CN100532918C - Ring lighting device and manufacturing method thereof - Google Patents

Abstract

Provided are a ring lighting device capable of preventing electrical contact failure between lead wires of LEDs and a printed wiring board, and capable of being easily manufactured, and a manufacturing method thereof. Equipped with a plurality of LEDs (8), an annular platform (10) supporting the plurality of LEDs (8), and a printed wiring board (12) electrically connected to the plurality of LEDs (8), on the platform (10) A plurality of through-holes (24) extending from one side to the other side are provided on the upper side, and an inclined surface (20) that descends and inclines toward the radially inner side is provided on the first side. Lead wires (16) of a plurality of LEDs (8) pass through a plurality of through holes (24) of the platen (10), are inserted into a plurality of through holes (32) of a printed wiring board (12) and are soldered The respective light emitting parts (14) of the plurality of LEDs (8) are supported on the inclined surface (20) of the table (10) in a substantially vertical direction.

Description

Ring lighting device and manufacturing method thereof

technical field

The present invention relates to a ring lighting device for illuminating an object to be inspected, for example, in image processing inspection and the like, and a method for manufacturing the same.

Background technique

Conventionally, it has been used when inspecting the quality of industrial products such as printed wiring boards and semiconductors on the manufacturing line, such as poor soldering or adhesion of foreign matter, or printing errors such as the date of manufacture printed on beverage cans. Image processing inspection based on imaging by CCD camera etc. In this image processing inspection, a ring illumination device for illuminating an inspection object arranged in an illumination area is used.

The ring lighting device includes a ring light source that irradiates light in a ring shape, and the ring light source includes a plurality of LEDs and a flexible printed wiring board electrically connected to the plurality of LEDs (for example, refer to Patent Document 1). This ring lighting device is manufactured as follows, for example. The printed wiring board is formed in a ring shape with a cutout, and each lead wire of a plurality of LEDs is soldered to one surface of the printed wiring board while maintaining the printed wiring board in a planar shape. Then, the printed wiring board is bent into a truncated cone shape with this surface of the printed wiring board as the inner side, and the two ends are joined to each other, so that the respective light emitting parts of the plurality of LEDs are arranged on the printed wiring board. The truncated conical concave side of the substrate.

Patent Document 1: Japanese Patent No. 2975893

However, the conventional ring lighting device has the following problems. Since the actual mounting density of a plurality of LEDs on the printed wiring board is relatively high, it is not easy to bend the printed wiring board into a truncated cone shape. Therefore, there is a problem that ring lighting devices cannot be easily manufactured. In addition, if the printed wiring board is bent into a truncated cone shape as described above, stress acts on the printed wiring board, and thus the stress acts on the lead wires of the LEDs soldered on the printed wiring board. The problem: Cracks occur in the soldering part of the LED wire, which may cause poor electrical contact between the LED wire and the printed wiring board.

Contents of the invention

An object of the present invention is to provide a ring-shaped lighting device and a manufacturing method thereof that can prevent electrical contact failure between lead wires of LEDs and a printed wiring board and that can be easily manufactured.

A first aspect of the present invention provides a ring-shaped lighting device including a plurality of LEDs and a printed wiring board electrically connected to the plurality of LEDs, each of the plurality of LEDs has a light-emitting portion covered with a resin and the The lead wires extending from the light emitting part are provided with a plurality of through holes corresponding to the respective lead wires of the plurality of LEDs on the printed wiring board, and the respective lead wires of the plurality of LEDs are inserted through the respective lead wires of the plurality of LEDs. The plurality of through holes of the printed wiring board are soldered, and the ring lighting device is characterized in that,

The printed wiring board is configured in a flat plate and ring shape, and an insulating ring-shaped platen is interposed between the printed wiring board and each of the light emitting parts of the plurality of LEDs. The platen is provided with a plurality of through holes extending from one side, that is, the first surface, to the other surface, that is, the second surface. In addition, the first surface is provided with an inclined surface that descends and slopes toward the radially inner side,

The respective lead wires of the plurality of LEDs pass through the plurality of through holes of the platen, are inserted into the plurality of through holes of the printed wiring board, and are soldered. Each of the light emitting parts of the LEDs is supported in a substantially vertical direction on the inclined surface of the table, and an annular recess is provided on the second surface of the table. The concave portion is used to accommodate the solder sucked up to the first surface through the plurality of through holes of the printed wiring board.

