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CN100524706C - Semiconductor device manufacturing method - Google Patents

Semiconductor device manufacturing method Download PDF

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Publication number
CN100524706C
CN100524706C CNB2007101619466A CN200710161946A CN100524706C CN 100524706 C CN100524706 C CN 100524706C CN B2007101619466 A CNB2007101619466 A CN B2007101619466A CN 200710161946 A CN200710161946 A CN 200710161946A CN 100524706 C CN100524706 C CN 100524706C
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China
Prior art keywords
semiconductor element
semiconductor
semiconductor device
resin layer
resin bed
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Expired - Fee Related
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CNB2007101619466A
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Chinese (zh)
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CN101131970A (en
Inventor
藤沢哲也
松木浩久
井川治
爱场喜孝
生云雅光
佐藤光孝
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Socionext Inc
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Fujitsu Semiconductor Ltd
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Publication of CN100524706C publication Critical patent/CN100524706C/en
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

本申请公开了一种半导体器件的制造方法。在该半导体器件中，当半导体芯片并列地排列时，多个半导体芯片的每一个的电路形成面可以容易地置于齐平的平面上，由此简化了形成重排布线的工艺。半导体芯片借助粘结剂层以两维布局安装在基板上。树脂层形成在基板上并位于半导体元件周围，树脂层的厚度基本上与半导体元件的厚度相同。有机绝缘层形成在树脂层表面以及半导体元件的电路形成面上。重排布线层形成在有机绝缘层以及半导体芯片的电极上。外部连接端子通过重排布线层中的布线电连接到半导体元件的电路形成面。

The application discloses a method for manufacturing a semiconductor device. In the semiconductor device, when the semiconductor chips are arranged side by side, the circuit formation face of each of the plurality of semiconductor chips can be easily placed on a flush plane, thereby simplifying the process of forming rearrangement wiring. The semiconductor chips are mounted on the substrate in a two-dimensional layout by means of an adhesive layer. A resin layer is formed on the substrate around the semiconductor element, and the thickness of the resin layer is substantially the same as that of the semiconductor element. The organic insulating layer is formed on the surface of the resin layer and the circuit formation surface of the semiconductor element. The rearrangement wiring layer is formed on the organic insulating layer and the electrodes of the semiconductor chip. The external connection terminal is electrically connected to the circuit formation surface of the semiconductor element through the wiring in the rearrangement wiring layer.

Description

The manufacture method of semiconductor device
The application is that application number is the dividing an application for the patent application of " semiconductor device and manufacture method thereof " that 03138174.X, the applying date be on May 30th, 2003, denomination of invention.
To quoting of related application
The present invention requires the priority of Japanese patent application No.2002-158997 (May 31 2002 applying date), No.2002-316076 (October 30 2002 applying date) and No.2003-127344 (May 2 2003 applying date), and its full content draws at this and is reference.
Technical field
Present invention relates in general to the manufacture method of semiconductor device, particularly constitute the manufacture method of surface-mountable semiconductor device.
Background technology
In the last few years, highdensity semiconductor chip progress highly significant, semiconductor chip size reduces.Relevant therewith, the semiconductor device of high density and function high concentration is constantly progressive, has now developed a plurality of semiconductor chips are integrated into a technology in the semiconductor device.For example, exist a kind of semiconductor chip that a plurality of variety classeses and function wherein arranged to interconnect and provide the semiconductor device of external connecting electrode.
Though a kind of multi-chip module (MCM) that holds a plurality of semiconductor chips in an encapsulation is for example arranged, conventional MCM does not have the fine structure identical with the semiconductor chip of the fine structure with nearest exploitation.
Japan's special permission applies for that openly No.2001-217381 discloses the technology of holding a plurality of semiconductor chips in an encapsulation.Adopt disclosed technology in this patent document, a plurality of semiconductor chips are arranged on the sectional fixture, and copper tip is formed on the electrode of each semiconductor chip.Then, use transfer modling by sealing resin sealing semiconductor chips and copper tip, the surface of grinding-in resin is to expose copper tip.Exposing formation wiring on the sealing resin surface of copper tip (rearrangement wiring) afterwards, external connecting electrode is formed on to be reset on connect up (rearrangement wiring).
Japan's special permission applies for that openly No.2001-332643 discloses a kind of disclosed technology in the above-mentioned patent document that is similar to.This patent document discloses on each semiconductor chip backside and has formed diaphragm.
In addition, Japan's special permission applies for that openly No.7-86502 discloses a kind of technology, and wherein a plurality of semiconductor chips are contained in the groove that forms in the substrate and reset wiring and are formed on the semiconductor chip, and outside afterwards link is formed on to be reset in the wiring.Adopt this technology, the degree of depth of groove forms to such an extent that the circuit formation face of each semiconductor chip is aimed at the surface of substrate.
In addition, Japan's special permission applies for that openly No.2002-110714 discloses a kind of technology, a plurality of semiconductor chips wherein are set, circuit forms and faces down, resin is filled between the semiconductor chip, makes the circuit formation face of semiconductor chip become smooth surface by covering semiconductor chip backside and side simultaneously.Afterwards, reset wiring and be formed on the side of circuit formation face, to form external connection terminals.
In addition, Japan's special permission applies for that openly No.5-206368 discloses a kind of technology, and wherein a plurality of semiconductor chips are installed on the heat-conducting substrate, and insulating resin is filled between the chip, forms on circuit formation face with aluminium and resets wiring.
Though above-mentioned routine techniques constitutes in the mode of a plurality of semiconductor chips of installation arranged side by side, now developed the wherein stacked N-type semiconductor N device of stacked a plurality of semiconductor chips of many kinds.
As the example of the file that discloses stacked N-type semiconductor N device, there is Japan's special permission openly to apply for No.2001-298149 and No.2001-320015.
Adopt Japan's special permission openly to apply for disclosed technology among the No.2001-298149, in the welding disking area of the following semiconductor chip of semiconductor-on-insulator chip stacked semiconductor-on-insulator chip mounted thereto (being arranged in the electrode of periphery).In addition, adopt Japan's special permission openly to apply for disclosed technology among the No.2001-320015, conductive pole (cylindricality metal parts) is arranged on the wiring layer of each stacked semiconductor chip.
Adopt the special permission of above-mentioned Japan openly to apply for disclosed technology among No.2001-217381 and the No.2001-332643, use transfer modling by the sealing resin sealing semiconductor chips, thus, applied pressure has negative effect to semiconductor chip during the transfer modling.In addition, during the grinding-in resin surface, bigger power is applied on the semiconductor chip after the molding.In addition, when the stacked semiconductor chip, owing to the contraction when installation base plate (silicon wafer) upward solidifies sealing resin warpage may take place.When the stacked semiconductor chip, this warpage can have negative effect.
In publication application No.7-86502, when forming the groove of holding semiconductor chip, the degree of depth of groove needs pinpoint accuracy.Particularly, if the semiconductor chip attenuation, the degree of depth of groove needs higher accuracy so, and this is difficult to realize.
In addition, adopt Japan's special permission openly to apply for disclosed technology among the No.2002-110714, resin is provided at semiconductor chip backside, produces the problem of semiconductor chip heat dissipation characteristics difference.In addition, because warpage on semiconductor chip backside, therefore may take place in resin solidification in semiconductor device.
In addition, openly apply for disclosed technology among No.2002-110714 and the No.5-206368 according to Japan's special permission, semiconductor chip is arranged on after the precalculated position, resin is filled between the semiconductor chip, there is when semiconductor chip or potting resin are installed the situation that semiconductor chip is subjected to displacement thus.Adopt this technology, can not remove the chip of displacement.
In addition, for stacked N-type semiconductor N device, openly apply among the No.2001-298149 in the disclosed technology in Japan special permission, in the welding disking area of the following semiconductor chip of semiconductor-on-insulator chip stacked semiconductor-on-insulator chip mounted thereto (being arranged in the electrode of periphery), can not stackedly have the semiconductor chip of same size.In addition, adopt Japan's special permission openly to apply for disclosed technology among the No.2001-320015, owing to form conductive pole, the manufacturing cost of semiconductor device increases.
