CN100538255C - Method and system for measuring on-machine for micro-dimension of element - Google Patents

Abstract

The invention relates to a method for measuring on a fine size machine for an element, which comprises the steps of providing a fine size on-machine measuring system, providing an element to be measured, utilizing a control unit to generate a measuring path operation step, utilizing a signal unit to generate a measuring signal operation, transmitting the measuring signal to a fine measuring probe step, carrying out fine size operation step of measuring the element by an electrical measuring mode through the displacement of the fine measuring probe and carrying out analysis and measurement of the size signal.

Description

A method and system for on-machine measurement of micro-sized components

technical field

The present invention relates to a method and system for on-machine measurement of micro-sized components, in particular to a method and system for on-machine measurement of micro-sized components that do not require off-line measurement and can provide a smaller range of measurement scales .

Background technique

At present, when operators want to measure the size of an object, they will generally consider and decide the size measurement method and measurement tools to be used according to the scale range and measurement accuracy requirements of the object to be measured, so as to meet the size of the measured object. For example, for objects ranging from a few millimeters to tens of centimeters, whether it is the measurement of length or diameter, the commonly used measuring tools are nothing more than cursor calipers, centimeter cards and height gauges, etc., but when you want to measure objects If the scale range is larger than the scale range of the measuring tool, a three-dimensional measuring instrument must be used to measure the size of the object.

And when the scale range of the object is as small as millimeters or even sub-millimeters, the measurement tools and measurement methods must be selected. In order to use image two-dimensional contour measurement, the principle of this image two-dimensional measurement method is roughly to use an industrial camera to take a picture. Measure the component, then analyze the length of the size to be measured on the image, and calculate the size of the above-mentioned component to be measured according to the camera parameters obtained by image correction, but when the scale range of the above-mentioned object to be measured is smaller, the size measurement system It is necessary to have a higher size resolution capability to maintain a certain level of measurement accuracy. Therefore, the aforementioned two-dimensional image profile measurement will have a huge measurement defect problem. This image two-dimensional profile measurement system will be limited by the optical diffraction phenomenon. (That is, because the resolution depends on the wavelength of the light source), its measurement accuracy can only reach the micron-scale level. However, when the part to be measured of the workpiece is blocked by the surface contour of the workpiece, the optical measurement light is also blocked and cannot penetrate the surface of the workpiece. If the contour of a workpiece is not measured, the size to be measured cannot be obtained. For example, the contour of a workpiece surface is arranged in a matrix arrangement that blocks each other, or if a workpiece has a stepped or tapered concave hole, the blocked size cannot be measured by optical measurement. Measurement limitations, and for various digital electronic products and related components that are increasingly miniaturized, the above-mentioned optical image measurement system and traditional measurement methods can no longer meet the measurement accuracy requirements, so other measurement solutions must be sought in order to measure more tiny scale range.

In addition, in order to ensure the fine dimensional accuracy of the components, the wear amount of the processing tool or the mold and the size of the processed component will be measured before and during the manufacturing process. However, at present, the measurement of such components and processing tools can only use Off-line measurement means that it cannot be measured in real time on the machine tool, but the biggest disadvantage of off-line measurement is that after reinstalling the workpiece and the tool, the positional relationship between them will be different from the relative position before disassembly, so it must be The positioning correction is performed again, but the dimensional accuracy of the finished product originally improved by the off-line measurement method will be offset by the repositioning correction error, thereby losing the originally improved dimensional accuracy of the finished product.

Therefore, the existing measurement technology needs to be measured offline, which leads to the inability to effectively improve the accuracy of the fine size of the finished component, and the measurement scale range of the existing measurement technology is limited, and cannot provide a finer measurement scale range, so how to redesign an application The method and system for measuring the fine dimensions of components on a machine can effectively improve the precision of fine dimensions of finished components, which is the purpose of the present invention.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method and system for on-machine measurement of micro-sized components to solve the problem that the existing measurement technology requires off-line measurement, so it is impossible to effectively improve the precision of the micro-sized components. The invention overcomes the disadvantage that the measurement scale range of the existing measurement technology is limited and cannot provide a smaller measurement scale range.

