is installed on the casing 1110 by the first supporting structure 1161 . The first support structure 1161 has a specific (or predetermined minimum) height, so as to lift or place the step 1165 and the socket 1120 above other components (such as: electronic components 38a, electronic components 38b, electronic components 38c, etc.), to avoid damage to other components. In this embodiment, the second support structure 1162 does not hang the receptacle 1120 above the step, but it should be said that the receptacle 1120 is supported on the step 1165 and secured by the second support structure 1162 . As shown, although the first support structure 1161 is not attached to the circuit board 1131, it is understood that the first support structure 1161 can be attached to the inner or outer area of the circuit board 1131 as described above. The socket 1120 includes a base 1122 , a seat 1123 , a cover 1124 and a terminal support (not shown), and is used to receive the integrated circuit 137 .

The seat 1123 may also include a mechanical support for terminals that are electrically connected to one or more electrical contacts (not shown) of the integrated circuit 137 . The plurality of wires 140 are electrically connected to at least one (preferably plural) electrical contacts of the integrated circuit 137 and at least one (preferably plural) electrical contacts 133 of the circuit board 1131 . The plurality of wires 140 can be connected to the adapter 1132 and terminals (not shown) contained in the terminal support. In one embodiment, the step includes at least one through hole, so that a plurality of wires can pass through the through hole without contacting the step. FIG. 13 is an enlarged view showing the range A of the dotted line in FIG. 12 . The base 1122 of the receptacle 1120 is located on top of the step 1165 . The plurality of wires 140 may include terminals 142 , wherein the terminals 142 are included in the terminal support 1121 of the socket 1120 and are electrically connected to the wires 140 . In one embodiment, the step 1165 includes a through hole 1166 , wherein the wire 140 can pass through the through hole 1166 without contacting the step 1165 . In another embodiment, the step 1165 can include one via through which all wires can pass, or the step 1165 can include any number of vias through which one or more wires can pass. In another embodiment, the step 1165 may further include a circuit. The aforementioned circuits may include wires for winding, and may further include other electronic devices such as connectors, switches, indicators, ports, and/or controls. The step itself may comprise a circuit board coupled to a socket 1120 (preferably including a detection circuit) and/or a plurality of wires 140, wherein the circuit board includes electrical wires and components.

In some applications, commercial electronic products may be sensitive to radio frequency (RF) interference. The commercial electronic products described above may include suppression devices (such as conductive sheets or cages) to reduce any unwanted radio frequency signals. The test device of the present invention may require the above-mentioned protection to be moved or modified so that the plurality of wires can electrically connect the integrated circuit and the modified commercial electronic product. Fig. 14A and Fig. 14B show the exemplary device for testing the integrated circuit, which is used in the application where radio frequency interference needs to be considered when testing the integrated circuit. At this time, the step/chassis is in the form of a conductive box or a conductive cage. . The circuit board 1331 is placed in a conductive box or cage 1310 so that the circuit board 1331 can be protected from unwanted radio frequency interference. In one embodiment, the top of the conductive cage 1310 is parallel to the circuit board, and for the purposes of this discussion, may be considered a step as previously described. The first support structure 1361 is attached to the circuit board 1331 and the bottom surface of the step/casing 1310 . The second support structure 1362 attaches to the front face of the receptacle 1320 and the step/casing 1310 . Although the circuit board 1331 in FIG. 14B is configured on the bottom surface of the step 1310, it can be understood that the circuit board 1331 can be configured on the top surface of the step 1310, so the socket 1320 and the integrated circuit can be configured on the bottom surface of the step 1310. bottom surface.

In another embodiment, an apparatus for testing an integrated circuit may include input and/or output ports. Referring to Figure 3B, any element 13a may be an input and/or output port. The port 13a can be electrically connected to the modified commercial electronic product 230 , the socket 220b , the port 11 , the switch 12 and/or the indicator 13 . In yet another embodiment, the power supply may be coupled to a retrofit commercial electronic product. The power source 14 can be a DC-to-DC converter, an AC-to-DC converter, or an independent power source such as a battery. In one embodiment, the power source 14 is a battery of a commercial electronic product. The power source 14 can be further coupled to the port 11 or the port 13a.

