CN100468708C - heat sink - Google Patents

Abstract

A heat dissipation device for dissipating heat from heating electronic components, comprising a heat sink, a fixed module and a buckle, the heat sink includes a heat sink and a heat conductor combined with the heat sink, the buckle includes a The connection part and the operation part extended from the connection part, the connection part is rotatably installed on the fixed module, the connection part is provided with a protruding pressing part, and the heat dissipation device also includes a The fixed plate is provided with protruding first fixed arm and second fixed arm on opposite sides of the fixed plate, and the fixed module includes a bottom that presses against the first fixed arm and can be buckled with the operating part of the buckle One buckle ear of the buckle, the pressing part of the buckle rotates the operation part of the buckle downward, so that the operation part can press the second fixing arm when the buckle ear of the fixing module is buckled, and the buckle of the buckle The pressing part can release pressing against the second fixing arm when the operating part and the buckle lug of the fixing module are released from buckling by rotating the operating part of the buckle upwards.

Description

heat sink

【Technical field】

The invention relates to a heat dissipation device, in particular to a heat dissipation device with a fixing element for fixing the heat dissipation device to a heat-generating electronic component.

【Background technique】

As we all know, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the heat-generating electronic component from rising due to the accumulation of heat, thereby causing unstable operation, the electronic component usually needs to be equipped with a heat dissipation device to assist in heat dissipation. Usually, in order to closely fix the heat sink to the electronic component, additional fixing components are required.

At present, one of the various heat dissipation devices used in the industry includes a heat sink, a fixing module arranged around the electronic components, and a fastener that cooperates with the fixing module to fix the heat sink to the electronic components. The radiator includes a base and a plurality of cooling fins arranged on the base, and a groove is left between the two fins in the middle of the base. The buckle is elongated and has a pressing portion and two hooking portions arranged at both ends of the pressing portion. The fixing module is provided with a fastening portion corresponding to the hooking portion of the buckle. The pressing part of the buckle straddles the groove of the radiator, the hook part hooks the fastening part of the fixed module, the buckle deforms, and the pressing part presses the radiator base downward, thereby The radiator is fixed on the electronic component. However, in order to fasten the hook portion of the fastener with the fastening portion of the fixed module, it is necessary to overcome the elastic recovery force of the fastener, and the operation is laborious. In addition, the fastening process often requires tools, which is inconvenient to operate. Therefore, the heat dissipation device needs to be further improved.

【Content of invention】

In view of this, it is necessary to provide a heat dissipation device that is easy to disassemble.

A heat dissipation device for dissipating heat from heating electronic components. The heat dissipation device includes a radiator, a fixed module and a fastener. The radiator includes a radiator and a heat conductor combined with the radiator. The fastener It includes a connecting part and an operating part extending from the connecting part, the connecting part is rotatably installed on the fixed module, the connecting part is provided with a protruding pressing part, and the heat dissipation device also includes a A combined fixed plate, the opposite sides of the fixed plate are provided with a protruding first fixed arm and a second fixed arm, the fixed module includes a bottom that presses the first fixed arm and can be connected with the operating part of the buckle A buckle ear of the buckle, the pressing part of the buckle rotates the operating part of the buckle downward, so that the operating part can press the second fixing arm when the buckle ear of the fixing module is buckled, and the buckle When the pressing part of the tool rotates the operating part of the buckle upwards, the second fixing arm can be released when the buckle between the operating part and the buckle ear of the fixing module is released.

Compared with the prior art, the fixed plate of the heat sink is combined with the radiator, the fixed module presses against the first fixed arm of the fixed plate, the buckle of the heat sink is rotatably connected to the fixed module, and by rotating the buckle, The pressing part of the buckle can press or release the pressing part of the second fixing arm of the fixing plate, so as to realize the convenient assembly and disassembly of the heat sink and the electronic components.

The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

【Description of drawings】

FIG. 1 is a three-dimensional exploded view of an embodiment of a heat dissipation device of the present invention.

FIG. 2 is a partially assembled view of FIG. 1 .

Fig. 3 is a partial assembly diagram of Fig. 2 .

FIG. 4 is a three-dimensional assembly view of the heat sink in FIG. 1 before fastening.

FIG. 5 is a three-dimensional assembled view of the heat dissipation device in FIG. 1 after fastening.

Fig. 6 is a view from another direction of Fig. 5 .

FIG. 7 is an exploded perspective view of another embodiment of the heat sink of the present invention.

【Detailed ways】

Please refer to FIG. 1 , the heat dissipation device is used for dissipating heat generated by an electronic component (not shown) mounted on a circuit board (not shown). The heat dissipation device includes a heat sink, and the heat sink includes a heat dissipation body 50 and a heat conductor 40 combined with the heat dissipation body 50 . The heat dissipation device further includes a fixing plate 30 matched with the heat conductor 40 , a buckle 20 and a fixing module 10 matched with the buckle 20 and the fixing plate 30 .

