CN100498359C - Circuit connection detection device, electronic equipment and detection method - Google Patents

Abstract

The invention provides a circuit connection detection device, an electronic device and a detection method. The circuit connection detection device comprises a substrate, a circuit module, a group of sensing elements and a detection unit. A plurality of contact pads are arranged on the substrate. The circuit module includes a plurality of conductive bumps respectively corresponding to the contact pads on the substrate. The sensing elements are respectively and correspondingly arranged on two sides of at least one of the partial contact pads and the corresponding conductive bumps; the detection unit is connected with the group of sensing elements so as to output an error signal when at least one of the contact pads provided with the sensing elements on two sides and the corresponding conductive bumps deforms and contacts the sensing elements. The invention can replace the manual detection by an automatic process, reduce the cost, the assembly difficulty and the possibility of detection loss, and has lower production cost.

Description

Circuit bonding detection device, electronic equipment and detection method

technical field

The present invention relates to a circuit bonding detection device, a detection method used therefor, and an optoelectronic device using the detection device and method; in particular, a circuit bonding detection device on a display panel, a detection method used therefor, and the detection device and method used display panel.

Background technique

With the continuous improvement of display panel technology, the technical growth demand for the packaging of display panel driver integrated circuits is driven. Taking thin-film transistor liquid crystal display devices as an example, the current common driving circuit packaging methods include Tape Carrier Package (TCP), Chip on Film (COF) and Chip on Glass (COG). kind. Among them, the chip-on-glass packaging method has gradually become a widely used packaging method due to its advantages of lower cost, simplified process and high precision.

Figure 1 shows a schematic diagram of a conventional chip-on-glass package. The conductive pad 11 electrically connected to the thin film transistor is disposed on the glass substrate 10 . The driving circuit on the chip 30 has a conductive block 31 electrically connected to the conductive pad 11 . A layer of bonding material 20 with conductive particles 22 , such as anisotropic conductive film (ACF), is disposed between the conducting pad 11 and the conductive block 31 . After the chip 30 is bonded to the glass substrate 10 , the conductive pad 11 can conduct with the corresponding conductive block 31 by means of the bonding material under pressure.

However, for all packaging methods including chip-on-glass, the alignment accuracy between the chip 30 and the circuit on the substrate and the detection of indentation are the key points to improve the process yield. As shown in FIG. 1 , due to reasons such as overvoltage or uneven thickness of the substrate 33 of the chip 30 , the deformation of the conductive block 31 is often too large, resulting in defective products with defects. In order to screen out such defective products, visual inspection is generally carried out by humans. However, this method of screening results in incoherent processes and the risk of missed detection.

Contents of the invention

The object of the present invention is to provide a circuit joint testing device and a testing method thereof, which can replace manual testing with an automated process.

Another object of the present invention is to provide a circuit joint testing device and a testing method thereof, which can reduce cost and ease assembly difficulty.

Another object of the present invention is to provide a circuit joint testing device and a testing method thereof, which can reduce the possibility of missing testing.

Another object of the present invention is to provide a display device with lower production cost.

The circuit bonding detection device of the present invention includes a substrate, a circuit module, a set of sensing elements and a detection unit. A plurality of contact pads are arranged on the substrate. Among the plurality of contact pads, at least one contact pad forms a first group. The circuit modules are correspondingly arranged on the substrate. The circuit module includes a plurality of conductive bumps. The conductive bumps respectively correspond to contact pads on the substrate. The sensing elements are correspondingly arranged on two sides of at least one of the contact pads in the first group and at least one of the corresponding conductive bumps. The detection unit is coupled to the sensing element, so that when at least one of the contact pad in the first group and the conductive bump corresponding to the contact pad in the first group is deformed, it contacts the group of sensing elements. When at least one of the sensing elements is detected, an error signal is output.

In the above device, the error signal may be a signal difference between the contact pad in the first group and at least one of the conductive bumps corresponding to the contact pad in the first group.

In the above device, at least one sensing element in the set of sensing elements may comprise a line pattern, a rectangular pattern, or a combination of the above patterns.

In the above-mentioned device, the plurality of contact pads may include at least one second group, and the second group may have a plurality of contact pads, so that the first group having at least one contact pad may be arranged at a location with the first group of contact pads. outside of the second group of contact pads, within the second group of contact pads, or a combination thereof.

In the above device, one of the sensing elements in the group of sensing elements may have one of a ground signal and a common signal.

In the above device, one sensing element of the group of sensing elements may have a ground signal, and the other sensing element may have a common signal.

In the above device, the distance between one sensing element of the group of sensing elements and one side of the contact pad in the first group may be substantially greater than or substantially equal to 2 micrometers.

In the above device, when the contact pad in the first group and at least one side of at least one of the conductive bump corresponding to the contact pad in the first group are deformed, the amount of deformation can be substantially greater than or substantially above is equal to 50%.

In the above device, the circuit module may include an integrated circuit, a flexible substrate, a rigid substrate, or a combination thereof.

In the above device, the material of the substrate may include transparent material, opaque material or flexible material.

