CN100463126C - Method for mounting video sensor and adhesive tape used for it - Google Patents
Method for mounting video sensor and adhesive tape used for it Download PDFInfo
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- CN100463126C CN100463126C CNB2005100677588A CN200510067758A CN100463126C CN 100463126 C CN100463126 C CN 100463126C CN B2005100677588 A CNB2005100677588 A CN B2005100677588A CN 200510067758 A CN200510067758 A CN 200510067758A CN 100463126 C CN100463126 C CN 100463126C
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- adhesive tape
- imageing sensor
- installation method
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- accepting part
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Abstract
The invention discloses an assembling method of image sensor and adhesive band, which adopts polynaphthalic gylcol ester as base to coat on one surface of adhesive band.
Description
Technical field
The present invention relates to use the installation procedure of the imageing sensor of solid photographic device.
Background technology
At present, in the manufacturing process of solid photographic device, for prevent install and manufacturing process in the dust of image sensor surface adhere to, impaired, take the fit gimmick of surface protective film of the light accepting part side of imageing sensor with adhesive layer.
At this moment; for the parts installation procedure; great majority use under the state of portion of terminal that makes imageing sensor and installation base plate contraposition to be put into it in reflow soldering stove and the method for quickly carrying out connection thus; because comprise the operation under the high-temperature areas such as solder, on protective film and adhesive layer, require thermal endurance.But the majority in the surface protection adhesive tape of present situation does not have the thermal endurance that is suitable for above-mentioned operation, so interim stripper surface is protected adhesive tape when carrying out the installation procedure of parts, and other once more coating surface protection adhesive tape after the parts installation procedure.
In addition; also can take to use the gimmick of surface protection adhesive tape; and described surface protection adhesive tape uses with polyimides as principal component and have the film of high-fire resistance; but because of polyimides has umbrinaceous form and aspect; so identification is poor, and the total light transmittance when carrying out optical check after parts are installed is low.For this reason, be difficult to carry out adhesive tape and attach optical check under the form.
And then, also can take to use the gimmick of the transparent outstanding film of similar PETG (hereinafter referred to as " PET "), but under so-called 180 ℃ hot conditions, the thermal contraction of film causes peeling off of adhesive tape, so be necessary to increase the bonding force that adhesive tape has.But by this method, the adhesive tape that makes heating back cooling raises to the bonding force as the glass surface of the imageing sensor light accepting part of bur, so the adhesive layer of adhesive tape is destroyed, residual on the bur surface have an adhesive layer, causes unfavorable condition.
In addition, be used to protect the method surface and that use adhesive tape to have the easy advantage of operation that attaches or peel off, but then, the movement of electric charges that produces during by the attaching adhesive tape, adhesive tape and bur are charged, follow discharge when peeling off.Recently, along with the miniaturization of electronic device, highly integrated, realize the precise treatment of circuit, on the other hand, electronic device reduces at the patience of discharge, and the discharge when peeling off by adhesive tape causes the phenomenon that so-called electronic device is damaged.
Summary of the invention
Therefore; the object of the present invention is to provide a kind of installation method of imageing sensor as described below; promptly the protection image sensor surface is avoided foreign substance pollution, damage in the manufacturing process of solid photographic device; do not carry out peeling off of adhesive tape in the internal check operation after simultaneously parts installation procedure under heating conditions such as solder and parts are installed and get final product operation, and operation, fail safe, productivity ratio height.
In addition, the present invention also aims to provide a kind of surface protection adhesive film, promptly the destruction that in the stripping process of imageing sensor, prevents to follow generation of static electricity of peeling off and the device that discharge caused that causes thereof of adhesive tape with following effect.
And then, the present invention also aims to make the following possibility that becomes, promptly under the state that is fitted with adhesive tape on the sensitive side of imageing sensor, through the heating process that being used for reflow soldering, needn't carry out the heavily subsides operation of the adhesive tape of reflow soldering operation front and back thus.
Simultaneously, the present invention also aims to, a kind of operable when the installation of such imageing sensor, that heat-shrinkable is high and that have suitable bonding force and that whole adhesive tape has outstanding identification protection adhesive tape is provided.
Present inventors etc. concentrate on studies in order to solve above-mentioned problem, found that by using installation method as follows or adhesive tape to achieve the above object, thereby have finished the present invention.
Promptly, the present invention is a kind of installation method of imageing sensor, it is characterized in that, in the installation procedure of the imageing sensor that has used the solid photographic device, on the light accepting part of imageing sensor, fit PEN as base material and on single face, have the adhesive tape of adhesive layer at least.
According to said method; not only have in the past function promptly when parts transport the cover glass face avoid the performance of the pollution or the damage of foreign matter; by the thermal endurance that PEN had, can carry out preceding adhesive tape being installed and peel off simultaneously as preceding parts.In addition, because the shrinkage of base material is little, what can prevent that the contraction of adhesive tape from causing peels off, can carry out simultaneously the adhesive tape design that bonding force is lower than adhesive tape in the past, when back release adhesive band being installed, not having adhesive residue on the bur surface, thereby improve operating efficiency at parts.
And then, because the transmitance height of adhesive tape, so when the internal check of carrying out after parts are installed, can not follow peeling off of adhesive tape and check.Therefore, in the inspection operation after the parts of solid photographic device are installed, reduce transmitance that adhesive tape causes decay caused to checking the infringement of operation, can check being fitted with under the state of adhesive tape.Consequently need after inspection, not carry out the operations such as attaching again of adhesive tape.In addition, after inspection, transport etc. in the operation, can dispatch from the factory under the state of adhesive tape being fitted with, thereby guarantee fail safe.And then, become possibility at the series-operation that is fitted with under the state of adhesive tape, thereby can realize the raising of productivity ratio.
