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CN100472674C - overcurrent protection element - Google Patents

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CN100472674C
CN100472674C CNB2005100931625A CN200510093162A CN100472674C CN 100472674 C CN100472674 C CN 100472674C CN B2005100931625 A CNB2005100931625 A CN B2005100931625A CN 200510093162 A CN200510093162 A CN 200510093162A CN 100472674 C CN100472674 C CN 100472674C
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overcurrent protection
protection element
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ptc material
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CN1917101A (en
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王绍裘
朱复华
罗国彰
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Polytronics Technology Corp
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Abstract

本发明揭示一种过电流保护元件,其包含两个金属箔片及一个正温度系数(Positive Temperature Coefficient;PTC)材料层。所述PTC材料层介于所述两个金属箔片之间且包含复数个结晶性高分子聚合物、一导电陶瓷填料和一非导电填料。所述导电填料的粒径具一特定大小分布且所述PTC材料层的体积电阻值小于0.1Ω-cm。

The present invention discloses an overcurrent protection element, which comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is between the two metal foils and comprises a plurality of crystalline polymers, a conductive ceramic filler and a non-conductive filler. The particle size of the conductive filler has a specific size distribution and the volume resistance value of the PTC material layer is less than 0.1Ω-cm.

Description

过电流保护元件 overcurrent protection element

技术领域 technical field

本发明涉及一种过电流保护元件,更具体而言,涉及一种具有PTC导电复合材料的过电流保护元件,所述过电流保护元件具有优选的体积电阻值及电阻再现性,特别适合于移动通讯器材的电源保护。The present invention relates to an overcurrent protection element, more specifically, an overcurrent protection element with a PTC conductive composite material, the overcurrent protection element has a preferred volume resistance value and resistance reproducibility, and is especially suitable for mobile Power supply protection for communication equipment.

背景技术 Background technique

由于具有正温度系数(Positive Temperature Coefficient;PTC)特性的导电复合材料的电阻具有对温度变化反应敏锐的特性,可作为电流感测元件的材料,且目前已被广泛应用于过电流保护元件或电路元件上。由于PTC导电复合材料在正常温度下的电阻可维持极低值,使电路或电池得以正常运作。但是,当电路或电池发生过电流(over-current)或过高温(over-temperature)的现象时,其电阻值会瞬间提高到一高电阻状态(至少104欧姆以上),而将过量的电流反向抵销,以达到保护电池或电路元件的目的。Since the resistance of conductive composite materials with positive temperature coefficient (Positive Temperature Coefficient; PTC) characteristics has the characteristics of sensitive response to temperature changes, it can be used as a material for current sensing elements, and has been widely used in overcurrent protection elements or circuits. component. Because the resistance of the PTC conductive composite material can maintain an extremely low value at normal temperature, the circuit or battery can operate normally. However, when an over-current or over-temperature phenomenon occurs in a circuit or battery, its resistance value will instantly increase to a high resistance state (at least 10 4 ohms or more), and the excessive current will be Reverse offset to achieve the purpose of protecting the battery or circuit components.

一般而言,PTC导电复合材料由一种或一种以上具有结晶性的聚合物及导电填料所组成,所述导电填料均匀地分散于所述聚合物中。所述聚合物一般为聚烯烃类聚合物,例如:聚乙烯。而导电填料一般为碳黑、金属颗粒或无氧陶瓷粉末,例如:碳化钛或碳化钨等。Generally speaking, the PTC conductive composite material is composed of one or more crystalline polymers and conductive fillers, and the conductive fillers are uniformly dispersed in the polymers. The polymer is generally a polyolefin polymer, such as polyethylene. The conductive filler is generally carbon black, metal particles or oxygen-free ceramic powder, such as titanium carbide or tungsten carbide.