The present invention also provides a circuit bonding detection device, comprising: a substrate, on which a plurality of contact pads are arranged, wherein the contact pads include at least one first group, and the first group has at least two contact pads; a circuit module, Correspondingly arranged on the substrate and including a plurality of conductive bumps corresponding to the plurality of contact pads; a group of sensing elements, corresponding to each contact pad in the first group and its corresponding At least one of the conductive bumps is correspondingly staggered; and the detection unit is connected to the group of sensing elements, so that when at least one of the plurality of contact pads in the first group corresponds to the first group When at least one of the plurality of conductive bumps of the plurality of contact pads is deformed and contacts at least one sensing element in the group of sensing elements, an error signal is output.

In the above device, the error signal may be a signal difference between at least one of the plurality of contact pads in the first group and at least one of the conductive bumps corresponding to the contact pad in the first group.

In the above device, at least one sensing element in the set of sensing elements may comprise a line pattern, a rectangular pattern, or a combination of the above patterns.

In the above device, the plurality of contact pads may include at least one second group, the second group has a plurality of contact pads, so that the first group with the plurality of contact pads may be disposed at a location with the plurality of contact pads. outside of the second group of the plurality of contact pads, in the second group of the plurality of contact pads, or a combination thereof.

In the above device, one of the sensing elements in the group of sensing elements may have one of a ground signal and a common signal.

In the above device, one sensing element of the group of sensing elements may have a ground signal, and the other sensing element may have a common signal.

In the above device, at least one of at least one of the plurality of contact pads in the first group and at least one of the conductive bumps corresponding to the plurality of contact pads in the first group is deformed The amount of deformation can be substantially greater than or substantially equal to 50%.

In the above device, the circuit module may include an integrated circuit, a flexible substrate, a rigid substrate, or a combination thereof.

In the above device, the material of the substrate may include transparent material, opaque material or flexible material.

The present invention also provides an electronic device, which includes the above-mentioned circuit joint detection device.

The present invention also provides a detection method of a circuit pressure detection device, the method includes: providing a circuit pressure detection device, the circuit pressure detection device includes a substrate, and a plurality of contact pads are arranged on the substrate, wherein the plurality of contact pads The contact pads include at least one first group, and the first group has at least one contact pad; the circuit module is correspondingly arranged on the substrate, and includes a plurality of conductive bumps, and the plurality of conductive bumps correspond to the plurality of conductive bumps. a contact pad; a group of sensing elements, correspondingly disposed on both sides of at least one of the contact pad and its corresponding conductive bump in the first group; and a detection unit, connected to the group of sensing elements; pressing the substrate and the circuit module so that the plurality of contact pads on the substrate are electrically connected to the plurality of conductive bumps on the circuit module; and measuring the set of sensing elements to determine the Whether at least one of the first group having at least one contact pad and the conductive bump on the circuit module corresponding to the plurality of contact pads in the first group is deformed.

In the above method, the step of pressing the substrate and the circuit module may include: aligning the plurality of contact pads on the substrate with the plurality of conductive bumps on the circuit module.

The above method may further include: providing a bonding material between the substrate and the circuit module.

In the above method, the step of measuring the sensing element may include transmitting a signal to at least one sensing element in the group of sensing elements, and the group of sensing elements transmits another signal to the detection unit to detect the Whether the other signal is substantially equal to this signal.

In the above method, the signal may include a common signal, a ground signal, or a combination of the above signals.

The present invention provides a detection method of a circuit pressure detection device, which includes: providing a circuit pressure detection device, the circuit pressure detection device includes a substrate, and the substrate is provided with a plurality of contact pads, wherein the plurality of The contact pads include at least one first group, and the first group has at least two contact pads; the circuit module is correspondingly arranged on the substrate, and includes a plurality of conductive bumps, and the plurality of conductive bumps correspond to the plurality of contact pads. contact pads; a group of sensing elements, corresponding to at least one of each contact pad in the first group and at least one of the corresponding conductive bumps; and a detection unit connected to the group of sensing elements; combining the substrate and the circuit module so that the plurality of contact pads on the substrate are electrically connected to the plurality of conductive bumps on the circuit module; and measuring the set of sensing elements to determine the contact pads on the substrate Whether at least one of the first group having at least two contact pads and the conductive bump on the circuit module corresponding to the plurality of contact pads in the first group is deformed.

In the above method, the step of pressing the substrate and the circuit module may include: aligning the plurality of contact pads on the substrate with the plurality of conductive bumps on the circuit module.

The above method may further include: providing a bonding material between the substrate and the circuit module.

In the above method, the step of measuring the sensing element may include: transmitting a signal to at least two sensing elements in the set of sensing elements, and the set of sensing elements transmits another signal to the detection unit to It is detected whether the other signal is substantially equal to the signal.

In the above method, the signal may include a common signal, a ground signal, or a combination of the above signals.

The present invention also provides a detection method of electronic equipment, including the detection method of the above-mentioned circuit joint detection device.

The circuit pressing state detection method of the present invention includes: arranging sensing elements on both sides of the contact pads in the first group; pressing the substrate and the circuit module, so that the plurality of contact pads on the substrate and the circuit modules on the circuit module A plurality of conductive bumps are electrically connected; and the group of sensing elements is measured to determine whether at least one of the contact pads and the corresponding conductive bumps between the group of sensing elements is deformed. When the detection unit determines that at least one of the contact pad and its corresponding conductive bump is deformed, an error signal is output.