In order to achieve the above object, the present invention provides a method for on-machine measurement of micro-sized components, which is characterized in that it includes the following steps: providing an on-machine measurement system of micro-size, the on-machine measurement system is erected on a machine tool, and The on-board measurement system includes a control unit, a signal unit connected to the control unit and a mobile platform connected to the control unit, the mobile platform is equipped with a micro-measurement probe and the micro-measurement probe is connected to the signal unit; a waiting A measuring element, the element has a fine size, is fixed on the machine tool and connected to the signal unit; uses the control unit to generate a measurement path operation; uses the signal unit to generate a measurement signal operation, and transmits the measurement signal to the micro-measurement probe; perform the displacement of the micro-measurement probe to measure the micro-dimensional operation of the component by means of electrical measurement, the micro-measurement probe is displaced according to the measurement path, and the measurement signal is transmitted to the component, through the electrical property The measurement method obtains the measurement dimension signal of the component; and analyzes the measurement dimension signal. The signal unit obtains the measurement dimension signal, and the control unit performs analysis and processing of the measurement dimension signal, and calculates the measurement dimension of the component.

The above-mentioned method applied to the on-machine measurement of the micro dimension of the component is characterized in that the measurement dimension signal includes a movement data of the micro measurement probe and a dimension measurement signal, which are analyzed and processed by the control unit to obtain the measurement dimension of the component.

The above-mentioned method applied to the on-machine measurement of micro-sized components is characterized in that the shape or size of the micro-measurement probe is different from the shape or size of the measuring part of the component.

The above-mentioned method applied to on-machine measurement of micro-sized components is characterized in that the side shape of the micro-measurement probe is cylindrical or spherical.

The above-mentioned method applied to the on-machine measurement of the micro-size of components is characterized in that the size of the micro-measurement probe is 10 μm to 1 mm.

The present invention also provides a system for on-machine measurement of microscopic dimensions of components, which is characterized in that it includes: a control unit that generates a measurement path and analyzes a measurement signal processing of a measurement dimension to obtain the microdimensions of the component The measurement size of the component; the signal unit, the signal unit is connected to the control unit and generates a measurement signal, and obtains the measurement size signal of the component; the mobile platform, the mobile platform is connected to the control unit; and the micro measurement probe, the micro The measuring probe is arranged on the mobile platform, and the micro measuring probe is connected to the signal unit, and the element measuring operation is carried out through the displacement of the micro measuring probe in the way of electrical measurement.

The above-mentioned system applied to the on-machine measurement of micro-sized components is characterized in that the measurement signal of the measurement size includes a movement data of a micro-measurement probe and a size measurement signal, which are used for analysis and processing by the control unit to obtain the measurement of the component. size.

The above-mentioned system for on-machine measurement of micro-sized components is characterized in that the shape or size of the micro-measurement probe is different from the shape or size of the measuring part of the component.

The above-mentioned system applied to on-machine measurement of micro-sized components is characterized in that the side shape of the micro-measurement probe is cylindrical or spherical.

The above-mentioned system applied to on-machine measurement of micro-sized components is characterized in that the size of the micro-measurement probe is 10 μm to 1 mm.

Effect of the present invention is as follows:

1. Through the implementation and application of this method and system for on-machine measurement of micro-sized components, when applied to the measurement of small components with high aspect ratios, this on-machine dimensional measurement method can avoid the shadowing problem and dead angle of measurement in optical image measurement methods .

2. Through the implementation of the method and system for on-machine measurement of micro-sized components, the method and system for on-machine dimensional measurement of the present invention can also be applied to measurement parts of various geometric shapes to produce appropriate measurement distances and efficiency measurement path to obtain better measurement results.

3. Through the implementation and application of this method and system applied to the on-machine measurement of the micro-sized components, it is possible to match the micro-probes with different geometric shapes and sizes for various measurement parts with different geometric shapes to obtain better measurement results. Of course It can also be applied to components of various sizes and material characteristics, and use different mathematical algorithms to analyze the change mode of the measurement signal, so as to determine the contact state between the fine probe and the fine size of the component to obtain better measurement results.