In another embodiment, an exemplary apparatus for testing an integrated circuit includes: a power supply; a switch; a tester including a socket for receiving the integrated circuit, a circuit board substantially identical to a commercial electronic product including the integrated circuit a circuit board with a plurality of wires electrically connected to at least one electrical contact of the integrated circuit and at least one electrical contact of the circuit board; and a circuit for detecting (i) whether the integrated circuit is correctly aligned with the socket and/or (ii) in the A voltage of at least one predetermined terminal of the tester and/or a current through at least one predetermined terminal of the tester.

As shown in FIG. 15 , a device for testing an integrated circuit includes a power source 1410 , a circuit breaker or switch 1420 , a tester 1430 including a socket, and a circuit 1440 . In one embodiment, the device for testing an integrated circuit may include an indicator 1450 connected to the circuit 1440 . In another embodiment, as shown in FIG. 16 , the device for testing integrated circuits may include a control computer 1542 , an automatic chip loader 1551 , a loading box 1552 and an unloading box. The automatic chip loader 1551 can include a mechanical arm with two or more segments (preferably more than three segments) that moves independently and a support at the end of the mechanical arm, such as a vacuum wand, wherein the support is connected to the logic unit, indicator , and/or input and/or output ports together to pick up, clamp and release an integrated circuit or chip. For example, the automated chip loader 1551 can be configured to pick up the integrated circuit from the load bin 1552, release the integrated circuit to the tester 1430, e.g., place the integrated circuit into a socket, and indicate that the integrated circuit is placed into the tester 1430, e.g., by automatically Close the lid of the test socket equipped with the detection circuit (as described herein), wait for instructions from the circuit 1440, pick up the integrated circuit from the tester 1430, and release the tested integrated circuit into the unload bin. The unloading bins may be divided such that pass integrated circuits are placed in bin 1554, and failed integrated circuits are placed in one of bin 1555a, bin 1555b, bin 1555c depending on the type of error. Additionally, the unloaded bins may be partitioned such that failing integrated circuits are placed in bin 1554, and passing integrated circuits are placed in bins 1555a, 1555b, 1555c depending on test criteria and/or results (e.g., critical parameter values) one.

Referring more closely to FIG. 17 , an apparatus for testing an integrated circuit includes a power supply 1610 , a switch 1620 , a tester 1630 and a circuit 1640 . The power source 1610 can be a DC-to-DC converter, an AC-to-DC converter, a battery, or any other source. The switch 1620 is disposed between the power supply 1610 and the tester 1630 for controlling whether the above-mentioned power supply supplies power to the tester. In one embodiment, the switch 1620 may be configured as an open circuit to prevent conduction of power from the power source 1610 to the tester 1630 . In another embodiment, switch 1620 may be configured to short the output of power supply 1610 to ground. Although switch 1620 is illustrated as a separate component from tester 1630 or power supply 1610, it is understood that switch 1620 may be a component of power supply 1610, a component of tester 1630, and/or any other component within a test setup. Switch 1620 may be a physical switch or any other functional switch, and the present invention contemplates including a switch function that prevents conduction of power to receptacle 1631 , circuit board 1632 , tester 1630 and/or overall test equipment. The tester 1630 may also include a plurality of wires 1633 for electrically connecting at least one electrical contact 1635 of the integrated circuit 1660 a and at least one electrical contact 1635 of the circuit board 1632 . The conductive terminals in terminal support 1637 may be one or more plurality of wires 1633 . The tester may further include an input/output port 1634 for connecting to the circuit 1640 .

The circuit 1640 may include several detectors. In one embodiment, the circuit 1640 receives an indication from the socket 1631, wherein the socket 1631 may include additional circuitry required to detect whether the integrated circuit 1660a is properly aligned. In another embodiment, the circuit 1640 may include a voltage detector including a reference voltage and a comparator for detecting when the detected voltage on a given terminal of the tester 1630 is greater than or less than the reference voltage. Alternatively, the circuit 1640 may include a plurality of voltage detectors for detecting whether the detected voltage on a given terminal of the tester is within or outside a predetermined voltage range. In yet another embodiment, the circuit 1640 may include a current detector to detect the current flowing through a given terminal of the tester 1630 . This may include current detectors placed in series with predetermined terminals (not shown) of the tester 1630 . The current detector may also include other components, such as a comparator, which is used to indicate when the current is greater than or less than a reference current or is within or outside a predetermined current range.

