CN100522442C - Soldering method, soldering device, bonding method, bonding device, and nozzle unit - Google Patents
Soldering method, soldering device, bonding method, bonding device, and nozzle unit Download PDFInfo
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- CN100522442C CN100522442C CNB2006100820843A CN200610082084A CN100522442C CN 100522442 C CN100522442 C CN 100522442C CN B2006100820843 A CNB2006100820843 A CN B2006100820843A CN 200610082084 A CN200610082084 A CN 200610082084A CN 100522442 C CN100522442 C CN 100522442C
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- 238000005476 soldering Methods 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims description 126
- 238000005219 brazing Methods 0.000 claims description 58
- 238000012423 maintenance Methods 0.000 claims description 47
- 230000005855 radiation Effects 0.000 claims description 27
- 238000003466 welding Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 15
- 239000012190 activator Substances 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 210000001503 joint Anatomy 0.000 claims 3
- 239000007787 solid Substances 0.000 claims 3
- 230000004308 accommodation Effects 0.000 description 44
- 239000007789 gas Substances 0.000 description 36
- 239000007921 spray Substances 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000005086 pumping Methods 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 5
- 239000000155 melt Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.
Description
Technical field
The present invention relates to a kind of fastener that utilizes and join first element on second element joint method and junction apparatus.
Background technology
In magnetic head producing process, utilize brazed ball to realize joint between head slider electrode and the bool electrode by soldering.More specifically, with of the angular spacing settings of two electrodes, and brazed ball is placed between these two electrodes with 90 degree.Make the brazed ball fusing by heat radiation or other similar method, to be implemented in the electrical connection between these two electrodes.Next, will a kind of brazed ball brazing equipment of routine be described with reference to the accompanying drawings.
Fig. 9 shows is a kind ofly to be used to utilize conventional brazing equipment 300 to carry out the part sectioned view of the suction nozzle with battery unit of soldering.In Fig. 9, Reference numeral 309 expressions one are the slider of parallelepiped substantially, Reference numeral 311 expressions one bool.Slider electrode 313 is arranged on an end of slider 309.This slider 309 is connected on the bool 311 of plate-shaped, and the bool electrode 315 of bool 311 extends into the angle with 313 one-tenth about 90 degree of slider electrode.The following describes the brazing equipment that is used for this workpiece of soldering.
Described brazing equipment has and is used for brazed ball 307 is transferred to taper suction nozzle with battery unit 301 on the electrode to be brazed from soldering holder (not shown).Suction nozzle with battery unit 301 is connected to the suction source (not shown), and the suction force that comes from this suction source is applied on the brazed ball 307 by nozzle interior space 305 and suction hole 303, and brazed ball 307 is maintained at the front end of suction nozzle with battery unit 301 by suction force.Brazed ball 307 by suction nozzle with battery unit 301 absorption is maintained at a position, contacts with slider electrode 313 and bool electrode 315 at this position brazed ball 307, and under this state, makes brazed ball 307 fusings by (not shown) such as laser beams.Brazed ball fix in position between slider electrode and bool electrode of fusing is to be implemented in the electrical connection between these two electrodes.
In recent years, along with reducing of area of bed, their electrode is also reducing gradually.In the brazing equipment 300 of above-mentioned explanation, the leading section that need under the situation that is adsorbed with brazed ball 307, make suction nozzle with battery unit 301 reliably and with a kind of stable manner near described electrode.Yet, along with electrode and around the reducing of component size, do not take place under the situation of unnecessary contact with electrode and peripheral element thereof at the leading section of suction nozzle with battery unit 301 etc., will become more and more difficult to the maintenance of brazed ball 307.Under the circumstances, another kind of brazing equipment has been proposed.Below, will be described this another kind brazing equipment.
Figure 10 is the part sectioned view of another kind of brazing equipment.In this brazing equipment 400, solid-state brazed ball 407 is ejected in the substrate (substrate) then by heat fused, to realize soldering.
The nozzle assembly 401 that brazing equipment 400 has by the nozzle 402 that is used to spray brazed ball 407 and is used to keep the nozzle body 413 of nozzle 402 to form, be used to store the holder 415 of a plurality of brazed balls 407, and the laser aid 417 that is used to melt brazed ball 407.Nozzle 402 forms taper gradually towards end.Be provided with accommodation section 405 and opening 403 in these nozzle 402 inside.Accommodation section 405 is positioned near the external diameter of the internal diameter of the part the opening 403 less than brazed ball 407.The internal diameter of the remainder of the accommodation section 405 of nozzle is greater than the external diameter of brazed ball 407.Therefore, the solid-state brazed ball 407 that is directed in the accommodation section 405 of nozzle 402 is maintained at 405 inner positions near openings 403, accommodation section.
Be introduced in the accommodation section 405 of nozzle 402 from the laser beam of laser aid 417 laser aiming path 419, and be applied near the brazed ball 407 that remains on the opening 403, with fusing brazed ball 407 by nozzle body part 413.Then, be fed in the accommodation section 405, thereby eject the brazed ball 407 of fusing from compressed gas source (not shown) Compressed Gas.
In brazing equipment 400, brazed ball 407 is in the fusing of the inside of the accommodation section 405 of nozzle 402, and therefore part or all of the brazed ball 407 of fusing may stick on the outer wall surface of the inwall of accommodation section 405 and the accommodation section 405 around the opening 403.When for example brazed ball 407 sticks to the inner wall surface of accommodation section 405, between the next inner wall surface that is incorporated into brazed ball 407 in the accommodation section 405 and accommodation section 405, can produce the gap, and compressed gas is known from experience by this clearance leakage, thereby in the accommodation section, can't keep suitable interior pressure, and the injection of the brazed ball of fusing possibly can't realize fully also.
In addition, when spraying fusing brazed ball 407, brazed ball 407 is adhered to the surface tension traction of solder of the fusing of inner wall surface, thereby the fusing brazed ball may spray along departing from predetermined direction.In addition, because the solder that adheres to, the opening 403 of nozzle 402 may block.