所述导电复合材料的导电度视导电填料的种类及含量而定。一般而言,由于碳黑表面呈凹凸状,与聚烯烃类聚合物的附着性较好,所以具有较好的电阻再现性。然而,碳黑所能提供的导电度比金属颗粒低,而金属颗粒比重较大,分散较不均匀且易被氧化而造成电阻升高。为有效降低过电流保护元件的电阻值且避免氧化,逐渐趋向以陶瓷粉末作为低阻值导电复合材料的导电填料。但由于陶瓷粉末不像碳黑一般具有凹凸表面,与聚烯烃类等聚合物的附着性比碳黑差,所以其电阻再现性也较难控制。为增加聚烯烃类聚合物与金属颗粒之间的附着性,常规地以陶瓷粉末为导电填料的导电复合材料会另外添加一耦合剂,例如:酐类化合物或是硅烷类化合物,以加强聚烯烃类聚合物与金属颗粒之间的附着性,然而加入耦合剂后却无法有效地降低整体的电阻值。The conductivity of the conductive composite material depends on the type and content of the conductive filler. Generally speaking, due to the concave-convex surface of carbon black, it has good adhesion to polyolefin polymers, so it has good resistance reproducibility. However, the electrical conductivity that carbon black can provide is lower than that of metal particles, while metal particles have a larger specific gravity, are less uniformly dispersed and are easily oxidized, resulting in increased resistance. In order to effectively reduce the resistance value of overcurrent protection components and avoid oxidation, ceramic powders are gradually used as conductive fillers for low-resistance conductive composite materials. However, since ceramic powder does not have a concave-convex surface like carbon black, and its adhesion to polymers such as polyolefins is worse than that of carbon black, its resistance reproducibility is also difficult to control. In order to increase the adhesion between polyolefin polymers and metal particles, a conventional conductive composite material using ceramic powder as a conductive filler will add a coupling agent, such as: anhydride compounds or silane compounds, to strengthen the polyolefin. Adhesion between polymer-like particles and metal particles, but the addition of coupling agent cannot effectively reduce the overall resistance value.

目前市面上具低电阻(约20mΩ)的PTC导电复合材料是以镍(Ni)作为导电填料,其可承受的电压仅6V。其中,如果镍不经严密保护与空气絶缘,那么经一段时间后容易氧化,导致电阻上升。另外,所述导电复合材料经过触发(trip)之后,其电阻再现性不好。At present, the PTC conductive composite material with low resistance (about 20mΩ) on the market uses nickel (Ni) as the conductive filler, and its withstand voltage is only 6V. Among them, if nickel is not tightly protected and insulated from the air, it is easily oxidized after a period of time, resulting in an increase in resistance. In addition, after the conductive composite material is tripped, its resistance reproducibility is not good.

发明内容 Contents of the invention

本发明的主要目的是提供一种过电流保护元件,通过加入一具有特定粒径分布的导电填料及至少一具低熔点的结晶性高分子聚合物,而使所述过电流保护元件具有优异的低电阻值、低温快速触发(trip)的保护功能、耐电压特性及电阻再现性。The main purpose of the present invention is to provide an overcurrent protection element, which has excellent performance by adding a conductive filler with a specific particle size distribution and at least one crystalline high molecular polymer with a low melting point. Low resistance value, low temperature quick trip (trip) protection function, withstand voltage characteristics and resistance reproducibility.

为了达到上述目的,本发明揭示一种过电流保护元件,其包含两个金属箔片以及一PTC材料层。所述金属箔片含瘤状(nodule)突出的粗糙表面,并与所述PTC材料层直接物理性接触。所述PTC材料层是介于所述两个金属箔片之间且包含复数个结晶性高分子聚合物、一无氧导电陶瓷粉末(即,导电填料)及一非导电填料。所述无氧导电陶瓷粉末的粒径大小介于0.01μm至30μm之间,优选粒径大小介于0.1μm至10μm之间,所述无氧导电陶瓷粉末的体积电阻值小于500μΩ-cm,且均匀分散于所述复数个结晶性高分子聚合物之中。所述复数个结晶性高分子聚合物可选自:高密度聚乙烯、低密度聚乙烯、聚丙烯、聚氟乙烯及其共聚合物。为了达到低温快速触发(trip)的保护功能,所述PTC材料层中至少包含一熔点低于115℃的结晶性高分子聚合物。In order to achieve the above purpose, the present invention discloses an overcurrent protection element, which includes two metal foils and a PTC material layer. The metal foil has a nodule protruding rough surface and is in direct physical contact with the PTC material layer. The PTC material layer is between the two metal foils and includes a plurality of crystalline polymers, an oxygen-free conductive ceramic powder (ie, conductive filler) and a non-conductive filler. The particle size of the oxygen-free conductive ceramic powder is between 0.01 μm and 30 μm, preferably the particle size is between 0.1 μm and 10 μm, the volume resistance of the oxygen-free conductive ceramic powder is less than 500 μΩ-cm, and uniformly dispersed among the plurality of crystalline polymers. The plurality of crystalline polymers may be selected from high density polyethylene, low density polyethylene, polypropylene, polyvinyl fluoride and copolymers thereof. In order to achieve the protective function of rapid tripping at low temperature, the PTC material layer contains at least one crystalline polymer with a melting point lower than 115°C.