The power supply 1610 can be coupled to the tester 1630 via the switch 1620 . In one embodiment, the circuit 1640 can be used to open the switch 1620 if (i) the integrated circuit 1660a is not properly aligned with the receptacle 1631 and/or (ii) the voltage at one or more given terminals of the tester 1630 and/or pass The current at one or more given terminals of tester 1630 is outside a given range of values. In another embodiment, the device for testing an integrated circuit may also include an indicator 1641 to indicate (i) whether the integrated circuit 1660a is correctly aligned with the socket 1631 and/or (ii) one or more of the tester 1630 The voltage at a given terminal and/or the current through one or more given terminals of the tester 1630. In the embodiment shown in FIG. circuit 1640 indicator. In one embodiment, the visual indicators may include one or more liquid crystal displays, light emitting diodes, and/or analog displays (eg, voltmeters or galvanometers). In another embodiment, the indicator may be a buzzer or an audible signal generated by a speaker. In yet another embodiment, the indicator may be an electronic signal of the circuit.

The device for testing integrated circuits may further include analog and/or digital logic units 1642 . Although the logic unit 1642 is shown as one of the components of the circuit 1640, it is understood that the logic unit 1642 may be a component connected to the circuit 1640, such as a controller or a computer. For example, the logic unit 1642 may be a microcontroller that is part of the circuit 1640 , or the logic unit 1642 may be a personal computer connected to the circuit 1640 . In one embodiment, the logic unit 1642 can be used to open the switch 1620 if (i) the integrated circuit is not properly aligned with the socket and/or (ii) the voltage at one or more given terminals of the tester and/or The current through one or more of the specified terminals of the tester is outside the specified range value. In one embodiment, the circuit 1640 is used to receive an indication from a voltage detector or a current detector, and/or an indication from a detector for detecting whether the integrated circuit is correctly aligned to the seat. The circuit 1640 further corresponds to the indicator for controlling the switch 1620 . For example, when integrated circuit 1660a is not properly aligned with receptacle 1631, or the voltage at one or more given terminals of tester 1630 and/or the current through one or more given terminals of tester 1630 is within a given range of values Additionally, circuit 1640 is used to open switch 1620 to prevent current from passing through tester 1630 .

In another embodiment, the logic unit 1642 is also connected to the tester through input and/or output ports, and corresponds to a program for controlling the tester. Tester 1630 may include input/output ports 1634 as previously described. Additionally, circuit board 1632 may include input/output ports 1636 . The logic unit 1642 can be connected to the tester 1630 via the input/output port 1634 and/or the port 1636 . The logic unit 1642 may include a program containing instructions to control the tester 1630 . An embodiment may include instructions to "power on" the tester. Another embodiment may include instructions to configure the tester to open different peripheral devices. In yet another embodiment, the logic unit 1642 may generate a test waveform to be conducted through the tester 1630 and compare the actual response of the tester 1630 to the expected response. Such waveforms may be transmitted or received by either input/output port 1634 or port 1636, or to a given terminal (preferably a power supply terminal) of the tester. Waveforms may also be electromagnetic and/or optical signals transmitted to peripheral components such as antennas, light sensors or receivers, and/or image sensors. A program may include a number of instructions, each of which may be used to perform a specific function of the tester.

In another embodiment, the apparatus for testing integrated circuits includes a memory component 1643 for recording the results of one or more procedures. The memory component may be included within or connected to the logic unit 1642 . Another embodiment includes an indicator 1644 to indicate one or more procedure results. The indicator may be visual, for example by using a liquid crystal display, light emitting diode and/or any other analog display; or the indicator may be audible, for example by using a buzzer or speaker. The indicator can also be an electronic signal of the circuit. Indicator 1644 to indicate the result of the procedure may be combined with indicator 1641, wherein indicator 1641 is used to indicate whether the integrated circuit is correctly aligned with the socket, and/or the voltage at one or more given terminals of the tester and/or Or the current through one or more given terminals of the tester. Indicator 1641 and/or indicator 1644 may further indicate the result of a comparison of the actual voltage at one or more given terminals of the tester to the expected voltage, and/or the actual voltage across one or more given terminals of the tester. current and expected current.

