CN100488028C - Electronic device with fine-tuning voltage-controlled oscillator - Google Patents
Electronic device with fine-tuning voltage-controlled oscillator Download PDFInfo
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- CN100488028C CN100488028C CNB031383696A CN03138369A CN100488028C CN 100488028 C CN100488028 C CN 100488028C CN B031383696 A CNB031383696 A CN B031383696A CN 03138369 A CN03138369 A CN 03138369A CN 100488028 C CN100488028 C CN 100488028C
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Abstract
Description
技术领域 technical field
本发明涉及一种压控振荡器,且特别关于具有一种能够在制造过程中微调输出频率范围的压控振荡器的电子装置。The present invention relates to a voltage controlled oscillator, and more particularly to an electronic device having a voltage controlled oscillator capable of fine-tuning the output frequency range during the manufacturing process.
背景技术 Background technique
不管是模拟电路或是数字电路,今日的电路设计大量使用振荡器,以实现各式的信号处理或通讯功能。压控振荡器(Voltage Control Oscillator)就是一种用来产生振荡信号的重要组件。压控振荡器的工作原理,在于对其输入不同的参考电压,即能输出不同的振荡频率。Regardless of whether it is an analog circuit or a digital circuit, oscillators are widely used in today's circuit design to realize various signal processing or communication functions. Voltage Control Oscillator (Voltage Control Oscillator) is an important component used to generate oscillating signals. The working principle of the voltage-controlled oscillator is that it can output different oscillation frequencies by inputting different reference voltages.
虽然压控振荡器的发展历史久远,然而随着现代电子设备对于振荡器的品质要求不断提升,压控振荡器的设计也在不断地翻新。虽如此,还是有许多的问题有待克服。Although the development of voltage-controlled oscillators has a long history, with the continuous improvement of the quality requirements of modern electronic equipment for oscillators, the design of voltage-controlled oscillators is also constantly being refurbished. Even so, there are still many problems to be overcome.
其中一个常见的问题是,在制造压控振荡器的过程中,往往因为材料上的限制或是制程控制上的困难,使得压控振荡器在生产过程中造成输出频率偏差或相位噪声变差的结果。然而,由于此时振荡器已经组装完成,因此如何有效控制压控振荡器的制造合格率,便成为一大挑战。One of the common problems is that in the process of manufacturing voltage-controlled oscillators, often due to material limitations or difficulties in process control, the output frequency deviation or phase noise of the voltage-controlled oscillator will deteriorate during the production process. result. However, since the oscillator has been assembled at this time, how to effectively control the manufacturing yield of the voltage-controlled oscillator becomes a big challenge.
另一个常见的问题是,随着电子装置越来越精巧,整个电路板的设计也被要求走向集成化,因此,如何能够有效利用电路板的每一处空间,都成了极待追求的目标。Another common problem is that as electronic devices become more and more compact, the design of the entire circuit board is also required to be integrated. Therefore, how to effectively use every space on the circuit board has become a goal to be pursued .
并且,现在有越来越多的高频产品,例如无线电话或是无线网络等,以目前的表面贴组件,因为其电极端点寄生着对高频不连续的杂散效应,故对于高频的特性产生相当严重的限制。因此在高频的领域中,如何掌握材料特性以达成最好的产品品质更是重要的工程。Moreover, there are now more and more high-frequency products, such as wireless phones or wireless networks, etc., with the current surface mount components, because the electrode terminals are parasitic to high-frequency discontinuous stray effects, so for high-frequency The properties of the . Therefore, in the high-frequency field, how to master the material properties to achieve the best product quality is even more important.
发明内容 Contents of the invention
因此,本发明的目的是提出一种具有微调能力的包含有压控振荡器的电子装置,且此压控振荡器具有节省电路板使用空间的效果,使其更适用于轻薄短小的高频通讯产品。Therefore, the object of the present invention is to propose an electronic device including a voltage-controlled oscillator with fine-tuning capability, and the voltage-controlled oscillator has the effect of saving the space used by the circuit board, making it more suitable for thin, light and small high-frequency communication product.
