CN100516939C - Method for making light guiding board core - Google Patents
Method for making light guiding board core Download PDFInfo
- Publication number
- CN100516939C CN100516939C CNB03126901XA CN03126901A CN100516939C CN 100516939 C CN100516939 C CN 100516939C CN B03126901X A CNB03126901X A CN B03126901XA CN 03126901 A CN03126901 A CN 03126901A CN 100516939 C CN100516939 C CN 100516939C
- Authority
- CN
- China
- Prior art keywords
- manufacture method
- light guiding
- guiding board
- mould core
- board mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims description 20
- 238000011161 development Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 11
- 238000001039 wet etching Methods 0.000 abstract description 4
- 238000003384 imaging method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 14
- 238000005530 etching Methods 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000003760 hair shine Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000012940 design transfer Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- FBMUYWXYWIZLNE-UHFFFAOYSA-N nickel phosphide Chemical compound [Ni]=P#[Ni] FBMUYWXYWIZLNE-UHFFFAOYSA-N 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005950 photosensitized reaction Methods 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000010415 tropism Effects 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A process method of light conductive plate mold comprises the following steps: to provide a base plate; to coat a light resistance film on the base plate; to expose the light resistance by use of a light cover, wherein, the light cover pattern is two concentric circles with a ring between them and the transmission status of inner circle is opposite to the ring; to take imaging step; to take wet etching step; to take light resistance stripping step to remove the remaining light resistance.
Description
[technical field]
The present invention relates to a kind of manufacture method of die, particularly a kind of light guiding board mould core manufacture method with two circle structures site.
[background technology]
In recent years, along with the colorize and the maximization of LCD, its application is more extensive, as notebook computer, various desktop computer, LCD TV etc.Because of LCD is a kind of passive device, itself can not be luminous, thereby need utilize the light source of a light-source system as LCD, as module backlight (Backlight Module), wherein, light guide plate is a critical elements in the module backlight, from the transmission direction that light source sends light beam, converts line source or pointolite to the area source outgoing in order to guiding.
In order to improve the homogeneity of beam projecting, generally a plurality of sites are set on the light guide plate surface, in order to the total reflection condition of broken beam, and make the homogeneity of its scattering, and then promote the overall performance of module backlight with raising light guide plate outgoing beam in the light guide plate internal transmission.
The leaded light efficient and the lattice point structure of light guide plate have substantial connection, and most of light guide plate mesh points adopt circular configurations, and, show that after deliberation the light guide plate that the light guide plate with two circle structures site has single circle structure site has higher leaded light efficient.
Please consulting Fig. 1 together to Fig. 6, is the manufacture method that a kind of prior art has the light guiding board mould core of two circle structures site, and it may further comprise the steps:
As Fig. 1 and shown in Figure 2, a substrate 100 is provided, on this substrate 100, apply an even photoresist layer 200.Utilize 300 pairs of these photoresist layers 200 of light shield to carry out step of exposure, wherein, light shield 300 comprises a plurality of lightproof areas 340 and a plurality of transmission region 320, and this transmission region 320 is circular patterns.The transmission region 320 that light sees through light shield 300 shines the substrate 100 that applies photoresist layer 200.Carry out development step, with the design transfer of light shield 300 to substrate 100.
As shown in Figure 3, be the synoptic diagram of the wet etch step first time.Chemical reaction takes place with the substrate portion 220 that exposes to the open air through development in etching solution, forms the cylindrical pattern 120 of two circle structures.
Please consult Fig. 4 and Fig. 5 together, on this substrate 100, apply photoresist layer 200 once more, and photoresist layer 200 also is coated on cylindrical pattern 120 surfaces 122.Utilize light shield 400 to carry out step of exposure, wherein, light shield 400 comprises a plurality of lightproof areas 440,460 and a plurality of transmission region 420.Transmission region 420 is annulus patterns, and lightproof area 440 is circular patterns.And light shield 400 needs accurately to aim to guarantee that the pattern of design is undistorted in advance.The transmission region 420 that light sees through light shield 400 shines substrate 100, and chemical reaction takes place the photoresist layer 200 that is subjected to irradiate light, makes unexposed portion photoresistance 124 not be soluble in developer.Carry out development step, with the design transfer of light shield 400 to substrate 100.
As shown in Figure 6, be the synoptic diagram of the wet etch step second time.Chemical reaction takes place with the substrate portion 122 that exposes to the open air through development in etching solution, forms two circle structure plans 140.
Carry out photoresistance and peel off step, remove residual photoresistance 124,240, obtain one and have pair light guiding board mould core of circle structures site.
Yet, use the prior art method and form light guiding board mould core and need, and when carrying out exposing second time, need the light shield precision positioning through twice etching with two circle structures site, cause production cost to improve, production efficiency reduction, processing procedure complexity.