In one embodiment, the apparatus for testing an integrated circuit further includes an automatic chip loader 1650 coupled to the circuit 1640 and corresponding to a program in the logic unit 1642 for loading and unloading the integrated circuit. Automated chip loader 1650 includes mechanical device 1651 for moving integrated circuits into and out of socket 1631 . In FIG. 17 , mechanical device 1651 is used to move integrated circuit 1660 a from load box 1652 and to place integrated circuit 1660 a into socket 1631 . Integrated circuit 1660a is the circuit being tested and integrated circuit 1660b is the circuit that has been tested. After the integrated circuit is tested, the mechanical device 1651 is used to move the integrated circuit 1660b from the socket 1631 and place the integrated circuit 1660b into the unload bin 1653 . In one embodiment, the mechanism 1651 is further capable of marking the integrated circuits with different inks or dyes corresponding to the outcome of the procedure. In another embodiment, the mechanism 1651 can sort the integrated circuits into one or more parts of the unload bin 1653 corresponding to the results of the program, for example: bin 1654 of FIG. 16 or bin 1655a, bin 1655b, bin 1655c. Additionally, the automated chip loader 1650 can be used to record (i) the results of the program corresponding to the integrated circuit and (ii) the location of the integrated circuit.

In another embodiment, an exemplary method of testing an integrated circuit includes placing the integrated circuit in a socket mechanically coupled to a modified commercial electronic product, the modified commercial electronic product including a circuit board, the circuit board A circuit board substantially identical to a commercial electronic product including integrated circuits, where the modified commercial electronic product does not include integrated circuits; and testing integrated circuits.

FIG. 17 shows an exemplary device for testing an integrated circuit, which includes a socket 1631 for coupling to a modified commercial electronic product 1638 . In one embodiment of the invention, a method of testing an integrated circuit includes placing the integrated circuit in a socket. The modified commercial electronic product includes a circuit board that is substantially identical to the circuit board of the commercial electronic product. Although circuit boards are intended to include integrated circuits, circuit boards for modified commercial electronic products do not include integrated circuits. It should be said that the integrated circuit is placed inside the socket.

In one embodiment, the method for testing an integrated circuit may further include coupling a modified commercial electronic product to a power source. The power source may be a DC-to-DC converter, an AC-to-DC converter or may be an independent power source such as a battery. Modified commercial electronic products may be coupled directly to the power source, or indirectly coupled to the power source, such as through fuses, switches, or other wires, components, or circuits.

In another embodiment, the method of testing an integrated circuit may further include indicating a voltage at and/or passing through one or more predetermined terminals of a modified commercial electronic product. current. The predetermined terminals of the modified commercial electronic product may be completely located on the modified commercial electronic product, or the predetermined terminals may be electrically connected to the modified commercial electronic product. For example, voltage and/or current may be measured on wires other than entirely on the modified commercial electronic product, such as at the output terminals of a power supply, or at the terminals electrically connecting the power supply to the modified commercial electronic product. part of the wire. The voltage and/or current can be indicated visually using liquid crystal displays, light-emitting diodes, and analog displays; can be indicated using auditory methods such as buzzers or speakers; and/or can be indicated electronically using electronic signals such as circuits, or any combination of the foregoing.

In another embodiment, the method for testing an integrated circuit may further include detecting whether the integrated circuit is correctly placed on the socket. One embodiment of detecting whether the integrated circuit is properly seated on the socket includes configuring (i) the socket to include two or more wire terminals and wires, and (ii) circuitry to detect whether the wire terminals are electrically connected to the wires. Another embodiment may include placing one or more electromechanical switches in a first portion of the socket, and configuring the second portion of the socket to mechanically push the switches open when the integrated circuit is properly placed in the circuit. Another embodiment may include a method of indicating whether the integrated circuit is properly seated in the socket. The indication results can be obtained by using visual methods such as liquid crystal displays, light-emitting diodes, and analog displays; can be obtained by using auditory methods such as buzzers or speakers; and/or can be obtained by electronic methods such as electronic signals of circuits, or the aforementioned any combination of .