In order to eliminate the problems referred to above, need to replace contaminated nozzle, or remove the solder that sticks on nozzle 402 inner wall surface and the outer wall surface.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of junction apparatus and joint method, the fastener that neither can make fusing by this junction apparatus and joint method is solder stopped nozzles inside for example, also can not make the fastener of fusing stick to the opening periphery, thereby can spray fastener reliably.Another object of the present invention provides a kind of junction apparatus, a kind of joint method, and a kind of nozzle unit, this junction apparatus, joint method and nozzle unit can engage and do not need to make joint object that spray nozzle front end part and fastener will adhere to for example electrode contact.
An aspect of of the present present invention relates to a kind of nozzle unit that is used for junction apparatus, provide the joint of realizing by the fastener of heat fused between first element and second element by the bonding station that will be engaged with each other at first element and second element in this junction apparatus, nozzle unit comprises: the column nozzle assembly with the spatial accommodation that holds fastener; Allow to make the fastener that is contained in the spatial accommodation to be ejected into the opening of bonding station, the diameter of this opening is greater than the diameter of fastener, and communicates with spatial accommodation; And the maintenance/release member that is used for keeping releasedly the fastener in the spatial accommodation.
In specification, a kind of relation is set up in being meant synchronously between the opportunity of opportunity of carrying out release steps and execution heating steps of release steps (utilizing maintenance/releasing device to discharge) and heating steps (utilizing heater to heat).More specifically, being meant synchronously after the position relation that the solder and the maintenance/releasing device of fusing can not be interfered is each other determined of release steps and heating steps carried out heating steps and begun to melt solder.Therefore, needn't discharge simultaneously and radiation, and which carries out unimportant earlier in two.
In specification, term is meant the relation aspect the opportunity of setting up synchronously between release and radiation, do not need both to carry out simultaneously.
In addition, in explanation, the term fastener is meant that for example solder, gold or alloy constitute and can be with element to be joined element connected to one another by metal material.
Above-mentioned first and second elements comprise electronic component, substrate etc., and are meant the element that can link together by brazing member.
Description of drawings
Figure 1A is the part sectioned view according to the brazing equipment of the embodiment of the invention 1, and wherein the baffle plate of brazing equipment is in the closed position;
Figure 1B is the part sectioned view according to the brazing equipment of the embodiment of the invention 1, and wherein the baffle plate of brazing equipment is shown in an open position;
Fig. 2 is a soldering step chart;
Fig. 3 is the part sectioned view according to the nozzle that aspirating mechanism is housed of the embodiment of the invention 2;
Fig. 4 is the part sectioned view according to the brazing equipment of the embodiment of the invention 3;
Fig. 5 is the front view that the opening/closing part of solenoid type actuator is housed;
Fig. 6 is the profile of nozzle assembly, and the opening/closing that piezo-activator is housed partly is installed in this nozzle assembly;
Fig. 7 is to use the front view of the opening/closing part of another kind of piezo-activator;
Fig. 8 is the front view of shaft type opening/closing part;
Fig. 9 is the part sectioned view of first brazing equipment of routine; And
Figure 10 is the part sectioned view of another kind of brazing equipment.
The specific embodiment
Utilize the irradiated with thermal radiation solder aloft, and make the solder of fusing arrive electrode.Like this, even melt carry out insufficient owing to local melting makes, solder also can adhere on the electrode and rest on the precalculated position.Even utilize heat radiation that the solder of local melting is carried out the irradiation of very short time in addition then, thereby can make the joint between the electrode have enough intensity.
More preferably, be held/solder supply solder that releasing device keeps, and utilize release that holding device carries out and the irradiation that utilizes heat radiation to carry out to carry out synchronously, thereby utilize heat radiation to shine being in aerial solder by release.
The embodiment of brazing equipment of the present invention and method for welding is described below with reference to accompanying drawings.
(embodiment 1)
Figure 1A and 1B are the part sectioned views of brazing equipment according to an embodiment of the invention; Baffle plate at equipment described in Figure 1A is in the closed position, and baffle plate is shown in an open position in Figure 1B.In the equipment of the embodiment shown in Figure 1A and the 1B, substantially be to realize electrical connection between the head slider 109 of rectangle and the plate-shaped bool 111, it is that brazed ball 107 is connected on the bool 111 that described slider 109 will utilize solder.
The structure of slider to be brazed 109 and bool 111 at first is described.The slider electrode 113 that is formed by metallic plate is set on the surface of 109 1 ends of slider.The bool electrode 115 that is formed by metallic plate is set on bool 111, and slider electrode 113 and bool electrode 115 form corner part 114 with the angle of about 90 degree.Make the brazed ball 107a of fusing stick near the corner part 114 position, thereby slider electrode 109 and bool electrode 115 are electrically connected to each other (Figure 1B).
When carrying out soldering, importantly solder should not only stick on the slider electrode 113 but also stick on the bool electrode 115.Therefore, stick to reliably on slider electrode 113 and the bool electrode 115, bool 111 is tilted with respect to horizontal direction, thereby corner part 114 is used v-depression as locating in order to make solder.In this arrangement, even the position deviation precalculated position that solder falls also can be directed to corner part 114 with brazed ball by the surface of slider electrode 113 and bool electrode 115.Therefore, the brazed ball of fusing is in place in self aligned mode.
Maintenance/the releasing device of present embodiment is made up of nozzle assembly 101 and opening/closing part 122.Nozzle assembly 101 is equipped with the nozzle 102 that is used to spray brazed ball 107 and is connected thereon nozzle body 104 with this nozzle.The opening/closing part 122 of forming maintenances/releasing device is opened and closed the baffle plate 123 of the opening 106 of nozzle 102 and forms with the drive part 125 that is used to drive this baffle plate 123 by being used to of hereinafter will describing.
The nozzle 102 of nozzle assembly 101 is equipped with the accommodation section 105 that is used for holding therein brazed ball 107, and this nozzle 102 is the cylindrical member at its longitudinal end opening.One of nozzle 102 is vertically held and is connected to nozzle body 104, and its other end is formed for brazed ball 107 is ejected into the opening 106 of nozzle outside.The diameter of the inwall of nozzle 102 accommodation sections 105 greater than the external diameter of brazed ball 107, therefore allows brazed ball 107 freely to roll in nozzle 102 at least.The diameter of opening 106 is slightly greater than the diameter of brazed ball 107, and opening 106 also has the effect that brazed ball 107 is positioned with respect to horizontal direction (directions X of Figure 1A and 1B and Y direction (perpendicular to the direction on the plane of Figure 1A and 1B)).Therefore, when nozzle 102 is realized the location, also the brazed ball in the nozzle opening 106 has been realized the location.
