CN100530472C - Ultrathin plastic key module and manufacturing method thereof - Google Patents
Ultrathin plastic key module and manufacturing method thereof Download PDFInfo
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- CN100530472C CN100530472C CNB2005100539268A CN200510053926A CN100530472C CN 100530472 C CN100530472 C CN 100530472C CN B2005100539268 A CNB2005100539268 A CN B2005100539268A CN 200510053926 A CN200510053926 A CN 200510053926A CN 100530472 C CN100530472 C CN 100530472C
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Abstract
Description
技术领域 technical field
本发明涉及一种超薄塑料按键模块及其制作方法,尤指一种通过光学定位模块的定位、及计算机数值控制(Computer Numerical Control,CNC)设备的加工,而使按键体超薄化的超薄塑料按键模块及其制作方法。The present invention relates to an ultra-thin plastic button module and a manufacturing method thereof, especially to an ultra-thin plastic button module through the positioning of an optical positioning module and the processing of computer numerical control (Computer Numerical Control, CNC) equipment. Thin plastic key module and manufacturing method thereof.
背景技术 Background technique
请参阅图1所示,其为现有按键模块的制作方法的流程图。由流程图中可知,现有按键模块的制作方法包括:首先,开设一预定的塑料模(S100);然后,借由该塑料模,以射出成型(Injection Molding)方式成形所需厚度的薄板(S102),其中该厚度一般均大于1毫米;接着,提供一用于定位该薄板的夹具(S104);加工该薄板的外观(S106),如设置图文、符号于薄板的正面或背面;接下来,冲压该薄板,以成形多个按键体(S108);最后,贴合或设置多个弹性体于该等相对应的按键体下端(S110),以完成按键模块的制作。Please refer to FIG. 1 , which is a flow chart of the manufacturing method of the existing button module. It can be known from the flow chart that the manufacturing method of the existing button module includes: firstly, setting up a predetermined plastic mold (S100); then, using the plastic mold, forming a thin plate ( S102), wherein the thickness is generally greater than 1 mm; then, provide a fixture for positioning the thin plate (S104); process the appearance of the thin plate (S106), such as setting graphics, symbols on the front or back of the thin plate; then Next, punch the thin plate to form a plurality of key bodies (S108); finally, attach or arrange a plurality of elastic bodies on the lower ends of the corresponding key bodies (S110), so as to complete the production of the key module.
现有塑料按键体的成型方式皆以射出成型方法进行,但塑料射出成型做厚度低于1毫米的对象时,因机器、模具设计等限制常造成对象变形、料不足与冲切毛边等异常产生。Existing molding methods of plastic button bodies are all carried out by injection molding. However, when plastic injection molding is used to make objects with a thickness of less than 1 mm, due to limitations in machine and mold design, etc., abnormalities such as object deformation, insufficient material, and punching burrs often occur. .
另外,现有制作中尚有下列的缺点:In addition, there are following disadvantages in existing production:
1、射出成形制造中,须要针对不同厚度的薄板设计不同的塑料模;1. In injection molding manufacturing, it is necessary to design different plastic molds for thin plates of different thicknesses;
2、在定位薄板时,须使用另一定位夹具以进行外观加工;以及2. When positioning thin plates, another positioning fixture must be used for appearance processing; and
3、最后冲压薄板时,又须另外使用冲压机及配合冲压夹具的使用。3. When stamping the thin plate at last, another stamping machine and stamping fixture must be used.
是以,由上可知,上述现有的按键模块及其使用方法,在实际使用上,显然具有不便与缺失存在,而可待加以改善。Therefore, it can be seen from the above that the above-mentioned existing key module and its usage method obviously have inconvenience and defects in actual use, and can be improved.
发明内容 Contents of the invention
本发明所要解决的技术问题,在于提供一种超薄塑料按键模块及其制作方法,其通过光学定位模块的定位、及计算机数值控制(CNC)设备的加工,而制造出超薄化的按键体。不但使得按键模块整体的厚度降低,而且在超薄按键体制作过程中,不会因机器、模具设计等限制,而造成对象变形、料不足与冲切毛边等异常产生。The technical problem to be solved by the present invention is to provide an ultra-thin plastic key module and a manufacturing method thereof, which can produce an ultra-thin key body through the positioning of the optical positioning module and the processing of computer numerical control (CNC) equipment . Not only can the overall thickness of the button module be reduced, but also during the production process of the ultra-thin button body, there will be no abnormalities such as deformation of the object, insufficient material, and punching burrs due to restrictions on machine and mold design.