依据本发明的第一实施例的电子装置,包括:一压控振荡器,具有谐振电路(resonate circuit)、耦合电路(coupling circuit)及振荡电路(oscillatingcircuit);一第一图案化导电层,供安置该谐振电路、该耦合电路及该振荡电路,且该第一图案化导电层具有多个微带(micro-strips),供连接该谐振电路、该耦合电路及该振荡电路,且该多个微带中包含形成于该耦合电路中的一第一上微带;一第二图案化导电层,具有一与第一上微带相互重叠的第一下微带;一第一绝缘层,置于该第一导电层及该第二导电层之间,且该绝缘层包含一第一透孔,其中该第一透孔内填充导电性材料,并由该透孔连接该第一下微带至该振荡电路,使该第一上微带、该第一下微带及该第一绝缘层共同构成该耦合电路中的一第一可调式微带电容器,其中,该第一可调式微带电容的电容值能够由部分切割该第一上微带而改变,由此也微调该压控振荡器,以获得最低的相位噪声。The electronic device according to the first embodiment of the present invention includes: a voltage-controlled oscillator having a resonant circuit (resonate circuit), a coupling circuit (coupling circuit) and an oscillating circuit (oscillating circuit); a first patterned conductive layer for The resonant circuit, the coupling circuit and the oscillating circuit are arranged, and the first patterned conductive layer has a plurality of micro-strips (micro-strips) for connecting the resonant circuit, the coupling circuit and the oscillating circuit, and the plurality of The microstrip includes a first upper microstrip formed in the coupling circuit; a second patterned conductive layer having a first lower microstrip overlapping with the first upper microstrip; a first insulating layer set Between the first conductive layer and the second conductive layer, and the insulating layer includes a first through hole, wherein the first through hole is filled with a conductive material, and the first lower microstrip is connected through the through hole to the oscillating circuit, so that the first upper microstrip, the first lower microstrip and the first insulating layer jointly constitute a first adjustable microstrip capacitor in the coupling circuit, wherein the first adjustable microstrip The capacitance of the capacitor can be changed by partially cutting the first upper microstrip, thereby also fine-tuning the VCO to obtain the lowest phase noise.
在制造过程中,由对上电容微带进行切割,例如使用激光进行切割,可改变此可调式微带电容的电容量。由于此可调式微带电容的一端连接至谐振电路,另一端连接至振荡电路,当其电容量改变时,振荡电路与谐振电路间的耦合量随之改变此将同时影响振荡器的输出频率以及相位噪声。然而在本实施例中,我们仅着重于由此种压控振荡器的结构设计,来获得最低的相位噪声输出,关于振荡频率的改变将搭配第二实施例来加以补偿。During the manufacturing process, the capacitance of the tunable microstrip capacitor can be changed by cutting the upper capacitor microstrip, for example, by cutting with a laser. Since one end of the adjustable microstrip capacitor is connected to the resonant circuit and the other end is connected to the oscillating circuit, when its capacitance changes, the coupling between the oscillating circuit and the resonant circuit will change accordingly, which will simultaneously affect the output frequency of the oscillator and phase noise. However, in this embodiment, we only focus on obtaining the lowest phase noise output through the structural design of the voltage-controlled oscillator, and the change of the oscillation frequency will be compensated with the second embodiment.