为了保护锂离子电池过充电的安全,运用在锂离子电池的过电流保护元件必须在较低温就能产生触发(trip)反应,因此PTC材料层选用较低熔点的高分子材料:如低密度聚乙烯,并且可以选用一种或多种聚合物材料,但各聚合物中的最低熔点必须低于115℃。所述低密度聚乙烯可用传统Ziegler-Natta催化剂或用Metallocene催化剂聚合而成,也可经由乙烯单体与其它单体(例如:丁烯(butene)、己烯(hexene)、辛烯(octene)、丙烯酸(acrylic acid)或醋酸乙烯酯(vinyl acetate))共聚合而成。In order to protect the safety of overcharging of lithium-ion batteries, the over-current protection components used in lithium-ion batteries must be able to generate a trigger (trip) reaction at a relatively low temperature, so the PTC material layer uses a polymer material with a lower melting point: such as low-density polymer Ethylene, and one or more polymer materials can be selected, but the minimum melting point of each polymer must be lower than 115°C. The low-density polyethylene can be polymerized with traditional Ziegler-Natta catalysts or with Metallocene catalysts, and can also be polymerized through ethylene monomers and other monomers (for example: butene (butene), hexene (hexene), octene (octene) , acrylic acid (acrylic acid) or vinyl acetate (vinyl acetate)) copolymerization.

本发明所使用的无氧导电陶瓷粉末选自(1)金属碳化物(例如:碳化钛(TiC)、碳化钨(WC)、碳化钒(VC)、碳化锆(ZrC)、碳化铌(NbC)、碳化钽(TaC)、碳化钼(MoC)及碳化铪(HfC));(2)金属硼化物(例如:硼化钛(TiB2)、硼化钒(VB2)、硼化锆(ZrB2)、硼化铌(NbB2)、硼化钼(MoB2)及硼化铪(HfB2));或(3)金属氮化物(例如:氮化锆(ZrN))。The oxygen-free conductive ceramic powder used in the present invention is selected from (1) metal carbides (for example: titanium carbide (TiC), tungsten carbide (WC), vanadium carbide (VC), zirconium carbide (ZrC), niobium carbide (NbC) , tantalum carbide (TaC), molybdenum carbide (MoC) and hafnium carbide (HfC)); (2) metal borides (for example: titanium boride (TiB 2 ), vanadium boride (VB 2 ), zirconium boride (ZrB 2 ), niobium boride (NbB 2 ), molybdenum boride (MoB 2 ) and hafnium boride (HfB 2 )); or (3) metal nitrides (eg zirconium nitride (ZrN)).

本发明所使用的无氧导电陶瓷粉末的形状可呈现出多种不同样式的颗粒,例如:球体型(spherical)、方体型(cubic)、片状型(flake)、多角型或柱状型等。一般而言,因导电陶瓷粉末的硬度相当高,制造方法不同于碳黑或金属粉末,以致于其形状也不同于碳黑或一些高结构(high structure)的金属粉末。无氧导电陶瓷粉末颗粒的形状是以低结构型(low structure)为主,其粒径小于10μm,纵横比(aspect ratio)小于10。The shape of the oxygen-free conductive ceramic powder used in the present invention can present various types of particles, such as: spherical, cubic, flake, polygonal or columnar. Generally speaking, because the hardness of conductive ceramic powder is quite high, the manufacturing method is different from carbon black or metal powder, so that its shape is also different from carbon black or some high structure metal powder. The shape of oxygen-free conductive ceramic powder particles is mainly low structure type, with a particle size of less than 10 μm and an aspect ratio of less than 10.