Description of drawings

FIG. 1 is a schematic diagram of lamination of a control circuit on a traditional liquid crystal panel;

2 is a cross-sectional view of the first embodiment of the circuit bonding detection device of the present invention;

Fig. 3 is a sectional view of a variant embodiment of the first embodiment shown in Fig. 2;

Fig. 4a is a top view of the second embodiment, wherein the first group of contact pads is located outside the second group of contact pads;

Fig. 4b is a variant embodiment of the second embodiment, wherein the first group of contact pads is located in the second group of contact pads;

Fig. 4c is a variant embodiment of the second embodiment, wherein part of the first group of contact pads is located outside the second group of contact pads;

Figure 5a is a top view of a third embodiment in which the first set of contact pads is formed by a single contact pad;

Fig. 5b is a variant embodiment of the third embodiment, wherein the first group of contact pads is formed by a single contact pad;

Fig. 6 is the schematic diagram of the fourth embodiment;

7 is a top view of a fifth embodiment, wherein the circuit module includes a flexible substrate or a rigid substrate;

8 is a top view of the sixth embodiment, wherein the circuit module includes both a flexible substrate and a rigid substrate;

Fig. 9a is a schematic diagram of the seventh embodiment when the first group is composed of three contact pads;

Fig. 9b is a schematic diagram of a variant embodiment of the seventh embodiment;

FIG. 10 is a flow chart of an embodiment of the circuit pressing detection method of the present invention;

FIG. 11 is a schematic diagram of an embodiment applied to a display panel and an electronic device.

Wherein, the reference signs are explained as follows:

100 substrates

110 contact pad

111 Group 1

112 second group

200 bonding material

220 conductive particles

300 circuit modules

310 conductive bump

350 flexible circuit board

370 printed circuit board

500 sensing elements

700 detection units

701 error signal

710 warning device

Detailed ways

The invention provides a circuit joint detection device, a detection method used therein, and an optoelectronic device using the detection device and method. The embodiment of the present invention, preferably, is illustrated by an example of detecting a chip-on-glass process; however, in different embodiments, the present invention can also detect a circuit of a chip-on-film process, a tape-and-reel package, or other devices with a similar structure. circuit. Among them, in the chip-on-glass process and the chip-on-film process, preferably, the anisotropic conductive adhesive film is used as the main bonding material; however, in different embodiments, the bonding material also uses other suitable materials (such as solder, patch, or other materials) as bonding material. Furthermore, the following embodiments of the present invention all take one side as an implementation example, but not limited thereto, and the following embodiments of the present invention can also be selectively used on all sides.

The circuit bonding detection device of the present invention includes a substrate 100 , a circuit module 300 , a set of sensing elements 500 and a detection unit 700 . In the first embodiment shown in FIG. 2 , a plurality of contact pads 110 are disposed on the substrate 100 , and the arrangement includes a side-by-side arrangement, a letter-shaped arrangement, or other arrangements. In addition, as shown in FIG. 2 , among the plurality of contact pads 110 , at least one contact pad 110 forms a first group 111 . The contact pad 110 is electrically connected to the thin film transistor or other signal conducting circuits on the substrate 100 . The material of the substrate 100 may include: flexible materials such as rubber, polyamides, polyalcohols, polyesters, thermosetting polymers, thermoplastic polymers, or other polymers, or combinations thereof; opaque materials such as silicon wafers, Ceramic, or other material; or transparent material, such as glass, quartz, or other material. In the present embodiment shown in FIG. 2 , the material of the substrate 100 is exemplified by glass, but is not limited to this material. The material of the contact pad 110 includes: reflective materials, such as gold, silver, copper, iron, tin, lead, cadmium, tungsten, titanium, tantalum, neodymium, aluminum, molybdenum, hafnium, or other metals, or alloys of the above metals, or Nitrides of the above metals, or oxides of the above metals, or oxynitrides of the above metals, or combinations of the above metals; transparent materials, such as indium tin oxide, aluminum zinc oxide, indium zinc oxide, cadmium tin oxide , or other materials, or a combination of the above materials; or non-metallic materials, such as doped silicon-containing single crystal material, doped silicon-containing polycrystalline material, doped silicon-containing microcrystalline material, doped silicon-containing Amorphous material, or germanium-containing material, or other materials, or a combination of the above materials; or a combination of the above materials.

The circuit module 300 is correspondingly disposed on the substrate 100 . The circuit module 300 includes a plurality of conductive bumps 310 . The plurality of conductive bumps 310 respectively correspond to the contact pads 110 on the substrate 100 , so the arrangement of the conductive bumps 310 on the circuit module 300 preferably corresponds to the arrangement of the contact pads 110 . The conductive bumps 310 and the contact pads 110 are preferably in signal or electrical connection with the bonding material 200 therebetween. The bonding material 200 preferably includes a bonding material with/without conductive particles 220, such as: anisotropic conductive adhesive film or other polymers, and the present invention takes an anisotropic conductive adhesive film with conductive particles as an example; however, in In different embodiments, the bonding material can also be replaced by other suitable materials (such as solder, patch, or other materials). The conductive bump 310 is preferably made of conductive metal, such as gold, silver, copper, and the like. The circuit module 300 is an integrated circuit (such as a chip or other integrated circuits), a printed circuit board, a flexible circuit board, or other modules with substrates as base materials, or a combination of the above circuits or modules. This embodiment takes an integrated circuit (such as a chip) as an example, but is not limited thereto.