In another embodiment, the method of testing an integrated circuit may further include that the connection from a power source to a modified commercial electronic product may be electrically severed when (i) the integrated circuit is not properly seated in the socket and/or (ii) The voltage at one or more given terminals of the modified commercial electronic product and/or the current through one or more given terminals of the modified commercial electronic product is outside the established range values. In one embodiment, power to the modified commercial electronic product from the power source can be cut off by opening a switch connected in series between the modified commercial electronic product and the power source. In another embodiment, the output of the power supply may be shorted to ground.

Another embodiment of the invention includes being controlled by a processor and/or an external computer to execute the program. The program may be stored in the processor and/or the external computer, or the program may be stored in a storage device connected to the processor and/or the external computer. A program may contain instructions to control a modified commercial electronic product to perform a predetermined function. In addition, the program can compare the expected and actual results from executing instructions. The processor and/or external computer may also store results in memory components within the processor and/or external computer, or may store results in external memory components.

In another embodiment, the method of testing an integrated circuit may further include automatically loading and unloading the integrated circuit into and/or out of the socket. An embodiment can include connecting an automated chip loader to a processor and/or an external computer executing a program, and placing the integrated circuit into and out of the socket corresponding to the program. The design and implementation of automated equipment for carrying out the methods described herein is within the level of the employed skill. For example, the processor and/or external computer can be programmed to (1) load the first integrated circuit in the socket; (2) detect whether the integrated circuit is correctly placed in the socket; (3) turn off the switch to connect the power to the socket; (4) instruct the modified commercial electronic product to perform one or more intended functions; (5) compare, record and/or indicate the results of the above procedures; (7) unloading the integrated circuit and placing it into a box; and (8) corresponding to the location of the integrated circuit and its box and/or marking the integrated circuit with ink to record the results of the procedure. The processor and/or the external computer can be further executed to: load another integrated circuit into the socket; repeat the above steps (2)-(8); and repeat until the last tested integrated circuit is unloaded from the socket.

In another embodiment, the method of testing an integrated circuit may further include indicating one or more results of the procedure. The indication results can be obtained by visual methods such as liquid crystal displays, light-emitting diodes, and analog displays; by auditory methods such as buzzers or speakers; by electronic methods such as electronic signals of circuits, and/or any of the foregoing combination.

In another embodiment, an exemplary method of manufacturing an integrated circuit testing device includes mechanically attaching a receptacle to a modified commercial electronic product, the modified commercial electronic product including a circuit board substantially identical to the circuit board including the integrated circuit A circuit board of a commercial electronic product of the circuit, wherein the modified commercial electronic product does not include an integrated circuit; At least one electronic contact of a commercial electronic product.

In one embodiment, the step of mechanically attaching the receptacle to the modified commercial electronic product includes connecting one or more support structures to the modified commercial electronic product in a passive and/or non-conductive area. In general, a passive and/or non-conductive area is an area that has no electrically conductive components or areas that are not in close proximity to interfere with the normal operation of integrated circuits or modified commercial electronic products.

In another embodiment, the method of manufacturing an integrated circuit testing device may further include modifying the commercial electronic product such that one or more support structures in the passive and/or non-conductive area can be mounted on the modified commercial electronic product. For example, a circuit board of a commercial electronic product may be modified to move traces, conductors, busses, vias, or otherwise, and to rearrange electrical contacts to accommodate additional support structures as described above. In another embodiment, traces, conductive lines, busses, dielectric vias, or other aspects may be pulled back from the side of the printed circuit board to accommodate the through hole in order to place one or more support structures.

In another embodiment, the method of manufacturing an integrated circuit testing device may further include modifying the commercial electronic product, so that one or more electrical contacts of the modified commercial electronic product are electrically connected to one or more electronic contacts of the integrated circuit. It may be necessary to move one or more electrical contacts to provide mechanical attachment of the plurality of wires. For example, it may be necessary for one or more electrical contacts on one side of the circuit board to be relocated to the other side of the circuit board so that multiple wires can be mounted on the circuit board.

In some embodiments, it is necessary to modify commercial electronic products to mechanically attach support structures or to electrically connect modified commercial electronic products to integrated circuits. Minimizing relocation is a priority so that the vast majority of modified commercial electronic products are identical to unmodified commercial electronic products.