This nozzle body 104 has laser aiming path 119, and this laser aiming path is extended and is used to guide laser beam along vertical substantially (gravity) direction (vertical direction shown in Figure 1A and 1B).Laser beam transport part 127 sealings that the upper end in laser aiming path 119 is made by the glass material by transmitting laser beam that connects thereon.The bottom in laser aiming path 119 links to each other with an end of nozzle 102, and wherein laser aiming path 119 and accommodation section 105 communicate with each other.In this embodiment, the central axis of laser aiming path 119, nozzle accommodation section 105 and opening 106 is positioned on the straight line.
In addition, nozzle body 104 has the brazed ball path of navigation 121 that is used for brazed ball 107 is directed to from following holder part 128 accommodation section 105 of nozzle 102.One end of brazed ball path of navigation 121 is connected to the solder of holder part 128 and supplies with port 129, and its other end is connected to the laser aiming path 119 of nozzle body 104.Therefore, holder part 128 and laser aiming path 119 are connected to each other by brazed ball path of navigation 121.The internal diameter of brazed ball path of navigation 121 is greater than the external diameter of brazed ball 107, thereby permission brazed ball 107 rolls therein.
In addition, above the laser beam hop 127 of nozzle assembly 101 heating member is installed, promptly laser aid 117, to be used for by heat radiation being applied on the brazed ball 107 and melt brazed ball 107 by means of heating.Laser aid 117 is known devices.The optical axis of the laser beam that sends from laser aid 117 and the central axis of laser aiming path 119, nozzle accommodation section 105 and opening 106 are located along the same line.Therefore, laser beam hop 127 is passed through in the laser beam transmission, and enters in the laser aiming path 119 of nozzle body 104.In addition, laser beam passes through the accommodation section 105 of nozzle 102, and is transferred to the outside of nozzle assembly 101 by opening 106.
Opening/closing part 122 is arranged on the vertical lower of the opening 106 of nozzle 102.The baffle plate 123 of opening/closing part 122 moves between closed position and open position by drive part 125, described closed position be positioned at opening 106 under and close opening 106 (shown in Figure 1A) in place, this closed position opening/closing part 122, described open position is in the right side of the directions X of position under the opening 106, and opens opening 106 in this open position opening/closing part 122.When baffle plate 123 was in the closed position, the brazed ball 107 of introducing accommodation section 105 was kept by the inner wall surface of nozzle 102 and the upper surface of baffle plate 123.When baffle plate 123 moved to the right side of directions X by drive part 125, the opening 106 of nozzle 102 was opened, and brazed ball 107 falls (along the direction of arrow Y Figure 1B) from nozzle 102.Nozzle 102 is positioned at the position that the precalculated position perpendicular separation on the corner part 114 that will adhere to brazed ball 107 is opened preset distance, and therefore d/d brazed ball falls towards the precalculated position by self gravitation.
In addition, the brazing equipment 100 of this embodiment is equipped with the control section 135 as control device.This control section 135 is exported the driving command signal of the drive part 125 of the baffle plate 123 that is used for opening/closing part 122, and output is used for the radiation command signal of driving laser device 117, and this control section can to make beginning drive opportunity of baffle plate 123 towards open position synchronous with the opportunity that laser aid 117 begins the lase radiation.
In addition, brazing equipment 100 is connected to the holder part 128 that is used to store brazed ball 107.The solder of holder 128 parts is supplied with the end that port 129 is connected to the brazed ball path of navigation 121 of nozzle body 104 in the brazing equipment 100.Therefore, the solder that leaves holder part 128 brazed ball 107 of supplying with port 129 is directed in laser aiming path 119 and the nozzle accommodation section 105 by brazed ball path of navigation 121.
Utilize the step according to the method for welding of the embodiment of the invention of the brazing equipment 100 of above-mentioned structure below with reference to Figure 1A, 1B and Fig. 2 explanation.
At first, use travel mechanism's (not shown) moving nozzle 102, being located a position, this position from the brazed ball 107a of fusing with the preset distance (step S1) at interval vertically upward of the precalculated position on the bool electrode that adheres to.As travel mechanism, for example, can be known can be along the mobile mechanism of three axis directions (X-axis, Y-axis, Z axle).The position cameras that utilization is made of for example CCD camera and being used to is checked the monitor of the image of position cameras (shootings), judges by the object of shooting nozzle and soldering whether nozzle has been positioned at the precalculated position.
Then, brazed ball 107 is directed to (step S2) the accommodation section 105 from holder part 128 via solder path of navigation 121 and laser aiming path 119.At this moment, opening/closing part 122 is in closed condition, and the opening 106 of nozzle 102 is closed by baffle plate 123.105 the inside in the accommodation section, brazed ball 107 are positioned near the upper surface of the baffle plate 123 the opening 106, thereby finish the maintenance step, and wherein solid-state solder is maintained at the position (step 3) of the vertical and spaced apart preset distance that makes progress in the position that will adhere to solder.
In release steps subsequently, make baffle plate 123 move to the right side along directions X, discharging maintenance, and make brazed ball drop on precalculated position (step S4) on the bool electrode 115 that is positioned at its vertical lower from opening 106 to brazed ball 107.
Synchronously carry out heating steps with above-mentioned release steps, wherein the laser beam that utilizes laser aid 117 to send of the brazed ball 107 by opening 106 is melted (step S5) by heating.This laser beam is by laser beam hop 127, laser aiming path 119, accommodation section 105 and opening 106, so that aloft heat and melt brazed ball 107.
Aloft Rong Hua brazed ball 107a adheres to the corner part 114 (step S6) that is limited by bool electrode 115 and slider electrode 113, thereby finishes soldering.
In the above-mentioned method for welding, aloft-that is to say the time-utilizations heating realizes the fusing of brazed ball 107, thereby can prevent to be heated and the brazed ball that melts adheres on the inwall or opening 106 nozzle segment on every side of nozzle from nozzle 102 ejection brazed balls.
(embodiment 2)
Although in the foregoing description 1, adopted opening/closing part 122, also can realize maintenance and release to brazed ball by adopting aspirator.Below, with the embodiment 2 of explanation employing aspirator.