依据本发明的第二实施例的电子装置,包括:一压控振荡器,具有一谐振电路、一耦合电路及一振荡电路;一第一图案化导电层,供安置该谐振电路、该耦合电路及该振荡电路的,且该第一图案化导电层具有多个微带,供连接该谐振电路、该耦合电路及该振荡电路,且该多个微带中包含形成于该谐振电路中的一第一上微带;一第二图案化导电层,具有一与第一上微带相互重叠的第一下微带;一绝缘层,置于该第一导电层及该第二导电层之间,使该第一上微带、该第一下微带及该绝缘层共同构成该谐振电路中的一第一可调式微带电容,该第一可调式微带电容与该谐振电路的一电感相接,其中,当以一第一方向切割该第一上微带时,该可调式微带电容呈现出电感性,以降低该谐振电路的一谐振频率,且当以一第二方向切割该第一上微带时,该可调式电容的电容值降低,以增高该谐振电路的该谐振频率,由此以微调该压控振荡器所产生振荡频率的范围。The electronic device according to the second embodiment of the present invention includes: a voltage controlled oscillator having a resonant circuit, a coupling circuit and an oscillating circuit; a first patterned conductive layer for arranging the resonant circuit, the coupling circuit and the oscillating circuit, and the first patterned conductive layer has a plurality of microstrips for connecting the resonant circuit, the coupling circuit and the oscillating circuit, and the plurality of microstrips include one formed in the resonant circuit The first upper microstrip; a second patterned conductive layer having a first lower microstrip overlapping with the first upper microstrip; an insulating layer placed between the first conductive layer and the second conductive layer , so that the first upper microstrip, the first lower microstrip and the insulating layer jointly constitute a first adjustable microstrip capacitance in the resonant circuit, and the first adjustable microstrip capacitance and an inductance of the resonant circuit connected, wherein, when the first upper microstrip is cut in a first direction, the adjustable microstrip capacitance presents inductance to lower a resonant frequency of the resonant circuit, and when the first upper microstrip is cut in a second direction When the first micro-strip is on, the capacitance value of the adjustable capacitor is reduced to increase the resonant frequency of the resonant circuit, thereby fine-tuning the range of the oscillating frequency generated by the voltage-controlled oscillator.
在制造过程中,经由对上微带进行不同方向的切割,例如使用激光进行切割,可改变此可调式微带电容器之电容量或使其电容本身呈现出电感性。此可调式微带电容器安置于谐振电路中,且一端与谐振电路的电感连接,另一端接地。当以第一方向切割上微带时,可调式微带电容呈现出电感性,以降低谐振电路之谐振频率;且当以第二方向切割上微带时,可调式微带电容之电容量降低,以增高谐振电路之谐振频率,藉此以微调该压控振荡器所产生振荡频率。During the manufacturing process, the capacitance of the adjustable microstrip capacitor can be changed or the capacitance itself can be inductive by cutting the upper microstrip in different directions, such as cutting with a laser. The adjustable microstrip capacitor is arranged in the resonant circuit, and one end is connected with the inductance of the resonant circuit, and the other end is grounded. When the upper microstrip is cut in the first direction, the adjustable microstrip capacitor presents inductance to reduce the resonant frequency of the resonant circuit; and when the upper microstrip is cut in the second direction, the capacitance of the adjustable microstrip capacitor decreases , to increase the resonant frequency of the resonant circuit, thereby fine-tuning the oscillating frequency generated by the voltage-controlled oscillator.
依据本发明的第三实施例的电子装置,其同时使用前面两种实施例所述的技巧。也就是说,其同时在耦合电路及谐振电路使用微带电容器及对微带的切割,以期于大量制造过程中的压控振荡器能够同时兼具最低的相位噪声并获得最准确的输出频率的微调目的。According to the electronic device of the third embodiment of the present invention, it uses the techniques described in the above two embodiments at the same time. That is to say, it uses microstrip capacitors and cutting microstrips in the coupling circuit and resonant circuit at the same time, in order to achieve the lowest phase noise and the most accurate output frequency of the VCO in the mass production process. fine-tuning purpose.
因此,本发明至少具有下列优点。Therefore, the present invention has at least the following advantages.