Furthermore, the ring lighting device according to the second aspect of the present invention is characterized in that opening ends of the plurality of through-holes on the side of the inclined surface of the table are provided with openings that expand outward. cone.

In addition, the ring lighting device according to the third aspect of the present invention is characterized in that a positioning mechanism is provided on the table and the printed circuit board for positioning them by overlapping them with each other.

Furthermore, the ring lighting device according to the fourth aspect of the present invention is characterized in that the positioning mechanism is composed of: a positioning protrusion or a recess provided on the table; and a positioning recess or The protrusion is provided on the printed wiring board engaging with the positioning protrusion or recess.

In addition, the ring lighting device according to the fifth aspect of the present invention is characterized in that it further includes a case for holding the table top and the printed wiring board, and the other surface of the printed wiring board and the printed wiring board A flexible heat dissipation member is interposed between the casings, and the leading ends of the wires of the plurality of LEDs are in contact with the heat dissipation member in a heat conduction manner.

Furthermore, a sixth aspect of the present invention provides a method of manufacturing a ring-shaped lighting device including a plurality of LEDs, an insulating ring-shaped plate supporting the plurality of LEDs, and the A printed wiring board to which a plurality of LEDs are electrically connected,

Each of the plurality of LEDs has a light-emitting portion covered with resin and a lead extending from the light-emitting portion, the printed wiring board is configured in a flat and ring shape, and the printed wiring board and the plurality of A plurality of through holes are provided corresponding to the respective wires of the LEDs, and a plurality of through holes extending from one side, that is, the first surface, to the other surface, that is, the second surface are provided on the platen. The first surface is provided with an inclined surface inclined downwardly toward the radially inner side,

The manufacturing method of the ring lighting device is characterized in that it includes:

a step of bending the lead wires of the plurality of LEDs; a step of cutting the lead wires of the plurality of LEDs into predetermined lengths; a step of aligning the plurality of through holes of the printed wiring board; a step of making the second surface of the platen face one side of the printed wiring board so that they overlap each other; The respective light emitting parts of the plurality of LEDs are supported on the inclined surface of the table, and the lead wires of the plurality of LEDs are inserted into the plurality of through holes of the table. and the plurality of through-holes of the printed wiring board; and a step of soldering the lead wire inserted through the through-hole and the through-hole to the through-hole.

According to the ring lighting device of the present invention, since the lead wires of the plurality of LEDs pass through the plurality of through holes of the platen and are inserted into the plurality of through holes of the printed wiring board and are soldered, the respective leads of the plurality of LEDs pass through the plurality of through holes of the platen and are soldered. The light-emitting part of the table is supported in a substantially vertical direction on the inclined surface of the table, so that the respective light-emitting parts of the plurality of LEDs can be arranged as desired without bending the printed wiring board as in the prior art. By arranging in a ring shape, it is possible to easily manufacture a ring lighting device, and in addition, a plurality of LEDs can be arranged by inclining accurately at a predetermined angle by an inclined surface. Furthermore, since stress does not act on the printed wiring board, cracks do not occur at the soldered portion of the lead wire of the LED, thereby preventing poor electrical contact between the lead wire of the LED and the printed wiring board.

In addition, according to the ring-shaped lighting device of the present invention, since the ring-shaped concave portion is provided on the other surface of the platen, after the lead wires of the plurality of LEDs are inserted through the plurality of through-holes of the printed wiring board and soldered At this time, the solder that passes through the plurality of through holes of the printed wiring board and is sucked up to one surface is accommodated in the annular recess. Therefore, the lead wires of the LED can be reliably soldered to the printed wiring board on both surfaces of the printed wiring board, and the electrical connection state between the lead wires of the LED and the printed wiring board can be maintained well.

Furthermore, according to the ring lighting device of the present invention, since the opening ends of the plurality of through-holes on the inclined surface side of the table are provided with tapered portions expanding outward, if the lead wires of the LEDs are inserted through the table, When the through hole of the plate is molded with resin to form the light-emitting part of the LED, the resin protruding part formed at the lower end of the light-emitting part is accommodated in the accommodation space formed inside the tapered part. As a result, the lower end surface of the light-emitting portion of the LED abuts against the inclined surface of the table, and the light-emitting portion of the LED can be stably supported on the inclined surface of the through-hole portion of the table.