The fixing module 10 is a square frame, which is arranged on the circuit board around the electronic components. The fixing module 10 has an opening 110 for accommodating electronic components and first, second, third, and fourth sides 120 , 130 , 140 , 150 surrounding the opening 110 and connected to each other. Four corners of the fixing module 10 extend downwards to define four fixing feet 160 for fixing the fixing module 10 to the circuit board. The second side 130 extends upwards from its outer edge to a side wall 170 , and the side wall 170 is provided with four spaced positioning blocks 171 at its upper end facing the opening 110 for positioning the buckle 20 between the second side 130 and the opening 110 . between the positioning blocks 171 . The second edge portion 130 defines a plurality of notches 131 corresponding to the positioning block 171 of the side wall 170 . At the junction of the third and four side parts 140, 150 and the junction of the fourth and side parts 150, 120, there are a number of stoppers 141, 151, 121 facing the direction of the opening 110, and one end of the stopper 121 protrudes outwards. The first side portion forms a buckle ear 123 .

The buckle 20 is roughly "L" shaped and made of bent metal wires. The buckle 20 includes a connecting portion 210 and an operating portion 230 bent and extended from one end of the connecting portion 210 . The connecting portion 210 is bent between adjacent positioning blocks 171 corresponding to the sidewall 170 of the fixing module 10 to form two pressing portions 211 , and the two pressing portions 211 protrude toward the opening 110 of the fixing module 10 . The free end of the operating part 230 is bent back to form a handle 231 , and a plastic sleeve 250 is sleeved on the handle 231 to facilitate the operation of the operator.

The heat conductor 40 has high thermal conductivity, and includes a circular bottom 410 with a larger diameter and a column 430 with a slightly smaller diameter extending vertically upward from the bottom 410 . A cavity is formed on the upper portion of the cylinder 430 . The radiator 50 includes a cylindrical core 510 and a plurality of fins 530 radially extending from the periphery of the core 510 . The center of the core body 510 forms a through hole 511 passing through the core body 510 up and down, and the column body 430 of the heat conductor 40 is combined into the through hole 511 . The plurality of fins 530 are slightly curved along the circumferential direction of the core body 510 .

The fixing plate 30 includes an annular body portion 310 , two separated first fixing arms 330 extending outward from the outer edge of the main body portion 310 , and two separated second fixing arms 350 extending in opposite directions to the first fixing arms 330 . The center of the main body 310 has a circular opening 311 for the heat conductor 40 to pass through. The end of each first fixing arm 330 is bent downwards and outwards to form a blocking piece 331 , and the blocking piece 331 has a step difference with the main body portion 310 .

Please refer to FIG. 2 , when assembling the buckle 20 and the fixing module 10 , the connecting portion 210 of the buckle 20 is rotatably installed between the second side 130 of the fixing module 10 and the positioning block 171 of the side wall 170 . Each pressing portion 211 of the connecting portion 210 is located between two adjacent positioning blocks 171 and protrudes toward the opening 110 of the fixing module 10 .

Please refer to FIG. 3 , when assembling the heat conductor 40 , the fixing plate 30 and the radiator 50 , the cylinder 430 of the heat conductor 40 passes through the opening 311 of the main body 310 of the fixing plate 30 , and is fixed on the bottom of the cylinder 430 of the heat conductor 40 , and attached to the upper surface of the bottom 410 of the heat conductor 40 . The cylinder 430 of the heat conductor 40 is fixed in the through hole 511 of the heat sink 50 through interference fit. Therefore, the fixing plate 30 is sandwiched between the radiator 50 and the heat conductor 40 .

Please refer to Figures 4-6. When in use, the bottom 410 of the heat conductor 40 is placed on the electronic component, the first fixing arm 330 of the fixing plate 30 is placed under the fourth side 150 of the fixing module 10 and its baffle 331 blocks end at the bottom surface of the fourth side portion 150 . The two second fixing arms 350 of the fixing plate 30 are located in the opening 110 of the fixing module 10 , and are respectively located below the two resisting portions 211 of the buckle 20 . The stoppers 141 , 151 , 121 are stopped on the outer bottom of the radiator 50 . At this time, the cooling device is in the state shown in FIG. 4 . Turn the operating part 230 of the buckle 20 downward until the part of the operating part 230 close to the handle 231 engages with the buckle ear 123 of the fixed module 10, at this time, the pressing part 211 of the connecting part 210 of the buckle 20 presses down Fix the second fixing arm 350 of the plate 30 so that the bottom surface of the bottom 410 of the heat conductor 40 is closely fixed on the electronic component, so that the heat sink is in close contact with the electronic component, as shown in FIG. 5 and FIG. 6 .