The present invention is a kind of installation method of imageing sensor, it is characterized in that, in the installation procedure of the imageing sensor that has used the solid photographic device, for the light accepting part of imageing sensor, be with PEN as base material and have on the one side adhesive layer and on the another side coating antistatic agent adhesive tape fit on the light accepting part of above-mentioned imageing sensor.
According to said method; has the performance that when parts transport cover glass face is avoided the pollution or the damage of foreign matter; and can carry out as preceding parts preceding adhesive tape being installed peels off; what can prevent simultaneously that the contraction of adhesive tape from causing peels off; carry out the adhesive tape design that bonding force is lower than adhesive tape in the past; when back release adhesive band being installed, not having adhesive residue on the bur surface, thereby improve operating efficiency at parts.In addition, when the internal check of carrying out after parts are installed, can not follow peeling off of adhesive tape and check, need after inspection, not carry out the operations such as attaching again of adhesive tape.After inspection, transport etc. in the operation, can dispatch from the factory under the state of adhesive tape being fitted with, thereby guarantee fail safe.And then, become possibility at the series-operation that is fitted with under the state of adhesive tape, thereby can realize the raising of productivity ratio.
In addition, by the coating antistatic agent, except having the function of improving productivity ratio, the generation of the static in the time of can also suppressing charged caused adhesive tape and peel off, the destruction that prevents electronic device.Particularly by on substrate backside, applying, can alleviate antistatic agent to the adhering to, pollute of bur, and can improve effective rate of utilization.
The present invention is a kind of installation method of above-mentioned imageing sensor, it is characterized in that, above-mentioned antistatic agent is host with the quaternary ammonium salt.
As mentioned above, the antistatic in the installation procedure of imageing sensor produces extremely important, the anti-static effect after special requirement high temperature passes through.The present inventor finds, on the basis of general anti-static effect, various conditions such as the thermal endurance of special requirement or operation from installation procedure are that the antistatic agent of host is the antistatic agent that is fit to very much purpose of the present invention with the quaternary ammonium salt.Thus, the generation of the static in the time of can suppressing adhesive tape and peel off, the destruction that prevents electronic device.Wherein,, formally should be called " quaternary ammonium compound salt ", but unification is " quaternary ammonium salt " in the present invention about " quaternary ammonium salt ".
The present invention is a kind of installation method of above-mentioned imageing sensor, it is characterized in that, for above-mentioned adhesive tape, has the protuberance of the usefulness peeled off at least a portion of its periphery.
The attaching of adhesive tape and peel off the important operation of formation in the installation of imageing sensor requires infallible and does not occur attachment etc. subsequently.For the present invention, by at least a portion of its periphery, having the protuberance of the usefulness peeled off, before production process such as inspection finish the back or are about to use, release adhesive band easily.At this moment, preferably under the installment state of imageing sensor, the installation of the parts of adhesive tape institute adjacency or solder etc. are not caused obstacle.
The present invention is a kind of installation method of above-mentioned imageing sensor, it is characterized in that, the whole light accepting part of above-mentioned adhesive tape overlay image transducer, at least a portion of its peripheral part has predetermined distance at end face to the central side from imageing sensor simultaneously, thereby is fitted in above-mentioned light accepting part.
For the protection of imageing sensor, need be the band shape that comprehensively covers light accepting part, on the other hand, when the end face of the imageing sensor that exposes of peripheral part of band is big, the installation of the parts of adhesive tape institute adjacency or solder etc. are caused obstacle.That is, preferred adhesive tape should cover light accepting part comprehensively, makes its minimum simultaneously as far as possible.Therefore, for the outer peripheral face of the adhesive tape beyond the above-mentioned protuberance, preferably with its at least a portion, more preferably its major part is fitted on the above-mentioned light accepting part in the mode that end face to the central side from imageing sensor has predetermined distance.
The present invention is a kind of installation method of above-mentioned imageing sensor, it is characterized in that, above-mentioned adhesive tape has parallel with the end face of imageing sensor and is connected to the limit portion of the bottom of above-mentioned protuberance, and the sidepiece that is connected to the bottom from the top of protuberance has Any shape in the middle of oblique line shape, broken line shape, shaped form or their combination simultaneously.
As mentioned above, preferred adhesive tape can easily be peeled off before production process such as inspection finish the back or are about to use.Yet, the fixing bonding force that needs regulation of adhesive tape, on the other hand, if bonding force is strong excessively, when the release adhesive band, possible residual adhesive is so the condition of bonding force is limited at specific scope.Particularly find, for peeling off of the adhesive tape that is provided with protuberance, can clamp and promote protuberance, the be full of cracks of adhesive tape appears this moment easily, so for the present invention, the sidepiece that is connected to the bottom from the top of protuberance has Any shape in the middle of oblique line shape, broken line shape, shaped form or their combination, can successfully adhesive tape be stripped down from imageing sensor thus.
In addition, between the peripheral part of the end face of imageing sensor and light accepting part, has very short distance usually, so for the installation of imageing sensor, the sticking position of adhesive tape is important, even under situation about attaching automatically, also need to confirm sticking position.Therefore, by the adhesive tape of and limit portion that have the bottom that be connected to above-mentioned protuberance parallel with the limit portion of the end face of composing images transducer, sticking position that can clear and definite adhesive tape is so can guarantee the installation of correct and effective imageing sensor.
The present invention is a kind of installation method of above-mentioned imageing sensor, it is characterized in that, for above-mentioned adhesive tape, on the part of the above-mentioned imageing sensor of contact adhesive layer is not set.