Simultaneously, the semiconductor device that forms by the stacked semiconductor chip is fixed firmly to semiconductor chip on the substrate by the periphery that covers semiconductor chip usually.In addition, be installed in substrate for example in the situation on the multi-chip module at a plurality of semiconductor chips, apply for openly that as Japan's special permission No.2002-110714 is disclosed, resin is filled between the semiconductor chip.Adopt the resin bed of this filling, each semiconductor chip can be fixed firmly to substrate, the semiconductor chip mutually insulated.
Can before being installed to semiconductor chip on the substrate, be pre-formed the resin bed of filling, potting resin after perhaps semiconductor chip being installed on the substrate.
When before semiconductor chip is installed, forming above-mentioned potting resin layer, remove the partially filled resin bed that is formed on the substrate, expose the opening of substrate surface, this chip is installed in the opening by semiconductor chip is placed on formation.Therefore, the opening of formation has the size of being a bit larger tham the semiconductor chip profile.
In addition, a kind of method that forms the potting resin layer after semiconductor chip is installed is arranged, solidify after wherein resin is applied on the substrate, on substrate, install and sheltered semiconductor chip.Equally in this case, be difficult to make the resin bed of filling closely to contact with the side of semiconductor chip, the gap can be formed between the side of the resin bed of filling and semiconductor chip.
If between the side of resin bed of filling and semiconductor chip, be formed with the gap, can not obtain abundant fixed effect by the resin bed of filling so to semiconductor chip.In addition, this gap can hinder and form wiring on semiconductor chip and resin packed layer.When insulating resin layer was formed on semiconductor chip and the resin packed layer, insulating resin entered the gap, was insulated resin in the step intermediate gap that forms insulating resin layer and filled.Yet insulating resin is not filled whole gap.
Summary of the invention
General objects of the present invention provides a kind of improvement and efficient semiconductor device, has wherein eliminated above-mentioned problem.
Purpose more specifically of the present invention provides a kind of semiconductor device and manufacture method thereof, even wherein semiconductor chip is arranged side by side, the circuit of each of a plurality of semiconductor chips forms face and can easily be positioned on the smooth face (even level), has simplified thus to form the technology of resetting wiring.
Another object of the present invention provides a kind of semiconductor device and manufacture method thereof, wherein can easily stacked semiconductor chip with same size, form thin wiring layer simultaneously betwixt.
Another purpose of the present invention provides a kind of semiconductor device and manufacture method thereof, wherein the potting resin layer side of contact semiconductor chip closely.
In order to realize above-mentioned purpose, a scheme according to the present invention provides a kind of semiconductor device, and comprising: a plurality of semiconductor elements are installed on the substrate by adhesive layer with two-dimensional arrangement; Be formed on the substrate and be positioned at resin bed around the described semiconductor element, the thickness of the resin bed thickness with semiconductor element basically is identical; Be formed on the organic insulator on the circuit formation face of resin layer surface and semiconductor element; Be formed on the rearrangement wiring layer on the electrode of organic insulator and semiconductor chip; And the external connection terminals that is electrically connected to the circuit formation face of semiconductor element by the wiring in the rearrangement wiring layer.
According to another aspect of the present invention, provide a kind of manufacture method that encapsulates the semiconductor device of a plurality of semiconductor elements, may further comprise the steps: form the thickness resin bed identical with the thickness of the semiconductor element that will install; Remove resin bed by part and in resin bed, form opening; Place semiconductor element respectively in opening, circuit forms and faces up; On the circuit formation face of the surface of resin bed and semiconductor element, form organic insulator; On the electrode of organic insulator and semiconductor element, form rearrangement wiring layer; And on rearrangement wiring layer, forming external connection terminals, external connection terminals is connected to the electrode of semiconductor element by the wiring in the rearrangement wiring layer.
According to above-mentioned invention, because the thickness of the resin bed around the semiconductor element is substantially equal to the thickness of semiconductor element, so the surface of the circuit of semiconductor element formation face and resin bed is located substantially on (basically on identical level) in the same plane.Thus, rearrangement wiring layer can easily be formed on the semiconductor element.
In addition, according to another scheme of the present invention, provide a kind of stacked semiconductor device, comprise a plurality of mutually stacked layer structure, each layer structure comprises: be arranged in semiconductor element on the substrate by adhesive layer; Be formed on the substrate and semiconductor element resin bed on every side, the thickness of resin bed is substantially equal to the thickness of semiconductor element; Be formed on the organic insulator on the circuit formation face of resin layer surface and semiconductor element; And be formed on rearrangement wiring layer on semiconductor element and the semiconductor element electrode.
In addition, according to a scheme more of the present invention, a kind of manufacture method of stacked semiconductor device is provided, may further comprise the steps: on substrate, form first resin bed, the thickness of first semiconductor element that the thickness of first resin bed is substantially equal to install, first resin bed is around first semiconductor element; In first resin bed, form first opening, so that first semiconductor element places first opening; First semiconductor element is placed first opening; Forming first organic insulator on the surface of first resin bed and on the circuit formation face of first semiconductor element; On the electrode of first organic insulator and first semiconductor element, form first rearrangement wiring layer; Form second resin bed on first rearrangement wiring layer, the thickness of second resin bed thickness with second semiconductor element that will install basically is identical, and second resin bed is around second semiconductor element; In second resin bed, form second opening, so that second semiconductor element places second opening; Second semiconductor element is placed second opening; On the surface of second resin bed and the circuit formation face of second semiconductor element, form second organic insulator; On second organic insulator, form second rearrangement wiring layer; Extend through the conductive connection part branch of second resin bed between first rearrangement wiring layer and second rearrangement wiring layer by formation, first rearrangement wiring layer is electrically connected to second rearrangement wiring layer.
According to above-mentioned invention, owing to be substantially equal to the thickness of semiconductor element around the thickness of the resin bed of semiconductor element, so the surface that the circuit of semiconductor element forms face and resin bed is located substantially on (basically in same level) in the same plane.Thus, rearrangement wiring layer can easily be formed on the semiconductor element.In addition because rearrangement wiring layer extends to the surface of resin bed, therefore by as the conductive connection part branch of path can easily realize electrical connection between the rearrangement wiring layer such as through hole.
In addition, provide a kind of semiconductor device according to another aspect of the present invention, comprising: substrate; Be installed in the semiconductor element on the substrate; And be provided at around the semiconductor element and have the resin bed that is in the upper surface of same horizontal plane with the upper surface of semiconductor element basically, wherein but this resin bed is the resin of semi-solid preparation, have deliquescing and fluidised characteristic when semi-cured state heats, this resin bed closely contacts with the side surface of semiconductor element, and is very close to each other between the two.
In addition, another scheme according to the present invention provides a kind of manufacture method of semiconductor device, may further comprise the steps: form the resin bed of semi-cured state on substrate, make semiconductor element be arranged in this resin bed, but this resin bed is made by the resin of semi-solid preparation; Make potting resin layer (the filing resin layer) fluidisation of semi-cured state by heating; By the potting resin layer of fill fluidization in the gap, eliminate the gap between semiconductor element and the potting resin layer; And by this resin bed of heating full solidification.
According to above-mentioned invention, but the resin by using semi-solid preparation as the material of described resin bed, by softening and fluidised resin bed can the filling semiconductor element and described resin bed between the gap.Thus, can easily be manufactured on semiconductor device very close to each other between semiconductor element and the resin bed.
In addition, a scheme more according to the present invention provides a kind of manufacture method of semiconductor device, may further comprise the steps: but on substrate, form the semiconductor element that the resin bed with opening also prepares the binding agent of the resin formation that has semi-solid preparation; Semiconductor element is placed described opening; The fluidised while of binding agent make semi-cured state by heating, semiconductor element is pressed on the substrate across binding agent; When the upper surface of upper surface that semiconductor element is remained on semiconductor element and potting resin layer is in the position of same level basically by the binding agent that is heating and curing.