In the first embodiment shown in FIG. 2 , the sensing elements 500 are respectively disposed on the substrate 100 corresponding to the two sides of the contact pad 110 in the first group 111 as an example, but it is not limited thereto. Optionally, It varies according to different embodiments. In the modification of the first embodiment shown in FIG. 3 , the sensing element 500 is arranged on the circuit module 300, or both (such as the substrate 100 and the circuit module 300) are provided with sensing elements. 500. The distance between the sensing element 500 and the side of the adjacent contact pad 110 depends on the design. The embodiment of the present invention is preferably substantially greater than or substantially equal to 2 micrometers (μm) as an example, but it is not limited thereto. This distance can also be adjusted and reduced in conjunction with a more precise circuit design. The sensing elements 500 located on both sides of the contact pad 110 respectively transmit different signals. In this embodiment, the sensing element 500 on one side of the contact pad 110 transmits the ground signal Vg, and the sensing element 500 on the other side of the same contact pad 110 transmits the common signal Vcom. An example of the common signal is the substrate 100. Vcom transmitted by the circuit on. But not limited thereto, the different signals transmitted by the two can also selectively transmit at least one of the signal provided by the circuit on the substrate 100 , the signal provided by the circuit module 300 , and the signal or voltage potential provided by other signal sources.

The detection units 700 are respectively coupled to the sensing elements 500 to detect signals or signal changes on the sensing elements 500 . The detection unit 700 can optionally exist in the joint detection device in the form of a firmware module, a software module, a hardware module, or a combination of the above modules. In addition, in order to make it easy for people to know whether the signal is wrong, preferably, the detection unit 700 is connected to the warning device 710 , but it is not limited thereto, and other devices can be used instead of the warning device 710 . The warning device 710 includes a display screen, a speaker device, a form generating device, or other devices, or a combination of the above devices; and the warning method includes screen display, warning sound, report, or other forms, or a combination of the above forms. When the contact pad 110 in the first group 111 or its corresponding conductive bump 310 is deformed due to pressing or other reasons and contacts any sensing element 500, the detection unit 700 can detect the sensing element 500 by means of transmission and/or detection. This change of state is known by the signal on the sensing element 500. In addition, if the detection units 700 on both sides of the same contact pad 110 are touched at the same time, the detection units 700 can also detect the state change. In order to easily standardize and judge the deformation standard of the contact pad 110 and/or the conductive bump 310, preferably, the deformation of the contact pad 110 and/or the conductive bump 310 in the same dimension (such as the horizontal direction) can be designed The amount is regarded as the allowable value. When the side of the contact pad 110 and/or the conductive bump 310 is in contact with the sensing element 500, preferably, the amount of deformation of the contact pad 110 and/or the conductive bump 310 in the same dimension is substantially greater than or substantially equal to 50%. However, the amount of deformation can also be changed according to the size of the contact pad 110 and/or the conductive bump 310, the pitch of the arrangement, or the depth of the bonding; about 80%.

When the detection unit 700 detects and/or transmits the signal on the sensing element 500 or the signal changes, the detection unit 700 transmits the error signal 701 accordingly, and can issue a warning by means of the warning device 710 . In order to make the error signal 701 easier to be judged, therefore, the signal change (that is, the difference) of the contact pad 110 and/or the conductive bump 310 contacted by the sensing element 500 is preferably an absolute signal difference, but is not limited to Therefore, it can also be judged according to the original signal difference.

In the second embodiment shown in FIG. 4 a , among all the plurality of contact pads 110 on the substrate 110 , a second group 112 of contact pads 110 can also be formed by the plurality of contact pads 110 . As far as this embodiment is concerned, the first group 111 contains at least two contact pads 110; however, in different embodiments, the first group 111 may contain one or more than two contact pads 110, for example, one, two, There are three, four, five, or six contact pads 110 . As shown in FIG. 4a, when the first group 111 includes two adjacent contact pads 110, a sensing element 500 can be respectively provided on both sides and in the middle of the two contact pads 110; Three sensing elements 500 are arranged within group 111 . However, in different embodiments, in the two adjacent contact pads 110, separate sensing elements 500 may also be provided on both sides of each contact pad 110, therefore, between two adjacent contact pads 110 Two independent sensing elements 500 are arranged between them.

Moreover, the contact pads 110 of the first group 111 are disposed outside the contact pads 110 of the second group 112 . Preferably, the contact pads 110 in the first group 111 are used as alignment contact pads 110, dummy contact pads (dummycontacted pads) 110, or contact pads 110 for other non-signal transmission purposes; The contact pad 110 is a contact pad 110 for circuit signal transmission, but is not limited thereto, and the above functions can be selectively changed. Similarly, the conductive bumps 310 on the circuit module 300 corresponding to the contact pads 110 can also be divided into a first group and a second group, so as to be electrically connected to the contact pads 110 . In addition, the contact pads 110 of the first group 111 and the second group 112 are preferably arranged along the same direction, and there is a large gap between them as isolation; however, in different embodiments, the first group 111 and the second group 112 It can also be changed in a different direction, with a different gap, or in other arrangements.