In one embodiment, the above steps of modifying the commercial electronic product may be one or more of the following: the commercial electronic product may be configured for the tested integrated circuit, but the commercial electronic product does not include an integrated circuit; the socket may be completely ground and/or electrically mounted on commercial electronic products that have been modified; commercial electronic product wiring that can be re-routed to provide receptacle and/or support structure connections to steps and/or receptacles; and commercial electronic product and And/or the socket can be configured with an automatic chip loader to place one or more integrated circuits into the socket.

As described above, the present invention provides an apparatus and method for testing an integrated circuit, and a method of manufacturing the apparatus for testing an integrated circuit.

Although the present invention is disclosed above with preferred embodiments and non-limiting examples, it is not intended to limit the scope of the present invention. Anyone skilled in this art can make some modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (40)

1. A kind of integrated circuit testing device, in order to test an integrated circuit, it is characterized in that, described testing device comprises: a socket for receiving said integrated circuit; a modified commercial electronic product that includes a circuit board that is substantially identical to a circuit board of a commercial electronic product that includes the integrated circuit, and that does not include the integrated circuit; and A plurality of wires are electrically connected to at least one electronic contact of the integrated circuit and at least one electronic contact of the modified commercial electronic product. 2. The integrated circuit testing device as claimed in claim 1, wherein the refitted commercial electronic product further includes all electronic components needed to perform the predetermined functions of the commercial electronic product when coupled to the integrated circuit. , mechanical and/or electromechanical components. 3. The integrated circuit testing device as claimed in claim 1, further comprising a casing containing the circuit board of the modified commercial electronic product. 4. The integrated circuit testing device as claimed in claim 3, wherein the casing is a conductive box or a conductive cage, and the circuit board of the modified commercial electronic product is accommodated therein. 5. The integrated circuit testing device according to claim 1, wherein said socket comprises: a seat for clamping and aligning said integrated circuit; and A base including mechanical supports for supporting the seat. 6. The integrated circuit testing device as claimed in claim 5, wherein the socket further comprises a plurality of terminals for supporting each of the plurality of wires, and each terminal contacts one of the electronic contacts of the integrated circuit. 7. The integrated circuit testing device as claimed in claim 5, wherein the socket further comprises an upper cover for contacting the seat and fastening the integrated circuit on the seat. 8. The integrated circuit testing device as claimed in claim 5, further comprising a circuit for detecting whether the integrated circuit is correctly aligned with the seat. 9. The integrated circuit testing device as claimed in claim 8, further comprising an indicator for indicating whether the integrated circuit is correctly aligned with the seat. 10. The integrated circuit testing device as claimed in claim 1, further comprising a support structure for mechanically connecting the socket and the modified commercial electronic product. 11. The integrated circuit testing device as claimed in claim 1, further comprising a step for mechanically attaching the socket and the modified commercial electronic product. 12. The integrated circuit testing device as claimed in claim 11, further comprising a first plurality of support structures for mechanically connecting the modified commercial electronic product and the step. 13. The integrated circuit testing device as claimed in claim 12, further comprising a second plurality of supporting structures for mechanically connecting the socket and the step. 14. The integrated circuit testing device as claimed in claim 11, wherein the step comprises at least one gap, wherein the plurality of wires can pass through the gap without contacting the step. 15. The integrated circuit testing device as claimed in claim 11, wherein the step comprises a circuit. 16. The integrated circuit testing device as claimed in claim 1, wherein the modified commercial electronic product further comprises an input and/or output port. 17. The integrated circuit testing device as claimed in claim 1, further comprising a power supply coupled to the modified commercial electronic product. 18. An integrated circuit testing device for testing an integrated circuit, characterized in that the testing device comprises: a power supply; a switch; A tester comprising a socket for receiving said integrated circuit, a circuit board substantially identical to a circuit board of a commercial electronic product including said integrated circuit, a plurality of wires electrically connecting at least one electronic contact of said integrated circuit and said circuit at least one electrical contact of the board; and A circuit for detecting (i) whether said integrated circuit is properly aligned with said socket and/or (ii) voltage at and/or current through at least one given terminal of said tester ; Wherein, the above-mentioned switch is arranged between the above-mentioned power supply and the above-mentioned tester, and is used for controlling whether the above-mentioned power supply supplies power to the tester. 