本发明所使用的非导电填料选自具有阻燃效果或抗电弧效应的无机化合物,例如:氧化锌、氧化锑、氧化铝、氧化硅、碳酸钙、硫酸镁、硫酸钡以及含有氢氧基(OH)的化合物(例如:氢氧化镁、氢氧化铝、氢氧化钙、氢氧化钡等)。此非导电填料其粒径大小主要介于0.05μm至50μm之间,且其重量比介于1%至20%之间。The non-conductive filler used in the present invention is selected from inorganic compounds with flame-retardant effect or anti-arc effect, for example: zinc oxide, antimony oxide, aluminum oxide, silicon oxide, calcium carbonate, magnesium sulfate, barium sulfate and containing hydroxyl ( OH) compounds (for example: magnesium hydroxide, aluminum hydroxide, calcium hydroxide, barium hydroxide, etc.). The particle size of the non-conductive filler is mainly between 0.05 μm and 50 μm, and its weight ratio is between 1% and 20%.

由于无氧导电陶瓷粉末体积电阻值非常低(小于500μΩ-cm),以致于所混合成的PTC材料可达到低于0.5Ω-cm的体积电阻值。一般而言,PTC材料不易达到低于0.1Ω-cm的体积电阻值,即使当PTC材料能达到低于0.1Ω-cm的体积电阻值时,常会因阻值太低而失去耐电压的特性,然而本发明的过电流保护元件中的PTC材料层可达到小于0.1Ω-cm且能承受12V至40V的电压及小于等于50安培的电流。Since the volume resistance of the oxygen-free conductive ceramic powder is very low (less than 500 μΩ-cm), the mixed PTC material can achieve a volume resistance value lower than 0.5 Ω-cm. Generally speaking, it is difficult for PTC materials to achieve a volume resistance value lower than 0.1Ω-cm. Even when the PTC material can achieve a volume resistance value lower than 0.1Ω-cm, it often loses the characteristics of withstand voltage because the resistance value is too low. However, the PTC material layer in the overcurrent protection element of the present invention can reach less than 0.1Ω-cm and can withstand a voltage of 12V to 40V and a current of less than or equal to 50 amperes.

一般而言,当PTC材料达到低于0.1Ω-cm的体积电阻值时,常无法承受高于12V的电压,因此本发明为了提升耐电压性,PTC材料中添加非导电填料,主要以含有氢氧基(OH)的无机化合物为主,并控制PTC材料层的厚度大于0.2mm,使得所述低阻值PTC材料可以大幅提升所能承受的电压。此无机化合物的非导电填料也具有控制电阻再现性的功能,通常能将电阻再现性比值(trip jump)R1/Ri控制在小于3。其中Ri为起始阻值,R1为触发一次后回复到室温一小时后所测量的阻值。Generally speaking, when the PTC material reaches a volume resistance value lower than 0.1Ω-cm, it is often unable to withstand a voltage higher than 12V. Therefore, in order to improve the voltage resistance in the present invention, a non-conductive filler is added to the PTC material, mainly containing hydrogen Oxygen (OH) is the main inorganic compound, and the thickness of the PTC material layer is controlled to be greater than 0.2mm, so that the low-resistance PTC material can greatly increase the withstand voltage. The non-conductive filler of the inorganic compound also has the function of controlling the resistance reproducibility, and usually can control the resistance reproducibility ratio (trip jump) R 1 /R i to be less than 3. Among them, R i is the initial resistance value, and R 1 is the resistance value measured after returning to room temperature for one hour after being triggered once.

因为PTC材料层具有相当低的体积电阻值,所以可将PTC芯片(即,本发明的过电流保护元件所需的PTC材料层)的面积缩小到小于50mm2,且仍然能够达到元件低电阻的目的,最终可以从同面积的每片PTC材料层生产出更多的PTC芯片,使生产成本降低。Because the PTC material layer has a relatively low volume resistance value, the area of the PTC chip (that is, the required PTC material layer of the overcurrent protection element of the present invention) can be reduced to less than 50mm 2 , and the low resistance of the element can still be achieved. The purpose is to finally produce more PTC chips from each PTC material layer of the same area, so as to reduce the production cost.