For the present invention; protection adhesive tape about imageing sensor; work out by base material and adhesive layer are worked hard and realize series-operation under the state of adhesive tape being fitted with; and then; by on the part corresponding, adhesive layer not being set with the light accepting part of this adhesive tape; when the adhesive tape after parts are installed is peeled off, on the bur surface, do not have adhesive residue, thereby promote operating efficiency.That is to say, the installation method of following imageing sensor can be provided, promptly in the installation procedure of imageing sensor, light accepting part side at imageing sensor is fitted with under the state of adhesive tape, by via the heating process more than 170 ℃, its operation, fail safe, productivity ratio height, wherein, the formation of described adhesive tape is to have stable on heating film to the major general as the base material constituent material and on light accepting part divides adhesive layer not to be set.
In addition, the present invention is the installation method of above-mentioned imageing sensor, it is characterized in that, the percent thermal shrinkage of the base material that uses in above-mentioned adhesive tape under 150 ℃ is below 1.0%.
Promptly, as mentioned above, for peeling off that the thermal contraction that prevents adhesive tape causes, the shrinkage of preferred substrates is little, in the installation procedure of imageing sensor, so that the shrinkage of base material in above-mentioned scope for well, thus, the adhesive tape that bonding force is lower than adhesive tape in the past is designed to possibility, when carrying out the peeling off of adhesive tape after parts are installed, on the bur surface, do not have adhesive residue, promote operating efficiency.
And then the present invention is the installation method of above-mentioned imageing sensor, it is characterized in that, the percent thermal shrinkage of implementing 180 ℃ the above-mentioned adhesive tape of heating after 1 hour is below 1.0%.
That is, as mentioned above, for the installation of imageing sensor, the shrinkage of preferred substrates is little, particularly because comprise the operation of high-temperature areas such as solder, so that the shrinkage of the base material under the hot conditions in above-mentioned scope for well, by clear and definite such additional conditions, further promote operating efficiency.
The present invention is the installation method of above-mentioned imageing sensor, it is characterized in that, the bonding force of implementing 180 ℃ the above-mentioned adhesive tape of heating after 1 hour is 0.1～8.0N/19mm amplitude.
That is,, need have the above bonding force of regulation, on the other hand,, need have the bonding force below the regulation in order to prevent the residual of from bur the adhesive layer the release adhesive band after in order to prevent peeling off of adhesive tape.Particularly under the situation of the installation procedure that comprises high-temperature area, the bonding force of adhesive tape that preferably makes heating condition is in above-mentioned scope, do not damage the function of adhesive tape thus, and during the peeling off of the adhesive tape after parts are installed, do not make adhesive residue on the bur surface and promote operating efficiency.
In addition, the present invention is the installation method of above-mentioned imageing sensor, it is characterized in that, the light transmittance of above-mentioned adhesive tape is more than 50%.
As mentioned above, in the installation of imageing sensor, when preferably optical check is carried out in the inside after parts are installed, check without peeling off of adhesive tape.That is,, when optical check, can keep such function by the light transmittance of adhesive tape is guaranteed more than setting.The operations such as attaching again of the adhesive tape after consequently not needing to check, transporting etc. in the operation after inspection can be dispatched from the factory under the state of adhesive tape being bonded with, and guarantees fail safe thus.In addition, become possibility, thereby can improve productivity ratio at the series-operation that is fitted with under the state of adhesive tape.
The present invention be with PEN as base material and on single face, have the adhesive tape of adhesive layer at least, it is characterized in that, be used for the installation method of above-mentioned any imageing sensor.
In above-mentioned installation method; claimed image sensor surface is not subjected to pollution, the damage of foreign matter, does not carry out peeling off of adhesive tape in the internal check operation after simultaneously parts installation procedure under heating conditions such as solder and parts are installed and adhesive tape that can operation.By the present invention, provide a kind of with PEN as base material and surface protection adhesive tape with outstanding thermal endurance, heat-shrinkable and identification, can satisfy such requirement thus.Simultaneously, the generation of static in the time of can suppressing adhesive tape and peel off, the destruction that prevents electronic device.
As mentioned above; according to the present invention; promptly at the installation procedure of the parts of solid photographic device etc. or check in the operation etc.; become possibility at the series-operation that is fitted with under the state of adhesive tape, the installation method of the imageing sensor that operation when can be provided in the protection image sensor surface thus, fail safe and productivity ratio are high.In addition, by the coating antistatic agent, except having the function of improving productivity ratio, the generation of the static in the time of can also suppressing charged caused adhesive tape and peel off, and the destruction that can prevent electronic device.Simultaneously, can provide a kind of operable when the installation of this imageing sensor, that heat-shrinkable is high and that have suitable bonding force and that whole adhesive tape has outstanding identification protection adhesive tape.
Description of drawings
Fig. 1 is the key diagram of expression adhesive tape of the present invention to the fit-state of imageing sensor.
Fig. 2 is the key diagram of the shape of illustration adhesive tape of the present invention.
Fig. 3 is the expression key diagram with basic comprising of adhesive uncoated adhesive tape partly of the present invention.
Fig. 4 is the expression key diagram with other formations of adhesive uncoated adhesive tape partly of the present invention.
Among the figure: 1-imageing sensor, 2-light accepting part, 3-adhesive tape, 3a-protuberance, 3b-limit portion, 3c-sidepiece, 3d-top, 4-base material, 5-adhesive layer, X-center line.
Embodiment
Below, embodiments of the present invention are described.
Adhesive tape of the present invention is that the adhesive layer that is provided with on the single face by adhesive tape base material and base material forms basically, but can be to the base material applying mould release film of adhesive tape.That is, will be attached on the base material of adhesive tape having implemented the mould release film that the demoulding handles at least one face, and can protect adhesive layer thus and realize the protection of image sensor surface by adhesive layer.
In addition, by the coating of antistatic agent, except having the function of improving productivity ratio, the generation of static electricity in the time of can also suppressing the charged adhesive tape that causes and peel off, and the destruction that prevents electronic device.