Fig. 3 one has the profile of a part of the brazing equipment of aspirator.Except member shown in Figure 3, those members of the brazing equipment among (other) member of the brazing equipment of present embodiment and Fig. 1 are identical, because of member total among these embodiment is not shown among Fig. 3.Nozzle 152 has SS 187 near opening 156.These SS 187 horizontal-extendings pass the wall (as shown in Figure 3) of nozzle 152, and and accommodation section 155 connections.In addition, an end of suction tube 174 is connected to SS 187.Aspirator, that is, the aspirator 175 that produces suction force is communicated to the other end of suction tube 174, and suction force imposes on SS 187 by suction tube 174.In addition, aspirator 175 is connected to control section 185.These control section 185 outputs are used to drive and stop the driving command signal and the stop instruction signal of aspirator 175, and the driving command signal that is used for driving laser device (not shown), this control section can also make the opportunity that stops to apply suction force synchronous with the opportunity of the laser emission that stops laser aid.
In the brazing equipment of above-mentioned structure, at first drive aspirator 175, to apply suction force to SS 187.Brazing equipment is positioned (referring to the step S1 of Fig. 2), and brazed ball 157 is supplied in the nozzle accommodation section 155 of brazing equipment (referring to the step S2 of Fig. 2).By the suction force that aspirator 175 applies, brazed ball 157 is held and closes SS 187 (referring to the step S3 of Fig. 2).When receiving the stop instruction signal that comes from control section 185, aspirator 175 stops to apply suction force, and brazed ball 157 is released (referring to the step S4 of Fig. 2).Brazed ball 157 relies on deadweight to fall.By using laser beam to by opening 156 and be in aerial brazed ball 157 and heat (referring to the step S5 of Fig. 2).The brazed ball of fusing sticks to the corner part (shown in the Reference numeral among Figure 1A and the 1B 114) of soldering object, thereby finishes soldering (referring to the step S6 of Fig. 2).
In the foregoing description 1 and 2, whole brazed ball is melted after by opening and before arriving the corner part that is limited by bool electrode and slider electrode, but this should restrictively not understand.For example, brazed ball also can local melting.Also can only melt brazed ball with the contacted a part of solder of soldering object, after brazed ball stops at the precalculated position, continue laser emission again, thereby melt whole brazed ball, to carry out soldering.
In the described brazing equipment 400 of reference Figure 10, therein in the method that brazed ball 407 melted in accommodation section 405 before spraying, when setting the force value of spraying brazed ball 407 used Compressed Gas, need to consider the viscosity of fusing solder (brazed ball of fusing).For example, when the force value of Compressed Gas during less than predetermined value, because the viscosity of fusing solder, solder may plug nozzle.
On the contrary, when the force value of Compressed Gas during, can eliminate the influence of viscosity greater than predetermined value.On the other hand, the solder of fusing may aloft disperse or spread out on the surface of soldering thing or splash.In the present invention, solid-state solder falls by deadweight, and does not use any Compressed Gas, thereby can prevent the problems referred to above that the solder by fusing causes.
From preventing the viewpoint of solder oxidation, can in the embodiments of the invention of above-mentioned explanation, add the known gas supply source that is used to supply with Compressed Gas, and in accommodation section 105, supply with for example nitrogen of inert gas (Compressed Gas), thereby apply Compressed Gas to spray solder to solder.Therefore and in described structure, the solder that sprays from nozzle is solid-state, the force value of Compressed Gas can be arranged to be suitable for sticking to suprabasil value, and need not to consider the viscosity etc. of the solder that melts.Therefore, can not go wrong aspect the solder adhesion.
(embodiment 3)
Below, with the brazing equipment of explanation, wherein apply Compressed Gas to spray solder to solder according to the embodiment of the invention 3.Fig. 4 is the part sectioned view according to the brazing equipment of the embodiment of the invention 3.
Setting is soldering slider 1151 and bool 1155 together each other, and making slider electrode 1153 and bool electrode 1157 be is the elevation angle of 90 degree substantially.Be provided with at least four slider electrodes and four bool electrodes.The interim location of realizing slider 1151 and bool 1155 by cement or clamp mechanism, and slider electrode 1151 and bool 1155 constitute grooves 1159 with the elevations angle that are approximately 90 degree.Soldering nozzle 1102 is positioned the center that makes this nozzle on width (perpendicular to the direction on the plane of Fig. 4), correspond essentially to groove 1159; Injected and the fusing of brazed ball 1131 is to realize electrically connecting between the electrode.Different with the embodiment of the invention 1 and 2 is, present embodiment adopts a kind of like this layout, and wherein slider 1151 bool that will connect is essentially horizontally extended.
Basic for the solder supply unit 1101 of column is the member that is detachably connected to nozzle assembly 1103, and it also is used as the lid of nozzle assembly 1103.Solder supply unit 1101 has the heat radiation path, and the laser beam that is used to melt solder can pass through this heat radiation path.The heat radiation path is made up of laser aiming path 1119 and laser beam hop 1127.Is extending between the upper surface 1101a horizontal respect to one another of solder supply unit 1101 and lower surface 1101b in laser aiming path 1119.Opening in the upper surface 1101a in laser aiming path 1119 side is sealed by laser beam hop 1127, and this laser beam hop 1127 is made by the glass material that can transmit laser beam, and this opening is specifically designed to the transmission laser beam.The lower surface 1101b side in laser aiming path 1119 is opened.When solder supply part 1101 was connected to nozzle assembly 1103, laser aiming path 1119 was communicated with the inner space 1109 of following nozzle body 1105.Like this, though in embodiments of the invention 1 and 2, laser aiming path and brazed ball path of navigation branch are arranged, and in embodiments of the invention 3, a single path of navigation is used as laser aiming path and brazed ball path of navigation.
In addition, the radial outside of solder supply part 1101 in laser aiming path 1119 has the aspiration path 1129 of extending between surperficial 1101a and the lower surface 1101b thereon.Aspiration path 1129 is connected to pumping unit 1133 in the end that it is positioned at upper surface 1101a side.The end of the lower surface 1101b side of aspiration path 1129 is connected to the single dimple 1131 under shed.Dimple 1131 is that its inside is the column dimple of hollow.The slightly larger in diameter of the internal perisporium of dimple 1131 is in the external diameter of solder wall 1107.The diameter of aspiration path 1129 that is connected to dimple 1131 is less than the diameter of the internal perisporium of dimple 1131.Therefore, when from pumping unit 1133 when aspiration path 1129 applies suction force, suction force imposes on brazed ball 1107 by dimple 1131, and a brazed ball is received and remains on 1131 li of dimples.A plurality of aspiration path 1129 and dimple 1131 also can be provided.