为了解决上述技术问题,根据本发明的其中一种方案,提供一种超薄塑料按键模块的制作方法,其步骤包括:首先,提供一薄板;接着,借由一光学定位模块以定位该薄板;然后,借由一计算机数值控制(CNC)设备,以加工该薄板成为一预定的形状;最后,设置一弹性体于该具有预定形状的薄板下端。In order to solve the above technical problems, according to one solution of the present invention, a method for manufacturing an ultra-thin plastic button module is provided, the steps of which include: firstly, providing a thin plate; then, positioning the thin plate by means of an optical positioning module; Then, by means of a computer numerical control (CNC) equipment, the thin plate is processed into a predetermined shape; finally, an elastic body is arranged at the lower end of the thin plate with the predetermined shape.
为了解决上述技术问题,根据本发明的其中一种方案,提供一种超薄塑料按键模块,其包括:薄形按键体及弹性体。该薄形按键体借由计算机数值控制(CNC)设备加工成形,且该薄形按键体具有小于等于1毫米的厚度;以及该弹性体设置于该薄形按键体下端。In order to solve the above technical problems, according to one solution of the present invention, an ultra-thin plastic key module is provided, which includes: a thin key body and an elastic body. The thin key body is shaped by computer numerical control (CNC) equipment, and the thin key body has a thickness less than or equal to 1 millimeter; and the elastic body is arranged at the lower end of the thin key body.
为更好地说明本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而该附图仅提供参考与说明用,并非用来对本发明加以限制者。In order to better illustrate the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, however, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.
附图说明 Description of drawings
图1为现有按键模块的制作方法的流程图;Fig. 1 is the flow chart of the manufacturing method of existing button module;
图2为本发明超薄塑料按键模块的制作方法的第一实施例的流程图;Fig. 2 is the flowchart of the first embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention;
图3为本发明超薄塑料按键模块的制作方法的第二实施例的流程图;Fig. 3 is the flowchart of the second embodiment of the manufacturing method of the ultra-thin plastic button module of the present invention;
图4为本发明超薄塑料按键模块的制作方法的第三实施例的流程图;以及Fig. 4 is the flowchart of the third embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention; and
图5为本发明超薄塑料按键模块的示意图。Fig. 5 is a schematic diagram of the ultra-thin plastic key module of the present invention.
其中,附图标记:Among them, reference signs:
10-薄形按键体10-thin button body
20-弹性体20-Elastomer
D-小于1毫米D-less than 1 mm
具体实施方式 Detailed ways
请参阅图2所示,其为本发明超薄塑料按键模块的制作方法的第一实施例的流程图。由流程图中可知,本发明提供一种超薄塑料按键模块的制作方法,其步骤包括:首先,提供一薄板(S200),其中该薄板为塑料材料,且该薄板的厚度小于等于1毫米;接着,借由一光学定位模块以定位该薄板(S202),其中该光学定位模块具有一定位用的感光耦合元件(CCD)或互补金属氧化物半导体(CMOS);然后,借由一计算机数值控制(Computer Numerical Control,CNC)设备,以加工该薄板成为一预定的形状(S204)。Please refer to FIG. 2 , which is a flow chart of the first embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention. It can be seen from the flowchart that the present invention provides a method for manufacturing an ultra-thin plastic key module, the steps of which include: first, providing a thin plate (S200), wherein the thin plate is made of plastic material, and the thickness of the thin plate is less than or equal to 1 mm; Then, position the thin plate by means of an optical positioning module (S202), wherein the optical positioning module has a photosensitive coupling device (CCD) or complementary metal oxide semiconductor (CMOS) for positioning; then, by means of a computer numerical control (Computer Numerical Control, CNC) equipment to process the thin plate into a predetermined shape (S204).