本发明的过电流保护元件,其中所述两个金属箔片可与另外两个金属镍片(即,金属电极片)借着锡膏(solder)经回焊或借着点焊方式接合成一组装体(assembly),通常是成一轴向引线型(axial-leaded)、径向引线型(radial-leaded)、端子型(terminal)或表面粘着型(surface mount)的元件。本发明的过电流保护元件,其中所述上下金属箔片可连于电源而形成一导电回路(circuit)(于另一实施例中,则可通过所述两个金属电极片连于电源而形成一导电回路),PTC材料层在过电流的状况下运作,而达到保护回路的功用。In the overcurrent protection device of the present invention, the two metal foils can be combined with the other two metal nickel sheets (that is, metal electrode sheets) by reflow soldering or spot welding with solder paste. Assembly (assembly), usually an axial-leaded, radial-leaded, terminal or surface mount component. In the overcurrent protection device of the present invention, wherein the upper and lower metal foils can be connected to a power supply to form a conductive circuit (in another embodiment, it can be formed by connecting the two metal electrode sheets to a power supply) A conductive circuit), the PTC material layer operates under the condition of overcurrent, and achieves the function of protecting the circuit.

附图说明 Description of drawings

图1例示本发明的过电流保护元件;以及Figure 1 illustrates an overcurrent protection element of the present invention; and

图2例示本发明的过电流保护元件的另一实施例。FIG. 2 illustrates another embodiment of the overcurrent protection element of the present invention.

具体实施方式 Detailed ways

以下说明本发明过电流保护元件的两种组成成份(实施例一及实施例二)及制作过程。The two components (Example 1 and Example 2) and the manufacturing process of the overcurrent protection device of the present invention are described below.

本发明过电流保护元件所使用的PTC材料层的成份及重量(单位:公克)如表一所示。The composition and weight (unit: gram) of the PTC material layer used in the overcurrent protection element of the present invention are shown in Table 1.

表一Table I

  LDPE-1 HDPE-1 HDPE-2 Mg(OH)<sub>2</sub> TiC 实施例一 12.66 0.50 ---- 5.04 92.60 实施例二 11.20 ---- ---- 5.04 93.60 比较例 ---- 3.16 12.65 4.20 90.90 LDPE-1 HDPE-1 HDPE-2 Mg(OH)<sub>2</sub> TiC Embodiment one 12.66 0.50 ---- 5.04 92.60 Embodiment two 11.20 ---- ---- 5.04 93.60 comparative example ---- 3.16 12.65 4.20 90.90

其中LDPE-1为低密度结晶性聚乙烯(密度:0.924g/cm3,熔点:113℃);HDPE-1为高密度结晶性聚乙烯(密度:0.943g/cm3,熔点:125℃);HDPE-2为高密度结晶性聚乙烯(密度:0.962g/cm3,熔点:131℃);Mg(OH)2为用96.9wt%纯度的氢氧化镁并含0.50% CaO、0.85% SO3、0.13% SiO2、0.03%Fe2O3、0.06% Al2O3等微量化合物及碳化钛(TiC)导电填料。其中碳化钛(TiC)的平均粒径大小为3μm,粒径纵横比(aspect ratio)小于10。Among them, LDPE-1 is low-density crystalline polyethylene (density: 0.924g/cm 3 , melting point: 113°C); HDPE-1 is high-density crystalline polyethylene (density: 0.943g/cm 3 , melting point: 125°C) ; HDPE-2 is high-density crystalline polyethylene (density: 0.962g/cm 3 , melting point: 131°C); Mg(OH) 2 is magnesium hydroxide with 96.9wt% purity and contains 0.50% CaO, 0.85% SO 3. Trace compounds such as 0.13% SiO 2 , 0.03% Fe 2 O 3 , 0.06% Al 2 O 3 and titanium carbide (TiC) conductive filler. The average particle size of titanium carbide (TiC) is 3 μm, and the particle size aspect ratio (aspect ratio) is less than 10.

制作过程如下:将批式混炼机(Hakke-600)进料温度定在160℃,进料时间为2分钟,进料程序为按表1所示的重量,加入定量的结晶性高分子聚合物,搅拌数秒钟,再加入无氧导电陶瓷粉末(碳化钛,其粒径大小介于0.1μm至10μm之间)及非导电填料。混炼机旋转的转速为40rpm。3分钟之后,将其转速提高到70rpm,继续混炼7分钟后下料,而形成一具有PTC特性的导电复合材料。The production process is as follows: set the feed temperature of the batch mixer (Hakke-600) at 160°C, the feed time is 2 minutes, and the feed program is to add a quantitative amount of crystalline polymer polymer according to the weight shown in Table 1. Stir for a few seconds, then add oxygen-free conductive ceramic powder (titanium carbide, the particle size is between 0.1 μm and 10 μm) and non-conductive filler. The rotational speed of the mixer rotation was 40 rpm. After 3 minutes, the rotating speed was increased to 70 rpm, and the kneading was continued for 7 minutes before feeding to form a conductive composite material with PTC characteristics.