[summary of the invention]
For overcoming the light guiding board mould core manufacture method production cost height that prior art has two circle structures site, the defectives that production efficiency is low, processing procedure is complicated, the invention provides a kind of production efficiency height, production cost is low and processing procedure simply has the light guiding board mould core manufacture methods of two circle structures site.
Light guiding board mould core manufacture method of the present invention may further comprise the steps: a substrate is provided; On this substrate, apply a photoresist layer; Utilize a light shield that this photoresist layer is exposed, wherein this mask pattern is two concentric circless, forms an annulus between two circles, and other parts of circle and light shield are opposite with the printing opacity situation of this annulus in this; Carry out development step; Carry out wet etch step; Carry out photoresistance and peel off step, remove residual photoresistance.
Compared with prior art, light guiding board mould core manufacture method of the present invention makes full use of two concentric circles light shields, and utilize wet etching to have iso characteristics, therefore only adopt single exposure, development and etching step promptly to form and have pair light guiding board mould core of circle structures site, can reduce production costs, enhance productivity, simplify processing procedure.
[description of drawings]
Fig. 1 is that a kind of prior art light guiding board mould core manufacture method is exposed for the first time, the development synoptic diagram.
Fig. 2 is that a kind of prior art light guiding board mould core manufacture method adopts the first light shield synoptic diagram.
Fig. 3 is a kind of prior art light guiding board mould core manufacture method etching step synoptic diagram for the first time.
Fig. 4 is that a kind of prior art light guiding board mould core manufacture method is exposed for the second time, the development step synoptic diagram.
Fig. 5 is that a kind of prior art light guiding board mould core manufacture method adopts the second light shield synoptic diagram.
Fig. 6 is a kind of prior art light guiding board mould core manufacture method etching step synoptic diagram for the second time.
Fig. 7 is the light guiding board mould core manufacture method photoresistance coating synoptic diagram that the present invention has two circle structures site.
Fig. 8 is the exposure of light guiding board mould core manufacture method, the development synoptic diagram that the present invention has two circle structures site.
Fig. 9 is that the light guiding board mould core manufacture methods that the present invention has two circle structures site adopt the light shield synoptic diagram.
Figure 10 is the light guiding board mould core manufacture method etching synoptic diagram that the present invention has two circle structures site.
Figure 11 is the two circle of the light guiding board mould core structural representation with two circle structures site after wet etch step.
Figure 12 adopts gained of the present invention to have the two circle of the light guiding board mould core structural representation of two circle structures site.
[embodiment]
Please consulting Fig. 7 together to Figure 12, is light guiding board mould core manufacture method process flow diagram of the present invention, and it may further comprise the steps:
One substrate 500 is provided, and wherein, this substrate 500 is shaped as rectangle, can adopt the high metal material of conventional thermal conductivity, forms as electroforming such as copper, aldary or beryllium coppers.In addition, for improving the rigidity of substrate 500, the nickel that can mix, nickel cobalt (alloy) (NiCo), nickel phosphide (NiP), hybrid silicon carbide (SiC), chromium or the contour hard material electroforming of titanium carbide (TiC) form.Place vacuum or nitrogen environment to carry out dewatering roast substrate 500, baking temperature is 140 ℃-200 ℃.
On this substrate 500, apply a photoresist layer 600, as shown in Figure 7.Wherein, the photoresistance that applies is organic photoresist material, can adopt positive photoresist, as phenolics, also can adopt negative photoresist.The method that applies photoresistance adopts spin coating method, also can adopt spraying method.The substrate 500 that has applied photoresist layer 600 is placed heated baking on the backing plate, promptly soft roasting.Wherein, baking temperature is that stoving time is 20-30 minute between 90 ℃-100 ℃.
As shown in Figure 8, utilizing in advance, the light shield 700 of layout exposes, development step.Please consult Fig. 9 together, light shield 700 comprises a plurality of concentric structures, and wherein interior circle is a lightproof area 740,760 with the light shield other parts, and the annulus between the inside and outside circle is a transmission region 720.This concentrically ringed size is less than the sizes of designed two circle structures site, the lateral etches that tropism's wet etching is produced such as to remedy.Light shield 700 is aimed at substrate 500, carried out step of exposure.Wherein, exposure light source is ultraviolet ray, adopts the exposure of projection exposure technology, and promptly this light shield 700 is parallel to substrate 500.The light that light source sends shines on the light shield 700 through optical system (figure does not show), the transmission region 720 that sees through light shield 700 again shines on the substrate 500 that applies photoresist layer 600, be subjected to the photoresistance generation photosensitized reaction of irradiate light, generate the composition that is soluble in developer solution.After the exposure substrate 500 is placed heated baking on the backing plate, promptly roasting firmly, photoresistance is further hardened, its unexposed portion 640,660 is separated than indissoluble.Wherein, baking temperature is that stoving time is 20-30 minute between 100 ℃-120 ℃.