In addition, according to the ring lighting device of the present invention, since the positioning mechanism for positioning them by overlapping each other is provided on the base plate and the printed wiring board, it is possible to align the plurality of through holes of the base plate and the printed wiring board. The plurality of through-holes of the substrate correspond to each other, thereby facilitating positioning when the platen and the printed wiring board are superimposed on each other. Furthermore, since the positioning mechanism is composed of the following parts, that is: the protrusion or recess for positioning, which is provided on the platen; Therefore, positioning when the platen and the printed wiring board are superimposed on each other can be performed more easily and reliably.

In addition, according to the ring lighting device of the present invention, since the flexible heat dissipation member is interposed between the other surface of the printed wiring board and the housing, the leading ends of the respective lead wires of the plurality of LEDs are covered by the heat dissipation member. By covering and being in contact with it in a heat-conducting manner, the heat from the lead wire is transferred to the case through the heat dissipation member to dissipate heat. Therefore, it is possible to efficiently dissipate the heat generated in the respective light emitting parts of the plurality of LEDs. In addition, there is no case where the wire is pressed by the heat dissipation member so that an external force acts on the wire, thereby preventing cracks from being generated in the soldered portion of the wire.

Furthermore, according to the manufacturing method of the ring lighting device of the present invention, since the lead wires of the plurality of LEDs are bent and cut into predetermined lengths, the plurality of through-holes are aligned with the plurality of through-holes, and the board and the printed wiring The substrates are superimposed on each other, and the respective light-emitting parts of the plurality of LEDs are supported on the inclined surface of the platform, and the respective wires of the plurality of LEDs are passed through the plurality of through-holes of the platform, and inserted into the plurality of through-holes of the printed wiring board. Holes and soldering, therefore, without bending the printed wiring board as in the prior art, the respective light emitting parts of a plurality of LEDs can be arranged in a ring shape as desired, so that the ring shape can be easily manufactured In addition, the lighting device can be arranged by tilting the plurality of LEDs accurately at a predetermined angle by using the inclined surface. Furthermore, since stress does not act on the printed wiring board, cracks do not occur at the soldered portion of the lead wire of the LED, thereby preventing poor electrical contact between the lead wire of the LED and the printed wiring board.

Description of drawings

FIG. 1 is a perspective view showing a ring lighting device according to a first embodiment of the present invention;

Fig. 2 is an exploded perspective view showing the annular lighting device of Fig. 1;

Fig. 3 is a schematic cross-sectional view of the ring lighting device of Fig. 1;

Fig. 4 is an enlarged cross-sectional view showing the structure of the through-hole of the platen of Fig. 3 and its periphery;

Fig. 5 is a schematic partial perspective view showing a ring lighting device according to a second embodiment of the present invention.

In the figure: 2, 2A—annular lighting device; 4—annular light source; 6—housing; 8—LED; 10, 10A—table; 12—printed wiring board; 20—inclined surface; 22—annular recess; 24, 24A—through hole; 26—taper; 30—positioning protrusion; 32—through hole; 36—positioning recess; 50—radiating member.

Detailed ways

Hereinafter, various embodiments of the ring lighting device and its manufacturing method according to the present invention will be described with reference to the drawings. 1 is a perspective view showing a ring lighting device according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the ring lighting device of FIG. 1 , FIG. 3 is a schematic sectional view of the ring lighting device of FIG. 1 , and FIG. 4 It is an enlarged cross-sectional view showing the structure of the through-hole and its surroundings of the platen in FIG. 3 .

In FIGS. 1 to 4 , the illustrated ring lighting device 2 includes a ring light source 4 that emits light in a ring shape, and a housing 6 for holding the ring light source 4 . Hereinafter, each of these constituent elements will be described in detail.

The annular light source 4 includes a plurality of LEDs 8 , an annular base 10 supporting the plurality of LEDs 8 , and a printed wiring board 12 electrically connected to the plurality of LEDs 8 .

The LED 8 has a light emitting part 14 and a pair of lead wires 16 extending from the light emitting part 14 . The light emitting unit 14 is formed in a cannonball shape by molding a light emitting body sheet (not shown) from transparent resin or the like, and a pair of lead wires 16 extend outward from the lower end of the light emitting unit 14 . In addition, at the lower end portion of the light emitting portion 14 (that is, the portion where the wire 16 is led out from the light emitting portion 14), there is a resin protruding portion 18 formed by slightly protruding from the transparent resin forming the light emitting portion 14 into a mountain shape (refer to Figure 4). The resin protruding portion 18 is formed when the light emitting portion 14 is molded. In addition, in FIG. 2, only one LED8 is shown in figure.