In addition, an also scheme according to the present invention provides a kind of manufacture method of semiconductor device, may further comprise the steps: form the resin bed with opening and prepare the semiconductor element that has binding agent on substrate; The upper surface of lower surface support semiconductor element by with soldering tip (bonding tool) places opening with semiconductor element; Contact cured binders under the state of this resin bed upper surface at the lower surface of soldering tip.
According to above-mentioned invention, by binding agent can the filling semiconductor element and described resin bed between the gap, the upper surface of the upper surface of semiconductor element and potting resin layer can accurately be arranged in the same basically plane.In addition, owing to applied an amount of binding agent, binding agent is pushed by semiconductor element and is filled the gap.Thus, the tight contact substrate of binding agent, and can prevent the insufficient wetting or phenomenon of swashing of binding agent.
When reading following detailed description in conjunction with the accompanying drawings, other purpose of the present invention, characteristics and advantage will become clearer.
Brief description
Fig. 1 is the profile according to the semiconductor device of first embodiment of the invention;
Fig. 2 shows the profile of a semiconductor device, is the modification of semiconductor device shown in Figure 1;
Fig. 3 shows the profile of a semiconductor device, is another modification of semiconductor device shown in Figure 1;
Fig. 4 shows the profile of the semiconductor device with empty chip;
Fig. 5 shows the plane graph of empty chip and adjacent semiconductor chip;
Fig. 6 shows the fragmentary cross-sectional view of the semiconductor device with the capacitor in the rearrangement wiring layer of being formed on;
Fig. 7 A shows the profile of the semiconductor device with the inductor in the rearrangement wiring layer of being formed on;
Fig. 7 B shows the plane graph of inductor shown in Fig. 7 A;
Fig. 8 shows the fragmentary cross-sectional view with the semiconductor device that is formed on the capacitor in the resin bed;
Fig. 9 shows the fragmentary cross-sectional view with the semiconductor device that is formed on the capacitor between substrate and the semiconductor chip;
Figure 10 shows the mounting process of semiconductor chip.
Figure 11 has the semiconductor device profile of mounting process of the semiconductor chip of different-thickness for expression;
Figure 12 shows the profile of the semiconductor chip with the alignment patterns (alignmentpattern) that is used to locate semiconductor chip;
Figure 13 shows the profile that is formed on the semiconductor device that has the alignment patterns that is used to discern line of cut on the substrate;
Figure 14 shows the profile of semiconductor device according to a second embodiment of the present invention;
Figure 15 shows the profile of a semiconductor device, is the modification of semiconductor device shown in Figure 14;
Figure 16 shows the profile of a semiconductor device, is another modification of semiconductor device shown in Figure 14;
Figure 17 shows the profile of the semiconductor device of a third embodiment in accordance with the invention;
Figure 18 is the profile of semiconductor device that semiconductor packages shown in Figure 1 is got up;
Figure 19 A shows the profile of a fourth embodiment in accordance with the invention at the semiconductor device of the centre of manufacture process;
Figure 19 B for the semiconductor device shown in Figure 19 A by making the resin bed fluidisation fill profile under the state in gap;
Figure 20 A and 20B show the profile of an example of the formation that is used to illustrate the potting resin layer;
Figure 21 A and 21B show the profile of another example of the formation that is used to illustrate the potting resin layer;
Figure 22 shows the profile that concerns between explanation potting resin layer and the semiconductor element thickness;
Figure 23 A shows the profile of production process of semiconductor device according to a fifth embodiment of the invention to 23D;
Figure 24 shows the profile according to the semiconductor device of sixth embodiment of the invention;
Figure 25 A and 25B show the profile of production process of semiconductor device according to a seventh embodiment of the invention;
Figure 26 A shows the technology that is applied to binding agent on the semiconductor element and binding agent is arranged on semi-cured state to 26C;
Figure 27 A and 27B show and are used for illustrating the upper surface of resin bed and the upper surface of semiconductor element are set to the profile of the method on same plane basically.
DETAILED DESCRIPTION OF THE PREFERRED
Introduce the first embodiment of the present invention below
Fig. 1 shows the profile according to the semiconductor device 10 of the first embodiment of the present invention.Semiconductor device 10 has structure 11, and wherein a plurality of semiconductor chips (perhaps semiconductor element) are installed on substrate such as the silicon wafer, and input/output terminal (external connection terminals) is formed in the wiring on the semiconductor chip.
Substrate 11 is not limited to silicon wafer, also can use by the material with thermal conductive resin to form, and can be used as the substrate of heating panel, to promote the heat radiation of semiconductor chip.
Comprise logic chip 12 and storage chip 13 in the example shown in Figure 1 though be installed in semiconductor chip on the substrate 11, the semiconductor chip with any amount of various functions can be installed on the substrate 11.Yet, mounted semiconductor chip to be preferably to have the thin semiconductor chips of 50 μ m or littler thickness.
Logic chip 12 and storage chip 13 (hereinafter referred is a semiconductor chip 12 and 13) are installed on the substrate 11 by adhesive layer 15, are arranged in resin bed 14 simultaneously.Here, in the present embodiment,, logic chip 12 and storage chip 13 are installed in the resin bed 14 by placing the formation resin bed afterwards at the opening of resin bed 14 formation logic chip 12 and storage chip 13.
That is, adhesive layer 15 at first is formed on the substrate 11, and then, resin bed 14 is formed on the adhesive layer 15.The thickness that resin bed 14 forms is identical with the thickness of wanting mounted semiconductor chip 12 and 13.Resin bed 14 is formed by photosensitive resin, uses optical lithography to form the opening 14a of holding semiconductor chip 12 and 13.Opening 14a has the degree of depth that penetrates resin bed 14, exposes the surface of adhesive layer 15 below opening 14a.In addition, the size of each opening 14a form just in time suitable semiconductor chip 12 and 13 each.
Semiconductor chip 12 and 13 is arranged among the opening 14a that so forms in the resin bed 14, and circuit forms and faces up simultaneously.Semiconductor chip 12 and 13 places after the opening 14a, and the semiconductor chip 12 and 13 the back side are bonded on the adhesive layer 15, and semiconductor chip 12 and 13 is fixed among the opening 14a.Under this state, semiconductor chip 12 and 13 circuit formation face are in the state of aiming at the surface of resin bed 14.That is, semiconductor chip 12 and 13 circuit form the flush of face and resin bed 14.
In the present embodiment, each semiconductor chip 12 and 13 thickness are set to 50 μ m or littler.Though the thickness of semiconductor chip contains 10% the acceptable tolerance of having an appointment usually, because 50 μ m's 10% only is 5 μ m, this irregularity degree (being flatness) can not influence in technology subsequently and form rearrangement wiring layer.Therefore, in the present invention, importantly make and want mounted semiconductor chip thinner.
Install after the semiconductor chip 12 and 13, form on face and resin bed 14 surfaces at the circuit that flushes, form organic insulating film 16 as polyimides or epoxy resin, rearrangement wiring layer 17 is formed thereon.By replacing stacked conductive layer and insulating barrier and by connecting conductive layers such as through holes, forming rearrangement wiring layer 17, rearrangement wiring layer also can use techniques well known in the art to form, and has therefore omitted introduction.
Thus, by connecting logic chip 12 and storage chip 13 with rearrangement wiring layer 17, constituted the semiconductor device with complete function, made that for example, logic chip 12 can use the data of storage chip 13 to calculate, the result is stored in the storage chip 13.On rearrangement wiring layer 17 surfaces, form input/output terminal 18 as external connection terminals after, just finished semiconductor device shown in Figure 1.
In semiconductor device 10 according to present embodiment, because film, semiconductor device is arranged in the resin bed 14 identical with semiconductor chip thickness, therefore do not need to carry out the independent technology that circuit formation face and resin layer surface are made even, only semiconductor chip 12 and 13 is placed the opening 14a of resin bed 14 just can obtain to form rearrangement wiring layer 17 needed flatnesses.
