CN100485474C - Double-sided display panel module sharing one application-specific integrated circuit chip - Google Patents
Double-sided display panel module sharing one application-specific integrated circuit chip Download PDFInfo
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- CN100485474C CN100485474C CNB031411940A CN03141194A CN100485474C CN 100485474 C CN100485474 C CN 100485474C CN B031411940 A CNB031411940 A CN B031411940A CN 03141194 A CN03141194 A CN 03141194A CN 100485474 C CN100485474 C CN 100485474C
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- 239000011521 glass Substances 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004973 liquid crystal related substance Substances 0.000 claims description 34
- 238000009792 diffusion process Methods 0.000 claims description 11
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000012769 display material Substances 0.000 claims 4
- 238000012536 packaging technology Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- HOBRTVXSIVSXIA-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-phenylbenzene Chemical compound ClC1=C(Cl)C(Cl)=CC(Cl)=C1C1=CC=CC=C1 HOBRTVXSIVSXIA-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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Abstract
The invention discloses a double-sided display panel module sharing a special application integrated circuit chip. The main display panel module is used for providing a front image display function, and the auxiliary display panel module is arranged below the main display panel module in parallel and used for providing a back image display function. A common backlight module is used for providing a light source module required by the main display panel module and the auxiliary display panel module for displaying images. Two ends of a flexible circuit board are connected between the glass substrate bulge of the main display panel module and the glass substrate bulge of the auxiliary display panel module. And the special application integrated circuit chip is assembled on the flexible circuit board by a die soft film bonding packaging technology, so that the main display panel module and the auxiliary display panel module share the special application integrated circuit chip.
Description
Technical field
The present invention relates to a kind of display with double faces, relevant especially a kind of dual-display module (dual-displaypanel module), the shared Application Specific Integrated Circuit of its main display panel and secondary display panel (ASIC) chip.
Background technology
In present flat-panel screens technical development, having released can be in the LCD of the two sides of panel display image and literal, be referred to as double side liquid crystal display (dual LCD) again, it is applicable to the clamshell phone that adopts LCD Panel and palmtop computer etc.For a dual-display module (dual-display panel module), therefore the shared backlight module of its main screen and secondary screen is having concurrently outside panel slimming and the light-weighted characteristic, can also reach the advantage that reduces number of parts.
See also Fig. 1, it shows the diagrammatic cross-section of existing dual-display module, represent a kind of amorphous silicon (amorphous silicon, the dual-display module of TFT-LCD a-Si), and the display area of main display module is greater than the display area of secondary display module.Dual-display module is by a main display module, a secondary display module and a shared backlight module, main display module is in order to provide positive image display function, secondary display module is in order to provide the image display function of reverse side, and backlight module comprises one in order to main display module and the required light source of secondary display module display image to be provided, and one in order to improve the intensity of light source and inhomogeneity light source module.
Main display module includes on one first liquid crystal panel 10, Polarizer 12I and Polarizer 12II once, and first liquid crystal panel 10 is made of an a pair of upper and lower glass substrate and a liquid crystal layer.Secondary display module includes on one second liquid crystal panel 20, Polarizer 22I and Polarizer 22II once, and second liquid crystal panel 20 is made of an a pair of upper and lower glass substrate and a liquid crystal layer.In addition, light source module is adjacent to first liquid crystal panel, 10 places and includes one first prismatic lens 14I, one second prismatic lens 14II and a diffusion sheet 16, be adjacent to second liquid crystal panel, 20 places and include one first prismatic lens 24I, one second prismatic lens 24II and a diffusion sheet 26, and be folded with the reflector plate 28 of a light guide plate 18 and a semi-penetration semi-reflective between two diffusion sheets 16,26.
In the chip packaging technology of dual-display module, with non-crystalline silicon tft-LCD shown in Figure 1 is example, be with glass top chip (COG) (chip-on-glass, directly being engaged in chip on glass) technology is assembled in the chip for driving of panel module on the glass substrate, therefore a plurality of chip for driving 30A of main display module are formed on the glass substrate protuberance of first liquid crystal panel 10, and a plurality of chip for driving 30B of secondary display module are formed on the glass substrate protuberance of second liquid crystal panel 20.In addition, one Application Specific Integrated Circuit (ASIC) but chip and IC element nationality on every side thereof engage (Chip on Flex by pipe chip on film, COF) structure packing technique and produce with panel engages, therefore the employed first asic chip 34A of main display module combines with the glass substrate generation of first liquid crystal panel 10 by one first flexible PCB 32A, and the employed second asic chip 34B of secondary display module combines with the glass substrate generation of second liquid crystal panel 20 by one second flexible PCB 32B.