接着,设置多个图文或符号于该具有预定形状的薄板的背面(S206),该设置的方法可为印刷(coating)或涂布(printing)的方式;最后,设置一弹性体于该具有预定形状的薄板下端(S208)。若该薄板为预定的单组按键体大小,则不须经过冲压成形,若该薄板为多组按键体,则借由该计算机数值控制设备进行冲压制作(不须更换加工设备及定位模具)。Next, set a plurality of graphics or symbols on the back of the thin plate with a predetermined shape (S206), the setting method can be printing (coating) or coating (printing); finally, set an elastic body on the The lower end of the thin plate of a predetermined shape (S208). If the thin plate is of a predetermined single-group key body size, stamping is not required; if the thin plate is a multi-group key body, stamping is performed by the computer numerical control equipment (no need to replace processing equipment and positioning molds).
请参阅图3所示,其为本发明超薄塑料按键模块的制作方法的第二实施例的流程图。由流程图中可知,第二实施例的步骤S300至S304及S308与第一实施例的步骤S200至S204及S208相同。而最大的不同在于:步骤S304之后包括:借由一激光雕刻设备,以激光雕刻该具有预定形状的薄板的正面,使该薄板的正面产生所需的图文或符号(S306)。Please refer to FIG. 3 , which is a flow chart of the second embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention. It can be seen from the flowchart that the steps S300 to S304 and S308 of the second embodiment are the same as the steps S200 to S204 and S208 of the first embodiment. The biggest difference is that after the step S304, it includes: using a laser engraving device to laser engrave the front side of the thin plate with a predetermined shape, so that the front side of the thin plate produces the required graphics or symbols (S306).
请参阅图4所示,其为本发明超薄塑料按键模块的制作方法的第三实施例的流程图。由流程图中可知,第三实施例的步骤S400至S404与第一实施例的步骤S200至S204相同。而最大的不同在于:步骤S404之后包括:借由一激光雕刻设备,以激光雕刻该具有预定形状的薄板的正面,使该薄板的正面产生所需的图文或符号(S406);然后,涂布防护用的硬膜于该激光雕刻后的薄板的正面(S408);最后设置一弹性体于该具有预定形状的薄板下端(S410)。Please refer to FIG. 4 , which is a flow chart of the third embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention. It can be known from the flowchart that steps S400 to S404 of the third embodiment are the same as steps S200 to S204 of the first embodiment. The biggest difference is that after step S404, it includes: using a laser engraving device to laser engrave the front side of the thin plate with a predetermined shape, so that the front side of the thin plate produces the required graphics or symbols (S406); then, paint Cloth a protective hard film on the front of the thin plate after laser engraving (S408); finally arrange an elastic body on the lower end of the thin plate with a predetermined shape (S410).
另外,该激光雕刻设备对该薄板的激光雕刻深度控制,借由调整该激光雕刻设备的激光输出功率大小决定。且该激光雕刻设备对该薄板的正面的织纹控制,借由调整该激光雕刻设备的激光输出功率与路径的变化,以改变雕刻线宽、线距与线型,而呈现所需的样式及质感。In addition, the control of the laser engraving depth of the thin plate by the laser engraving equipment is determined by adjusting the laser output power of the laser engraving equipment. And the laser engraving equipment controls the texture on the front of the thin plate, by adjusting the laser output power and path of the laser engraving equipment, to change the engraving line width, line distance and line type, and present the desired style and texture.