19. The integrated circuit testing device as claimed in claim 18, wherein the circuit is further used to open the switch when (i) the integrated circuit is not correctly aligned with the socket and/or (ii) the tester The voltage at at least one given terminal of the tester and/or the current through at least one given terminal of the tester is outside a given range of values. 20. The integrated circuit testing device as claimed in claim 18, wherein the testing device further comprises an indicator for indicating (i) whether the integrated circuit is correctly aligned with the socket and/or (ii) during the test voltage at least one predetermined terminal of the tester and/or current through at least one predetermined terminal of the tester. 21. The integrated circuit testing device as claimed in claim 18, wherein the testing device further comprises a logic unit for opening the switch when (i) the integrated circuit is not correctly aligned with the socket and/or (ii) A voltage at and/or a current through at least one given terminal of the tester from the power source is outside a predetermined range of values. 22. The integrated circuit testing device according to claim 21, wherein the logic unit is further coupled to the tester via an input and/or output port, and corresponds to a program for controlling the tester. 23. The integrated circuit testing device as claimed in claim 22, further comprising a memory component for recording at least one result of the procedure. 24. The integrated circuit testing device as claimed in claim 23, further comprising an indicator for indicating at least one result of the procedure. 25. The integrated circuit testing device as claimed in claim 22, further comprising an automatic chip loader coupled to the circuit for loading and unloading the integrated circuit corresponding to the program. 26. The integrated circuit testing device as claimed in claim 18, further comprising a casing for accommodating the circuit board of the tester. 27. The integrated circuit testing device as claimed in claim 26, wherein the casing is a conductive box or a conductive cage. 28. A test method for an integrated circuit, for testing an integrated circuit, characterized in that the test method comprises: placing said integrated circuit in a socket mechanically coupled to a modified commercial electronic product, said modified commercial electronic product including a circuit board substantially identical to a commercial electronic product including said integrated circuit Circuit boards for products in which such modified commercial electronic products do not include such integrated circuits; and Test the above integrated circuit. 29. The method for testing an integrated circuit as claimed in claim 28, further comprising coupling the modified commercial electronic product to a power source. 30. The method for testing an integrated circuit as claimed in claim 29, further comprising indicating the voltage at at least one predetermined terminal of the modified commercial electronic product and/or through the voltage of the modified commercial electronic product. current at least one given terminal. 31. The method for testing an integrated circuit as claimed in claim 28, further comprising detecting whether the integrated circuit is correctly placed in the socket. 32. The method for testing an integrated circuit as claimed in claim 31, further comprising indicating whether the integrated circuit is correctly placed in the socket. 33. The integrated circuit testing method according to claim 29, further comprising cutting off the electrical connection between the power supply and the modified commercial electronic product when (i) the integrated circuit is not correctly placed on the The receptacle and/or (ii) the voltage at and/or the current through at least one predetermined terminal of the modified commercial electronic product is outside a predetermined range of values. 34. The method for testing an integrated circuit as claimed in claim 28, wherein testing the integrated circuit comprises controlling a processor and/or an external computer to execute a program. 35. The integrated circuit testing method according to claim 34, further comprising automatically loading and unloading said integrated circuits into and/or out of said sockets. 36. The method for testing an integrated circuit as claimed in claim 34, further comprising indicating at least one result of the procedure. 37. A manufacturing method of a testing device for testing an integrated circuit, characterized in that the manufacturing method comprises: Mechanically attaching a receptacle to a modified commercial electronic product, said modified commercial electronic product comprising a circuit board substantially identical to a circuit board of a commercial electronic product including said integrated circuit, wherein said modified commercial electronic products that do not include such integrated circuits; and A plurality of wires are installed for electrically connecting at least one electronic contact of the integrated circuit and at least one electronic contact of the modified commercial electronic product when the integrated circuit is located in the socket. 38. The method of manufacturing a testing device according to claim 37, wherein mechanically attaching said receptacle to said modified commercial electronic product comprises connecting at least one support structure to said modified commercial electronic product in a passive and/or non-conductive area. commercial electronic products. 39. The method of manufacturing a testing device as claimed in claim 38, further comprising modifying said commercial electronic product such that said at least one support structure is mechanically attached to said modified commercial electronic products. 40. The method of manufacturing a testing device as claimed in claim 37, further comprising modifying the commercial electronic product such that at least one electronic contact of the modified commercial electronic product is electrically coupled to the integrated circuit at least one electronic contact.

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