About the antistatic agent that uses in the present invention,, then be not particularly limited if having the effect of the generation of static electricity in the time of can suppressing adhesive tape and peel off.For example, can enumerate branch dispersion medias such as making water or any organic solvent etc. and will be coated in method on the base material etc. to quaternary ammonium salt as material, inorganic salts or the metallic compound (for example, tin oxide etc.) of host.Particularly be the antistatic agent of host,, preferably use in the present invention according to the simplicity of operations such as its dissolubility, solvent screening characteristics to solvent with the quaternary ammonium salt.
In addition, on purposes of the present invention, in view of adding ingredient to transfer printing, pollution as the solid photographic device of bur, preferably the rear side of base material is implemented to handle.In addition, when being provided with on the surface at adhesive layer, might influence the mutual characteristic of adhesive layer and antistatic agent, so not preferred.
At this moment, the protuberance that preferably at least a portion of the periphery of adhesive tape, has the usefulness peeled off.Specifically, shown in the example of Fig. 1,,, become the form that protuberance 3a is exposed to the end face 1a of imageing sensor 1 for the part of adhesive tape 3 for the state of applying adhesive tape 3 on the light accepting part 2 of imageing sensor 1.Under this form, imageing sensor 1 is installed on the substrate, at the reflow soldering by high temperature and after carrying out the installation place reason, and the action that can check image transducer 1 or the function of installation base plate.Before production process finishes the back or is about to use, can be by automatic or manual and release adhesive band 3 very easily.
For the sticking position of adhesive tape 3, preferably the part of its peripheral part is positioned at the centre of the end face and the light accepting part 2 of imageing sensor 1.That is, the width of preferred adhesive tape 3 is greater than the width of light accepting part 2, and less than the width of imageing sensor 1.And then, as shown in Figure 1,, be preferably placed at the centre of the end face and the light accepting part 2 of imageing sensor 1 for the whole peripheral part of the adhesive tape 3 the 1b of limit portion of the imageing sensor 1 that covers except protuberance 3a.Can cover light accepting part 2 by adhesive tape 3 comprehensively, when the installation of imageing sensor 1, can prevent that adhesive tape from covering the parts of periphery simultaneously.But, in the installment state of substrate of imageing sensor 1 etc., do not have other mounting portion around the substrate and exist when not needing the space of solder, as long as the part of its peripheral part is positioned at the centre of the end face and the light accepting part 2 of imageing sensor 1, then enough, and do not require that its whole periphery all is positioned at this place.
In addition, the shape of adhesive tape 3 as shown in Figure 2.The situations such as shape that can enumerate situation that shown in Fig. 2 (A) roughly foursquare 1 limit is provided with protuberance 3a or the roughly rectangle shown in Fig. 2 (B) or adapt with the shape of imageing sensor 1.
At this moment, have the 3b of limit portion near the preferred protuberance 3a, the described limit 3b of portion is with the end face 1a of imageing sensor 1 shown in Figure 1, more precisely the mode parallel with the 1b of limit portion that constitutes end face 1a and the bottom of protuberance 3a link to each other.Thereby can guarantee that clear and definite sticking position and bonding affirmation become easy.In addition, when imageing sensor 1 is not illustrative square as Fig. 1, but does not have the square or Long Circle in bight or when oval, preferably have the limit portion of the similar shape parallel with the limit portion of its end face of formation.
And then for protuberance 3a, the sidepiece 3c that is connected to the bottom from its top 3d preferably has the Any shape in the middle of oblique line shape, broken line shape, shaped form or their combination.When release adhesive band 3, to the strongest power of center line effect of protuberance 3a, so the shape 3e by shown in the dotted line of Fig. 2 (A), the adhesive that the be full of cracks of adhesive tape 3 might occur or follow it is residual light accepting part 2.Therefore, preferred sidepiece 3c is the shape of can the power when peeling off disperseing.For concrete shape, if having the divergent function of power, then there is no need to limit especially, for example, can enumerate the shape of the sidepiece 3c shown in Fig. 2 (A)～(D).That is, make the shape of sidepiece 3c become Any shape in the middle of oblique line shape (Fig. 2 (C)), broken line shape (Fig. 2 (D)), shaped form (Fig. 2 (A) and (B)) or their combination (not shown), when release adhesive band 3, can successfully peel off sidepiece 3c thus.Therefore, then the power of the enough approximate equalities of energy is peeled off whole protuberance 3a, and then the power of the enough approximate equalities of energy is peeled off the major part of the adhesive tape that covers light accepting part 2 on the vertical direction in the face of direction of delaminate X.Wherein, can set oblique line or the inclination angle of broken line, the curvature of curve etc. arbitrarily according to the shape of shape, whole adhesive tape 3 or the protuberance 3a of imageing sensor 1 etc.
In addition, adhesive tape 3 preferably is not provided with adhesive layer in the part of the light accepting part 2 of contact image sensor 1.This be because, when the band after parts are installed is peeled off, residual adhesive and promote operating efficiency not on the bur surface.
Specifically, illustration as Fig. 3, can enumerate method as described below etc., promptly when on base material 4, forming adhesive layer 5, forming width and be the uncoated part of a on the part that central authorities and light accepting part imageing sensor of adhesive tape contacts and forming width at two ends is the adhesive layer 5 of b, makes adhesive tape thus.But, shape for adhesive layer 5, if basically with part that the light accepting part of imageing sensor contacts on form the uncoated part, then be not particularly limited, for example, as the illustration of Fig. 4, can use that setting (A) is circular, (B) square method of cutting out the hole that waits arbitrary shape, (C) on four jiaos of base material 4, form the method for adhesive layer 5, the uncoated the whole bag of tricks such as method partly of inclination shape that (D) forms Rack.The oblique line portion of Fig. 4 represents adhesive coating part.