When the heat sink is removed from the electronic component, the buckle between the operation part 230 of the fastener 20 and the buckle ear 123 of the fixed module 10 is released, and the operation part 230 is turned upwards, thereby releasing the resistance of the connection part 210 of the fastener 20. The pressing portion 211 presses against the second fixing arm 350 of the fixing plate 30 , as shown in FIG. 4 , at this moment, the heat sink and the fixing plate 30 can be taken out from the opening 110 of the fixing module 10 .

Compared with the prior art, the buckle 20 is rotatably connected to the fixed module 10, the fixed plate 30 is coupled to the heat conductor 40 of the heat sink, and the first fixed arm 330 of the fixed plate 30 blocks the fixed module 10. Below the fourth side portion 150, by rotating the operating portion 230 of the clip 20, the pressing portion 211 of the clip 20 presses down against the second fixing arm 350 of the fixing plate 30 to realize the close fit of the heat sink and the electronic component. Alternatively, the pressing portion 211 of the clip 20 releases the pressing against the second fixing arm 350 of the fixing plate 30 to remove the heat sink from the electronic component. Therefore, the assembly and disassembly of the heat dissipation device and the electronic components is convenient.

Please refer to FIG. 7 , which is another embodiment of the heat dissipation device of the present invention. The difference between this embodiment and the first embodiment lies in the fourth side 150 ′ and the side wall 170 ′ of the fixed module 10 ′ in this embodiment. The middle part of the bottom edge of each extends downwards to fix the fixed module 10 to the fixed foot 160' on the circuit board, and the side wall 170' is provided with a gap 173 above the fixed foot 160', and the buckle 20' is on the two sides. A bending portion 213 is provided between the pressing portions 211 ′ corresponding to the notch 173 , and the bending portion 213 is substantially perpendicular to the pressing portion 211 ′, so as to prevent the buckle 20 ′ from interfering when fixing the fixing foot 160 ′. A blocking piece 331', 351 is provided at the end of each first and second fixing arm 330', 350' of the fixing plate 30'.

Claims (10)

1. A heat dissipation device, comprising a radiator, a fixed module and a fastener, the radiator comprising a radiator and a thermal conductor combined with the radiator, characterized in that: the fastener comprises a connecting portion and An operating part extending from the connecting part, the connecting part is rotatably mounted on the fixed module, the connecting part is provided with a protruding pressing part, and the heat dissipation device also includes a fixing plate combined with the heat conductor, The opposite sides of the fixing plate are provided with a protruding first fixing arm and a second fixing arm, and the fixing module includes a bottom that presses against the first fixing arm and a buckle that can be buckled with the operating part of the buckle Ear, the pressing part of the buckle rotates the operating part of the buckle downward, so that the operating part can press against the second fixed arm when the buckle ear of the fixing module is buckled, and the pressing part of the buckle By rotating the operating part of the buckle upwards, the pressing of the second fixing arm can be released when the operating part and the buckle lug of the fixing module are released from the buckle. 2. The heat dissipation device according to claim 1, wherein the fixing plate is combined between the heat conductor and the heat dissipation body. 3. The heat dissipation device according to claim 2, wherein: the fixed module further comprises a side wall vertically extending from the bottom, the side wall is extended with a plurality of positioning blocks towards the bottom, the The connecting part of the buckle is rotatably installed between the bottom and the positioning block. 4. The heat dissipation device according to claim 3, wherein: one side of the fixing plate is provided with two first fixing arms, the bottom of the fixing module includes an edge portion opposite to the side wall, the The end of the first fixed arm is provided with a blocking piece which stops at the bottom surface of the edge. 5. The heat dissipation device according to claim 4, wherein: the other side of the fixing plate is provided with two second fixing arms, and the connecting part of the buckle is provided with two second fixing arms that can press against the two second fixing arms respectively. The second pressing part of the arm. 6. The heat dissipation device according to any one of claims 3 to 5, characterized in that: the free end of the operating part of the buckle is bent back to form a handle. 7. The heat dissipation device according to claim 1, wherein the heat conductor comprises a bottom with a larger diameter and a cylinder with a smaller diameter vertically extending from the bottom, and a through hole is arranged in the center of the heat dissipation body. hole, and the column is combined into the through hole. 8. The heat dissipation device according to claim 7, wherein the heat dissipation body comprises a core body and a plurality of fins extending radially from the periphery of the core body, and the opening penetrates through the center of the core body. 9. The heat dissipation device according to claim 8, wherein the fins are bent along the circumference of the core body. 10. The heat dissipation device according to any one of claims 7 to 9, characterized in that: the center of the fixing plate is provided with an opening, and the fixing plate is coupled to the bottom of the above-mentioned heat conductor cylinder through the opening.

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