The platen 10 is formed of a material having high heat resistance and insulation properties, such as polycarbonate, and is configured in a ring shape. On one side of the platen 10 is provided an inclined surface 20 that is inclined radially inward at an angle θ1 (for example, about 72 degrees) (see FIG. 3 ) with respect to the axis C of the ring lighting device 2 . An annular recess 22 is provided. In addition, the platen 10 is provided with a plurality of through-holes 24 extending from one side to the other side in the direction of the axis C, through which the respective wires 16 of the plurality of LEDs 8 are inserted, and these through-holes 24 are formed concentrically. Multiple columns (four columns in this embodiment) are provided. At the opening end of the through hole 24 on the inclined surface 20 side of the table 10, a tapered portion 26 (see FIG. 4 ) expanding outward is provided. The outer side gradually increases, and the housing space 28 for housing the resin protruding part 18 of the light emitting part 14 of the LED 8 is formed inside the taper part 26 . In addition, a positioning protrusion 30 as a positioning mechanism is provided on the outer peripheral portion of the other surface of the table 10 (see FIGS. 2 and 4 ).

The printed wiring board 12 has a flat plate shape and a ring shape, and its outer diameter and inner diameter are substantially the same as those of the platen 10 . A plurality of through-holes 32 are provided on the printed wiring board 12 corresponding to the respective lead wires 16 of the plurality of LEDs 8 (that is, corresponding to the plurality of through-holes 24 of the platen 10 ). Conductive regions (not shown) are provided at both ends of the plurality of through holes 32 , and the conductive regions are electrically connected to wiring patterns (not shown) provided on the printed wiring board 12 . One end portion of a cable 34 extending from a power supply device (not shown) is electrically connected to the wiring pattern on the other surface side of the printed wiring board 12 by soldering. In addition, on the outer peripheral portion of one surface of the printed wiring board 12, a positioning recess 36 (refer to FIGS. 2 and 4 ) as a positioning mechanism is provided corresponding to the positioning protrusion 30 of the platen 10, and the positioning protrusion 30 and the positioning concave portion 36 are engaged with each other, so that the platen 10 and the printed wiring board 12 overlap each other. Then, the plurality of through-holes 24 of the platen 10 and the plurality of through-holes 32 of the printed wiring board 12 are made to coincide with each other.

The housing 6 includes a cylindrical housing main body 38 and an annular cover 40 attached to one opening of the housing main body 38 . The inner diameter of the case main body portion 38 is substantially the same as or slightly larger than the outer diameters of the platen 10 and the printed wiring board 12 . On the inner peripheral surface of the case body part 38, there is provided an annular locking protrusion 42 protruding radially inward, and at one end thereof, there is provided a cable 34 extending from the printed circuit board 12 to pass therethrough. The rectangular first notch portion 44 and the plurality of screw insertion holes 46 arranged at predetermined intervals in the circumferential direction.

The outer diameter of the cover portion 40 is substantially the same as or slightly smaller than the inner diameter of the case main body portion 38 . A plurality of threaded holes 48 are provided at predetermined intervals in the circumferential direction on the cover portion 40 , and an annular housing recess 52 for housing a heat dissipation member 50 described later is provided on one surface thereof. A plurality of screw holes 54 are provided on the outer peripheral portion of the cover portion 40 corresponding to the plurality of screw insertion holes 46 of the case body portion 38 , and a plurality of threaded holes 54 are provided corresponding to the first notch portions 44 of the case body portion 38 . The second cutout portion 56 (see FIG. 2 ).

The heat dissipation member 50 accommodated in the housing recess 52 of the cover 40 is annular and made of a deformable flexible material having electrical insulation and thermal conductivity such as silicone, fluorosilicone, SEP, or the like.