4. Through the implementation of the method and system applied to the on-machine measurement of the micro-sized components, the measurement position of the workpiece can not be restricted by the surface contour of the workpiece, and the measurement probe can be inserted to obtain the size of the workpiece to be measured.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 is the method flowchart that the present invention is applied to the on-machine measurement of the fine size of component;

Fig. 2 is the system schematic diagram that the present invention is applied to the on-machine measurement of the micro-size of component;

Fig. 3 is a schematic diagram of the measurement path of the system applied to the on-machine measurement of the micro-sized components of the present invention;

FIG. 4A is a schematic diagram of the first aspect of the side shape of the micro-measurement probe applied to the system for on-machine measurement of micro-sized components according to the present invention;

Fig. 4B is a schematic diagram of the second aspect of the side shape of the micro-measurement probe applied to the system for on-machine measurement of micro-sized components of the present invention;

FIG. 5A is a schematic diagram of implementation elements of the present invention; and

FIG. 5B is an experimental data table of the actually measured components of the present invention.

Among them, reference signs:

S1 Applied to the method of on-machine measurement of micro-sized components

Step S10 Provide an on-board measurement system for micro-sized

Step S20 provides a component to be tested

Step S30 Use the control unit to generate a measurement path operation

Step S40 Use the signal unit to generate a measurement signal operation, and transmit the measurement signal to the micro-measurement probe

Step S50 Carry out the micro-dimension operation of the micro-measurement probe displacement and the electrical measurement method to measure the component

Step S60 Carry out the operation of analyzing and measuring the size signal

1 A system for on-machine measurement of micro-sized components

10 control unit

20 Signal Units

30 mobile platforms

40 Micro measuring probe

2 components

R measurement path

Q Nominal diameter

Detailed ways

First, please refer to FIG. 1, the present invention is a method for on-machine measurement of micro-sized components, a preferred embodiment of the method S1 for on-machine measurement of micro-sized components includes, step S10, providing a micro-sized On-board measurement system; step S20, providing a component to be tested; step S30, using the control unit to generate a measurement path operation; step S40, using the signal unit to generate a measurement signal operation; step S40, and transmitting the measurement signal to the micro-measurement probe ; Step S50, carry out the operation of measuring the fine size of the component by the displacement of the micro-measurement probe by means of electrical measurement; step S60, carry out the operation of analyzing and measuring the size signal.

Please refer to Fig. 2, the present invention is a system applied to the on-machine measurement of micro-sized components, a preferred embodiment of the system 1 applied to the on-machine measurement of micro-sized components includes a control unit 10, a signal unit 20. A mobile platform 30 and a micro measuring probe 40 are arranged on the mobile platform 30 and connected to the signal unit 20 , the signal unit 20 is connected to the control unit 10 , and the mobile platform 30 is connected to the control unit 10 .

Please refer to Fig. 1, Fig. 2 and Fig. 3, the present invention is a method and system applied to the on-machine measurement of micro-sized components, the method S1 and system 1 applied to the on-machine measurement of micro-sized components are carried out first, step S10 , provide a fine-sized on-board measurement system, the on-board measurement system 1 is erected on a machine tool, and the on-board measurement system 1 includes a control unit 10, a signal unit 20, connected to the control unit 10 and a mobile platform 30 In the control unit 10, the mobile platform 30 is equipped with a micro-measurement probe 40, and the micro-measurement probe 40 is connected to the signal unit 20. Furthermore, in step S20, a device to be tested is provided. The component 2 has a micro-size and is fixed. Set on a machine tool (not shown in the figure) for processing operations, and the component 2 is also connected to the signal unit 20, and the fine size of the component 2 is 10cm～10-2μm, and, step S30, using the control unit Generate a measurement path operation, follow-up, step S40, use the signal unit to generate a measurement signal operation, and transmit the measurement signal to the micro-measurement probe, and proceed to step S50, the displacement of the micro-measurement probe measures the micro-size of the component by electrical measurement operation, the micro-measurement probe 40 is displaced according to the measurement path R, and the measurement signal is transmitted to the component 2, and the measurement size signal of the component 2 is obtained through an electrical measurement method. Finally, in step S60, the operation of analyzing the measurement size signal is carried out. The unit 20 obtains the measured dimension signal, and performs the above-mentioned measured dimension signal analysis and processing through the control unit 10 , and calculates the desired measured dimension of the component 2 .