Fig. 4b shows a modified embodiment of the second embodiment shown in Fig. 4a. In this embodiment, the contact pads 110 of the first group 111 are arranged in the contact pads 110 of the second group 112 ; At this time, the contact pads 110 of the first group 111 and the second group 112 are preferably contact pads 110 for transmitting circuit signals. Therefore, in this embodiment, the difference between the contact pads 110 of the first group 111 and the contact pads 110 of the second group 112 is that the sensing elements 500 are arranged on both sides of the contact pads 110 of the first group 111; The two sides of the group 112 contact pad 110 are not provided with the sensing element 500 . Similarly, the conductive bumps 310 on the circuit module 300 corresponding to the contact pads 110 can also be divided into a first group and a second group, so as to be electrically connected to the contact pads 110 .

Fig. 4c shows another variant embodiment of the second embodiment shown in Fig. 4a. In this embodiment, part of the contact pads 110 of the first group 111 are disposed in the contact pads 110 of the second group 112 , and part of the contact pads 110 of the first group 111 are disposed outside the contact pads 110 of the second group 112 . Likewise, the conductive bumps 310 corresponding to the contact pads 110 can also be divided into a first group and a second group, so as to be electrically connected to the contact pads 110 . With this arrangement, the bonding status of the contact pads 110 and the conductive bumps 110 in different regions can also be grasped.

In the third embodiment shown in FIG. 5 a , the first group 111 includes a single contact pad 110 . Sensing elements 500 are arranged on both sides of the contact pads 110 respectively, and the contact pads 110 of the first group 111 are arranged outside the contact pads 110 of the second group 112, but not limited thereto, and the sensing elements 500 can also be arranged on at least two contact pads 110. The outer side of the first group 111 of three contact pads (for example, two, three, four, five contact pads, etc.), that is, the outer side of at least two contact pads. Preferably, the contact pads 110 in the first group 111 are alignment contact pads 110, dummy contact pads 110, or several contact pads 110 used for other non-signal transmission purposes; and the contact pads in the second group 112 110 does not include other contact pads 110 in the first group 111, and the contact pads 110 in the second group 112 include several contact pads 110, alignment contact pads 110, and dummy contact pads 110 for signal transmission purposes. , or several contact pads 110 for other non-signal transmission purposes. Likewise, the conductive bumps 310 corresponding to the contact pads 110 can also be divided into a first group and a second group, so as to be electrically connected to the contact pads 110 .

Fig. 5b shows another variant embodiment of the third embodiment shown in Fig. 5a. In this embodiment, the first group 111 only includes a single contact pad 110, and it is arranged among the contact pads 110 of the second group 112; arranging the sensing element 500 on both sides of the selected contact pad 110, making it the contact pad 110 of the first group 111, but not limited thereto, the first group 111 may also include at least two contact pads 110, And it is disposed in the contact pads 110 of the second group 112 , and the sensing element 500 is disposed on both sides of the contact pads of the first group. At this time, the contact pads 110 of the first group 111 and the second group 112 are preferably contact pads 110 for transmitting circuit signals, but are not limited thereto, and may also be non-contact pads 110 for transmitting circuit signals (such as alignment contact pads, dummy contact pads, or other contact pads). Therefore, in this embodiment, the difference between the contact pads 110 of the first group 111 and the contact pads 110 of the second group 112 is that the sensing elements 500 are arranged on both sides of the contact pads 110 of the first group 111; Sensing elements 500 are not provided on both sides of the contact pads 110 of the group 112 . Likewise, the conductive bumps 310 corresponding to the contact pads 110 can also be divided into a first group and a second group, so as to be electrically connected to the contact pads 110 .

In addition, in the embodiments of FIG. 4a to FIG. 4c and FIG. 5a to FIG. 5b, the sensing element 500 is a circuit with a linear pattern, but it is not limited thereto. The sensing element 500 can also be implemented as shown in FIG. 6 For example, a circuit of a rectangular pattern, or a circuit of other shapes, or a combination of circuits of the above shapes (for example, the pattern of the sensing element can be a rectangular pattern first, and then a linear pattern, or a linear pattern first, and then a linear pattern. rectangular pattern, and finally a linear pattern). In addition, this embodiment can also be used in conjunction with the above-mentioned embodiments, such as arrangement and design specifications.

In the embodiments of FIGS. 4 a to 4 c and FIGS. 5 a to 5 b , the circuit module 300 is used as an integrated circuit as an implementation example, and is connected to the substrate 100 . At this time, the conductive bump 310 on the circuit module 300 is electrically connected to the contact pad 110 on the substrate 100 by means of a bonding material; however, in different embodiments, the circuit module 300 also includes: a flexible substrate, such as a flexible circuit board (FPC) , thermoplastic polymers, thermosetting polymers, or a combination of the above circuit boards or polymers; rigid substrates, such as printed circuit boards (PCBs), ceramics, or other materials; or combinations of the above flexible substrates and rigid substrates as substrates. Wherein, the above-mentioned substrate may optionally include or not include a driving circuit (such as an integrated circuit, including a chip).