首先,依据本发明所设计的压控振荡器能充分地运用了电路板的空间,因此达成了更精巧的设计。其次,依据本发明所设计的压控振荡器,能够避免制造过程中因为材料或制程限制对压控振荡器的制造合格率所带来的困扰,特别是在更高频的震荡器应用时,本发明的优点将更显得突出。第三,依据本发明所设计的压控振荡器,在耦合电路部分使用可调式微带电容器,成功的取代了传统的表面贴电容器,不但提供了微调相位噪声的能力,并且克服了传统表面贴组件在电极端点所造成的不连续现象,进一步提升了此振荡器的输出品质。第四,依据本发明所设计的压控振荡器,其在谐振电路的可调式微带电容中,使用不同方向的切割,巧妙地改变电容量或让电容器本身呈现出电感性的方式,由此以提供双向的频率调整能力。第五,依据本发明所制作的压控振荡器,因为其具有微调的功能,因此通过微调也能大幅地改善制作的合格率。第六,本发明利用微带电容来取代传统的表面贴电容器,更进一步降低材料成本,有效提升产品价格的竞争力。Firstly, the voltage-controlled oscillator designed according to the present invention can fully utilize the space of the circuit board, thus achieving a more compact design. Secondly, the voltage-controlled oscillator designed according to the present invention can avoid the troubles caused by material or process restrictions on the manufacturing yield of the voltage-controlled oscillator during the manufacturing process, especially when the oscillator is applied at a higher frequency. The advantages of the present invention will be more prominent. Third, the voltage-controlled oscillator designed according to the present invention uses an adjustable microstrip capacitor in the coupling circuit, successfully replacing the traditional surface mount capacitor, which not only provides the ability to fine-tune the phase noise, but also overcomes the traditional surface mount capacitor. The discontinuities created by the components at the electrode terminals further enhance the output quality of this oscillator. Fourth, the voltage-controlled oscillator designed according to the present invention uses cutting in different directions in the adjustable microstrip capacitance of the resonant circuit to subtly change the capacitance or make the capacitor itself inductive, thus To provide two-way frequency adjustment capability. Fifth, because the voltage-controlled oscillator manufactured according to the present invention has a fine-tuning function, the yield of manufacture can be greatly improved through fine-tuning. Sixth, the present invention uses microstrip capacitors to replace traditional surface mount capacitors, which further reduces material costs and effectively improves the competitiveness of product prices.
附图说明 Description of drawings
图1是一压控振荡器的结构示意图;Fig. 1 is a schematic structural diagram of a voltage-controlled oscillator;
图2是一压控振荡器电路的电路组件示意图;2 is a schematic diagram of circuit components of a voltage-controlled oscillator circuit;
图3是依据本发明第一实施例的电路板示意图;3 is a schematic diagram of a circuit board according to a first embodiment of the present invention;
图4A是依据本发明第一实施例可调式电容结构的剖面爆炸图;4A is a cross-sectional exploded view of an adjustable capacitor structure according to the first embodiment of the present invention;
图4B是图4A的电路示意图;Fig. 4B is a schematic circuit diagram of Fig. 4A;
图5A是调整依据本发明第一实施例可调式电容的示意图;5A is a schematic diagram of adjusting an adjustable capacitor according to the first embodiment of the present invention;
图5B是调整依据本发明第一实施例可调式电容的示意图;5B is a schematic diagram of adjusting the adjustable capacitor according to the first embodiment of the present invention;
图6A是依据本发明第二实施例制作的可调式电容结构的剖面图;6A is a cross-sectional view of an adjustable capacitor structure made according to the second embodiment of the present invention;