将上述导电复合材料以上下对称方式置入外层为钢板,中间厚度为0.35mm的模具中,模具上下各置一层铁弗龙脱模布,先预压3分钟,预压操作压力50kg/cm2,温度为180℃。排气之后进行压合,压合时间为3分钟,压合压力控制在100kg/cm2,温度为180℃,之后再重复一次压合动作,压合时间为3分钟,压合压力控制在150kg/cm2,温度为180℃,之后形成一PTC材料层11(参看图1)。所述PTC材料层11的厚度为0.35mm或0.45mm。Put the above-mentioned conductive composite material into a mold whose outer layer is a steel plate and the middle thickness is 0.35mm in a symmetrical manner up and down. Put a layer of Teflon release cloth on the upper and lower sides of the mold, pre-press for 3 minutes, and the pre-press operating pressure is 50kg/ cm 2 at a temperature of 180°C. Pressing is carried out after exhausting, the pressing time is 3 minutes, the pressing pressure is controlled at 100kg/cm 2 , the temperature is 180°C, and then the pressing action is repeated again, the pressing time is 3 minutes, and the pressing pressure is controlled at 150kg /cm 2 , the temperature is 180°C, and then a PTC material layer 11 is formed (see FIG. 1 ). The thickness of the PTC material layer 11 is 0.35mm or 0.45mm.

将所述PTC材料层11裁切成20 x 20cm2的正方形,再利用压合将两个金属箔片12直接物理性接触于所述PTC材料层11的上下表面,其于所述PTC材料层11表面以上下对称方式依序覆盖金属箔片12。所述金属箔片12含瘤状(nodule)突出的粗糙表面并与PTC材料层11直接物理性接触。压合专用缓冲材、铁弗龙脱模布及钢板而形成一多层结构。所述多层结构再进行压合,压合时间为3分钟,操作压力为70kg/cm2,温度为180℃。之后,以模具冲切形成3.4mm x 4.1mm或3.5mm x 6.5mm的芯片状过电流保护元件10,再将两个金属电极片22以锡膏(solder paste)借着回焊方式上下连接于所述两个金属箔片12上,制成轴状式的电流保护元件20(参图2)。The PTC material layer 11 is cut into a square of 20 x 20 cm 2 , and then two metal foils 12 are directly physically contacted on the upper and lower surfaces of the PTC material layer 11 by pressing, which is on the upper and lower surfaces of the PTC material layer. The surface of 11 is sequentially covered with metal foil 12 in a vertically symmetrical manner. The metal foil 12 has a nodule protruding rough surface and is in direct physical contact with the PTC material layer 11 . Press special buffer material, Teflon release cloth and steel plate to form a multi-layer structure. The multi-layer structure is then pressed, and the pressing time is 3 minutes, the operating pressure is 70kg/cm 2 , and the temperature is 180°C. Afterwards, a chip-shaped overcurrent protection element 10 of 3.4mm x 4.1mm or 3.5mm x 6.5mm is punched out with a mold, and then two metal electrode pieces 22 are connected up and down with solder paste by means of reflow. A shaft-shaped current protection element 20 is formed on the two metal foils 12 (see FIG. 2 ).

另外,所述PTC材料层11的体积电阻值(ρ)可根据式(1)计算而得:In addition, the volume resistance value (ρ) of the PTC material layer 11 can be calculated according to formula (1):

&rho;&rho; == RR &CenterDot;&Center Dot; AA LL &CenterDot;&Center Dot; &CenterDot;&Center Dot; &CenterDot;&Center Dot; (( 11 ))

其中R为PTC材料层11的电阻值(Ω),A为PTC材料层11的面积(cm2),L为PTC材料层11的厚度(cm)。将式(1)中的R以表2的Ri(Ω)值(0.0069Ω)代入,A以6.5 x 3.5mm2(=6.5 x 3.5 x 10-2cm2)代入,L以0.45mm(=0.045cm)代入,即可求得ρ=0.0349Ω-cm,明显小于0.1Ω-cm。Where R is the resistance value (Ω) of the PTC material layer 11 , A is the area (cm 2 ) of the PTC material layer 11 , and L is the thickness (cm) of the PTC material layer 11 . Substitute R in formula (1) with the Ri(Ω) value (0.0069Ω) in Table 2, substitute A with 6.5 x 3.5mm 2 (=6.5 x 3.5 x 10 -2 cm 2 ), and L with 0.45mm (= 0.045cm) is substituted, and ρ=0.0349Ω-cm can be obtained, which is obviously smaller than 0.1Ω-cm.