In addition since by photoetch process resin layer 14 to form opening 14a, therefore can pinpoint accuracy ground control the position and the size of opening.Therefore can be with enough precision setting semiconductor chips 12 and 13.In addition, owing to formed 14 layers of resins before semiconductor chip 12 and 13 is installed, therefore after installing, the contraction of resin was not offset when semiconductor chip 12 and 13 position can be owing to cured resins.
When on as silicon wafer, forming a plurality of semiconductor device 10, after semiconductor device is formed on the silicon wafer, obtain single semiconductor device 10 by cutting silicon according to the substrate 10 of the semiconductor device 10 of present embodiment.In this case, cutting belt (dicingtape) acts on the back side of silicon wafer, cuts from the front of silicon wafer.
Thus, in the present embodiment, needn't be pre-formed or remove from adhesive layer 15 to resin bed 14 the top part corresponding to line of cut, promptly scribing machine (dicing saw) the part of process, thereby needed only is to use the scribing machine cutting silicon.In addition, order is stacked on the adhesive layer 15 and each edge of the resin bed 14, organic insulator 16 and the rearrangement wiring layer 17 that form all is positioned at the inside at following one deck edge of next-door neighbour (left side of the semiconductor device 10 of Fig. 1 and the right are step-likely to bias internal, so that these layers do not contact scribing machine.Thus, can effectively cut.
Fig. 2 shows the profile of semiconductor device 20, is the modification of semiconductor device 10 shown in Figure 1.Though semiconductor device 20 has and semiconductor device 10 similar structures, has removed substrate 11 and adhesive layer 15, on input/output terminal 18, form soldered ball 21 as external connection terminals.
When removing substrate 11, can be by grinding attenuation and removing substrate 11 effectively by dissolving substrate 11 such as corrosion and adhesive layer 15.Should note removing after the substrate 11, can heating panel be set at the back side of semiconductor chip 12 and 13.
Fig. 3 shows the profile of semiconductor device 30, is the modification of semiconductor device 10 shown in Figure 1.Though semiconductor device 30 has and semiconductor device 10 similar structures, use semiconductor chip (LSI) 31 to replace substrate 11.
Just, form insulating barrier 32 on LSI31, adhesive layer 15 is formed on the insulating barrier 32.After this, identical with above-mentioned semiconductor device 10 mode forms.In addition, the electrode on semiconductor chip 12 and 13 the circuit formation face is electrically connected by through hole 33 mutually with the electrode of LSI31, and through hole 33 passes resin bed 14 and adhesive layer 15.
According to semiconductor device 30, a plurality of semiconductor chips can be installed on the semiconductor device by higher density, can obtain to have the semiconductor device of higher functionality.
In above-mentioned embodiment, when the interval between the semiconductor chip was big, the length of the resin bed 14 between the semiconductor chip (12 and 13) was also big.At this moment, because therefore the thermal coefficient of expansion difference between resin bed and semiconductor chip and the substrate 11 often produces stress in semiconductor device.Then, in this case,, reduce the length of resin bed 14, to alleviate stress by arranging empty chip 35 in the space bigger between semiconductor chip.
In addition, by the wire structures that in empty chip, provides wiring also can simplify rearrangement wiring layer 17, as shown in Figure 5.In example shown in Figure 5, adjacent line 36A and 36B intersect mutually by the line 35a in the empty chip 35.
In the present invention, passive component such as capacitor or inductor can be formed in the rearrangement wiring layer 17.Fig. 6 shows the profile that capacitor is formed on an example in the rearrangement wiring layer 17.Fig. 7 A shows the profile that capacitor is formed on an example in the rearrangement wiring layer 17, and Fig. 7 B is the plane graph of capacitor.
As shown in Figure 6, by providing dielectric layer 38 can form capacitor 37 between the conductive layer in rearrangement wiring layer 17.In addition, shown in Fig. 7 B,, the conductive layer in the rearrangement wiring layer 17 can form inductor 39 by being made spirality.Thus, by capacitor and inductor are provided, can suppress to enter the noise of semiconductor device inside in rearrangement wiring layer 17.
In addition, in the present invention, as shown in Figure 8, capacitor 27 can be provided in the resin bed 14.At this moment, dielectric components 38 is filled in the opening that forms in the resin bed 14, and conductive layer 40 is formed on each side of rearrangement wiring layer 17.
In addition, as shown in Figure 9, capacitor also can be formed between substrate 11 and semiconductor chip 12 and 13.At this moment, insulating barrier at first is formed on the substrate 11, and conductive layer 41 is formed on the position that forms capacitor 27 on the insulating barrier 40.Then, dielectric layer 42 is formed on the conductive layer 41, and conductive layer 41 and dielectric layer 42 are embedded in the insulating barrier 43.Next, conductive layer 44 is formed on the dielectric layer 42, and conductive layer 44 is embedded in the insulating barrier 45.Thus, dielectric layer 42 is clipped between conductive layer 41 and the conductive layer 44, has formed capacitor 27.After this, adhesive layer 45 is formed on the insulating barrier 45, and the mode identical with above-mentioned semiconductor device 10 installed semiconductor chip 12 and 13, forms rearrangement wiring layer 17.
Introduce the mounting process of semiconductor chip 12 and 13 below with reference to Figure 10.Figure 10 shows the mounting process of semiconductor chip 12 and 13.
At first, adhesive layer 15 is formed on the substrate 11 of silicon wafer for example.Adhesive layer 15 is formed by resin, has adhesiveness on its surface.Next, resin bed 14 is formed on the adhesive layer 15.Resin bed 14 is formed by photosensitive resin, and is formed on the almost whole surface of adhesive layer 15.Yet, as mentioned above, form resin bed 14 to such an extent that make its edge be positioned at the edge that is arranged on the adhesive layer under it.In addition, the thickness of resin bed is set, makes it to be substantially equal to the thickness of semiconductor chip.
After this, in resin bed, form opening 14a by photoetch resin bed 14.Then, in opening 14a, arrange semiconductor chip 12 and 13.Thus, semiconductor chip 12 and 13 is installed on the substrate 11, and simultaneously semiconductor chip 12 and 13 the circuit surface that forms face and resin bed 14 is in same horizontal plane.
Here, when the difference in thickness of semiconductor chip 12 and semiconductor chip 13 was big, the resin bed 14A that has corresponding to the thickness of this difference in thickness at first was formed on the substrate 11, and then, adhesive layer 15A is applied thereto.Afterwards, resin bed 14B further is formed on the adhesive layer 15A.After this, be formed on the opening 14a that wherein arranges semiconductor chip, so that expose substrate 11, and be formed on the opening 14a that wherein arranges semiconductor chip, so that expose adhesive layer 15A with less thickness with big thickness.In addition, adhesive layer 15B is formed among the opening 14a that arranges big thickness semiconductor chips.Thus, the semiconductor chip with different-thickness can be installed on the substrate 11, is in par basically so that circuit forms face.
In the present embodiment, need semiconductor chip 12 and 13 be arranged among the opening 14a of resin bed 14 with enough precision.For the ease of the location, as shown in figure 12, be preferably formed alignment patterns 50 and be used for semiconductor chip is positioned at substrate 11.
Can form alignment patterns 50 by titanium (Ti) or the chromium (Cr) that sputtering method deposit formation and silicon on substrate 11 have a good adhesion.Determine the position of the opening 14a of resin bed 14 according to alignment patterns 50.Then, semiconductor chip 12 and are installed at 13 o'clock on substrate 11, the image recognition by alignment patterns 50 can accurately detect the position of opening 14 and semiconductor chip 12 and 13 is arranged on detected position.
In addition, as shown in figure 13, except the alignment patterns 51 that is used to locate the alignment patterns of semiconductor chip, is preferably formed as be used to cut.That is, form alignment patterns 51 by the mode identical with alignment patterns 50 along line of cut, the image of identification alignment patterns 51 when cutting is to determine line of cut.In addition, also can be included on the substrate 11 location and the processing of the resin bed 14 that forms or rearrangement wiring layer 17 according to alignment patterns 51 at each interior layer.