图6B是图6A的可调式电容结构的剖面爆炸图;FIG. 6B is a cross-sectional exploded view of the adjustable capacitor structure in FIG. 6A;
图6C是电路实施例示意图;Figure 6C is a schematic diagram of a circuit embodiment;
图7A是以第一方向调整依据本发明第一实施例可调式电容的示意图;7A is a schematic diagram of adjusting the adjustable capacitor according to the first embodiment of the present invention in the first direction;
图7B是第一方向调整依据本发明第一实施例可调式电容的示意图;7B is a schematic diagram of the first direction adjustment according to the first embodiment of the adjustable capacitor of the present invention;
图7C是第二方向调整依据本发明第一实施例可调式电容的示意图;FIG. 7C is a schematic diagram of the second direction adjustment according to the first embodiment of the present invention adjustable capacitor;
图7D是以第二方向调整依据本发明第一实施例可调式电容的示意图;7D is a schematic diagram of adjusting the adjustable capacitor according to the first embodiment of the present invention in the second direction;
图8A是依据本发明第三实施例的示意图;以及FIG. 8A is a schematic diagram according to a third embodiment of the present invention; and
图8B是依据本发明第三实施例各层组件的示意图;FIG. 8B is a schematic diagram of various layer components according to the third embodiment of the present invention;
其中,附图标记说明如下:Wherein, the reference signs are explained as follows:
10 压控振荡器 11 谐振电路10 Voltage Controlled Oscillator 11 Resonant Circuit
13 耦合电路 15 振荡电路13 Coupling circuit 15 Oscillation circuit
17 控制电压 20 压控振荡器17
21 谐振电路 211 可调式微带电容21
23 耦合电路 231 可调式微带电容23
25 振荡电路 27 控制电压25
30 压控振荡器 31 谐振电路30 Voltage Controlled
32 第一导电层 33 耦合电路32 The first
331 可调式微带电容 3310 上微带331
33101 连接端 33103 切割轨迹33101
3312 下微带 3314 导电性材料3312 Lower Microstrip 3314 Conductive Material
34 绝缘层 36 第二导电层34 insulating layer 36 second conductive layer
40 压控振荡器 411 可调式微带电容40 Voltage Controlled
4110 上微带 4112 下微带4110
4116 导电性材料 41103 切割轨迹4116
41105 切割轨迹 41107 切割轨迹41105
41109 切割轨迹 42 第一导电层41109 cutting
43 电感 44 绝缘层43
441 穿孔 45 振荡电路441 Perforation 45 Oscillating circuit
46 导电层 48 绝缘层46
481 穿孔 49 电感481
具体实施方式 Detailed ways
请参照图1,是一压控振荡器10的结构示意图。压控振荡器10是利用外部控制电压17来调整振荡器10的输出频率。如图1所示,压控振荡器10包含有一谐振电路11、一耦合电路13,以及一振荡电路15。振荡电路15是用来激发振荡并维持振荡信号的延续,而谐振电路11可限缩振荡电路15所产生的振荡频率将振荡器的工作频率范围局限在所需的频率区间。耦合电路13则用来连接谐振电路11及振荡电路15。此外,调整耦合电路13也能进一步调整振荡电路15与谐振电路11间的耦合量来进一步达成相位噪声调整的目的。Please refer to FIG. 1 , which is a schematic structural diagram of a voltage controlled oscillator 10 . The VCO 10 uses an external control voltage 17 to adjust the output frequency of the oscillator 10 . As shown in FIG. 1 , the VCO 10 includes a resonant circuit 11 , a coupling circuit 13 , and an oscillating circuit 15 . The oscillation circuit 15 is used to stimulate oscillation and maintain the continuation of the oscillation signal, and the resonance circuit 11 can limit the oscillation frequency generated by the oscillation circuit 15 to limit the operating frequency range of the oscillator to a desired frequency range. The coupling circuit 13 is used to connect the resonance circuit 11 and the oscillation circuit 15 . In addition, adjusting the coupling circuit 13 can further adjust the coupling amount between the oscillation circuit 15 and the resonant circuit 11 to further achieve the purpose of phase noise adjustment.