The end of the upper surface 1101a side of aspiration path 1129 is also connected to and is used to provide the gas supply part of Compressed Gas to divide 1135.Be that aspiration path 1129 is also as the gas feed lines.Be used for and divide gas supply route that 1135 Compressed Gas that provide impose on solder to form from gas supply part by aspiration path 1129, dimple 1131 and the inner space 1109 that will be described below and accommodation section 1113.Compressed Gas imposes on brazed ball by gas supply route, and brazed ball is ejected.For Compressed Gas, can use inert gas, for example nitrogen.
In addition, wherein laser route is also passed as laser beam in the inner space 1109 of nozzle body 1105.
The diameter of the diameter of the inwall of accommodation section 1113 and opening 1115 is at least greater than the external diameter of brazed ball 1107, thereby brazed ball 1107 can move freely in nozzle 1102.
In addition, the brazing equipment 1100 of the embodiment of the invention 3 is equipped with: be used for solid-state brazed ball 1107 is remained on releasedly the maintenance/releasing device of a position, this position and solder will securely be connected the predetermined at interval distance in soldering position (corner part 1159) on bool electrode 1157 and the slider electrode 1153; Heater promptly is used for applying heat radiation with the laser aid 1117 by heat fused brazed ball 1107 to brazed ball 1107; And control device, promptly be used to make maintenance/releasing device to discharge opportunity that keeps (action) and the synchronous control section 1235 on opportunity that heater heats.
Maintenance/releasing device is made of said nozzle assembly 1103 and opening/closing part 1222.Opening/closing part 1222 is by the baffle plate 1223 of the opening 1115 that is used to open and close nozzle 1102 and be used for the drive part 1225 that (along directions X) drive baffle plate 1223 and constitute.
In addition, the inside of nozzle 1102 accommodation sections 1113 also constitutes the laser path that laser beam passes through.In embodiments of the invention 3, member is arranged such that solder supplies with the central axis separately of the accommodation section 1113 of the inner space 1109 of the laser aiming path 1119 of part 1101, nozzle body 1105, nozzle 1102 and opening 1115 on same straight line.Therefore, the laser beam by laser aiming path 1119 enters inner space 1109, and passes the accommodation section 1113 of nozzle 1102 before being applied to brazed ball 1107.
In addition, when solder supply part was connected to nozzle assembly, except opening 1115, laser aiming path 1119, inner space 1109 and accommodation section 1113 all were in sealing state.
In above-mentioned brazing equipment, carry the step of brazed ball 1107 as follows.Drive pumping unit 1133 brazed ball 1107 is remained in the dimple 1131 by suction.Keep the solder of brazed ball 1107 to supply with part 1101 by suction, and solder supply part 1101 is connected to nozzle assembly 1103 along mobile on the directions X.This state as shown in Figure 4.Next, cancel the suction force that is applied to brazed ball 1107 from pumping unit 1133.Then, gas supply part divides 1135 operations, applying Compressed Gas to brazed ball 1107, and brazed ball 1107 is directed to inner space 1109.Brazed ball 1107 by inner space 1109 and nozzle 1102 accommodation section 1113 and arrive near the opening 1115 part, keep to utilize baffle plate 1223 and nozzle 1102.
It is as follows to use the solder of above-mentioned structure to supply with the operation of brazing equipment of part 1101.
After the transmitting step of brazed ball 1107 is finished, the brazing equipment 1100 that brazed ball 1107 is housed is positioned.Mobile brazing equipment, make nozzle opening 1115 be positioned at such position, promptly this position is along being the direction of inclined angle alpha with the approximate centre location interval of groove 1159 widths is opened preset distance with respect to horizontal direction H, and described groove is formed by slider electrode 1153 and the bool electrode 1157 that the brazed ball 1107 that melts will adhere to.As travel mechanism, using for example can be along three axial (X-axis, Y-axis, Z axle) mobile known mechanism.
To cancel from the suction force that pumping unit 1133 is applied on the brazed ball 1107, and meanwhile, apply to brazed ball 1107 by aspiration path 1129 and to divide 1135 Compressed Gas from gas supply part.The brazed ball 1107 that is kept by dimple 1131 moves along the direction of opening 1115, and is positioned on the baffle plate 1223, thereby closes opening 1115.
Then, when the drive part 1225 of baffle plate 1223 was driven, baffle plate 1223 moved to open opening 1115.After opening opening 1115, carry out laser emission with fusing brazed ball 1107.Applying of Compressed Gas can and be carried out before opening baffle plate proper time afterwards.That is, before opening baffle plate, by applying Compressed Gas to brazed ball and brazed ball being positioned on the baffle plate.After opening baffle plate, utilize Compressed Gas brazed ball to be ejected into the outside of nozzle 1102 from opening 1115.
The laser beam that sends from laser aid 1117 passes Laser Transmission part 1127, laser aiming path 1119 and inner space 1109, is applied on the solid-state brazed ball that ejects from opening 1115 then and makes the fusing of this brazed ball.
The brazed ball 1107 of fusing adheres to predetermined portions (concave part 1159), thereby finishes soldering.
Being equipped with above-mentioned solder to supply with in the brazing equipment of part, brazed ball can be remained in the airtight space, therefore can be reliably and easily be predetermined value with the design of pressure of the Compressed Gas that is used to spray, thereby can spray brazed ball reliably.
In addition, the direction of the brazed ball that no matter ejects from brazing equipment how, can make brazed ball arrive given soldering position.
(structure of opening/closing part)
Explanation can be applicable to the concrete example of the opening/closing part-structure in the embodiment of the invention 1 to 3 below with reference to accompanying drawings.