将轴状式的电流保护元件20置于80℃的环境温度下,经6V/0.8A的电压及电流测试,以模仿在6V/0.8A过充电环境下电池升温至80℃时的情形,所述轴状式的电流保护元件20必须能触发以便截断电流,以达到保护电池的目的。The shaft-shaped current protection element 20 is placed at an ambient temperature of 80°C, and tested at a voltage and current of 6V/0.8A to simulate the situation when the battery temperature rises to 80°C under an overcharged environment of 6V/0.8A. The shaft-shaped current protection element 20 must be able to be triggered in order to cut off the current, so as to achieve the purpose of protecting the battery.

表2显示实施例一和实施例二均能触发,可达到保护电池的目的;然而比较例却无法触发,因而无法达到保护电池的目的。另外,轴状式的电流保护元件20在6V、12V及16V的电压下(即,在过电流保护触发状态下)触发的表面温度也显示在表2中。其中,比较例的表面温度超过100℃,比实施例二的表面温度至少高10℃(实施例二的表面温度均低于100℃)。因此实施例二中的过电流保护元件可以在较低温触发,对温度的反应比比较例迅速,且因使用导电陶瓷粉末,其起始阻值(Ri)小于0.010Ω。Table 2 shows that both Example 1 and Example 2 can be triggered, and the purpose of protecting the battery can be achieved; however, the comparative example cannot be triggered, and thus the purpose of protecting the battery cannot be achieved. In addition, the surface temperature of the shaft-shaped current protection element 20 triggered under the voltages of 6V, 12V and 16V (ie, in the overcurrent protection triggering state) is also shown in Table 2. Wherein, the surface temperature of the comparative example exceeds 100° C., which is at least 10° C. higher than that of the second example (the surface temperatures of the second example are all lower than 100° C.). Therefore, the overcurrent protection element in the second embodiment can be triggered at a lower temperature, and the response to temperature is faster than that in the comparative example, and the initial resistance (R i ) is less than 0.010Ω due to the use of conductive ceramic powder.

表二Table II

Figure C200510093162D00101
Figure C200510093162D00101

本发明的过电流保护元件,通过加入一具有特定粒径分布的导电填料及至少一具有低熔点(115℃以下)的结晶性高分子聚合物,经由表2的结果可知,本发明的过电流保护元件确实可达到具有优异的起始电阻值(Ri小于20mΩ)、低温(80℃)快速触发的保护功能、耐电压特性及电阻再现性的预期目的。The overcurrent protection element of the present invention, by adding a conductive filler with a specific particle size distribution and at least one crystalline polymer with a low melting point (below 115 ° C), the results in Table 2 show that the overcurrent protection of the present invention The protection element can indeed achieve the expected purpose of having excellent initial resistance value (R i is less than 20mΩ), low temperature (80°C) rapid trigger protection function, withstand voltage characteristics and resistance reproducibility.

本发明的技术内容及技术特点已在上文得以揭示,然而所属领域技术人员仍可能基于本发明的教示及揭示而作出种种不背离本发明精神的替代及修正。因此,本发明的保护范围应不限于实施例所揭示的内容,而应包括各种不背离本发明的替代及修正,并为上述权利要求书所涵盖。The technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still make various substitutions and amendments based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various substitutions and modifications that do not depart from the present invention, and are covered by the above claims.

Claims (17)