Next, the method of manufacturing the ring lighting device 2 will be described as follows. First, bend a pair of lead wires 16 of the LED 8 in the vicinity of the resin protruding portion 18 with respect to the light emitting portion 14 at an angle θ2 (for example, about 18 degrees) (see FIG. A pair of lead wires 16 of LED8 are cut|disconnected to predetermined length. For example, when the thickness D1 of the outermost through hole 24 portion of the platen 10 is about 6 mm and the thickness D2 of the printed wiring board 12 is about 1.5 mm, the pair of lead wires 16 of the LED 8 inserted in the through hole 24 are cut off. The length is about 8.5 to 9.0 mm, and the pair of lead wires 16 of the LED 8 inserted into the second through-hole 24 from the outside of the platen 10 is cut to a predetermined length shorter than the lead wire 16 . In the same manner below, the through-holes 24 inserted into the through-holes 24 in the second row from the outer side of the platen 10, the through-holes 24 in the third row from the outer side, and the innermost through-holes are inserted in such a manner that the lengths become shorter in order. The pair of wires 16 of the LED 8 in the hole 24 are severed. By cutting in this way, when the leads 16 of the LED 8 are inserted into the through holes 32 of the printed wiring board 12 through the through holes 24 of the platen 10 as described later, the lead wires protruding from the other side of the printed wiring board 12 can be The length of the front end portion of 16 is ensured to be about 1.0 to 1.5 mm.

Then, the plurality of through holes 24 of the platen 10 and the plurality of through holes 32 of the printed wiring board 12 are aligned by engaging the positioning protrusions 30 of the platen 10 and the positioning recesses 36 of the printed wiring board 12 with each other. The other surface of the platen 10 and the one surface of the printed wiring board 12 are aligned so that they overlap each other, and both are integrally fixed, for example, with a temporary fixing tape (not shown). Then, the pair of lead wires 16 of the bent LED 8 are passed through the corresponding pair of through-holes 24 of the platen 10 as described above, and inserted into the corresponding pair of through-holes 32 of the printed wiring board 12 . During this insertion, the leading end portion of the lead wire 16 is inserted into the through hole 24 of the table 10 while moving along the surface of the radially outer tapered portion 26 of the table 10, so that the lead wire 16 of the LED 8 can be easily inserted into the table. In the through hole 24 of the plate 10. When the wire 16 of the LED 8 is inserted in this way, the resin protruding portion 18 of the light emitting portion 14 of the LED 8 is accommodated in the accommodation space 28 inside the tapered portion 26, whereby the lower end surface of the light emitting portion 14 abuts against the inclination of the table 10. The light emitting unit 14 can be stably supported on the inclined surface 20 of the through hole 24 .

As described above, the lead wire 16 of the LED 8 is passed through the through hole 24 of the platen 10 and inserted into the through hole 32 of the printed wiring board 12 , and the front end of the lead wire 16 is soldered to the conductive wire on the other side of the printed wiring board 12 . section (through hole 32). When the soldering is performed in this way, the solder 58 is sucked up from the other side of the printed wiring board 12 to one side through the through hole 32 , and the sucked up solder 58 is accommodated in the annular recessed portion of the platen 10 . 22 (refer to FIG. 4 ), thereby, also on one side of the printed wiring board 12, the lead wire 16 of the LED 8 can be reliably soldered to the conductive region.

In addition, although this soldering is performed using, for example, reflow solder, because, for example, a platen formed of a heat-resistant material such as polycarbonate is interposed between the light emitting portion 14 of the LED 8 and the printed wiring board 12 10. Therefore, when the other surface of the printed wiring board 12 is brought into contact with the upper surface of the solder tank (not shown), the heat of the melted solder in the solder tank is not easily transmitted to the light emitting part 14 of the LED 8, thereby preventing The light emitting part 14 of LED8 is damaged by the heat of solder.

If the soldering is performed in this way, the platen 10 and the printed wiring board 12 are sandwiched between the light emitting part 14 of the LED 8 and the front end of the lead wire 16 soldered to the conductive region part of the printed wiring board 12. , Therefore, the above-mentioned temporarily fixing belt can be removed. In addition, one end portion of the cable 34 extending from the power supply device is soldered to the wiring pattern on the other surface side of the printed wiring board 12 .

The annular light source 4 assembled as described above is held in the casing 6 as follows. First, the annular light source 4 is inserted into the case main body 38 through one opening thereof, and the outer peripheral portion on one side of the table 10 is locked to the locking protrusion 42 of the case main body 38 . Then, the heat dissipation member 50 is housed in the housing recess 52 of the cover 40 , and the cover 40 is inserted into one opening of the case main body 38 . When inserted in this way, the heat dissipation member 50 is interposed between the other surface of the printed wiring board 12 and one surface of the cover portion 40, and the front end portion of the lead wire 16 protruding from the other surface of the printed wiring board 12 is covered by the heat dissipation member 50. Thus, the lead wire 16 and the heat dissipation member 50 are in contact with each other in a thermally conductive manner. Then, the cables 34 extending from the printed wiring board 12 are drawn out through the second notch 56 of the cover 40 and the first notch 44 of the case main body 38 , and then a plurality of fixing screws 60 are passed therethrough. The plurality of screw insertion holes 46 of the case main body 38 are screwed into the plurality of screw holes 54 of the cover 40 . As a result, the housing main body 38 and the cover 40 are integrally fixed, and the annular light source 4 is sandwiched between the locking protrusion 42 of the housing main body 38 and one surface of the cover 40 . As described above, the manufacture of the ring lighting device 2 is completed.