(topology example 1)
Opening/closing according to topology example 1 partly is to utilize the direct type of action of solenoid type actuator as drive source.Fig. 5 is the front view in the opening/closing part of the solenoid type that the is equipped with actuator that is in the opening closed condition.Opening/closing part 2122 according to topology example 1 has: the baffle plate 2123 that is used for the opening 2116 of shut-off nozzle 2102; Drive part is promptly by realizing opening and closing the solenoid type actuator 2125 of opening along directions X moving stop 2123; Be used to keep the opening/closing main body 2201 partly of baffle plate 2123 and solenoid type actuator 2125; Be used to make the reciprocating guider 2226 of baffle plate 2123 along continuous straight runs; And the arm spare 2203 that supports and be used to keep guider 2226 by the main body 2201 of opening/closing part.
In addition, be provided with the bar 2205 that is connected to the movable core in the solenoid type driver.
In addition, an end of arm spare 2203 is fixed to the main body 2201 of opening/closing part.The other end of arm spare 2203 is connected to an end and the baffle plate 2123 of the bar 2205 of actuator 2125 by guider.Therefore, when bar 2205 (along directions X) moved back and forth, baffle plate 2123 also moved back and forth along X-direction by guider 2226.
When receiving the driving signal of control section, the opening/closing part 2122 with said structure moves (right side to Fig. 5) opening opening 2116 along directions X, or is moved to the left to close opening 2116.
(topology example 2)
Opening/closing according to topology example 2 partly is a pivot type opening/closing part of utilizing piezo-activator.Fig. 6 is to use the profile of the nozzle assembly of the opening/closing part that piezo-activator is installed.In state shown in Figure 6, opening 3115 is closed by opening/closing part 3222.Nozzle assembly 3103 has and the identical structure of nozzle assembly 1103 among Fig. 4 substantially, and therefore the difference between them only is described.
The drive part that constitutes the baffle plate 3223 of opening/closing part 3222 and be used to drive this baffle plate 3223 is the periphery that piezo-activator 3225 is connected to nozzle body 3105.
The fixed block 3237 that baffle plate 3223 is fixed to nozzle 3107 is by constituting with the peripheral consistent cylinder hole portion of nozzle 3107 and the breach fastening part of fixing by screw or analog.The pin 3237b that its external diameter is slightly less than baffle plate 3223 opening 3223c diameters stretches out from piece spare 3237a, and baffle plate 3223 can rotate around it pin 3237b as axle.Baffle plate 3223 is connected to piece spare 3237a by the effect of pin 3237b.
In addition, drive part is that an end of piezo-activator 3225 is connected to baffle plate 3223.Actuator 3225 is usually said bend actuators, and wherein piezoelectric element 3233 and 3235 is connected to the either side of plate-shape metal thin slice 3231.The effect of second fixed block 3239 of the other end of actuator by being fixed on nozzle body 3105 tops is fixed to nozzle body 3105.
When actuator was in normal position (state shown in Figure 6), baffle plate 3233 was closed opening 3115.In order to open opening 3115, apply voltage to piezoelectric element 3233 and 3235, so that piezoelectric element 3233 shrinks (as shown by arrow D) and another piezoelectric element 3235 is expanded (as shown by arrow E), thereby make actuator 3225 towards nozzle body 3105 bendings (shown in arrow Y).The baffle plate 3233 that is connected to actuator 3225 rotates (shown in arrow Z) around pin 3223c, to open opening 3107.
(topology example 3)
Partly be to use the pivot type opening/closing part of another kind of piezo-activator according to the opening/closing of topology example 3.Fig. 7 is the front view of this opening/closing part.In state shown in Figure 7, opening 4107 is closed by baffle plate 4223.In Fig. 7, only be shown in broken lines the nozzle 4107 of nozzle assembly.Because the nozzle assembly here has identical structure with the nozzle assembly among Fig. 4, therefore omit explanation to it.
Opening/closing part 4222 has baffle plate 4223 and piezo-activator 4225, and this piezo-activator 4225 is the drive parts that are used to drive baffle plate 4223.It is L shaped configuration that baffle plate 4223 has basic, and has the standing part 4223b that is used to close the flat part 4223a of opening 4107 and is connected to following leaf spring 4229.
In said structure, when voltage is applied on the piezoelectric element, piezoelectric element expands, and extension 4231 pushes the sweep 4229a of leaf spring left as shown in Figure 7, thereby the sweep 4229a of leaf spring tilts counterclockwise (deflection), and the baffle plate 4223 that is connected to the leaf spring sweep as shown in Figure 7 turns right, thereby opens opening 4107.Do not having voltage to be applied to the state of piezoelectric element, piezoelectric element returns to normally (contraction) state, and opening 4107 is closed.
(topology example 4)
Opening/closing according to topology example 4 partly is the rotary type opening/closing part that wherein realizes opening/closing by the revolution baffle plate.Fig. 8 is the front view of opening/closing part.Nozzle assembly 5103 has the structure identical with nozzle assembly shown in Figure 4 1103 substantially, thereby will omit the explanation to it.
The opening 5115 of one end shut-off nozzle 5102 of baffle plate 5223, the other end of baffle plate 5223 is by axle 5225 supportings.Axle 5225 is connected to rotary driving part and divides (not shown), and axle 5225 utilizes the direction rotation (pivot) of rotary driving part branch along arrow R.In the opening/closing part of said structure, the opening 5115 of nozzle 5102 opens or closes by baffle plate 5223 according to the turned position of axle 5225.Certainly, rotary driving part divide (not shown) can by rotary drive system for example pulse motor constitute.But also can adopt wherein the conversion of motion with directly effect type drive system such as piezo-activator is the structure that rotatablely moves.
[embodiment]
Below, an embodiment will be described, wherein utilize the brazing equipment of the embodiment of the invention 3 to carry out brazing operation.
Soldering is the gold electrode of 0.95mm * 0.6mm to liking planar dimension.Used brazed ball is that diameter is the spheroid of 110 μ m.Nitrogen is used as Compressed Gas.The distance of the soldering position from the spray nozzle front end to the workpiece is 0.5mm.The laser that uses is the YAG laser of wavelength as 1064nm, and is 0.3msec from the radiated time of beginning radiation laser beam.Spot diameter at soldering position laser beam is φ 200 μ m.
Following table illustrates the result of the embodiment 1 to 3 that carries out brazing operation under these conditions, wherein from opening be opened to laser emission between beginning time period and the force value of Compressed Gas change.
| Embodiment | Baffle plate is opened the back intermittent time | The pressure of Compressed Gas | Brazing state |
| 1 | 800μ?sec | 1.0kpa | Meet the requirements |
| 2 | 700μ?sec | 2.0kpa | Meet the requirements |
| 3 | 600μ?sec | 2.5kpa | Meet the requirements |
As can be seen from the above table, in whole embodiment 1 to 3, can realize soldering in satisfactory mode in the precalculated position.