For example, in the fifth embodiment shown in FIG. 7 , the circuit module 300 includes a flexible circuit board 350 as a substrate. Wherein, the flexible circuit board may optionally include or not include a driving circuit (such as an integrated circuit). The contact pads 110 of the first group 111 are disposed outside the contact pads 110 of the second group 112 . The conductive bumps 310 corresponding to the contact pads 110 can also be divided into a first group and a second group, so as to be electrically connected to the contact pads 110 . In addition, in the variation of the fifth embodiment, the methods described in the above embodiments can also be used, such as: interspersing the contact pads 110 of the first group 111 with the contact pads 110 of the second group 112 . The conductive bumps 310 corresponding to the contact pads 110 are respectively disposed corresponding to the contact pads 110 and are electrically connected. However, in the fifth embodiment shown in FIG. 7, a rigid substrate such as a printed circuit board can also be used instead of the flexible circuit board. Wherein, the printed circuit board may optionally include or not include a driving circuit (such as an integrated circuit, including a chip). It must be pointed out that the circuit bonding detection device is not limited to the connection between the flexible circuit board 350 and the contact pads 110 on the substrate 100, and can also be selectively used for the connection between the flexible circuit board 350 and the contact pads 110 on other devices. At least one of the contact pads 110 on the substrate 100 is connected to other types of circuit modules 300 .

However, the circuit module 300 may also include a flexible substrate and a rigid substrate at the same time. For example, in the sixth embodiment shown in FIG. 8, the circuit module 300 includes a flexible circuit board 350 and a printed circuit board 370, wherein the printed circuit board 370 is connected to the flexible circuit board 350, and the flexible circuit board 350 and the printed circuit board At least one of 370 may optionally include or not include driver circuitry (eg, integrated circuits). The contact pads 110 of the first group 111 are disposed outside the contact pads 110 of the second group 112 . The conductive bumps 310 corresponding to the contact pads 110 can also be divided into a first group and a second group to generate electrical connection with the contact pads 110 . In a variation of the sixth embodiment, the methods described in the above embodiments may also be used, such as: interspersing the contact pads 110 of the first group 111 with the contact pads 110 of the second group 112 . The conductive bumps 310 corresponding to the contact pads 110 are respectively disposed corresponding to the contact pads 110 and are electrically connected. It must be pointed out that the circuit bonding detection device is not limited to the connection between the flexible circuit board 350 and the contact pad 110 on the substrate 100, and can also be selectively used for the connection between the flexible circuit board 350 and the rigid substrate 370, and for rigid At least one of the connections between the substrate 370 and the contact pads 110 on other devices.

In the seventh embodiment shown in FIG. 9 a , the first group 111 consists of three adjacent contact pads 110 . The sensing elements 500 are respectively disposed on two sides of the first group 111 and between adjacent contact pads 110 . In other words, the three contact pads 110 of the first group 111 are arranged alternately with the four sensing elements 500 . However, in a variant of the seventh embodiment shown in FIG. 9 b , the first group 111 consists of three contact pads 110 spaced apart from each other. At this time, a sensing element 500 is respectively disposed on two sides of each contact pad 110 .

The invention also provides a detection method for the pressing state of the circuit. In the embodiment shown in FIG. 10 , step 1010 is disposing the sensing element 500 on both sides of the contact pad 110 in the first group 111 . The arrangement of the sensing element 500 includes using various semiconductor processes, thin film circuit processes or other processes, such as sputtering process, yellowing process, etching process and so on. In addition, this step can also be changed to dispose the sensing element 500 on both sides of the conductive bump 310 on the circuit module 300 or both (such as the circuit module and the substrate) are provided with the sensing element 500 .

Step 1030 is to press the substrate 100 and the circuit module 300 to electrically connect the plurality of contact pads 110 on the substrate 110 to the plurality of conductive bumps 310 on the circuit module 300 . This step preferably includes providing a bonding material between the substrate 110 and the circuit module 300 . The bonding material preferably includes a bonding material with/without conductive particles, such as anisotropic conductive adhesive film or other polymers. The present invention takes an anisotropic conductive adhesive film with conductive particles as an example; however, in different embodiments In the present invention, the bonding material can also be replaced by other suitable materials (such as solder, patch, or other materials). In addition, this step may also include aligning the plurality of contact pads 110 on the substrate 110 with the plurality of conductive bumps 310 on the circuit module 300 to reduce misalignment when the contact pads 110 are bonded to the conductive bumps 310 occur.

Step 1050 is to use the detection unit 700 to measure the set of sensing elements 500 to determine whether the contact pads 110 and/or their corresponding conductive bumps 310 between the set of sensing elements 500 are deformed. When the contact pad 110 in the first group 111 and/or its corresponding conductive bump 310 is deformed due to pressing or other reasons and contacts any sensing element 500, the detection unit 700 can detect the sensing element 500 by means of transmission and/or detection. This change of state is known by the signal on the sensing element 500. In addition, if the detection units 700 on both sides of the same contact pad 110 are touched at the same time, the detection units 700 can also detect the state change. The sensing element 500 on one side of the contact pad 110 is preferably used to transmit the ground signal Vg, and the sensing element 500 on the other side of the same contact pad 110 is preferably used to transmit the common signal. Vcom, the common signal Vcom is, for example, the Vcom transmitted by the circuit on the substrate 100, but is not limited thereto, and can also selectively transmit the signal provided by the circuit on the substrate 100, the signal provided by the circuit module 300, and other signal sources. At least one of a signal or voltage potential is provided. Then the group of sensing elements 500 transmits the feedback signal to the detection unit 700 for the detection unit 700 to judge whether the feedback signal is substantially equal to the originally sent signal. When the contact pads 110 in the first group 111 and/or the corresponding conductive bumps 310 are deformed due to pressing or other reasons and contact any sensing element 500, it will affect or change all the sensing elements 500. The received signal or voltage level further changes the feedback signal transmitted from the sensing element 500 to the detection unit 700 . At this time, the detection unit 700 judges that the feedback signal is substantially not equal to the original signal, and can know that the contact pad 110 or its corresponding conductive bump 310 is deformed or poorly bonded.