In the ring lighting device 2 configured as described above, the respective light emitting parts 14 of the plurality of LEDs 8 are annularly arranged on the inclined surface 20 of the table 10, and face the direction of the ring light source 4 at an angle θ2 with respect to the axis C. Radially inward (that is, a direction substantially perpendicular to the inclined surface 20 of the platen 10 ).

This ring lighting device 2 is used, for example, in the following image processing inspection. For example, by screwing a plurality of mounting screws (not shown) into the plurality of threaded holes 48 of the cover portion 40, the ring lighting device 2 is mounted on the inspection surface so that the inclined surface 20 of the ring light source 4 is on the lower side. Use equipment (not shown) and so on. An illumination area (not shown) is located below the ring lighting device 2, and an inspection object (not shown) is placed in the center of the illumination area. In addition, a CCD camera (not shown) is installed above the ring lighting device 2 , and the CCD camera inspects the object to be inspected through the opening 62 of the ring lighting device 2 .

When the predetermined power from the power supply device is supplied to the ring lighting device 2 via the cable 34, the power is supplied to the lead wire 16 of the LED 8 via the wiring pattern of the printed wiring board 12, the conductive area portion, and the solder 58, so that a plurality of Each light emitting part 14 of LED8 emits light. Thereby, the surface of the object to be inspected placed in the illumination area is illuminated, and image processing inspection of the object to be inspected is thus performed.

In addition, as mentioned above, since the front end portion of the lead 16 of the LED 8 is covered by the heat dissipation member 50 and is in contact with it, if the light emitting portion 14 of the LED 8 emits light, the heat generated in the light emitting portion 14 passes through the heat dissipation member 50 from the lead 16 . Then, the heat is transmitted to the cover portion 40 and the case main body portion 38 to dissipate heat, whereby the heat generated in the light emitting portion 14 can be efficiently dissipated.

In the ring lighting device 2 of the present embodiment, the lead wires 16 of the plurality of LEDs 8 are soldered to the printed wiring board 12 through the plurality of through-holes 24 of the platen 10, whereby the plurality of LEDs 8 The respective light emitting parts 14 are supported on the inclined surface 20 of the table 10, therefore, the respective light emitting parts 14 of the plurality of LEDs 8 can be arranged as desired without bending the printed wiring board 12 as in the prior art. Arranged in a ring shape in this way, the ring lighting device 2 can be easily manufactured. In addition, stress does not act on the printed wiring board 12, so no cracks will occur at the soldered portion of the lead 16 of the LED 8, thereby preventing poor electrical contact between the lead 16 of the LED 8 and the printed wiring board 12. Moreover, the irradiation direction of the light from several LED8 can be changed easily by suitably changing the inclination angle (theta) 1 of the inclined surface 20 of the platen 10.

Next, a second embodiment of the ring lighting device will be described with reference to FIG. 5 . Fig. 5 is a schematic partial perspective view showing a ring lighting device according to a second embodiment of the present invention. In FIG. 5 , the same reference numerals are assigned to the same constituent elements as those of the embodiment shown in FIGS. 1 to 4 , and detailed description thereof will be omitted.

In the ring lighting device 2A of this embodiment, the plurality of through-holes 24A provided in the base plate 10A are each formed in a long hole shape, and a pair of lead wires 16 of the LED 8 are inserted into each of the through-holes 24A. The length of this through-hole 24A is substantially the same as or slightly longer than the separation distance (pitch) of the pair of lead wires 16 of the LED 8 .

In the ring lighting device 2A of this other embodiment, since the lead wire 16 of the LED 8 is inserted through the one through-hole 24A of the table 10A, the insertion work of the lead wire 16 can be easily performed.

As mentioned above, various embodiments of the ring lighting device and its manufacturing method according to the present invention have been described, but the present invention is not limited to such embodiments, and various modifications and corrections can be made without departing from the scope of the present invention. .