See also Fig. 2, it shows the diagrammatic cross-section of existing dual-display module, represent a kind of low temperature polycrystalline silicon (low-temperature polysilicon, LTPS) dual-display module of TFT-LCD, and the display area of main display module equals the display area of secondary display module.The element of dual-display module shown in Figure 2 is roughly same as shown in Figure 1, and difference is the integration mode of drive IC.Because the electronic conduction speed of the TFT-LCD of low temperature polycrystalline silicon is very fast, therefore the part drive IC can be integrated into glass substrate inside, to reduce material cost and to help reducing line between the required area of circuit board and number of elements and drive IC and the panel electrode.
In the dual-display module of above-mentioned Fig. 1 and Fig. 2, main display module and secondary display module are driven by the first asic chip 34A and the second asic chip 34B respectively, are connected on the system board again.But the problem that power consumption is excessive, the cost of whole front panel module increases can take place, and be unfavorable for reducing required area and number of elements on the flexible PCB if each uses an asic chip in existing dual-display module.
Summary of the invention
In view of this, purpose of the present invention just is to provide a kind of dual-display module, make the shared asic chip of its main display panel and secondary display panel, with advantages such as required area and number of elements on realization reduction power consumption, the cost that reduces the whole front panel module, the minimizing flexible PCB.
For achieving the above object, the invention provides a kind of dual-display module of a shared asic chip.One main display module is in order to provide positive image display function, and a secondary display module is set in parallel in the below of this main display module, in order to the image display function of reverse side to be provided.One shared backlight module is in order to provide main display module and secondary display module display image required a light source and a light source module.The two ends of one flexible PCB be connected in this main display module the glass substrate protuberance and should the glass substrate protuberance of pair display module between.One Application Specific Integrated Circuit (ASIC) chip, engage (Chip on Flex by pipe chip on film, COF) structure packing technique and being assembled on this flexible PCB is so that this main display module and should shared this Application Specific Integrated Circuit of pair display module (ASIC) chip.
Description of drawings
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Fig. 1 is the diagrammatic cross-section of existing dual-display module, represent a kind of dual-display module of Thin Film Transistor-LCD (TFT-LCD) of amorphous silicon, and the display area of main display module is greater than the display area of secondary display module;
Fig. 2 is the diagrammatic cross-section of existing dual-display module, represent the dual-display module of a kind of TFT-LCD of low temperature polycrystalline silicon, and the display area of main display module equals the display area of secondary display module;
Fig. 3 is the diagrammatic cross-section of the dual-display module of one embodiment of the present invention; And
Fig. 4 is the diagrammatic cross-section of the dual-display module of another preferred embodiment of the present invention.
Description of reference numerals in the accompanying drawing is as follows:
10,20 liquid crystal panels; 12I, 12II, 22I, 22II Polarizer;
14I, 14II, 24I, 24II prismatic lens; 16,26 diffusion sheets;
18 light guide plate; 28 semi-penetration semi-reflective sheets;
30A, 30B chip for driving; 32A, 32B flexible PCB;
34A, 34B asic chip; M master's display module;
The secondary display module of S; The L light source module;
40,50 liquid crystal panels; 42I, 42II, 52I, 52II Polarizer;
44I, 44II, 54I, 54II prismatic lens; 46,56 diffusion sheets;
48 light guide plate; 58 semi-penetration semi-reflective sheets;
60A, 60B chip for driving; 62 flexible PCBs;
64 ASIC chips.
Embodiment
See also Fig. 3, it shows the diagrammatic cross-section of dual-display module of the present invention.Dual-display module is by a main display module M, a secondary display module S and a shared backlight module, main display module M is in order to provide positive image display function, secondary display module S is in order to provide the image display function of reverse side, and backlight module includes one in order to main display module and the required light source of secondary display module display image to be provided, and one in order to improve the intensity of light source and inhomogeneity light source module L.Dual-display module of the present invention can be applicable in the various flat-panel screens technology, include: LCD, plasma planar display, display of organic electroluminescence or the like, and do not limit area relationship between main display module M and the secondary display module S, position relation, function what etc. condition.
