CN100505198C - Automatic Operating System of Wire Bonding Equipment in Semiconductor Devices - Google Patents

Abstract

The invention relates to an automatic operating system for wire welding equipment in semiconductor devices, which belongs to the improvement of microelectronic packaging equipment from manual to automatic. On the basis of the original manual machine, the fixture base and microscope are removed, and the XY two-dimensional electric control platform, lens, CCD, main box, warning light, and display are newly added. The motion control card is used to realize the automatic displacement of the fixture or the welding head, the fixed CCD and lens above the welding head and the image acquisition card in the main box realize the automatic identification of the chip, and the main control computer in the main box realizes the automatic welding control, which becomes an automatic welding device of. The product quality and production efficiency are improved, the consistency and stability of the welding wire are guaranteed, and the human resources are saved, and the labor intensity is reduced. The application range and use value of the wire bonding machine are greatly improved. It is a high-tech microelectronics production equipment integrating precision machinery, automatic control, image recognition, computer application, ultrasonic welding and other fields.

Description

Automatic Operating System of Wire Bonding Equipment in Semiconductor Devices

technical field

The invention relates to an automatic operating system for welding equipment for inner leads of semiconductor devices, which belongs to the improvement of microelectronic packaging equipment from manual to automatic. It transforms the manual operation of the wire welding equipment in the semiconductor device into an automatic welding equipment.

Background technique

In my country, microelectronic packaging equipment is currently imported from the United States, South Korea, and Japan. It is an important task to promote my country's modern high-tech to develop my country's microelectronic packaging equipment as soon as possible. At present, most of the inner lead welding equipment introduced in my country are gold wire ball welding machines, and the cost of gold wire is very high. In order to reduce production costs, ultrasonic aluminum wire pressure welding machines have been developed in China, but they can only be operated manually, and the welding depends on the alignment of human eyes. , For the microelectronics industry, manual operation consumes a lot of human resources and labor intensity, and the inconsistency of manual operation also causes instability in product performance and low work efficiency.

Contents of the invention

In order to solve these problems, our company uses image recognition technology, automatic control technology and computer control technology on the basis of the original manual semiconductor device inner lead welding equipment to improve it into an automatic welding equipment, which greatly improves the welding efficiency and quality.

The original manual semiconductor device internal lead welding equipment includes a machine table, a fixture seat, a fixture, a welding head, a wire feeding mechanism, and a microscope, as shown in Figure 1.

The modified automatic semiconductor device internal lead welding equipment removes the fixture base and microscope on the basis of the original manual machine, and adds an X-Y two-dimensional electric control platform, lens, charge-coupled device, main box, warning lights, Display etc. are constructed as automatic equipment, see Fig. 2 and Fig. 3.

The automatic displacement of the fixture or the welding head is realized by the X—Y two-dimensional electronic control platform and the stepping motion control card in the main box. The automatic identification of the chip is realized by fixing the CCD and lens above the welding head and the image acquisition card in the main box. The main control computer in the main box realizes automatic welding control, transforming the original manual operation equipment into automatic welding equipment.

The improved model removes the microscope on the original welding machine, and replaces it with the lens, charge-coupled device and image acquisition card in the main box to realize the image acquisition of the chip, and automatically identify the position of the chip through software processing.

The improved model fixes the X—Y two-dimensional electric control platform and turntable under the fixture or welding head of the original manual ultrasonic aluminum wire pressure welding machine. There are two ways to fix the two-dimensional platform. One is that the X-axis platform is on the Y-axis platform. One is that the X-axis platform is under the Y-axis platform. The computer controls the X-Y two-dimensional electronic control platform according to the collected chip solder joint position to realize the automatic displacement of the fixture or welding head, thereby realizing automatic welding. The positioning of solder joints is precise, and the consistency of welding lines is good, which improves the quality of products.

Two arc grooves are engraved on the bottom disc of the fixture, and the angle of the fixture can be adjusted manually. When it is necessary to weld the inner lead and the welding wire is very oblique, turn the fixture to a certain angle and fix it with screws, so that the wiring of the welding wire becomes straight or close to a straight line. This solution is economical and practical, and achieves good results. Another method is to use an electronically controlled or manual turntable.

The beneficial effect of the present invention fills up the gap that there is no automatic wire welding machine for inner leads in China, and the automatic wire welding machine after transformation improves the production efficiency and quality of products, especially ensures the consistency and stability of welding wires, and improves the The qualification rate of the product is improved, and the human resources are saved, and the labor intensity is greatly reduced. Especially for the chip that is difficult to make by the original manual welding machine, the automatic machine can easily complete it with its automatic control advantage. The application range and use value of the wire bonding machine are greatly improved, and it plays a greater role in the production of semiconductor devices. It is a modern high-tech microelectronics production equipment integrating precision machinery, automatic control, image recognition, computer application, optics, mechanics, ultrasonic welding and other fields of technology.

Description of drawings

Fig. 1 is the composition diagram of the original manual semiconductor device internal lead welding equipment.

The figure includes a machine 1, a fixture base 2, a fixture 3, a welding head 4, a wire feeding mechanism 5, and a microscope 6.

Fig. 2 is a front view of the structure of the modified automatic semiconductor device inner lead welding equipment. The modified automatic semiconductor device internal lead welding equipment removes the fixture base 2 and the microscope 6 on the basis of the original manual machine, and adds an X-Y two-dimensional electronic control platform 8, lens 9, charge-coupled device 10, and a host in the new design. Box 7, warning light 11, display 12 etc. are constructed as automatic equipment.

Figure 3 is a right view of the structure of the modified automatic thick aluminum wire welding machine.