According to embodiment 1,2 and 3, a kind of method for welding and a kind of brazing equipment are provided, wherein solid-state solder is maintained at the position with the spaced apart preset distance of substrate, and discharges maintenance to solder in this position so that solder is applied heat radiation aloft.Therefore, do not need to keep the solder that melts, thereby can prevent to be used to keep the device of solder such as nozzle to be polluted.
In addition, utilize the solder maintenance/release member of opening with electrode gap to carry out soldering, can prevent that therefore solder maintenance/releasing device from contacting with the electrode that constitutes the soldering object, thereby can prevent that electrode or solder keeper from damaging.
Though used laser aid in the foregoing description 1,2 and 3, also can utilize halogen light, hot-air to wait heating and melt brazed ball is solder.In addition, though use spherical brazed ball as solder in the above-described embodiments, the configuration of solder is not confined to spherical especially.
In addition, though in the above-described embodiments, the central axis of the central axis in the optical axis of laser beam, laser aiming path, the central axis of accommodation section and opening is consistent each other along identical direction, and this should not understand on being limited property ground.As long as laser aid can utilize laser beam to scan along the path that the brazed ball that falls from opening is walked, then can use (laser) of any kind to install, the route matching that the brazed ball that also there is no need to make the optical axis of laser beam and spray the whereabouts, back is certainly walked.
In addition, maintenance/release member is not limited to the maintenance/release member in the foregoing description.For example, as nozzle opening/closing mechanism, also can adopt aperture (iris) structure or the breach end structure that constitutes by a plurality of blades.
In addition, be necessary to make to discharge brazed ball and to apply laser beam synchronous, make its fusing before promptly arriving electrode in the air thereby can be at brazed ball.That is to say, as long as no matter the release of brazed ball and laser emission basic synchronization each other is which carries out unimportant earlier among both.
In addition, though the fastener of electrode is a solder in this manual, this should not understand on being limited property ground.For example, also can use some other metal, for example gold or alloy.
In addition, though the gas that supplies in this manual in the nozzle is inert gas (nitrogen), also can utilizes and to reduce the gas (for example hydrogen) of fastener.
The present invention can comprise various ways under the situation that does not break away from its inner characteristic.Therefore, the foregoing description only provides as example, and obviously should restrictively not understand.
The application requires to enjoy the priority of Japanese patent application No.2005-97614 that submitted on March 30th, 2005 and the Japanese patent application No.2005-320252 that submitted on November 4th, 2005, the quoting in full at this as a reference of this two pieces of applications.
Claims (29)
1. a method for welding that is used for first element is soldered to second element comprises the steps:
Solid-state solder is remained on from first element and second element position of spaced apart preset distance vertically upward, soldering position of soldering each other;
Release is to the maintenance of solder, so that the precalculated position of solder on second element that vertically is positioned at its below falls; And
Thereby heat solder by using heat radiation to come to apply heat to solder,
Wherein, after the maintenance that discharges solder, heat being in aerial solder, thereby first element is soldered to second element.
2. a method for welding that is used for electronic component is soldered to substrate comprises the steps:
Solid-state solder is remained on from electronic component and the substrate position of spaced apart preset distance vertically upward, soldering position of soldering each other;
Release is to the maintenance of solder, so that solder falls to the suprabasil precalculated position that vertically is positioned at its below; And
Thereby heat solder by using heat radiation to come to apply heat to solder,
Wherein, after the maintenance that discharges solder, heat being in aerial solder, thereby electronic component is soldered to substrate.
3. a method for welding that is used for electronic component is soldered to substrate comprises the steps:
Solid-state solder is remained on from electronic component and the substrate position of spaced apart preset distance vertically upward, soldering position of soldering each other;
Release is to the maintenance of solder, so that solder falls to the suprabasil precalculated position that vertically is positioned at its below; And
Heat solder by applying heat radiation to solder,
Wherein, discharge solder synchronously, and heat being in aerial solder by making release steps and heating steps, thus in the soldering position with substrate and electronic component soldering each other.
4. method for welding as claimed in claim 1 is characterized in that described heat radiation is a laser beam.
5. method for welding as claimed in claim 2 is characterized in that described heat radiation is a laser beam.
6. method for welding as claimed in claim 3 is characterized in that described heat radiation is a laser beam.
7. method for welding as claimed in claim 1 is characterized in that, applies compressed air to solder in release steps.
8. method for welding as claimed in claim 2 is characterized in that, applies compressed air to solder in release steps.
9. method for welding as claimed in claim 3 is characterized in that, applies compressed air to solder in release steps.
10. method for welding as claimed in claim 4 is characterized in that, applies compressed air to solder in release steps.
11. method for welding as claimed in claim 5 is characterized in that, applies compressed air to solder in release steps.
12. method for welding as claimed in claim 6 is characterized in that, applies compressed air to solder in release steps.
13. a brazing equipment that is used for electronic component is soldered to substrate comprises:
Maintenance/releasing device, this maintenance/releasing device is used for solid-state solder is remained on from electronic component and the substrate position of spaced apart preset distance vertically upward, soldering position of soldering each other, and be used to discharge maintenance to solder, so that solder drops in the substrate that vertically is positioned at its below;
Heater, thus this heater is used for by using heat radiation to come to apply heat heating solder to solder; And
Control device, this control device are used to make the add hotsync of maintenance/releasing device to the release that keeps and heater;
Wherein, discharge and to heat to the maintenance of solder and to being in aerial solder, thus in the soldering position with electronic component and substrate soldering each other.
14. brazing equipment as claimed in claim 13 is characterized in that, described heater is a laser aid, and described heat radiation is a laser beam.
15. brazing equipment as claimed in claim 13 is characterized in that, it is identical with the direction that solder falls to apply thermal-radiating direction.
16. brazing equipment as claimed in claim 14 is characterized in that, the direction that applies laser beam is identical with the direction that solder falls.