Introduce the second embodiment of the present invention below with reference to Figure 14.Figure 14 shows the profile according to the semiconductor device 60 of second embodiment of the invention.Semiconductor device 60 shown in Figure 14 is so-called stacked N-type semiconductor N device, by stacked a plurality of semiconductor chips is installed in this device.
At first, resin bed 61A is formed on substrate 11 as on the silicon wafer, and opening is formed among the resin bed 61A.Resin bed 61A is formed by resin bed 14 identical materials with above-mentioned first embodiment, forms opening in the mode identical with above-mentioned opening 14a equally.Form after the opening, insulating adhesive layer 62A is formed among the opening 62A, and 63A is arranged in the opening with semiconductor chip.
In this state, by the fixing semiconductor chip 63A of adhesive layer 62A of insulation, the circuit formation face of semiconductor chip 63A is aimed at 61A with the surface of resin bed.Similar with above-mentioned first embodiment, the thickness of semiconductor chip 63A is preferably 50 μ m.Next, the circuit that organic insulating film (layer) 64A is formed on semiconductor chip forms on the surface of face and resin bed 61A, and then, conductive layer 65A is formed on the organic insulator 64A.Conductive layer 65A forms the outside of the electrode of semiconductor chip 63A being guided to semiconductor chip 63A as rearrangement wiring layer.
Next, resin bed 61B is formed on conductive layer 65A and the resin bed 61A.Resin bed 61B is also by forming with above-mentioned resin bed 14 identical materials, and forms opening similarly.Because the conductive layer 65A on the semiconductor chip 63A exposes in opening, so insulating adhesive layer 62B is formed in the opening.Then, semiconductor chip 63B is arranged in the opening of resin bed 61B.By the fixing semiconductor chip 63B of insulating adhesive layer 62B, semiconductor chip 63B almost is in identical horizontal plane with resin bed 61B.
Next, the circuit that organic insulator 64B is formed on semiconductor chip forms in the surface of face and resin bed 61B, and conductive layer 65B is formed among the organic insulator 64B.Conductive layer 65B forms the outside of the electrode of semiconductor chip 63B being guided to semiconductor chip 63B as rearrangement wiring layer.In addition, through hole can be formed among the resin bed 61B, and when forming conductive layer 65, conductive layer also is formed on through hole interior (forming so-called " vias ") so that conductive layer 65B is electrically connected to conductive layer 65A.
Similar with method above-mentioned, form resin bed 61C and insulating adhesive layer 62C, semiconductor chip 63C is arranged in the opening, and organic insulator 64C and conductive layer 65C are formed on the semiconductor chip 63C, and conductive layer 65C is electrically connected to the predetermined portions of conductive layer 65B.
In addition, after forming resin bed 61D in an identical manner and form insulating adhesive layer 62D in opening, semiconductor chip 63D installs with stacked state.Here, in example shown in Figure 14, semiconductor chip 63A, 63B have identical size with 63C, and semiconductor chip 63D is less than semiconductor chip 63A, 63B and 63C.The preferred 50 μ m or littler of the thickness of each of semiconductor chip 63A-63D.
Organic insulator 64D and conductive layer 65D are formed on the semiconductor chip 63D, form input/output terminal as external connection terminals on conductive layer 65D.Prominent point can be formed on the input/output terminal as soldered ball, and perhaps input/output terminal can be connected to external circuit by closing line.
In the semiconductor device 60 with said structure, semiconductor chip 63A-63D is stacked across organic insulator 64A-64D, conductive layer 65A-65D and insulating adhesive layer 62A-62D.In this structure, needn't between semiconductor chip, form the cylindricality conductive component such as the metal guide pillar, the distance between the semiconductor chip can make very little.Therefore, can easily form stacked N-type semiconductor N device with little thickness.In addition, because the electrode on the semiconductor chip is introduced to the outside of semiconductor chip by conductive layer 65A-65D, and conductive layer is electrically connected by through hole, so semiconductor chip can be stacked on the zone of arranging electrode.Just, having the semiconductor chip of same size can be stacked mutually.
Though in example shown in Figure 14, semiconductor chip 63A, the 63B of same size and 63C and less semiconductor chip 63D are stacked mutually, the quantity of stacked semiconductor chip to be not limited thereto, semiconductor chip that can stacked any amount.In addition, semiconductor chip size is had no particular limits, semiconductor chip can be stacked, and no matter whether they have identical size or different sizes.
Figure 15 shows the profile of semiconductor device 70, is the modification of semiconductor device 60 shown in Figure 14.In Figure 15, part same as shown in Figure 14 has adopted identical Reference numeral, has omitted introduction.Though semiconductor device 70 shown in Figure 15 has and semiconductor device 60 essentially identical structures, substrate 11 can be replaced by semiconductor chip 71.
Just, organic insulating film (layer) 72 is formed on the semiconductor chip 71, and last resin bed 61A is formed on the organic insulating film 72, with stacked semiconductor chip 63A thereon.The size of semiconductor chip 71 is bigger than the size of semiconductor chip 63A, and semiconductor chip 63D is arranged in the electrode arrangement zone of semiconductor chip 71.Then, the electrode that is formed on conductive layer 65A and the semiconductor chip 71 on the semiconductor chip 63A is electrically connected by resin bed 61A and the through hole that extends through organic insulating film 72.
As mentioned above, according to semiconductor device shown in Figure 15 70, can semiconductor chip be installed more to high-density than semiconductor device 60.
Figure 16 shows the profile of semiconductor device 80, is the modification of semiconductor device 60 shown in Figure 14.In Figure 16, though semiconductor device 80 has and semiconductor device 60 essentially identical structures, difference is that semiconductor chip 63B is connected to semiconductor chip 63A with ventricumbent state.According to semiconductor device 80, can omit the one deck in the rearrangement wiring layer, the chip of same size can be installed in addition.
The semiconductor device of third embodiment of the invention is described below in conjunction with Figure 17.Figure 17 is the profile of third embodiment of the invention.The semiconductor device 80 that is shown among Figure 17 is so-called stacked-type semiconductor device, wherein stacked a plurality of semiconductor chips have been installed, wherein, be installed in side by side on the substrate 11 than the semiconductor chip 81A and the 81B of lower floor, the semiconductor chip 82 on upper strata is stacked on semiconductor chip 81A and the 81B.
Just, in this semiconductor device, be similar to semiconductor device shown in Figure 10 10, semiconductor chip 81A and 81B are installed on the substrate 11 by adhesive layer 15, and provide resin bed 14 based on phenol phenolic resins (phenol novolac) around semiconductor chip 81A and 81B.The organic insulating film (organic insulator) 83 that provides on the upper surface of face and resin bed 14 based on phenol phenolic resins (phenol lovolac) is provided at the circuit of semiconductor device 81A and 81B.Form a conductive layer 84 on organic insulating film 83, this conductive layer forms the pattern circuit (pattern wirings) that is connected to semiconductor chip 81A and 81B.
Described semiconductor chip 82 is installed on described conductive layer and the organic insulating film by adhesive layer 85, provides resin bed 86 based on phenol phenolic resins (phenolnovolak) around this semiconductor chip 82.Then, form the organic insulator 87 that provides on the upper surface of face and described resin bed 86 based on phenol phenolic resins at the circuit of semiconductor chip 82, on this organic insulator 87, form a rearrangement wiring layer 17.This rearrangement wiring layer 17 and described conductive layer 84 are electrically connected by the through hole 88 that extends through resin bed 86.In addition, can on the input/output terminal 18 that is formed on the rearrangement wiring layer 17, form soldered ball as shown in Figure 2, to form ball grid array (BGA) N-type semiconductor N device.Although the resin that is based on phenol phenolic resins and the organic insulating film of Shi Yonging the invention is not restricted to use the material based on phenol phenolic resins in the present embodiment, for example also can use material based on epoxy resin or polyimides.
