CN100492621C

CN100492621C - heat sink

Info

Publication number: CN100492621C
Application number: CNB2005101004941A
Authority: CN
Inventors: 夏万林; 李涛; 田伟强
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-10-18
Filing date: 2005-10-18
Publication date: 2009-05-27
Anticipated expiration: 2025-10-18
Also published as: CN1953163A

Abstract

The invention relates to a heat emitter used to emit heat of electric element. Wherein, it comprises a heat adsorption part and a heat emission part connected with the adsorption part, and a heat storage element combined with said adsorption part; said storage element is a container made from thermal conductive material, filled with phase variable material. The invention has the heat storage element o adsorb heat quickly, to confirm normal operation of electric element; and the heat emission part has two conductive parts to emit heat at different directions.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that is used on the electronic component especially.

[background technology]

Electronic components such as central processing unit produce a large amount of heat in running, and if the heat of untimely its generation of discharge, the serious consequence that will influence the operation stability of electronic component even cause it to be burnt.Therefore, for guaranteeing the normal operation of electronic component, industry is installed a radiator usually and is carried out auxiliary heat dissipation on electronic component.

Generally, this radiator comprises a base and is arranged on some radiating fins on the base that this base absorbs the heat that electronic component produces, and constantly heat is dispersed in the environment by radiating fin again.

Yet the heat that electronic component produces in the course of the work is not constant always.When the situation that runs into power burst, the work speed of service of electronic component is accelerated, the heat of the generation maximum of uprushing, and temperature of electronic component increases.If the heat of electronic component can not effectively shift or distribute fast this moment, the danger that will have the temperature of electronic component of making to exceed normal range of operation must influence the operating efficiency of electronic component and shorten its useful life, will damage when even more serious.

[summary of the invention]

In view of this, the heat abstractor that is necessary to provide a kind of fast Absorption at short notice and stores big calorimetric.

A kind of heat abstractor comprises a pedestal that contacts with heat-generating electronic elements and is arranged on groups of fins on the pedestal, comprise that also one is sticked on the pedestal and be arranged at thermal store between the groups of fins, this thermal store is a container of being made by Heat Conduction Material, be filled with the phase change material in it, described groups of fins comprises along two heat-conducting parts of said base diagonally extending and some fin of being extended by the relative both sides of each heat-conducting part.

Compared to prior art, described heat abstractor absorbs heat heat abstractor by thermal store is set fast, and the assurance heat-generating electronic elements is worked under normal working temperature; This radiating part comprises two heat-conducting parts, and this heat-conducting part guiding heat distributes to different azimuth, strengthens the balanced heat dissipation capability of this radiating part.

With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.

[description of drawings]

Fig. 1 is a heat abstractor three-dimensional combination figure of the present invention.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

Fig. 3 is an inversion figure and the electronic component of Fig. 1.

[embodiment]

See also Fig. 1 to Fig. 3, heat abstractor 10 of the present invention is used for being installed on the heat-generating electronic elements 30 such as central processing unit (figure do not show) of a computer system it is dispelled the heat.This heat abstractor 10 comprises an endothermic section, the radiating part that engages with this endothermic section and a thermal store 20.

Above-mentioned endothermic section is a pedestal 12, radiating part is the groups of fins 14 that is arranged on this pedestal 12, fit and absorb heat in these pedestal 12 lower surfaces and heat-generating electronic elements 30 surfaces, pedestal 12 upper face center offer the groove 16 that extends in parallel along groups of fins 14 extension directions.This groove 16 is divided into symmetrical two parts with groups of fins 14 from pedestal 12 central authorities, wherein each part comprises the heat-conducting part 140 that is extended obliquely by pedestal 12, along heat-conducting part 140 1 sides and be parallel to first fin 142 that pedestal 12 extends and along heat-conducting part 140 relative opposite sides and perpendicular to second fin 144 of pedestal 12 extensions.

This thermal store 20 is the prismatic sealed container that a material by good heat conductivity (as aluminium) is made, and is filled with in it that fusing point is low, normal temperature can be converted into liquid phase change material by solid-state for solid-state heating down, as paraffin.Comprise the phase change material that is converted into gaseous state by liquid state in addition, as water, ethanol etc.Wherein be that by the solid-state great advantage that is converted into liquid phase change material it absorbs after a large amount of heats, the stereomutation of being followed can not change acutely.

This container comprises a square box body 22, be contained in the phase change materials 24 in the box body 22 and be sealed into the lid 26 of one with box body 22.Thermal store 20 is arranged on groove 16 bottoms, and its lower surface is sticked in the bottom surface of groove 16, and can be by heat-conducting glue mode such as bonding or tin cream welding be fixed in this groove 16.For the heat that stores in the thermal store 20 is outwards distributed fast, can add some radiating fins in the periphery of thermal store 20 so that improve its radiating efficiency.

As shown in Figure 3, during central processing unit work, the heat that this heat-generating electronic elements 30 produces is absorbed by pedestal 12 earlier, one part heat directly is passed to groups of fins 14 by pedestal 12, and by first, second fin 142,144 of heat-conducting part 140 relative both sides with heat along parallel, perpendicular to the different directions transmission of pedestal 12, reach multi-faceted even quick heat radiating; Simultaneously, another part heat is passed to the lower surface of thermal store 20 rapidly through pedestal 12 centre, is absorbed and is stored in the thermal store 20 by the phase change materials in the thermal store 20 24.When the central processing unit power burst, when heat-generating electronic elements 30 temperature are very high, the phase change that transforms (or be converted into gaseous state by liquid state) to liquid state by solid-state at high temperature takes place in the phase change materials 24 in the thermal store 20, in the phase change process, absorb big calorimetric simultaneously, and be stored in this thermal store 20, avoid a large amount of heats to concentrate on heat-generating electronic elements 30, assurance heat-generating electronic elements 30 is worked under normal working temperature; When central processing unit power recovers normal, when heat-generating electronic elements 30 temperature reduce, this phase change material 24 again by liquid state to solid-state conversion (or be converted into liquid state by gaseous state) heat release simultaneously, be dispersed in the air by groups of fins 14.

Claims

1. A heat dissipation device for heat dissipation of heating electronic components, comprising a base in contact with heating electronic components and a heat sink group arranged on the base, characterized in that: it also includes a base attached to the base and set The heat storage body between the fin groups, the heat storage body is a container made of heat-conducting material filled with a phase-change substance, the heat sink group includes two heat-conducting parts extending obliquely along the above-mentioned base and A plurality of cooling fins extending from opposite sides of each heat conducting portion.

2 . The heat dissipation device according to claim 1 , wherein the phase change substance is solid at room temperature and can be converted from solid to liquid after being heated. 3 .

3. The heat dissipation device according to claim 1, wherein the phase change substance is paraffin, water or ethanol.

4 . The heat dissipation device according to claim 1 , wherein a groove for accommodating the heat storage body is provided on a side of the base facing away from the heat-generating electronic component. 5 .

5. The heat dissipation device according to claim 4, wherein the heat dissipation fins include a first heat dissipation fin extending along one side of the heat conduction part parallel to the base, and a first heat dissipation fin extending along the other side of the heat conduction part perpendicular to the base the second heat sink.

6. The heat dissipation device according to claim 5, wherein the heat storage body is arranged parallel to the second heat dissipation fin of the heat dissipation fin group.

7. The heat dissipation device according to claim 1, wherein the heat storage body comprises a box body made of heat-conducting material and a cover sealed with the box body, and the box body accommodates a phase change substance .