17. brazing equipment as claimed in claim 13 is characterized in that, described maintenance/releasing device is a nozzle, the opening/closing part that this nozzle has outlet, holds solder and the accommodating chamber that is communicated with outlet and be used to open and close outlet; Solid-state solder is arranged in the accommodating chamber, and outlet is partly closed by opening/closing.
18. brazing equipment as claimed in claim 14 is characterized in that, described maintenance/releasing device is a nozzle, the opening/closing part that this nozzle has outlet, holds solder and the accommodating chamber that is communicated with outlet and be used to open and close outlet; Solid-state solder is arranged in the accommodating chamber, and outlet is partly closed by opening/closing.
19. brazing equipment as claimed in claim 15 is characterized in that, described maintenance/releasing device is a nozzle, the opening/closing part that this nozzle has outlet, holds solder and the accommodating chamber that is communicated with outlet and be used to open and close outlet; Solid-state solder is arranged in the accommodating chamber, and outlet is partly closed by opening/closing.
20. brazing equipment as claimed in claim 16 is characterized in that, described maintenance/releasing device is a nozzle, the opening/closing part that this nozzle has outlet, holds solder and the accommodating chamber that is communicated with outlet and be used to open and close outlet; Solid-state solder is arranged in the accommodating chamber, and outlet is partly closed by opening/closing.
21. a joint method that is used for first element is joined to second element comprises the steps:
The solid state bonded part is remained on the position of the spaced apart preset distance of bonding station that will be engaged with each other with first element and second element;
Release is to the maintenance of fastener;
The solid state bonded part is ejected on the bonding station; And
Thereby heat fastener by using heat radiation to come to apply heat to fastener,
Wherein, after discharging fastener, it is heated, first element is joined to the bonding station on second element.
22. joint method as claimed in claim 21 is characterized in that, in injecting step, applies Compressed Gas to fastener, thereby ejects fastener.
23. a junction apparatus that is used for electronic component is joined to substrate comprises:
Maintenance/releasing device, this maintenance/releasing device are used for the solid state bonded part is remained on releasedly the position of the spaced apart preset distance of suprabasil bonding station that will engage with electronic component;
Injection apparatus, this injection apparatus is used for fastener is ejected into bonding station;
Heater, thus this heater is used for by using heat radiation to come to apply heat heating fastener to fastener;
Control device, this control device are used to make the add hotsync of maintenance/releasing device to the release that keeps and heater;
Wherein, after the maintenance of control device release, fastener is heated, thereby join electronic component to suprabasil bonding station fastener.
24. junction apparatus as claimed in claim 23 is characterized in that, described maintenance/releasing device is by direct action system the achieve a butt joint maintenance or the release of component.
25. junction apparatus as claimed in claim 23 is characterized in that, described maintenance/releasing device is by pivot system the achieve a butt joint maintenance or the release of component.
26. junction apparatus as claimed in claim 23 is characterized in that, described maintenance/releasing device is by rotary system the achieve a butt joint maintenance or the release of component.
27. junction apparatus as claimed in claim 24, it is characterized in that, described maintenance/releasing device has nozzle assembly, and this nozzle assembly has opening and is used to open and close the opening/closing part of this opening, and this opening/closing part is driven by piezo-activator.
28. junction apparatus as claimed in claim 25, it is characterized in that, described maintenance/releasing device has nozzle assembly, and this nozzle assembly has opening and is used to open and close the opening/closing part of this opening, and this opening/closing part is driven by piezo-activator.
29. junction apparatus as claimed in claim 26, it is characterized in that, described maintenance/releasing device has nozzle assembly, and this nozzle assembly has opening and is used to open and close the opening/closing part of this opening, and this opening/closing part is driven by piezo-activator.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005097614 | 2005-03-30 | ||
| JP097614/2005 | 2005-03-30 | ||
| JP320252/2005 | 2005-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1846919A CN1846919A (en) | 2006-10-18 |
| CN100522442C true CN100522442C (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100820843A Expired - Fee Related CN100522442C (en) | 2005-03-30 | 2006-03-30 | Soldering method, soldering device, bonding method, bonding device, and nozzle unit |
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| Country | Link |
|---|---|
| CN (1) | CN100522442C (en) |
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| CN106825819A (en) * | 2017-02-09 | 2017-06-13 | 东莞市沃德精密机械有限公司 | Contactless tin ball bonding connection device and its welding procedure |
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| JP4982198B2 (en) * | 2007-01-30 | 2012-07-25 | 新科實業有限公司 | Solder nozzle and soldering apparatus provided with the same |
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| JP2011121070A (en) * | 2009-12-08 | 2011-06-23 | Hitachi Global Storage Technologies Netherlands Bv | Method for manufacturing head gimbal assembly and apparatus for interconnecting connecting pad of the head gimbal assembly |
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| CN106271062B (en) * | 2016-09-29 | 2020-01-31 | 深圳市艾贝特电子科技有限公司 | Laser spray welding nozzle, spray welding device and method |
| CN106825816A (en) * | 2017-02-09 | 2017-06-13 | 东莞市沃德精密机械有限公司 | Contact Solder Ball Soldering Device and Its Soldering Process |
| DE102017114771B4 (en) | 2017-06-29 | 2022-01-27 | Pac Tech - Packaging Technologies Gmbh | Method and device for producing a wire connection and component arrangement with wire connection |
| CN107931764B (en) * | 2017-11-28 | 2020-08-21 | 深圳市吉百顺科技有限公司 | Production process of ceramic soldering tin nozzle |
| CN109396597B (en) * | 2018-10-30 | 2024-03-26 | 深圳市艾贝特电子科技有限公司 | Solder ball welding line pressing device |
| CN114501791A (en) * | 2020-11-12 | 2022-05-13 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| WO2025054967A1 (en) * | 2023-09-15 | 2025-03-20 | Texas Instruments Incorporated | Ball mounting apparatus with ball attach volume control |
| CN118404160B (en) * | 2024-07-03 | 2024-11-19 | 鞍山沃天传感技术有限公司 | Sensor production welding equipment |
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| US4149062A (en) * | 1976-09-29 | 1979-04-10 | Texas Instruments Deutschland Gmbh | Scavenger hood for laser |
| CN1110232C (en) * | 1996-09-30 | 2003-05-28 | 国际商业机器公司 | Stability enhancement of molten solder droplets as ejected from nozzle of droplet pump |
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| CN1846919A (en) | 2006-10-18 |
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