By above-mentioned method, its formation makes adhesive layer 5 relative image sensor surface not be offset and guarantee adhered area in the adhesion strength of fully guaranteeing image sensor surface, can prevent the influence to light accepting part thus.
In view of the shrinkage of base material, to the applying of imageing sensor, the base material of adhesive tape is preferably by having the thermal endurance under 180 ℃ the temperature conditions simultaneously and the PEN of identification when fitting constitutes as the base material of principal component.
For the thickness of adhesive tape, for preventing folding or crackle, preferably be at least more than the 5 μ m, and then, in view of good processing, preferred 10～100 μ m.
In addition, about adhesive,, then be not particularly limited if having stable on heating material.Specifically can enumerate acrylic adhesives or silicone adhesive etc.Especially, the silicone adhesive phase not only has outstanding thermal endurance, also carry out the adjustment of bonding force easily, so finish the bonding force of back when adjusting the release adhesive band arbitrarily final the installation, make the possibility that is designed to of the good adhesive tape of the property handled, can be described as specially suitable jointing material.
For example, as acrylic adhesives, be the adhesive that constitutes by the acrylic copolymer that the copolymerization from the monomer that contains (methyl) alkyl acrylate at least obtains.As the example of said (methyl) alkyl acrylate here, can enumerate (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) butyl acrylate, (methyl) acrylic acid isopentyl ester, the just own ester of (methyl) acrylic acid, (methyl) acrylic acid 2-Octyl Nitrite, (methyl) Isooctyl acrylate monomer, (methyl) acrylic acid ester in the different ninth of the ten Heavenly Stems, (methyl) decyl acrylate, (methyl) dodecylacrylate etc.In addition, in these acrylic adhesives, can contain suitable crosslinking agent.For example, as an example, be isocyanate crosslinking, epoxy crosslinking agent, aziridines compound, chelate class crosslinking agent etc.
And then, as required,, can add as various additives such as filler, age resister, pigment, dyestuff, organosilan coupling agents as other additive.The thermal endurance of acrylic adhesives is the most preferred adhesive of the present invention than higher.
The thickness of the adhesive layer of adhesive tape is below the above 50 μ m of 1 μ m, below the above 30 μ m of preferred 3 μ m, further below the above 20 μ m of preferred 5 μ m.In order to ensure adhesive layer, be effectively if relative substrate surface produces a little height differences a little, but when less than 1 μ m, it is impaired to cause the contact light accepting part to divide because of the deflection of surface protection band, and attaching property also reduces.In addition, might produce peeling off of adhesive tape because of the thermal contraction that adds the film of pining for.When surpassing 50 μ m, the distortion of the adhesive that might add man-hour because of the slit processing and the stamping-out of adhesive tape or, the pressurization when adhesive tape attaches, when transporting etc. to the pressure of adhesive tape and the distortion of the adhesive that causes of the heating when installing be stained with adhesive at the light accepting part branch.In addition, if consider permeability, thin layer preferably then.
That is, in order to protect imageing sensor, require to have the intensity of installing of regulation as adhesive tape, be necessary simultaneously to keep and imageing sensor between the fit-state of mediation, also need machinability in addition.Therefore, for adhesive tape of the present invention, results measured finds that above-mentioned scope is an optimum range.Therefore, the adhesive tape of the thickness by having such adhesive layer can provide the installation method of operation, fail safe, imageing sensor that productivity ratio is high.
For the percent thermal shrinkage of the base material of adhesive tape of the present invention, 150 ℃ the shrinkage of heating in the time of 30 minutes is preferred below 1.0% down, and be further preferred below 0.5%.This is in order to prevent peeling off based on thermal contraction.Percent thermal shrinkage described here is to be that the value that benchmark is measured is a benchmark with JIS C2318.
And then in the present invention, the percent thermal shrinkage of having implemented the adhesive tape after 180 ℃ the heating 1 hour is preferred below 1.0%, more preferably below 0.5%, further preferred below 0.3%.This is because pass through the additional conditions of the shrinkage of the base material under the clear and definite relevant hot conditions, further improves operating efficiency.Here said percent thermal shrinkage is to be fitted in the adhesive tape form on the BA plate and value after placing 1 hour under 180 ℃ the temperature conditions is a benchmark.Assay method about concrete percent thermal shrinkage, adhesive tape is cut into the square of 20mm and is attached on the BA plate, heat under 180 ℃ temperature conditions, (ミ Star ト ヨ system: profile projector PJ-H3000F) measures the size of the band before and after its heating on any direction of MD direction and TD direction to use projector.Wherein, the BA plate is meant that with JIS " BA fine finishining " be benchmark, to the SUS304 plate (Japanese metal (strain) system BA5 fine finishining SUS304) that carries out Surface Finishing for BA5 number.
In addition,, implemented the preferred 0.1～8.0N/19mm amplitude of bonding force of the adhesive tape after 180 ℃ the heating 1 hour, in addition more preferably 0.2～5.0N/19mm amplitude, further preferred 0.3～4.0N/19mm amplitude for the present invention.This be because, is difficult with the bonding force that surpasses 8.0N/19mm release adhesive band from the bur in operation, and adhesive layer is remained on the bur surface, adhesive tape is peeled off by the thermal contraction that is lower than the film that adding of 0.1N/19mm pine for.Here the value that said bonding force will be measured based on JIS Z0237 is as benchmark.
The light transmittance of adhesive tape of the present invention is preferred more than 50%, more preferably more than 70%.When optical check was carried out in the inside after parts are installed, the light transmittance by guaranteeing adhesive tape can be checked without peeling off of adhesive tape more than setting.Here said light transmittance is represented the light transmission of visible region, is meant the light transmittance at 400～700nm place as wavelength region may.For the present invention, preferably any light transmittance in this wavelength region may is more than 50%.When being lower than 50% light transmittance, be difficult to carry out affirmation by the wiring operation that the solid photographic device had of adhesive tape etc.Here the value that said light transmittance will obtain by following assay method is as benchmark.