If the detection unit 700 determines that the contact pad 110 or its corresponding conductive bump 310 has been deformed, it proceeds to step 1070 to output an error signal for identification. However, in order to make it easy for personnel to know whether the signal is wrong, preferably, the detection unit 700 transmits the wrong signal to the warning device 710 and issues a warning through the warning device 710 . In a preferred embodiment, the error signal is a signal change (ie difference) of the contact pad 110 and/or conductive bump 310 in contact with the sensing element 500, preferably an absolute signal difference, but not limited to Therefore, it can also be judged according to the original signal difference. The warning device 710 may include a display screen, a speaker device, a form generating device, other devices, or a combination thereof; and the form of the warning includes screen display, warning sound, report, other forms, or a combination of the above.

In addition, the substrate 100 described in the above-mentioned embodiments of the present invention is an example of a substrate in a display panel, but can also be appropriately changed according to design requirements, application fields and materials of the substrate. In addition, the contact pads and conductive bumps described in the above-mentioned embodiments of the present invention all take a certain side of a component (such as a substrate, a circuit module, a flexible circuit board, a printed circuit board, etc.) It is required to be used on all sides of the element, that is, the design of the invention is provided on at least one side of the element. Moreover, the sensing element described in the above-mentioned embodiments of the present invention is exemplified by transmitting the ground signal Vg and the common signal Vcom, but is not limited thereto, and can also selectively transmit the ground signal, the common signal Vcom, and the circuit on the transmission substrate 100 The signal provided, the signal provided by the circuit module 300 and the signal provided by other signal sources or at least one of the voltage potential, or other easily distinguishable signals.

The detection device and detection method of the present invention can be used in display panels, such as liquid crystal display panels, electroluminescent diode display panels (such as organic, inorganic, or combinations of the above), or other types of display panels, or combinations of the above display panels. Circuit bond conditions; however, may also be used to detect bond conditions of integrated circuit packages, various electronic device circuits, various circuit board packages, or other circuits. In addition, as shown in FIG. 11 , the display panel 830 and the electronic component 810 described above in the present invention are combined into an electronic device 800 . The electronic element 810 includes, for example, a control element, an operation element, a processing element, an input element, a storage element, a drive element, a light emitting element, a protection element, a sensing element, a detection element, or other functional elements, or a combination of the above elements. The types of electronic equipment include portable products (such as mobile phones, video cameras, cameras, notebook computers, electronic photo frames, game consoles, watches, music players, electronic mail transceivers, map navigators or similar products), audio-visual products (such as audio-visual players or similar products), screens, TVs, indoor/outdoor signage, panels inside projectors, etc.

The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, equivalent modifications and equivalent arrangements made for the present invention are included in the scope of the claims of the present invention.

Claims (31)

1. circuit joint detector comprises:

Substrate, this substrate is provided with a plurality of contact mats, and wherein said a plurality of contact mats comprise at least one first group, and this first group has at least one contact mat;

Circuit module, correspondence are arranged on this substrate, and comprise a plurality of conductive projections, and described a plurality of conductive projections are corresponding to described a plurality of contact mats;

One group of sensing element, be arranged in this first group this contact mat and corresponding to the conductive projection of this contact mat in this first group both sides of one of them at least; And

Detecting unit, be connected in this group sensing element, with box lunch in this first group this contact mat and corresponding to this conductive projection of this contact mat in this first group one of them produces distortion and when contacting at least one sensing element in this group sensing element at least, the output error signal.

2. device as claimed in claim 1, wherein this rub-out signal be in this first group this contact mat and corresponding at least one signal difference of this conductive projection of this contact mat in this first group.

3. device as claimed in claim 1, wherein at least one sensing element in this group sensing element comprises the combination of linear pattern, rectangular patterns or above-mentioned pattern.

4. device as claimed in claim 1, wherein said a plurality of contact mat comprises at least one second group, this second group has a plurality of contact mats, and this first group the position that is provided with that so has at least one contact mat comprises and is arranged at this outside of second group with described a plurality of contact mats, has among this second group of described a plurality of contact mats or above-mentioned combination.

5. device as claimed in claim 1, wherein one of them sensing element of this group sensing element have ground signalling and common signal one of them.

6. device as claimed in claim 5, wherein one of them sensing element of this group sensing element has ground signalling, and another sensing element has common signal.

7. device as claimed in claim 1, wherein the distance of a wherein side of this contact mat in one of them sensing element of this group sensing element and this first group in fact greater than or equal 2 microns in fact.

8. device as claimed in claim 1, wherein this contact mat in this first group and the deflection when producing distortion corresponding at least one at least one side of this conductive projection of this contact mat in this first group in fact greater than or equal 50% in fact.

9. device as claimed in claim 1, wherein this circuit module comprises integrated circuit, flexible substrate, rigid substrate or above-mentioned combination.

10. device as claimed in claim 1, wherein the material of this substrate comprises transparent material, opaque material or flexible material.