Fig. 3 represents a kind of amorphous silicon (amorphous silicon, the dual-display module of TFT-LCD a-Si), and the display area of main display module M is greater than the display area of secondary display module S.Main display module M includes on one first liquid crystal panel 40, Polarizer 42I and Polarizer 42II once, and first liquid crystal panel 40 is made of an a pair of upper and lower glass substrate and a liquid crystal layer, is manufactured with driving element (as: tft array element), pixel electrode, liquid crystal alignment layer, colored filter or the like in it.Secondary display module S includes on one second liquid crystal panel 50, Polarizer 52I and Polarizer 52II once, and second liquid crystal panel 50 is made of an a pair of upper and lower glass substrate and a liquid crystal layer, is manufactured with driving element (as: tft array element), pixel electrode, liquid crystal alignment layer, colored filter or the like in it.
In addition, light source module L is arranged between main display module M and the secondary display module S, its following Polarizer 42II place that is adjacent to first liquid crystal panel 40 includes one first prismatic lens 44I, one second prismatic lens 44II and a diffusion sheet 46, its following Polarizer 52II place that is adjacent to second liquid crystal panel 50 includes one first prismatic lens 54I, one second prismatic lens 54II and a diffusion sheet 56, and is folded with the reflector plate 58 of a light guide plate 48 and a semi-penetration semi-reflective between two diffusion sheets 46,56.Light guide plate 48 is in order to incident light source is converted into an area source, and reflector plate 58 is in order to reflection function that light guide plate 48 bottoms are provided and the light source that penetrates the back is provided, and diffusion sheet 46,56 and prismatic lens 44,54 are in order to improve the ejaculation light characteristic of light guide plate 48.
In the chip packaging technology of dual-display module, with non-crystalline silicon tft-LCD shown in Figure 3 is example, with COG (chip-on-glass, directly being engaged in chip on glass) technology is assembled in the chip for driving of panel module on the glass substrate, therefore a plurality of chip for driving 60A of main display module M are formed on the glass substrate protuberance of first liquid crystal panel 40, and a plurality of chip for driving 60B of secondary display module S are formed on the glass substrate protuberance of second liquid crystal panel 50.
In addition, an Application Specific Integrated Circuit (ASIC) chip and IC element on every side thereof can engage that (Chip on Flex, COF) structure packing technique and produce with panel engages by pipe chip on film.Because feature of the present invention is to make main display module M and the shared asic chip 64 of secondary display module S, therefore the two ends of a flexible PCB 62 can be connected on the glass substrate of first liquid crystal panel 40 and second liquid crystal panel 50.So-called ASIC specially refers to according to customer demand, and the IC of circuit design with realization product intention is provided, and is that the circuit with a plurality of traditional die is incorporated on the chip, can reduce the product repair rate significantly.Developed at present and finished many moneys asic chip, comprised image/drawing chip, LCD panel control IC and LCD display control chip etc.COF structure packing technique is a kind of with the technology of tube core flip-chip bond (Flip Chip Bonding) on a flexible PCB (FPC) base material, be to utilize halogen-containing and not plumbous non-conductive adhesive material and flexible PCB to interosculate, the differential contraction stress after wherein non-conductive adhesive solidifies can directly make the IC tube core contact conducting with the electrode of flexible PCB.
As can be known above-mentioned, in the dual-display module of the present invention, the IC element of main display module M and secondary display module S shared asic chip 64 and periphery thereof by being connected of flexible PCB 62 is connected on the system board again.Therefore, under the situation of a shared asic chip 64, can effectively reduce living power consumption, reduce the cost of whole front panel module, help reducing required area and number of elements on the flexible PCB and effectively save the space of asic chip and the peripheral IC element thereof of secondary display module S.