The assay method of＜light transmittance 〉
(1) determinator: spectrophotometer (Shimadzu Seisakusho Ltd.'s system, MPS-2000)
(2) measurement range: wavelength domain is the scope of 400nm～700nm
(3) sample size: be cut into the size that the relative determination device relatively is fit to
(4) mensuration of adhesive tape is measured from adhesive phase.Wherein, about the mensuration of base material, be to measure from a side of adhesive coating or existence.
In addition, when using mould release film on adhesive tape, mould release film can use known any material.Specifically, can use the film that on the composition surface of the base material of mould release film and adhesive layer, forms demoulding overlay such as layer of silicone.As the base material of mould release film, can be exemplified as the resin film that constitutes by the paper material of glassine paper and so on, polyethylene, polypropylene, polyester etc.
In addition, this adhesive tape can be according to its purposes as the solid photographic size of devices of object and process.About processing method, if keep uniform shape and in processing section portion, do not have the method for adhesive residue, then be not particularly limited, but in view of productivity ratio and preferred stamping-out processing.
Embodiment
Below, embodiment of concrete expression formation of the present invention and effect etc. is described.In addition, the evaluation method of embodiment etc. is as follows.Wherein, the present invention is not limited to such embodiment, evaluation method.
＜evaluation method 〉
About the adhesive tape of making by above-mentioned condition, estimate with following project.
(1) shape of the adhesive tape after the heating
After the sample of the foregoing description of on glass, having fitted, comparative example, under 180 ℃ temperature conditions, place the shape of the adhesive tape after 1 hour.
The identification of the optical check of the inside after (2) the estimation encapsulation forms
Form the box of high 5mm with acrylic panel, portion puts into the semiconductor element that carries out the wiring operation within it.And, at acrylic panel top applying adhesive tape, across adhesive tape to the semiconductor element of acrylic panel inside whether wiring is confirmed.The affirmation of effect is undertaken by the visual of 5 people.Wherein, for metewand, divide 3 stages to classify.
Zero: can clearly confirm to have or not the wiring operation.
△: can barely confirm the wiring operation.
*: can't confirm the wiring operation.
(3) discharge capacity
After the adhesive surface of applying adhesive tape on glass, the discharge capacity when measure placing release adhesive band after 30 minutes.The mensuration of discharge capacity is undertaken by method as follows.
(3-1) is provided with the top and the relative release surface that make coaxial cable be connected the top release surface of high speed electronic stripping tester and moves with identical speed.
(3-2) and then by coaxial cable being connected measure on the oscilloscope the electromagnetic value that produces when peeling off.
It is wide that (3-3) are cut into 20mm with each adhesive tape, is attached on the glass, is arranged on the above-mentioned device.
(3-4) subsequently, the electromagnetic value that will be observed when measuring by 180 ° of peel angle, peeling rate 5mm/min is as place value.
The maximum of the electromagnetism crest that (3-5) will be measured is defined as place value.In addition, be to be benchmark for the judgement of quality of discharge with discharge capacity 100mV, when be 100mV when following for well, when above 100mV, be bad.
(4) fissility
After the sample of on glass, fit following embodiment, comparative example, the easiness of peeling off after placing 1 hour under 180 ℃ the temperature conditions.
＜embodiment 1 〉
Carry out the solution coating of acrylic adhesives on the base material that is made of PEN (the percent thermal shrinkage 0.4%:150 of base material ℃-30 minutes) of thick 25 μ m, drying obtains forming the adhesive tape of the adhesive layer of thick 10 μ m.This adhesive tape implemented measure bonding force based on JIS Z0237 after 180 ℃ about 1 hour of the heating, be 2.0N/19mm, percent thermal shrinkage is 0.15%, and the light transmittance of adhesive tape at 400nm～700nm place is (average 88.0%) more than 50%.
＜embodiment 2 〉
On the base material that is made of PEN of thick 25 μ m, (コ Le コ-ト (strain) system NR-121X) is coated on the rear side of the base material of adhesive tape with quaternary ammonium salt.Subsequently, the solution of coating acrylic adhesives on its another side, drying, making and having formed thickness is the adhesive tape of the adhesive phase of 10 μ m.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JISZ0237, be 2.0N/19mm, percent thermal shrinkage is 0.15%, the light transmittance of adhesive tape at the 500nm place is 86.0%.
＜embodiment 3 〉
On the base material that constitutes by PEN of thick 25 μ m, the solution of coating acrylic adhesives becomes the band shape that the uncoated portion of the coating portion of wide 10mm and wide 10mm replaces, drying, making and having formed thickness is the adhesive tape of the adhesive phase of 5 μ m.Make this adhesive tape have the wide slit of 20mm, thereby obtain adhesive tape so that uncoated partly becomes the central authorities of adhesive tape.Make the a=10mm among Fig. 3, the adhesive tape of b=5mm.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 1.0N/19mm, percent thermal shrinkage is 0.15%.
＜embodiment 4 〉
Except the adhesive layer that forms thick 30 μ m, obtain adopting the method identical and the adhesive tape made with embodiment 2.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 3.0N/19mm, percent thermal shrinkage is 0.15%.
＜embodiment 5 〉
Shown in above-mentioned Fig. 2 (A), adhesive tape is become from the square cover part of 11mm * 12mm, have the adhesive tape shape that outstanding length is the protuberance of 4mm through the sidepiece of the circular shape of R=2 (mm), in addition, make the adhesive tape identical with embodiment 1.