11. a circuit joint detector comprises:

Substrate, this substrate is provided with a plurality of contact mats, and wherein this contact mat comprises at least one first group, and this first group has at least two contact mats;

Circuit module, correspondence are arranged on this substrate, and comprise a plurality of conductive projections, and described a plurality of conductive projections are corresponding to described a plurality of contact mats;

One group of sensing element, with this first group in each contact mat and corresponding to the conductive projection of each contact mat in this first group one of them is staggered accordingly at least; And

Detecting unit, be connected in this group sensing element, when contacting at least one sensing element in this group sensing element with at least one of described a plurality of contact mats of box lunch in this first group and corresponding at least one of described a plurality of conductive projections of the described a plurality of contact mats in this first group produces distortion, the output error signal.

12. device as claimed in claim 11, wherein this rub-out signal be in this first group described a plurality of contact mats at least one and corresponding at least one signal difference of this conductive projection of this contact mat in this first group.

13. device as claimed in claim 11, wherein at least one sensing element in this group sensing element comprises the combination of linear pattern, rectangular patterns or above-mentioned pattern.

14. device as claimed in claim 11, wherein said a plurality of contact mat comprises at least one second group, this second group has a plurality of contact mats, and this first group the position that is provided with that so has described a plurality of contact mats comprises and is arranged at this outside of second group with described a plurality of contact mats, has among this second group of described a plurality of contact mats or above-mentioned combination.

15. device as claimed in claim 11, wherein one of them sensing element of this group sensing element have ground signalling and common signal one of them.

16. device as claimed in claim 11, wherein, one of them sensing element of this group sensing element has ground signalling, and another sensing element has common signal.

17. device as claimed in claim 11, wherein at least one of the described a plurality of contact mats in this first group and corresponding to this conductive projection of the described a plurality of contact mats in this first group at least one one of them deflection when producing distortion at least in fact greater than or equal 50% in fact.

18. device as claimed in claim 11, wherein this circuit module comprises integrated circuit, flexible substrate, rigid substrate or above-mentioned combination.

19. device as claimed in claim 11, wherein the material of this substrate comprises transparent material, opaque material or flexible material.

20. an electronic equipment comprises as claim 1 or 11 described circuit joint detector.

21. the detection method of a circuit pressing pick-up unit, this method comprises:

Circuit pressing pick-up unit is provided, and this circuit pressing pick-up unit comprises substrate, and this substrate is provided with a plurality of contact mats, and wherein said a plurality of contact mats comprise at least one first group, and this first group has at least one contact mat; Circuit module, correspondence are arranged on this substrate, and comprise a plurality of conductive projections, and described a plurality of conductive projections are corresponding to described a plurality of contact mats; One group of sensing element, correspondence be arranged in this first group this contact mat and corresponding to the both sides of one of them at least of the conductive projection of this contact mat in this first group; And detecting unit, be connected in this group sensing element;

This substrate of pressing and this circuit module make described a plurality of contact mats on this substrate and the described a plurality of conductive projections on this circuit module electrically connect; And

Measure this group sensing element, with judge on this substrate have this first group of at least one contact mat with this circuit module on whether produce distortion corresponding at least one of this conductive projection of the described a plurality of contact mats in this first group.

22. method as claimed in claim 21, wherein the step of this substrate of pressing and this circuit module comprises: described a plurality of contact mats on this substrate and the described a plurality of conductive projections on this circuit module are carried out contraposition.

23. method as claimed in claim 21 also is included between this substrate and this circuit module grafting material is provided.

24. method as claimed in claim 21, the step of wherein measuring this group sensing element comprises a signal is transferred at least one sensing element in this group sensing element, and this group sensing element is transferred to this detecting unit with another signal, detects this another signal and whether equals this signal in fact.

25. method as claimed in claim 24, wherein this signal comprises the combination of common signal, ground signalling or above-mentioned signal.

26. the detection method of a circuit pressing pick-up unit, this method comprises:

Circuit pressing pick-up unit is provided, and this circuit pressing pick-up unit comprises substrate, and this substrate is provided with a plurality of contact mats, and wherein said a plurality of contact mats comprise at least one first group, and this first group has at least two contact mats; Circuit module, correspondence are arranged on this substrate, and comprise a plurality of conductive projections, and described a plurality of conductive projections are corresponding to described a plurality of contact mats; One group of sensing element, with this first group in each contact mat and corresponding to the conductive projection of each contact mat in this first group one of them is staggered accordingly at least; And detecting unit, be connected in this group sensing element;

This substrate of pressing and this circuit module make described a plurality of contact mats on this substrate and the described a plurality of conductive projections on this circuit module electrically connect; And

Measure this group sensing element, with judge on this substrate have this first group of at least two contact mats with this circuit module on whether produce distortion corresponding at least one of this conductive projection of the described a plurality of contact mats in this first group.

27. method as claimed in claim 26, wherein the step of this substrate of pressing and this circuit module comprises: described a plurality of contact mats on this substrate and the described a plurality of conductive projections on this circuit module are carried out contraposition.

28. method as claimed in claim 26 also is included between this substrate and this circuit module grafting material is provided.

29. method as claimed in claim 26, the step of wherein measuring this group sensing element comprises a signal is transferred at least two sensing elements in this group sensing element, and this group sensing element is transferred to this detecting unit with another signal, detects this another signal and whether equals this signal in fact.

30. method as claimed in claim 29, wherein this signal comprises the combination of common signal, ground signalling or above-mentioned signal.

31. the detection method of an electronic equipment comprises the detection method as claim 21 or 26 described circuit joint detector.

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