接着,请参照图2,是例示一种压控振荡器20的电路示意图。压控振荡器20由一外部控制电压27来调整振荡器20的输出频率。如图2所示,压控振荡器20包含有一谐振电路21、一耦合电路23与一振荡电路25。Next, please refer to FIG. 2 , which is a schematic circuit diagram illustrating a voltage-controlled
在此示意例中,谐振电路21是由若干电容、电感、一可调式微带电容211与一可由电压调整的变容二极管等电路组件所组成。耦合电路23则由另一个可调式微带电容231所构成。至于振荡电路25则由若干电容、电感以及一双载子晶体管(BJT)等电路组件所组成。必须指出的是,此处所绘制的压控振荡器20仅供示意,当可使用各种些微差异的电路架构,仍应规属于本发明的范围。In this schematic example, the
本发明的重要特征包括对可调式电容211,231所提出的设计及微调方式。以下将以三个实施例对其加以说明。The important features of the present invention include the proposed design and fine-tuning method for the
第一实施例first embodiment
在此实施例中,安装于电子装置电路板上的压控振荡器,是由调整耦合电路中的可调式串联微带电容器,如图2中的可调式电容231,以达成在制造压控振荡器过程中,调整其相位噪声的工作。In this embodiment, the voltage-controlled oscillator installed on the circuit board of the electronic device is an adjustable series microstrip capacitor in the adjustment coupling circuit, such as the
请参照图3,图3是一种压控振荡器30的电路板结构。如图3所示,压控振荡器30包括一谐振电路31、一耦合电路33及一振荡电路35。谐振电路31、耦合电路33及振荡电路35的电路构造,可参考图2所示的电路示意图。Please refer to FIG. 3 . FIG. 3 is a circuit board structure of a voltage-controlled
首先,利用图案化第一导电层32来形成多个微带。这些微带具有导电性,用来连接谐振电路31、耦合电路33及振荡电路35的电路组件。在这些微带中包括一上微带3310,以构成耦合电路33的微带电容331的一部分。First, a plurality of microstrips are formed by patterning the first
此外,利用图案化一第二导电层36,使第二导电层36至少形成一下微带,且此下微带与第一导电层32的上微带3310重叠。并且,在第一导电层32与第二导电层36间夹藏一绝缘层34。绝缘层34具有一穿孔,在此穿孔中填充导电性材料,而由导电材料,可将第二导电层36与第一导电层32的上微带3310重叠的下微带连接到位于第一导电层32的振荡电路,并由此使得上微带3310、下微带及绝缘层32共同构成一可调式微带电容器331。In addition, by patterning a second conductive layer 36 , at least a lower microstrip is formed on the second conductive layer 36 , and the lower microstrip overlaps with the
接着,利用激光或其它切割工具,部分切割上微带3310,以改变可调式电容331的电容量,由此可改变耦合电路的电性,而调整压控振荡器30的相位噪声,以获得最低的相位噪声输出。Next, use a laser or other cutting tools to partially cut the
为了更清楚说明可调式微带电容器331的结构,以下请参照图4A,是图3的压控振荡器30的组合示意图。In order to illustrate the structure of the
如前所述,可调式微带电容器331是作为压控振荡器30的耦合电路33的电路组件,在一端33101连接谐振电路组件31,并在另一端33102连接振荡电路组件35。可调式微带电容器331是由上微带3310、绝缘层34及下微带3312所构成。绝缘层34具有穿孔341,其内填充导电性材料3314,以将下微带3312连接到振荡电路组件35。因此,由图4A的结构,可得到图4B所示的压控电路30的结构示意图。As mentioned above, the
接着,请参看图5A与图5B。此二图示意就俯视图观察上微带3310两种不同的调整状态。在制造压控振荡器30的过程中,可以用激光或其它切割工具,在上微带3310进行切割,例如图5A与图5B中所示的切割轨迹33103。由在上微带3310的不同位置进行切割,可使可调式微带电容331获得不同的电容量。例如图5A所示的切割轨迹,相对于图5B所示的切割轨迹,前者可使可调式微带电容331具有较小的电容值。Next, please refer to FIG. 5A and FIG. 5B . These two figures illustrate two different adjustment states of the
由于可调式微带电容331安置于压控振荡器30的耦合电路中,因此当其电容量改变时,便会改变压控振荡器的振荡电路与谐振电路间的耦合量,随切割微带多寡而呈现出不同的相位噪声以及输出频率,然而在本实施例中所探讨的是如何由耦合电容的调整来获得最佳的耦合量,以获取最低的相位噪声输出,对于频率的改变如果可能超出规格制定范围,则应该搭配第二实施例来加以补偿。Since the
第二实施例second embodiment