1.一种过电流保护元件,其特征在于包含:1. An overcurrent protection element, characterized in that it comprises: 两个金属箔片;以及two metal foils; and 一PTC材料层,其叠设于所述两个金属箔片之间且体积电阻值小于0.1Ω-cm,其包含:A PTC material layer, which is stacked between the two metal foils and has a volume resistance value of less than 0.1Ω-cm, comprising: (i)复数个结晶性高分子聚合物,其包含至少一熔点低于115℃的结晶性高分子聚合物;(i) a plurality of crystalline polymers, including at least one crystalline polymer with a melting point lower than 115°C; (ii)一无氧导电陶瓷粉末,其粒径大小介于0.1μm到10μm之间,体积电阻值小于500μΩ-cm,且散布于所述结晶性高分子聚合物之中;及(ii) an oxygen-free conductive ceramic powder, the particle size of which is between 0.1 μm and 10 μm, the volume resistance value is less than 500 μΩ-cm, and is dispersed in the crystalline polymer; and (iii)一非导电填料。(iii) A non-conductive filler. 2.根据权利要求1所述的过电流保护元件,其特征在于所述PTC材料层的厚度大于0.2mm。2. The overcurrent protection element according to claim 1, characterized in that the thickness of the PTC material layer is greater than 0.2mm. 3.根据权利要求1所述的过电流保护元件,其特征在于所述PTC材料层的起始电阻值小于20mΩ。3. The overcurrent protection element according to claim 1, characterized in that the initial resistance value of the PTC material layer is less than 20mΩ. 4.根据权利要求1所述的过电流保护元件,其特征在于所述PTC材料层可承受的电压为小于等于40伏特。4 . The overcurrent protection element according to claim 1 , wherein the withstand voltage of the PTC material layer is less than or equal to 40 volts. 5.根据权利要求1所述的过电流保护元件,其特征在于所述PTC材料层的面积小于50mm25. The overcurrent protection element according to claim 1, characterized in that the area of the PTC material layer is less than 50 mm 2 . 6.根据权利要求1所述的过电流保护元件,其特征在于在过电流保护触发状态下,其表面温度低于100℃。6. The overcurrent protection element according to claim 1, characterized in that its surface temperature is lower than 100°C when the overcurrent protection is triggered. 7.根据权利要求1所述的过电流保护元件,其特征在于电阻再现性比值小于3。7. The overcurrent protection element according to claim 1, characterized in that the resistance reproducibility ratio is less than 3. 8.根据权利要求1所述的过电流保护元件,其特征在于所述无氧导电陶瓷粉末为碳化钛。8. The overcurrent protection element according to claim 1, characterized in that the oxygen-free conductive ceramic powder is titanium carbide. 9.根据权利要求1所述的过电流保护元件,其特征在于所述熔点低于115℃的结晶性高分子聚合物为一低密度聚乙烯。9 . The overcurrent protection device according to claim 1 , wherein the crystalline polymer having a melting point lower than 115° C. is a low-density polyethylene. 10.根据权利要求9所述的过电流保护元件,其特征在于所述低密度聚乙烯是由催化剂聚合而成。10. The overcurrent protection element according to claim 9, characterized in that the low density polyethylene is polymerized by a catalyst. 11.根据权利要求1所述的过电流保护元件,其中特征在于述非导电填料为一含氢氧基(OH)的无机化合物。11. The overcurrent protection device according to claim 1, wherein the non-conductive filler is an inorganic compound containing hydroxyl groups (OH). 12.根据权利要求11所述的过电流保护元件,其特征在于所述无机化合物为氢氧化镁。12. The overcurrent protection element according to claim 11, characterized in that the inorganic compound is magnesium hydroxide. 13.根据权利要求1所述的过电流保护元件,其特征在于所述两个金属箔片含瘤状突出的粗糙表面且与所述PTC材料层直接物理性接触。13 . The overcurrent protection device according to claim 1 , wherein the two metal foils have bumpy rough surfaces and are in direct physical contact with the PTC material layer. 14 . 14.根据权利要求1所述的过电流保护元件,其特征在于另外包含两个金属电极片,其与所述两个金属箔片接合成一组装体。14 . The overcurrent protection device according to claim 1 , further comprising two metal electrode sheets, which are joined with the two metal foil sheets to form an assembly. 15.根据权利要求1所述的过电流保护元件,其特征在于所述两个金属箔片可连接于电源而形成一导电回路。15. The overcurrent protection device according to claim 1, wherein the two metal foils can be connected to a power source to form a conductive loop. 16.根据权利要求14所述的过电流保护元件,其特征在于所述两个金属电极片可连接于电源而形成一导电回路。16. The overcurrent protection device according to claim 14, wherein the two metal electrode pieces can be connected to a power source to form a conductive loop. 17.根据权利要求1所述的过电流保护元件,其特征在于承受的电流为小于等于50安培。17. The overcurrent protection device according to claim 1, characterized in that the withstand current is less than or equal to 50 amperes.
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