＜embodiment 6 〉
Shown in above-mentioned Fig. 2 (C), making adhesive tape become from the square cover part of 6mm * 7mm, also outstanding length be arranged via the sidepiece that the splay inclination of respectively opening 1mm (3b of Fig. 2 (C) and 3f are 1mm) is arranged in the outside, two ends is the adhesive tape shape of the protuberance of 2.5mm, in addition, make adhesive tape in the same manner with embodiment 1.
＜comparative example 1 〉
Except constituting, obtain adopting the method identical and the adhesive tape made with embodiment 1 by the PET film of thick 25 μ m (the percent thermal shrinkage 1.5%:150 of base material ℃-30 minutes).After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 2.0N/19mm, percent thermal shrinkage is 1.3%.The light transmittance of this adhesive tape at 400nm～700nm place is (average 91.0%) more than 50%.
＜comparative example 2 〉
Except constituting, adopt the method identical to obtain adhesive tape with embodiment 1 by the polyimide film of thick 25 μ m (the percent thermal shrinkage 0.2%:150 of base material ℃-30 minutes).The zone of the light transmittance of this adhesive tape below wavelength 510nm is less than 50%.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 2.0N/19mm, percent thermal shrinkage is 0.1%.
＜comparative example 3 〉
Except not the back side of the adhesive layer of adhesive tape coating quaternary ammonium salt, the adhesive tape that obtains adopting the method identical to make with embodiment 2.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 2.0N/19mm, percent thermal shrinkage is 0.15%, the light transmittance of this adhesive tape at the 500nm place is 88.0%.
＜comparative example 4 〉
As the base material that in adhesive tape, uses, use PETG (East レ system Le ミ ラ-S-10#38), in addition, obtain adopting method similarly to Example 2 and the adhesive tape made.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 1.5N/19mm, percent thermal shrinkage is 1.3%, the light transmittance of this adhesive tape at the 500nm place is 90.0%.
＜comparative example 5 〉
As the base material that in adhesive tape, uses, use polyimides (East レ テ ユ ボ Application corporate system power プ ト Application 100H), in addition, obtain adopting method similarly to Example 2 and the adhesive tape made.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 2.5N/19mm, percent thermal shrinkage is 0.1%, the light transmittance of this adhesive tape at the 500nm place is 24.5%.
＜comparative example 6 〉
Except the solution of acrylic adhesives not being applied as the bar shaped, obtain adopting method similarly to Example 3 and the adhesive tape made.After this adhesive tape being implemented 180 ℃ about 1 hour of heating, be that benchmark is measured bonding force with JIS Z0237, be 2.0N/19mm, percent thermal shrinkage is 0.15%.
＜comparative example 7 〉
The sidepiece of protuberance has the bottom shape (the shape 3e shown in the dotted line of Fig. 2 (A)) of square, in addition, makes adhesive tape similarly to Example 3.
＜result 〉
(1) shape of the adhesive tape after the heating
About embodiment 1～6, the comparative example 3,6 and 7 that on base material, has used PEN, the comparative example 2 and 5 that has used polyimide base material, do not find the decortication of adhesive tape on the glass, peel off, relative therewith, about the comparative example 1 that has used PET, confirmed that the adhesive tape end face peels off because of thermal contraction.In addition, in comparative example 4, confirmed the decortication of the end face of adhesive tape.
(2) identification
Record the result that the identification of the inside after the encapsulation formation is studied in the table 1.
Table 1
| Embodiment 1 | Embodiment 2 | |
|
|
Embodiment 6 | |
| Experimenter A | ○ | ○ | ○ | ○ | ○ | ○ |
| Experimenter B | ○ | ○ | ○ | ○ | ○ | ○ |
| Experimenter C | ○ | ○ | ○ | ○ | ○ | ○ |
| Experimenter D | ○ | ○ | ○ | ○ | ○ | ○ |
| Experimenter E | ○ | ○ | ○ | ○ | ○ | ○ |
| Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | Comparative example 6 | Comparative example 7 | |
| Experimenter A | ○ | △ | ○ | ○ | △ | △ | ○ |
| Experimenter B | ○ | △ | ○ | ○ | △ | △ | ○ |
| Experimenter C | ○ | × | ○ | ○ | × | × | ○ |
| Experimenter D | ○ | △ | ○ | ○ | △ | × | ○ |
| Experimenter E | ○ | × | ○ | ○ | × | × | ○ |
(3) discharge capacity
In the formation of comparative example 3, confirmed the discharge capacity of 400mV, relative therewith, applied the embodiment 2, comparative example 4 of quaternary ammonium salt and 5 formation for rear side at base material, discharge capacity 50mV is maximum.
(4) fissility
Affirmation is the fissility on the glass after implementing 180 ℃ about 1 hour of heating, adhesive tape for embodiment 3, not having has the foreign matter that comes from adhesive on the glass surface of affirmation after adhesive tape is peeled off, but about comparative example 6, having confirmed has the foreign matter that comes from adhesive on the glass surface after adhesive tape is peeled off.In addition, for embodiment 5 and 6, adhesive tape is interrupted and easily peel off from protuberance, but for comparative example 7, be full of cracks occurs and adhesive tape is interrupted from the square part of protuberance bottom, thereby can't from protuberance, easily peel off whole adhesive tape.
(5) sum up
According to above-mentioned result, the discharge in the time of can providing a kind of inhibition to peel off and thermal endurance, identification and fissility surface protection adhesive tape outstanding and that when CCD encapsulates, use during moulding.
Need to prove that " above, following " in this specification includes end points.
Claims (17)
1. the installation method of an imageing sensor, it is characterized in that, in the installation procedure of the imageing sensor that has used the solid photographic device, will be with PEN as base material and on one side, have the adhesive tape of adhesive layer at least, be fitted on the light accepting part of described imageing sensor
And, the protuberance that on the part of the periphery of described adhesive tape, has the usefulness peeled off.