请参阅图5所示,其为本发明超薄塑料按键模块的示意图。由图中可知,本发明提供一种超薄塑料按键模块,其包括:一薄形按键体10及一设置于该薄形按键体10下端的弹性体20。其中该薄形按键体10借由计算机数值控制(CNC)设备加工成形而成,且该薄形按键体10具有小于等于1毫米(D)的厚度。Please refer to FIG. 5 , which is a schematic diagram of the ultra-thin plastic button module of the present invention. It can be seen from the figure that the present invention provides an ultra-thin plastic key module, which includes: a
另外,该薄形按键体10为塑料材料。且该薄形按键体10的背面以印刷或涂布的方式设置有多个图文或符号;该薄形按键体10的正面以激光雕刻的方式设置有多个图文或符号。In addition, the
综上所述,本发明通过光学定位模块的定位、及计算机数值控制(CNC)设备的加工,而制造出超薄化的按键体。不但使得按键模块整体的厚度降低,而且于超薄按键体制作过程中,不会因机器、模具设计等限制,而造成对象变形、料不足与冲切毛边等异常产生。To sum up, the present invention manufactures an ultra-thin key body through the positioning of the optical positioning module and the processing of the computer numerical control (CNC) equipment. Not only can the overall thickness of the button module be reduced, but also during the production process of the ultra-thin button body, there will be no abnormalities such as deformation of the object, insufficient material, and punching burrs due to restrictions on machine and mold design.
以上所述内容仅为本发明的较佳可行实施例,并非用于限制本发明的专利保护范围,故举凡运用本发明说明书及附图内容所为的等效技术变化,均同理皆包含于本发明的保护范围内。The above-mentioned content is only a preferred feasible embodiment of the present invention, and is not used to limit the scope of patent protection of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are all included in the same reason. within the protection scope of the present invention.
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100539268A CN100530472C (en) | 2005-03-14 | 2005-03-14 | Ultrathin plastic key module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100539268A CN100530472C (en) | 2005-03-14 | 2005-03-14 | Ultrathin plastic key module and manufacturing method thereof |
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| CN1835155A CN1835155A (en) | 2006-09-20 |
| CN100530472C true CN100530472C (en) | 2009-08-19 |
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| CNB2005100539268A Expired - Fee Related CN100530472C (en) | 2005-03-14 | 2005-03-14 | Ultrathin plastic key module and manufacturing method thereof |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276699B (en) * | 2007-03-30 | 2010-05-26 | 毅嘉科技股份有限公司 | Method for manufacturing thinned key panel |
| CN103963331A (en) * | 2014-04-09 | 2014-08-06 | 格林精密部件(惠州)有限公司 | Processing method for ultrathin plastic piece |
| CN110549071B (en) * | 2019-09-06 | 2022-02-11 | 珠海菲高科技股份有限公司 | Processing methods of ultra-miniature parts |
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| US5807002A (en) * | 1997-08-26 | 1998-09-15 | Silitek Corporation | Super-thin plastic key |
| CN1224906A (en) * | 1998-01-24 | 1999-08-04 | 信越聚合物株式会社 | Push button switch covering assembly |
| CN1232277A (en) * | 1998-04-13 | 1999-10-20 | 固特橡胶股份有限公司 | Manufacturing method and finished product of light-transmitting film key |
| EP1017075A2 (en) * | 1998-12-31 | 2000-07-05 | You Eal Electronics Co., Ltd. | Keypad for portable telephone and manufacturing method thereof |
| CN1269589A (en) * | 1999-03-12 | 2000-10-11 | 毅嘉科技股份有限公司 | Forming method of hard light-transmitting key |
| US6153844A (en) * | 1997-03-27 | 2000-11-28 | Mitsubishi Denki Kabushiki Kaisha | Integrated key top assembly |
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2005
- 2005-03-14 CN CNB2005100539268A patent/CN100530472C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6153844A (en) * | 1997-03-27 | 2000-11-28 | Mitsubishi Denki Kabushiki Kaisha | Integrated key top assembly |
| US5807002A (en) * | 1997-08-26 | 1998-09-15 | Silitek Corporation | Super-thin plastic key |
| CN1224906A (en) * | 1998-01-24 | 1999-08-04 | 信越聚合物株式会社 | Push button switch covering assembly |
| CN1232277A (en) * | 1998-04-13 | 1999-10-20 | 固特橡胶股份有限公司 | Manufacturing method and finished product of light-transmitting film key |
| EP1017075A2 (en) * | 1998-12-31 | 2000-07-05 | You Eal Electronics Co., Ltd. | Keypad for portable telephone and manufacturing method thereof |
| CN1269589A (en) * | 1999-03-12 | 2000-10-11 | 毅嘉科技股份有限公司 | Forming method of hard light-transmitting key |
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