See also Fig. 4, it shows the diagrammatic cross-section of dual-display module of the present invention, represent a kind of low temperature polycrystalline silicon (low-temperature polysilicon, LTPS) dual-display module of TFT-LCD, and the display area of main display module M equals the display area of secondary display module S.The element of dual-display module shown in Figure 4 is roughly same as shown in Figure 3, and difference is the integration mode of drive IC.Because the electronic conduction speed of the TFT-LCD of low temperature polycrystalline silicon is very fast, therefore the part drive IC can be integrated into glass substrate inside, to reduce material cost and to help reducing line between the required area of circuit board and number of elements and drive IC and the panel electrode.Because main display module M and secondary display module S be shared asic chip 64 and peripheral IC element thereof by being connected of flexible PCB 62, therefore can effectively reduce living power consumption, reduce the cost of whole front panel module, help reducing required area and number of elements on the flexible PCB and effectively save the space of asic chip and the peripheral IC element thereof of secondary display module S.
Though the present invention with preferred embodiment openly as above; but it is not in order to limit the present invention; those skilled in the art can do a little change and retouching under the situation that does not break away from the spirit and scope of the present invention, so protection scope of the present invention should be as the criterion so that claims are determined.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031411940A CN100485474C (en) | 2003-06-06 | 2003-06-06 | Double-sided display panel module sharing one application-specific integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031411940A CN100485474C (en) | 2003-06-06 | 2003-06-06 | Double-sided display panel module sharing one application-specific integrated circuit chip |
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| Publication Number | Publication Date |
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| CN1553252A CN1553252A (en) | 2004-12-08 |
| CN100485474C true CN100485474C (en) | 2009-05-06 |
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| CNB031411940A Expired - Fee Related CN100485474C (en) | 2003-06-06 | 2003-06-06 | Double-sided display panel module sharing one application-specific integrated circuit chip |
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Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100470826C (en) * | 2005-04-25 | 2009-03-18 | 友达光电股份有限公司 | Double-sided display |
| US8303155B2 (en) * | 2007-10-19 | 2012-11-06 | Sharp Kabushiki Kaisha | Bifacial light emitting backlight |
| CN102982744B (en) * | 2012-12-17 | 2014-09-24 | 广东威创视讯科技股份有限公司 | A light-emitting diode LED display module |
| CN105572986B (en) | 2016-01-29 | 2019-02-26 | 武汉华星光电技术有限公司 | Double-side display device |
| CN106647069B (en) * | 2016-12-23 | 2020-05-19 | 武汉华星光电技术有限公司 | Double-sided display device |
| CN106773204A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | Reflective double-side display device |
| CN106773385A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | Double-side display device |
| CN106773386B (en) * | 2016-12-23 | 2020-09-01 | 武汉华星光电技术有限公司 | Double-sided display device |
| CN106783925B (en) * | 2016-12-28 | 2019-08-02 | 武汉华星光电技术有限公司 | A kind of double face display panel and double-side display device |
| US10613653B2 (en) | 2017-04-27 | 2020-04-07 | Wuhan China Star Optoelectronics Technology Co., Ltd | Dual-sided display device |
| CN107016933B (en) * | 2017-04-27 | 2019-08-20 | 武汉华星光电技术有限公司 | Display with double faces |
| CN107505748B (en) * | 2017-08-30 | 2020-08-07 | 武汉华星光电半导体显示技术有限公司 | Liquid crystal display assembly |
| CN107621708A (en) * | 2017-09-22 | 2018-01-23 | 京东方科技集团股份有限公司 | A kind of double face display panel and device, display signal processing method |
| CN110767168B (en) * | 2018-11-01 | 2022-01-25 | 昆山国显光电有限公司 | Drive chip, display panel and display terminal |
| CN109785743A (en) * | 2018-12-19 | 2019-05-21 | 维沃移动通信有限公司 | Display module and terminal equipment of terminal equipment |
| CN109637375B (en) | 2019-01-30 | 2020-12-25 | 武汉华星光电半导体显示技术有限公司 | Double-sided display device |
| CN111107200B (en) * | 2019-12-23 | 2021-08-31 | 上海创功通讯技术有限公司 | Display screen assembly and mobile terminal |
| CN114019738A (en) * | 2021-11-19 | 2022-02-08 | 惠科股份有限公司 | Array substrate, display panel and manufacturing method thereof |
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| Publication number | Publication date |
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| CN1553252A (en) | 2004-12-08 |
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