It should be noted that the semiconductor device according to one of above-mentioned first to the 3rd embodiment can be considered as a semiconductor chip to be attached in the package assembling.Figure 18 is the profile that is attached to the semiconductor device 90 that forms in the package assembling by the structure that will be similar to semiconductor device 10 shown in Figure 1.
In Figure 18, the input/output terminal 18 of semiconductor device 110 is arranged in the periphery of the upper surface of semiconductor device 110.This semiconductor device 110 is installed on the substrate 91 by adhesive layer 15, and the input terminal 18 of this semiconductor device 110 and the terminal (not shown) of substrate 91 are electrically connected by bonding wire 92.Semiconductor device 110 and bonding wire 92 are sealed on the substrate 91 by sealing resin 92.Dorsal part at substrate 91 provides soldered ball as external connection terminals.
In above-mentioned first to the 3rd embodiment, the insulating barrier that is formed on the circuit formation face of semiconductor chip is organic insulating film 16,64A-64D, 72,83,87.Use organic insulating film and do not use the benefit of inorganic insulating membrane as follows:
1) the surface planarization easily of organic insulator.
If on circuit formation face, form inorganic insulation layer, because inorganic insulation layer forms with gas-phase deposition method, dielectric film isotropic growth, the existence of pattern circuit and the unevenness that causes just is reflected in the surface of inorganic insulation layer.Therefore, use inorganic insulation layer to be difficult to obtain flat surfaces.On the other hand, because organic insulator does not form by carry out the material growth on circuit formation face, therefore form organic insulator easily with flat surfaces.
2) can reduce the operation number.
The formation of inorganic insulating membrane need be carried out etch process to carry out composition.If use the photosensitive organic dielectric film, utilize photoetching process to carry out composition, then can omit such etch process.
3) organic insulating film has the stress relaxation function.
Because inorganic insulating membrane is fragility normally, if form stacked N-type semiconductor N device with inorganic insulating membrane, can not obtain the stress relaxation effect.On the contrary, organic insulating film generally has to a certain degree flexible, thereby under organic insulating film was clipped in state between the semiconductor chip, organic insulating film provided the effect of stress relaxation.
Describe below height with semiconductor chip be provided with the essentially identical concrete grammar of height around the resin bed of this semiconductor chip.
Introduce the fourth embodiment of the present invention below with reference to Figure 19 A and 19B.
Figure 19 A and 19B show the production process of semiconductor device according to fourth embodiment of the invention.The profile of Figure 19 A has illustrated the intermediateness of manufacture process, wherein is formed with the gap between resin bed and semiconductor element.Figure 19 B shows the profile of having filled the semiconductor device in gap by the described resin bed of fluidisation.
Shown in Figure 19 B, have semiconductor element 102 according to the semiconductor device of third embodiment of the invention and be installed in structure on the substrate 101.Semiconductor element 102 is fixed to substrate 101 by binding agent 103.Resin bed 104 is formed on around the semiconductor element 102.The side of resin bed 104 tight contact semiconductor elements 102 does not form the gap between the two.
Be installed in the state on the substrate 101 having formed resin bed 104 and semiconductor element 102, shown in Figure 19 A, between the side of resin bed 104 and semiconductor element 102, be formed with the gap.In order to fill the gap, in the present embodiment, so-called B stage resin (B-stage resin) is used as the resin that forms resin bed 104.The B stage resin is generally epoxy resin, and the curing of resin can stop in the middle of the process from fluidised resin state to the full solidification state.But the B stage resin is called the resin of semi-solid preparation, solidifies the state stop between during the course and is called semi-cured state.The curing degree of semi-cured state about 50%.
Though the B stage resin is the solid-state of semi-cured state, can deliquescing and demonstrate flowability by heating.That is, the B stage resin has by heating and deliquescing and the mobile characteristic of increase in semi-cured state.In addition, heat with after increasing mobile and further heating in semi-cured state, can full solidification B stage resin by further heating.
In the present embodiment, above-mentioned B stage resin is used as the material that forms resin bed 104.Be formed on the substrate 101 and semiconductor element 102 is installed in the state of substrate 101 (state shown in Figure 19 A) at the resin bed 104 that is in semi-cured state, by heating and fluidisation resin bed 104, resin bed 104 flows in the side 102a and the gap between the resin bed 104 of semiconductor element 102, fill the gap thus, shown in Figure 19 B.Then, by further heating resin bed 104 full solidification resin beds 104.Therefore, the side of resin bed 104 tight contact semiconductor elements 102, the support semiconductor element 102 from the side, and make the fixing more reliable of semiconductor element 102.
Here, shown in Figure 20 A and 20B, after resin bed 104 is installed on the substrate 101, resin bed 104 can form semi-cured state, perhaps resin bed 104 is formed on the substrate 101 with semi-cured state in advance as shown in the figure, by semiconductor element 102 is inserted among the opening 104a semiconductor element 102 is installed on the substrate 101, shown in Figure 21 A and 21B.In addition, can use known printing process that the potting resin layer 104 of semi-cured state is transferred on the substrate 101.
Though by heating the flowability of the resin bed 104 that can increase semi-cured state, resin bed 104 can freely not flow as liquid.Thus, if the width of gap (G) increases greater than the thickness (chip thickness Tc) of semiconductor element 102, even fluidisation resin bed 104, the gap can be by complete filling yet.For the resin bed 104 of fluidisation semi-cured state to eliminate the gap between the semiconductor element 102 fully, as shown in figure 22, the thickness of semiconductor element 102 (chip thickness Tc) is the width of (G) more preferably greater than the gap, i.e. Tc〉G.
For the B stage resin that forms resin bed 104, mobile temperature (softening temperature) occurs in semi-cured state and be preferably 60 ℃ or higher.If this is because softening temperature is lower than 60 ℃, there is the possibility of the temperature current downflow of resin bed 104 during room temperature or manufacturing process so.
Consider to be provided between the substrate with the thickness of the fixing binding agent 103 of semiconductor element 102 and for the height that makes resin bed 104 after the full solidification and the height of semiconductor element 102 are in same horizontal plane basically, the thickness of the resin bed 104 of semi-cured state preferably than the big 5 μ m of thickness of semiconductor element 102 to 20 μ m.
Though the B stage epoxy resin is used as resin bed 104 in above-mentioned embodiment,, also can use for example novolac resin (novolakresin) or phenol resin (phenol resin) etc. if demonstrate identical characteristic.
Introduce semiconductor device below with reference to Figure 23 A to 23D according to fourth embodiment of the invention.Figure 23 A shows profile according to the production process of semiconductor device of fifth embodiment of the invention to 23D.In the semiconductor device according to fifth embodiment of the invention, the upper surface 104b of resin bed 104 and the upper surface 102b of semiconductor element 102 are in same level substantially.
At first, be similar to above-mentioned the 3rd embodiment, the resin bed 104 of semi-cured state is formed on the substrate 101, and semiconductor element 102 is installed on the substrate 101.Here, the through hole 104c that uses in technology subsequently is formed in the resin bed 104 of semi-cured state.Next, shown in Figure 23 A, photosensitive film 105 is coated on resin bed 104 and the semiconductor element 102.In the present embodiment, in order to form through hole 104c in resin bed 104, resin bed 104 does not preferably flow in the part that is formed with through hole 104c.Thus, shown in Figure 23 B, the part exposure of the photosensitive film 105 of covering through hole 104c also is removed.That is, make and do not need fluidised that part of resin bed 104 not covered by photosensitive film 105.
Then, the heating semi-cured state resin bed 104 so that fluidisation, shown in Figure 21 C.Therefore, filled by fluidised resin bed 104, eliminated the gap by the gap that photosensitive film 105 covers.On the other hand, among that part of through hole 104c that is covered by photosensitive film 105, resin bed 104 does not flow hardly, and through hole 104c such as the through hole of connecting conductive layer 65B and 65C as shown in figure 14, is not closed.That is, by can promote the fluidisation of resin bed 104 with band or film covering resin layer 104.