在此实施例中,安装于电子装置电路板上的压控振荡器,是由调整谐振电路中的可调式并联微带电容器,如图2中的可调式微带电容211,以达成在制造压控振荡器过程中,调整其输出频率的工作。In this embodiment, the voltage-controlled oscillator installed on the circuit board of the electronic device is adjusted by adjusting the adjustable parallel microstrip capacitor in the resonant circuit, such as the
请参照图6A,其示意一种压控振荡器40的电路板结构及其线路。压控振荡器40包括一谐振电路、一耦合电路及一振荡电路三部分。谐振电路、耦合电路及振荡电路的电路构造,可参考图2所示的电路示意图。Please refer to FIG. 6A , which illustrates a circuit board structure and circuit of a voltage-controlled oscillator 40 . The VCO 40 includes three parts: a resonant circuit, a coupling circuit and an oscillating circuit. For the circuit structure of the resonant circuit, the coupling circuit and the oscillating circuit, please refer to the circuit diagram shown in FIG. 2 .
在此实施例中其电路结构如下。首先,将第一导电层42图案化以形成多个微带。这些微带具有导电性,用来连接谐振电路、耦合电路及振荡电路的电路组件。并且,在这些微带中包括一上微带4110,位于谐振电路中成为谐振电路的一部分。In this embodiment, its circuit structure is as follows. First, the first
此外,将第二导电层46图案化,使第二导电层46至少形成一个下微带接地,并与第一导电层42的上微带4110重叠。并且,在第一导电层42与第二导电层46间安置一绝缘层44。绝缘层44具有一穿孔481,在穿孔481中填充导电性材料4116,而由导电材料4116,可将第二导电层46与第一导电层42重叠的下微带连接到位于第一导电层42的振荡电路,由此使得上微带4110、下微带及绝缘层44共同构成一可调式微带电容器411,且此可调式微带电容器安置于谐振电路中。In addition, the second
接着,决定压控振荡器的输出频率应该调高或调低。如图6B所示,当决定调低输出频率时,利用激光或其它切割工具,以一第一方向A部分切割上微带,此时,该微带电容将因为电波传输路径增长而呈现出电感性,由此以降低谐振电路的谐振频率。相对地,如果决定要调高输出频率时,则利用激光或其它切割工具,以一第二方向B部分切割上微带,由此以降低微带电容411的电容量,进而达到增高谐振电路的谐振频率的目的。由上述方法,便可调整压控振荡器所输出振荡频率。Next, decide whether the output frequency of the VCO should be adjusted up or down. As shown in Figure 6B, when it is decided to lower the output frequency, laser or other cutting tools are used to cut the upper microstrip in a first direction A. At this time, the microstrip capacitor will present an electric current due to the increase of the electric wave transmission path. Inductive, thereby reducing the resonant frequency of the resonant circuit. Conversely, if it is decided to increase the output frequency, laser or other cutting tools are used to cut the upper microstrip in a second direction B, thereby reducing the capacitance of the
为了更清楚地说明此种可调式微带电容器的结构,请参照图6B,此图例示可调式电容器411的结构。由于此可调式电容器411与第一实施例的可调式电容331部分结构类似,因此在下面的说明中,标号与前面相同者,其意义可参照前面的描述。In order to illustrate the structure of the adjustable microstrip capacitor more clearly, please refer to FIG. 6B , which illustrates the structure of the
可调式电容器411由上微带4110、下微带4112及夹在二者间的绝缘层44构成。上微带4110及下微带4112分别由图案化第一导电层42及第二导电层46而成。在此例子中,可调式电容411的上微带4110与电感49及电感43相接,另一端则由绝缘层48的穿孔481中的导电性材质4116连接到地。此外,请参照图6C,此图例示可调式微带电容器411与电感49相接并与电感43并联的电路示意图。The
接着,请参照图7A与图7B,其说明以第一方向A切割可调式微带电容器411的上微带4110,由此使得可调式微带电容器411呈现出电感性,并改变其谐振电路的谐振频率,进而调整压控振荡器的输出频率范围。Next, please refer to FIG. 7A and FIG. 7B , which illustrate that the
举例来说,如果以激光或其它切割工具在上微带4110切出图7A的轨迹41103,则可降低压控振荡器的输出频率。如果想要使压控振荡器的输出频率降得更低,则可切出如图7B的轨迹41105。For example, if the