For example, in each of the above-described embodiments, the positioning protrusion 30 is provided on the other surface of the table 10, and the positioning recess 36 is provided on one surface of the printed wiring board 12. The concave portion for positioning is provided on the other surface of the platen 10 , and the protruding portion for positioning is provided on one surface of the printed wiring board 12 . Alternatively, the positioning protrusions 30 and the positioning recesses 36 may not be provided, and the positioning mechanism may be constituted by marks respectively provided on the other surface of the platen 10 and one surface of the printed wiring board 12 so that these marks are consistent. In this way, the platen 10 and the printed wiring board 12 are superimposed and positioned.

In addition, for example, in each of the above-described embodiments, the leads 16 of the LED 8 are soldered to the printed wiring board 12 by reflowing solder, but soldering may be performed using, for example, a soldering iron or the like.

Claims (6)

1. circular lighting device; The printed wiring board that it possesses a plurality of LED and is electrically connected with described a plurality of LED; Described a plurality of LED has respectively the illuminating part that is covered by resin and the lead that extends from described illuminating part; Corresponding with the described lead separately of described a plurality of LED and be provided with a plurality of through holes on described printed wiring board; The described lead separately of described a plurality of LED is inserted through described a plurality of through holes of described printed wiring board and is soldered; Described circular lighting device is characterised in that

Described printed wiring board constitutes tabular and ring-type, between the described illuminating part separately of described printed wiring board and described a plurality of LED, clamp the platen of ring-type with insulating properties, being provided with on described platen from it simultaneously is that first face extends to i.e. second a plurality of through holes of another side, in addition, be provided with the inclined plane that descends towards radially inner side at described first face

The described lead separately of described a plurality of LED, described a plurality of through holes by described platen, insert and to lead in described a plurality of through holes of described printed wiring board and be soldered, the described illuminating part separately of described a plurality of LED, be supported on the direction in approximate vertical on the described inclined plane of described platen, described second face at described platen is provided with annular recessed portion, and described annular recessed portion is used to accommodate by described a plurality of through holes of described printed wiring board by the scolder of suction on described first.

2. circular lighting device as claimed in claim 1 is characterized in that,

The open end separately of the described a plurality of through holes on the side of the described inclined plane of described platen is provided with the tapering of expansion laterally.

3. circular lighting device as claimed in claim 1 or 2 is characterized in that,

On described platen and described printed wiring board, be respectively equipped with the detent mechanism that is used to they are overlapped and positions.

4. circular lighting device as claimed in claim 3 is characterized in that,

Described detent mechanism that is: is located with teat or recess by constituting as the lower part, and it is located on the described platen; With the location with recess or teat, it is located on the described printed wiring board that engages mutually with teat or recess with described location.

5. circular lighting device as claimed in claim 1 or 2 is characterized in that,

Also possesses the housing that is used to keep described platen and described printed wiring board, clamp the radiating component with flexibility between the another side of described printed wiring board and described housing, the leading section of the described lead separately of described a plurality of LED contacts with described radiating component with heat exchange pattern.

6. the manufacture method of a circular lighting device, described circular lighting device possess a plurality of LED, the described a plurality of LED of supporting and have the platen of ring-type of insulating properties and the printed wiring board that is electrically connected with described a plurality of LED,

Described a plurality of LED has illuminating part that is covered by resin and the lead that extends from described illuminating part respectively, described printed wiring board constitutes tabular and ring-type, corresponding with the described lead separately of described a plurality of LED and be provided with a plurality of through holes on described printed wiring board, being provided with on described platen from it simultaneously is that first face extends to i.e. second a plurality of through holes of another side, in addition, be provided with the inclined plane that descends towards radially inner side at described first face

The manufacture method of described circular lighting device is characterised in that to have:

Bend the operation of the described lead separately of described a plurality of LED; The described lead separately of described a plurality of LED is cut to the operation of specific length; Make the consistent operation of described a plurality of through holes of the described a plurality of through holes and the described printed wiring board of described platen; The one side of described second and described printed wiring board that makes described platen is opposed and make the operation that they overlap; The described illuminating part separately of described a plurality of LED is bearing on the described inclined plane of described platen, and the described lead separately of described a plurality of LED is inserted the operation of leading in described a plurality of through holes of described a plurality of through holes of described platen and described printed wiring board; And will insert the operation of described lead solder on described through hole of having led to described through hole and described through hole.

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