After this, shown in Figure 23 D, resin bed 104 full solidification are removed photosensitive film 105 by peeling off.In this state, very close to each other between semiconductor element 102 and the resin bed 104, the upper surface 102b of semiconductor element 102 is in the identical plane with the upper surface 104b of resin bed 104.In addition, the through hole 104c that forms in the resin bed 104 of semi-cured state remains unchanged.
Should be noted that to have now found that by experiment potting resin layer 104 can not flow in the part that is not covered by photosensitive film 105, the concrete reason of this phenomenon is not clear.Yet this phenomenon can be reproduced fully, can almost realize without any problem ground.
In addition, though used photosensitive film 105 in the above-described embodiments so that,, also can use film or band except that photosensitive film if be not necessary locating to produce opening in the corresponding position of fluidised part (through hole 104c) with the potting resin layer.For example, can be overlying on the resin bed 104 with cutting belt (dicing tape).
Introduce the semiconductor device of the sixth embodiment of the present invention below with reference to Figure 24.Figure 24 is the profile of the semiconductor device of a fourth embodiment in accordance with the invention.
Semiconductor device according to a sixth embodiment of the invention is a multi-chip module, has a plurality of semiconductor elements (two semiconductor element 102A be presented among Figure 24 with 102B).Each semiconductor element 102A and 102B are installed on the substrate 101 by binding agent 103, and circuit forms and faces up simultaneously.
Resin bed 104 be provided at semiconductor element 102A and 102B between and on every side, the upper surface of resin bed 104 is located substantially in the identical plane with the upper surface (circuit formation face) of each semiconductor element 102A and 102B.Resin bed 104 by with above-mentioned the 3rd embodiment in the same material introduced form, and closely contact the side surface of each semiconductor element 102A and 102B.In addition, the circuit that the wiring layer 106 that forms by stacked insulating barrier and conductive layer is formed on semiconductor element 102A and 102B forms on the upper surface of face and resin bed 104, is provided at the upper surface of wiring layer 106 as the soldered ball 107 of external connection terminals.The electrode that is provided on the circuit formation face of each semiconductor element 102A and 102B is electrically connected to corresponding soldered ball 107 by the wiring in the wiring layer 106.Should be noted that and to use known semiconductor fabrication to form wiring layer, omit its introduction here.
The about 50 μ m of the thickness of semiconductor element 102A and 102B, the about 5 μ m of the thickness of binding agent 3 are to about 20 μ m.Therefore, have the thickness of 50 μ m+ (5 to 20) μ m by making resin bed 104, the upper surface of semiconductor element 102A and 102B (circuit formation face) is in the identical plane basically with the upper surface of resin bed 104.Because the thickness of binding agent 103 and the thickness of semiconductor element are irrelevant, therefore the thickness by resin bed 104 is set to (thickness of semiconductor element)+(5 to 20 μ m), and the upper surface of semiconductor element (circuit formation face) can be in the same plane (substantially in same level) basically with the upper surface of resin bed 104.
Should be noted that in above-mentioned embodiment, provide binding agent with the fixing back side of semiconductor element 102A and 102B, and do not apply binding agent on the circuit formation face.Thus, binding agent 103 does not need to have special characteristic, can be by making with resin bed 104 identical materials.In this case, in the fluidisation technology of resin bed 104, binding agent 103 also can fluidisation, and this has further promoted binding agent 103 to contact with the tight of resin bed 104.
Introduce the semiconductor device of the seventh embodiment of the present invention below with reference to Figure 25 A and 25B.According to a seventh embodiment of the invention semiconductor device uses the resin that has with the similar semi-solid preparation characteristic of above-mentioned the 5th embodiment as the binding agent that semiconductor element is fixed on the substrate.
At first, shown in Figure 25 A, form opening 108a in the resin bed 108 on being formed on substrate 101, semiconductor element 102 is arranged in opening 108a.Different with above-mentioned embodiment, resin bed 108 is in the full solidification state.Identical with above-mentioned resin bed 104 materials binding agent 103A is applied to the back side of semiconductor element 102 in advance, and is in semi-cured state.
Next, soldering tip (bonding tool) 110 moves down, and makes binding agent 103A fluidisation by heating simultaneously, shown in Figure 23 B.Under this environment, binding agent 103A is pushed by semiconductor element 102 and flows, and enters between the side 108b of semiconductor element 102 and resin bed 108.Because fluidised resin bed 108 increases with the adhesiveness of substrate 101, so semiconductor element 102 can bond to substrate 101.Then, the position that moves down the lower surface contact pressure resin layer 108 upper surface 108c that stop at soldering tip 110 of soldering tip 110, in this state under 200 ℃ or higher temperature adhesive heating 103A almost completely to solidify (90% or more) binding agent 103A.
According to above-mentioned method, the gap between semiconductor element 102 and the resin bed 108 can be filled by bonded dose of 103A, and the upper surface of the upper surface of semiconductor element 102 and resin bed 108 accurately is arranged in same basically plane.
In addition, because the lower surface of soldering tip 110 is pushed resin bed 108 by the upper surface of contact pressure resin layer 108, can prevent that therefore the contraction when semiconductor element 102 solidifies owing to binding agent 103A is out of shape.In addition, the amount that applies binding agent 103A is the amount that the gap can be filled fully, and the pressing force by semiconductor element 102 fills the gap, so the tight contact substrate 101 of binding agent 103A, prevented the phenomenon of swashing of the insufficient wetting or binding agent of binding agent.
Introduce binding agent 103A be applied to semiconductor element 102 and binding agent be arranged on the technology of semi-cured state shown in Figure 25 A and the 53B below with reference to Figure 26 A to 26C.
At first, shown in Figure 26 A, circuit is formed on the wafer 109, forms a plurality of semiconductor elements on wafer 109.Next, shown in Figure 26 B, what binding agent 103A was applied to wafer 109 forms the opposite back side of face with circuit, being lower than cured binders 103A under 100 ℃ the temperature, so that binding agent is arranged on semi-cured state.By being lower than cured binders 103A under 100 ℃ the temperature, the method for present embodiment also can be applied to the semiconductor element of the LED reverse mounting type of the about 50 μ m of used thickness.Then, shown in Figure 24 C, wafer 109 is separated into the semiconductor element 102 that has binding agent 103A overleaf by individuation (individualize).The semiconductor element 102 that this state supports corresponding to soldering tip shown in Figure 23 A 110.
Even should be noted that it is not the binding agent of semi-cured state, the method for cured binders also is suitable in the upper surface 108c of the lower surface contact pressure resin layer 108 that makes soldering tip 110 as mentioned above.That is, even the binding agent that semiconductor element 102 is fixed to substrate 101 is not the B stage resin, but conventional resin also can obtain the upper surface of semiconductor element 102 and the upper surface 108c of resin bed 108 and accurately be positioned at conplane basically effect.
At first, form opening 108a in the resin bed 108 on being formed on substrate 101, semiconductor element 102 is arranged among the opening 108a.Resin bed 108 is in the full solidification state.Conventional binding agent 103B is applied to the back side of semiconductor element 102 in advance.Next, shown in Figure 27 A, soldering tip 110 moves down, and stops at the position of upper surface 108c of the lower surface contact pressure resin layer 108 of soldering tip 110.In this state, adhesive heating 103B is to make it full solidification.After binding agent 103B solidified, soldering tip 110 separated with the upper surface 108c of resin bed 108, and shown in Figure 25 B, the upper surface 108c of resin bed 108 and the upper surface of semiconductor element 102 accurately are positioned at same basically plane (same basically level).
The invention is not restricted to concrete disclosed embodiment, can make amendment within the scope of the invention and modification.