2. the installation method of imageing sensor as claimed in claim 1, it is characterized in that, the whole light accepting part of described adhesive tape overlay image transducer, so that at least a portion of the peripheral part of this adhesive tape is positioned at the mode of the centre of the end face of imageing sensor and light accepting part, be fitted on the described light accepting part.
3. the installation method of imageing sensor as claimed in claim 1, it is characterized in that, described adhesive tape has parallel with the end face of imageing sensor and is connected to the limit portion of the bottom of described protuberance, and the sidepiece that is connected to the bottom from the top of protuberance has Any shape in the middle of oblique line shape, broken line shape, shaped form or their combination simultaneously.
4. the installation method of imageing sensor as claimed in claim 1 is characterized in that, for described adhesive tape, in the part of light accepting part of the described imageing sensor of contact adhesive layer is not set.
5. the installation method of imageing sensor as claimed in claim 1 is characterized in that, the base material that uses in described adhesive tape is below 1.0% at 150 ℃ percent thermal shrinkage.
6. the installation method of imageing sensor as claimed in claim 1 is characterized in that, the percent thermal shrinkage of implementing 180 ℃ the described adhesive tape of heating after 1 hour is below 1.0%.
7. the installation method of imageing sensor as claimed in claim 1 is characterized in that, the bonding force of implementing 180 ℃ the described adhesive tape of heating after 1 hour is 0.1～8.0N/19mm amplitude.
8. the installation method of imageing sensor as claimed in claim 1 is characterized in that, the light transmittance of described adhesive tape is more than 50%.
9. the installation method of an imageing sensor, it is characterized in that, in the installation procedure of the imageing sensor that has used the solid photographic device, will with PEN as base material and have adhesive layer on the one side and on another side the coating antistatic agent adhesive tape, be fitted on the light accepting part of described imageing sensor
And, the protuberance that on the part of the periphery of described adhesive tape, has the usefulness peeled off.
10. the installation method of imageing sensor as claimed in claim 9 is characterized in that, described antistatic agent is host with the quaternary ammonium salt.
11. the installation method of imageing sensor as claimed in claim 9, it is characterized in that, the whole light accepting part of described adhesive tape overlay image transducer, so that at least a portion of the peripheral part of this adhesive tape is positioned at the mode of the centre of the end face of imageing sensor and light accepting part, be fitted on the described light accepting part.
12. the installation method of imageing sensor as claimed in claim 9, it is characterized in that, described adhesive tape has parallel with the end face of imageing sensor and is connected to the limit portion of the bottom of described protuberance, and the sidepiece that is connected to the bottom from the top of protuberance has Any shape in the middle of oblique line shape, broken line shape, shaped form or their combination simultaneously.
13. the installation method of imageing sensor as claimed in claim 9 is characterized in that, for described adhesive tape, in the part of light accepting part of the described imageing sensor of contact adhesive layer is not set.
14. the installation method of imageing sensor as claimed in claim 9 is characterized in that, the base material that uses in described adhesive tape is below 1.0% at 150 ℃ percent thermal shrinkage.
15. the installation method of imageing sensor as claimed in claim 9 is characterized in that, the percent thermal shrinkage of implementing 180 ℃ the described adhesive tape of heating after 1 hour is below 1.0%.
16. the installation method of imageing sensor as claimed in claim 9 is characterized in that, the bonding force of implementing 180 ℃ the described adhesive tape of heating after 1 hour is 0.1～8.0N/19mm amplitude.
17. the installation method of imageing sensor as claimed in claim 9 is characterized in that, the light transmittance of described adhesive tape is more than 50%.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004133807 | 2004-04-28 | ||
| JP2004133807 | 2004-04-28 | ||
| JP2004223516 | 2004-07-30 | ||
| JP2004316103 | 2004-10-29 | ||
| JP2004329598 | 2004-11-12 |
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| Publication Number | Publication Date |
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| CN1855403A CN1855403A (en) | 2006-11-01 |
| CN100463126C true CN100463126C (en) | 2009-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100677588A Expired - Fee Related CN100463126C (en) | 2004-04-28 | 2005-04-26 | Method for mounting video sensor and adhesive tape used for it |
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| CN (1) | CN100463126C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197100A (en) * | 1997-04-22 | 1998-10-28 | 阿尔泰克株式会社 | Antistatic agents, coatings, and adhesive |
| CN1285785A (en) * | 1997-11-06 | 2001-02-28 | 联合讯号公司 | Multilayered haloplymer poly (alkylene naphthalate) films with UV blocking characteristics |
| TW474100B (en) * | 2000-04-11 | 2002-01-21 | King Yuan Electronics Co Ltd | Packaged image sensor structure and method of packaging the same |
| US6472247B1 (en) * | 2000-06-26 | 2002-10-29 | Ricoh Company, Ltd. | Solid-state imaging device and method of production of the same |
-
2005
- 2005-04-26 CN CNB2005100677588A patent/CN100463126C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1197100A (en) * | 1997-04-22 | 1998-10-28 | 阿尔泰克株式会社 | Antistatic agents, coatings, and adhesive |
| CN1285785A (en) * | 1997-11-06 | 2001-02-28 | 联合讯号公司 | Multilayered haloplymer poly (alkylene naphthalate) films with UV blocking characteristics |
| TW474100B (en) * | 2000-04-11 | 2002-01-21 | King Yuan Electronics Co Ltd | Packaged image sensor structure and method of packaging the same |
| US6472247B1 (en) * | 2000-06-26 | 2002-10-29 | Ricoh Company, Ltd. | Solid-state imaging device and method of production of the same |
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| CN1855403A (en) | 2006-11-01 |
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