接着,请参照图7C与图7D,此二图说明以第二方向B切割可调式微带电容411的上微带4110切出图7C的轨迹41107与图7D的轨迹41109,由此以改变可调式电容411的电容值使得谐振频率将因为并联电容量减小而上升。如果以激光或其它切割工具在上微带4110切出图7D的轨迹41109,则压控振荡器的输出频率可以升得更高。Next, please refer to FIG. 7C and FIG. 7D. These two figures illustrate that cutting the
第三实施例third embodiment
除了上述的两个实施例分别在耦合电路及谐振电路上安置可调式微带电容器,另一种实施例则为同时在耦合电路及谐振电路上安置可调式微带电容器。In addition to the above-mentioned two embodiments where the adjustable microstrip capacitors are arranged on the coupling circuit and the resonant circuit respectively, another embodiment is to arrange the adjustable microstrip capacitors on the coupling circuit and the resonant circuit at the same time.
也就是说,第三实施例是结合第一实施例及第二实施例。请参照图8A,此图显示了一种结合第一实施例与第二实施例的电路板。在此电路板上,具有由微带所构成的可调式微带电容211与231,分别安置于压控振荡器的耦合电路与谐振电路。其中,可调式微带电容211可在不同位置切割,以提供不同的耦合电容量,来获得最低的相位噪声。至于可调式微带电容231则可于X方向,及Y方向切割,由此以精确地调整压控振荡器的输出频率。That is to say, the third embodiment is a combination of the first embodiment and the second embodiment. Please refer to FIG. 8A , which shows a circuit board combining the first embodiment and the second embodiment. On this circuit board, there are
此外,请参照图8B,此图显示了图8A的电路板的立体爆炸图。由此并配合前面的说明,则可更清楚地掌握本发明的技术。In addition, please refer to FIG. 8B , which shows a three-dimensional exploded view of the circuit board in FIG. 8A . From this and in conjunction with the foregoing description, the technology of the present invention can be grasped more clearly.
虽然本发明已以一较佳实施例揭露如上,但是并非用以限定本发明,任何本技术领域的普通技术人员,在不脱离本发明的精神和范围内,所做出的等效结构变换,均包含在本发明的专利范围内。Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any equivalent structural transformation made by any person of ordinary skill in the art without departing from the spirit and scope of the present invention, All are included in the patent scope of the present invention.
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US5600279A (en) * | 1994-09-08 | 1997-02-04 | Mitsubishi Denki Kabushiki Kaisha | VCO having adjustment for fluctuations in relation between control voltage and output frequency |
CN1270492A (en) * | 1999-04-13 | 2000-10-18 | 台达电子工业股份有限公司 | Method and Configuration of Voltage Controlled Oscillator Frequency Adjustment |
KR20020017512A (en) * | 2000-08-30 | 2002-03-07 | 권원현 | Phase Noise Enhancement Method for Miniature Voltage Controlled Oscillator composed of Integrated Circuits |
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CN1270492A (en) * | 1999-04-13 | 2000-10-18 | 台达电子工业股份有限公司 | Method and Configuration of Voltage Controlled Oscillator Frequency Adjustment |
KR20020017512A (en) * | 2000-08-30 | 2002-03-07 | 권원현 | Phase Noise Enhancement Method for Miniature Voltage Controlled Oscillator composed of Integrated Circuits |
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