The figure includes a machine 1 , a fixture 3 , a welding head 4 , a wire feeding mechanism 5 , a main box 7 , an X—Y two-dimensional electric control platform 8 , a lens 9 , a charge-coupled device 10 , and a warning light 11 .

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings, taking the manual ultrasonic aluminum wire pressure welding machine as an example,

The alignment of the solder joints of the original manual ultrasonic aluminum wire pressure welding machine is to use a microscope to observe with human eyes. The operator keeps staring at the welding area, which will cause great damage to human eyes. operation, resulting in a high product rejection rate and a decline in product quality. The improved model removes the microscope 6 on the original welding machine, and replaces it with the lens 9, CCD 10, and the image acquisition card in the main box 7 to jointly realize the image acquisition of the chip, and automatically identify the position of the chip through software processing. Manpower is liberated and product quality is improved.

The displacement of the fixture on the original manual ultrasonic aluminum wire pressure welding machine is realized by manually operating the fixture seat 2. The operator operates with both hands non-stop, and the labor intensity is high. Due to the misoperation of the person when he is tired or inattentive, thus Cause product rejection rate to be high, product quality declines. The improved model fixes the X—Y two-dimensional electric control platform 8 and the turntable under the fixture 3 or the welding head 4 of the original manual ultrasonic aluminum wire pressure welding machine. There are two ways to fix the two-dimensional platform. One is that the X-axis platform is in the On the Y-axis platform, one is that the X-axis platform is under the Y-axis platform. The computer controls the X—Y two-dimensional electric control platform 8 according to the collected positions of the solder joints of the chip to realize the automatic displacement of the fixture or the welding head, thereby realizing automatic welding. The positioning of solder joints is precise, and the consistency of welding lines is good, which improves the quality of products. The platform adopts ball screw and V-shaped cross ball guide rail or linear slider guide rail. The platform motor adopts stepping or servo motor. turntable.

Since the welding head only moves in two dimensions, Y and Z, and the platform also moves in two dimensions, X and Y, so for soldering a very oblique wire in a semiconductor device, the movement of the platform alone can easily pull the aluminum wire out of the rivet slot, resulting in a frame The solder joints on the pins are weak or not soldered. Our solution is to carve two arc grooves on the bottom disc of the fixture 3, and the angle of the fixture 3 can be manually adjusted. When it is necessary to weld the inner lead and the welding wire is very oblique, turn the fixture to a certain angle and fix it with screws, so that the wiring of the welding wire becomes straight or close to a straight line. This solution is economical and practical, and achieves good results. Another method is to use an electronically controlled or manual turntable.

The technical solution adopted by the present invention to solve its technical problems is:

1. Use the lens 9, the charge-coupled device 10, and the image acquisition card in the main box 7 to realize the image acquisition of the chip.

2. Use the X—Y two-dimensional electric control platform 8 and the stepping motion control card in the main box 7 to realize the automatic displacement of the fixture or welding head.

3. The main control computer in the main box 7 is used to analyze and calculate the image data, and the calculation results are sent to the stepping motion control card, thereby controlling the X—Y two-dimensional electronic control platform 8 to realize automatic alignment of solder joints.

4. Automatic welding is performed by the software program written in the main control computer, which realizes the transformation from the original manual operation equipment to automatic welding equipment, and meets the production requirements of different chips by setting parameters.

5. The status of the chips and bonding wires can be observed through the display 12, and the parameters can be set or operated through the keyboard according to different situations.

6. For lines with very oblique angles of welding lines, two solutions are used to solve them

3) Add a manual or automatic turntable on or below the X—Y two-dimensional electric control platform 8 .

4) Carve two arc grooves on the fixed chassis of fixture 3, and the fixture can also adjust the angle manually.

Claims (2)

1. The automatic operation system of 1 inner leading bonding device of semiconductor device is characterized in that the automatic operation system of this inner leading bonding device of semiconductor device comprises board (1), anchor clamps (3), soldering tip (4), wire feeder (5), mainframe box (7), the X-automatically controlled platform of Y bidimensional (8), camera lens (9), charge coupled device (10), warning lamp (11) and display (12); This automatic operation system combines with image identification system, computer control system, automatic control system, make it become automatic welding device, the position of each several part and annexation: go up sectional fixture (3) and soldering tip (4) at board (1), soldering tip (4) upper fixed charge coupled device (10) and camera lens (9), X-automatically controlled platform of Y bidimensional (8) is positioned on the board (1), be fixed under anchor clamps (3) or the soldering tip (4), fixed form has two kinds, a kind of be the X-axis platform on the Y-axis platform, a kind of is that the X-axis platform is under the Y-axis platform;

   Adopt the IMAQ of the image pick-up card realization chip in camera lens (9), charge coupled device (10) and the mainframe box (7);

   Adopt X-automatically controlled platform of Y bidimensional (8) and the step motion control card in the mainframe box (7) to realize the automatic displacement of anchor clamps (3) or soldering tip (4);

   Adopt the analytical calculation of the main control computer realization view data in the mainframe box (7), its operation result is sent to the step motion control card, thereby control X-automatically controlled platform of Y bidimensional (8) is realized the automatic contraposition of solder joint;

   Carry out welding automatically by the software program of writing in the main control computer, by the production requirement that parameter satisfies different chips is set;

   By the situation that display (12) can be observed chip and bonding wire, carry out the setting or the operation of parameter by keyboard according to different situations.
2. The automatic operation system of 2 inner leading bonding device of semiconductor device according to claim 1 is characterized in that for the very oblique line of bonding wire angle, adopts two kinds of schemes:

   1) go up or add manual or automatic turntable down at X-automatically controlled platform of Y bidimensional (8),

   2) on anchor clamps (3) fixed underpan, carve the twice arc groove, realize anchor clamps manual adjustments angle.

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