Claims (17)

1.一种半导体器件的制造方法，特征在于包括以下步骤：1. A method for manufacturing a semiconductor device, characterized in that it comprises the following steps: 在基板上形成半固化状态的树脂层，以便将半导体元件设置到该树脂层中，该树脂层由可半固化树脂制成；forming a resin layer in a semi-cured state on the substrate so that a semiconductor element is disposed in the resin layer, the resin layer being made of a semi-curable resin; 通过加热使半固化状态的所述树脂层流体化；fluidizing the resin layer in a semi-cured state by heating; 通过在所述半导体元件和树脂层之间的间隙中填充流体化的树脂层，消除所述间隙；以及eliminating the gap by filling the gap between the semiconductor element and the resin layer with a fluidized resin layer; and 通过加热完全固化所述树脂层。The resin layer is completely cured by heating. 2.根据权利要求1的半导体器件的制造方法，其中，在将所述半导体元件安装在所述基板上之后，在所述半导体元件周围形成半固化状态的所述树脂层。2. The manufacturing method of a semiconductor device according to claim 1, wherein said resin layer in a semi-cured state is formed around said semiconductor element after said semiconductor element is mounted on said substrate. 3.根据权利要求1的半导体器件的制造方法，其中，在将所述半导体元件安装在所述基板上之前，在所述基板上形成具有用于放置所述半导体元件的开口的半固化状态的所述树脂层。3. The manufacturing method of a semiconductor device according to claim 1, wherein, before mounting the semiconductor element on the substrate, a semi-cured state having an opening for placing the semiconductor element is formed on the substrate. the resin layer. 4.根据权利要求1的半导体器件的制造方法，其中，使用印刷法将半固化状态的所述树脂层转移到所述基板上。4. The method of manufacturing a semiconductor device according to claim 1, wherein said resin layer in a semi-cured state is transferred onto said substrate using a printing method. 5.根据权利要求1的半导体器件的制造方法，其中在所述基板上形成半固化状态的所述树脂层，使所述树脂层的侧面和所述半导体元件的侧面之间的距离小于所述半导体元件的厚度。5. The manufacturing method of a semiconductor device according to claim 1, wherein the resin layer in a semi-cured state is formed on the substrate such that the distance between the side faces of the resin layer and the side faces of the semiconductor element is smaller than the The thickness of the semiconductor element. 6.根据权利要求1的半导体器件的制造方法，其中，在通过加热使半固化状态的所述树脂层流体化之前，在所述树脂层和所述半导体元件上覆盖一层光敏膜。6. The method of manufacturing a semiconductor device according to claim 1, wherein a photosensitive film is covered on said resin layer and said semiconductor element before fluidizing said resin layer in a semi-cured state by heating. 7.根据权利要求6的半导体器件的制造方法，其中，在所述流体化步骤之前，除去所述光敏膜的一部分，该部分对应于所述树脂层的不需要流体化的部分。7. The manufacturing method of a semiconductor device according to claim 6, wherein, before said fluidizing step, a portion of said photosensitive film corresponding to a portion of said resin layer that does not require fluidization is removed. 8.根据权利要求7的半导体器件的制造方法，其中通过将所述光敏膜的所述部分曝光而除去所述光敏膜的该部分。8. The manufacturing method of a semiconductor device according to claim 7, wherein the part of the photosensitive film is removed by exposing the part of the photosensitive film to light. 9.根据权利要求1的半导体器件的制造方法，其中，通过在等于或高于60℃的温度下加热使半固化状态的所述树脂层流体化。9. The method of manufacturing a semiconductor device according to claim 1, wherein said resin layer in a semi-cured state is fluidized by heating at a temperature equal to or higher than 60°C. 10.根据权利要求1的半导体器件的制造方法，其中，形成半固化状态的所述树脂层，使得半固化状态的所述树脂层的厚度大于所述半导体元件的厚度。10. The method of manufacturing a semiconductor device according to claim 1, wherein said resin layer in a semi-cured state is formed such that a thickness of said resin layer in a semi-cured state is greater than that of said semiconductor element. 11.根据权利要求1的半导体器件的制造方法，在完全固化所述树脂层的步骤之后，还包括如下步骤：将厚度为5μm到20μm的粘结剂施加到所述半导体元件上，以通过所述粘结剂将所述半导体元件固定到所述基板上，其中所述半导体元件的背表面露出并且所述粘结剂施加到露出的所述背表面上。11. The manufacturing method of a semiconductor device according to claim 1, after the step of completely curing the resin layer, further comprising the step of: applying an adhesive having a thickness of 5 μm to 20 μm to the semiconductor element to pass through the resin layer The adhesive secures the semiconductor element to the substrate, wherein the back surface of the semiconductor element is exposed and the adhesive is applied to the exposed back surface. 12.根据权利要求11的半导体器件的制造方法，其中，所述可半固化树脂用做所述粘结剂。12. The method of manufacturing a semiconductor device according to claim 11, wherein said semi-curable resin is used as said binder. 13.根据权利要求12的半导体器件的制造方法，其中，通过在等于或低于60℃的温度下加热所述粘结剂，以半固化状态设置所述粘结剂。13. The manufacturing method of a semiconductor device according to claim 12, wherein said adhesive is set in a semi-cured state by heating said adhesive at a temperature equal to or lower than 60°C. 14.根据权利要求1的半导体器件的制造方法，其中所述半导体元件的厚度等于或小于50μm。14. The method of manufacturing a semiconductor device according to claim 1, wherein the thickness of said semiconductor element is equal to or less than 50 [mu]m. 15.一种半导体器件的制造方法，特征在于包括以下步骤：15. A method for manufacturing a semiconductor device, comprising the steps of: 在基板上形成具有开口的树脂层，并制备背表面带有可半固化树脂形成的粘结剂的半导体元件；forming a resin layer with openings on the substrate, and preparing a semiconductor element with an adhesive that can be formed from a semi-curable resin on the back surface; 将所述半导体元件置于所述开口中；placing the semiconductor element in the opening; 通过加热使半固化状态的所述粘结剂流体化，并隔着所述粘结剂将所述半导体元件按压到所述基板上；fluidizing the adhesive in a semi-cured state by heating, and pressing the semiconductor element onto the substrate via the adhesive; 将所述半导体元件保持在使所述半导体元件的上表面与所述树脂层的上表面处于相同平面的位置，同时通过加热固化所述粘结剂。The adhesive is cured by heating while holding the semiconductor element in such a position that the upper surface of the semiconductor element is in the same plane as the upper surface of the resin layer. 16.根据权利要求15的半导体器件的制造方法，其中所述半导体元件的上表面由焊头的下表面附接，所述粘结剂在使焊头的下表面接触所述树脂层上表面的状态下被固化。16. The manufacturing method of a semiconductor device according to claim 15, wherein the upper surface of the semiconductor element is attached by the lower surface of the bonding head, and the adhesive is placed in contact with the lower surface of the bonding head on the upper surface of the resin layer. state is solidified. 17.一种半导体器件的制造方法，特征在于包括以下步骤：17. A method of manufacturing a semiconductor device, comprising the steps of: 在基板上形成具有开口的树脂层，并制备背表面带有粘结剂的半导体元件；forming a resin layer with openings on the substrate, and preparing a semiconductor element with an adhesive on the back surface; 通过用焊头的下表面附接半导体元件的上表面，将所述半导体元件置于所述开口中；以及placing the semiconductor element in the opening by attaching the upper surface of the semiconductor element with the lower surface of the solder tip; and 在所述焊头的下表面接触所述树脂层上表面的状态下，固化所述粘结剂。The adhesive is cured in a state where the lower surface of the horn contacts the upper surface of the resin layer.
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US6313521B1 (en) * 1998-11-04 2001-11-06 Nec Corporation Semiconductor device and method of manufacturing the same
US6348728B1 (en) * 2000-01-28 2002-02-19 Fujitsu Limited Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6313521B1 (en) * 1998-11-04 2001-11-06 Nec Corporation Semiconductor device and method of manufacturing the same
CN1300180A (en) * 1999-11-24 2001-06-20 欧姆龙株式会社 Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly
US6348728B1 (en) * 2000-01-28 2002-02-19 Fujitsu Limited Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer

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