Furthermore, the present invention is a method and system applied to on-machine measurement of micro-sized components. This method and system 1 are applied to the on-machine measurement of micro-sized components. The measurement signal includes a micro-measurement probe 40 movement data and a The size measurement signal is used for analysis and processing by the control unit 10 to obtain the measurement size of the above-mentioned component 2, and the shape or size of the above-mentioned micro-measurement probe 40 is that the measurement part of the corresponding component 2 has a different shape or size, please Referring to Fig. 4A and Fig. 4B, the side shape of this micro-measurement probe 40 can be cylindrical or spherical respectively, and the size of this micro-measurement probe 40 is 10 μm ~ 1mm, finally, please refer to Fig. 5A and Fig. As the measurement experiment data, it can be seen from the figure that the nominal diameter Q of the component 2 is 80 μm, and the cylindrical micro-measurement probe 40 is selected, and the obtained three measurement experiment data are 80.09 μm, 80.48 μm and 79.97 μm respectively.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art should make various corresponding changes and deformations according to the present invention, but these corresponding changes All changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (10)

1. A method for on-machine measurement of micro-sizes applied to components, characterized in that it comprises the following steps: Provide an on-board measurement system of fine size, the on-board measurement system is erected on a machine tool, and the on-board measurement system includes a control unit, a signal unit connected to the control unit and a mobile platform connected to the control unit, the mobile platform installing a micro measuring probe and connecting the micro measuring probe to the signal unit; providing a component to be tested, the component has a fine size, and is fixed on the tool and connected to the signal unit; using the control unit to generate a measurement path; using the signal unit to generate a measurement signal, and transmitting the measurement signal to the micro-measurement probe; Measuring the micro dimension of the component by performing the displacement of the micro-measurement probe, the micro-measurement probe is displaced according to the measurement path, and the measurement signal is transmitted to the component, and the measurement of the component is obtained by the electrical measurement method size signal; and The measurement dimension signal is analyzed, the signal unit obtains the measurement dimension signal, and the measurement dimension signal is analyzed and processed by the control unit, and the measurement dimension of the component is calculated. 2. The method for on-machine measurement of micro-sized components according to claim 1, wherein the measured dimension signal includes a micro-measurement probe movement data and a dimension measurement signal for analysis and processing by the control unit to obtain the component of the measured size. 3. The method for on-machine measurement of micro-sized components according to claim 1, wherein the micro-measurement probes have different shapes or sizes corresponding to the measurement parts of the component. 4. The method for on-machine measurement of micro-sized components according to claim 1, characterized in that the side shape of the micro-measurement probe is cylindrical or spherical. 5. The method for on-machine measurement of micro-sized components according to claim 1 or 3, characterized in that the size of the micro-measurement probe is 10 μm-1 mm. 6. A system for on-machine measurement of micro-sized components, characterized in that it includes: a control unit, the control unit generates a measurement path, and analyzes a measurement signal processing of a measurement dimension to obtain a measurement dimension of the component's fine size; a signal unit, the signal unit is connected to the control unit and generates a measurement signal, and obtains the measurement signal of the component; a mobile platform connected to the control unit; and A micro-measurement probe, the micro-measurement probe is arranged on the mobile platform, and the micro-measurement probe is connected to the signal unit, and the element measurement operation is carried out through the displacement of the micro-measurement probe by means of electrical measurement. 7. The system for on-machine measurement of micro-sized components according to claim 6, wherein the measurement signal of the measurement size includes a movement data of a micro-measurement probe and a size measurement signal for analysis by the control unit Process to get the measured dimension of the component. 8. The system for on-machine measurement of micro-sized components according to claim 6, wherein the micro-measurement probes have different shapes or sizes corresponding to the measurement parts of the component. 9. The system for on-machine measurement of micro-sized components according to claim 6, wherein the side shape of the micro-measurement probe is cylindrical or spherical. 10. The system for on-machine measurement of micro-sized components according to claim 6 or 8, characterized in that the size of the micro-measurement probe is 10 μm-1 mm.

Images