Carry out development step, the pattern that is designed in advance.Wherein, developer is a sodium hydroxide solution, and spray developing liquid on substrate 500, and substrate was remained static 30 seconds-60 seconds makes that exposed portion 620 fully is dissolved in developer solution, can be with the design transfer of light shield 700 to substrate 500.
As shown in figure 10, be light guiding board mould core manufacture method wet etch step synoptic diagram of the present invention.Wherein, etching solution is a hydrofluorite.Because wet etching is a kind of isotropic etching (Isotropic Etching) in essence, not only can produce vertical etching, also can produce lateral etches, and the speed of vertical etched speed and lateral etches is almost equal.Etching solution is sprayed onto substrate 500 surfaces, chemical reactions take place in itself and the exposed portion after developing 620, and through one period reaction time, substrate 500 forms the structure shown in the figure, comprise cylindrical 5 20 and interior circle 540, and vertical deep equality of cylindrical 520 and interior circle 540.Owing to produce isotropic etching, after substrate 500 left standstill a period of time, in circle 540 can be etched liquid corrode and cause all dissolvings of upper end, vertical degree of depth of circle 540 is lower than vertical degree of depth of cylindrical 520 promptly, and cylindrical 520 also can become big by diameter owing to isotropic etching takes place, formation two circle structures as shown in figure 11.
In substrate 500 surface spraying exfoliant, residual unexposed portion 640,660 and exfoliant are reacted, can obtain one and have pair light guiding board mould core of circle structures site, as shown in figure 12.
Claims (8)
1. light guiding board mould core manufacture method, it may further comprise the steps: a substrate is provided; On this substrate, apply an even photoresist layer; Utilize a light shield that this photoresist layer is exposed, wherein this mask pattern is two concentric circless, forms an annulus between two circles, and other parts of circle and light shield are opposite with the printing opacity situation of this annulus in this; Carry out development step; Carry out wet etch step; Carry out photoresistance and peel off step, remove residual photoresistance.
2. light guiding board mould core manufacture method according to claim 1 is characterized in that: this baseplate material is the higher metal of thermal conductivity.
3. light guiding board mould core manufacture method according to claim 1 is characterized in that: the painting method of this photoresist layer is spraying.
4. light guiding board mould core manufacture method according to claim 1 is characterized in that: the painting method of this photoresist layer is spin coating.
5. light guiding board mould core manufacture method according to claim 1 is characterized in that: this photoresistance is to adopt positive photoresist.
6. light guiding board mould core manufacture method according to claim 1 is characterized in that: this photoresistance is to adopt negative photoresist.
7. light guiding board mould core manufacture method according to claim 1 is characterized in that: this manufacture method further comprises a soft roasting step, and it carries out after applying the photoresistance step.
8. light guiding board mould core manufacture method according to claim 1 is characterized in that: this manufacture method further comprises a hard roasting step, and it carries out after step of exposure He before the development step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03126901XA CN100516939C (en) | 2003-06-14 | 2003-06-14 | Method for making light guiding board core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03126901XA CN100516939C (en) | 2003-06-14 | 2003-06-14 | Method for making light guiding board core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1566997A CN1566997A (en) | 2005-01-19 |
| CN100516939C true CN100516939C (en) | 2009-07-22 |
Family
ID=34469107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03126901XA Expired - Fee Related CN100516939C (en) | 2003-06-14 | 2003-06-14 | Method for making light guiding board core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100516939C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105093394A (en) * | 2015-08-19 | 2015-11-25 | 武汉华星光电技术有限公司 | Light guide plate and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099134A (en) * | 1996-09-27 | 2000-08-08 | Hitachi, Ltd. | Liquid crystal display device |
| CN2457630Y (en) * | 2000-08-17 | 2001-10-31 | 中强光电股份有限公司 | backlight |
| CN1372161A (en) * | 2001-02-26 | 2002-10-02 | 兴隆发电子股份有限公司 | Light guide plate mold core and manufacturing method thereof |
-
2003
- 2003-06-14 CN CNB03126901XA patent/CN100516939C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099134A (en) * | 1996-09-27 | 2000-08-08 | Hitachi, Ltd. | Liquid crystal display device |
| CN2457630Y (en) * | 2000-08-17 | 2001-10-31 | 中强光电股份有限公司 | backlight |
| CN1372161A (en) * | 2001-02-26 | 2002-10-02 | 兴隆发电子股份有限公司 | Light guide plate mold core and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1566997A (en) | 2005-01-19 |
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Granted publication date: 20090722 Termination date: 20150614 |
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