CN100458652C - Heat dissipation method - Google Patents

Abstract

A heat dissipation method is applied to a computer system with a timing inquiry mechanism and a temperature sensing unit, the method firstly executes a heat dissipation temperature working mode setting program, the timing inquiry mechanism of the computer system outputs periodic signals to a basic input and output system, the temperature sensing unit senses the temperature of a hardware device, and then the heat dissipation unit of each hardware device carries out heat dissipation treatment by means of the temperature measured by the temperature sensing unit and according to the heat dissipation temperature working mode; the invention uses the timing inquiry mechanism to output a signal to the basic input and output system at regular time to control the operation intensity of the heat dissipation unit, thus the hardware monitoring can be carried out without additionally installing software or hardware, and the heat dissipation and operation efficiency of the hardware device of the computer system can be improved.

Description

cooling method

technical field

The invention relates to a heat dissipation method, in particular to a heat dissipation method applied to a computer system with a timing inquiry mechanism.

Background technique

The research and development of electronic information-related technologies is changing with each passing day, and many products with powerful functions and reasonable prices have come out one after another. Taking computer equipment as an example, whether it is a large supercomputer, a server host or even a personal computer and a notebook computer, etc., it has already become an indispensable and important tool in people's work and life. With the advancement of semiconductor processes, computer products can integrate more and more circuits into the same integrated circuit (IC), which has smaller and smaller volume and faster and faster operation speed. As far as the central processing unit (CPU) in the computer hardware device is concerned, it is constantly introducing new ones, and its operating speed is increasing exponentially.

However, it is accompanied by the problem of difficult heat dissipation due to the reduction in the size of the computer hardware device and the increase in its operating speed, which increases power consumption. The temperature will affect the stability of the computer system. Generally speaking, heat-dissipating units (such as fans) will be installed in the heat-generating parts of electronic components, such as central processing units or computer cases with various electronic components inside, to avoid system crashes or even Cause internal electronic parts to burn. Furthermore, power consumption directly affects the service life of portable computer devices (such as notebook computers). Generally speaking, users will choose high-capacity batteries to increase the use time, but high power consumption is more likely to make the computer The temperature of the chassis rises.

With regard to the design of current computer systems, such as the erection of servers or workstations, Hardware Monitoring has become one of the important considerations in its design. Personal needs dynamically adjust the status of computer hardware, which includes monitoring items such as voltage monitoring, temperature monitoring, and fan control. Among them, the temperature monitoring of the central processing unit of computer hardware equipment is the most important. Another relative function is the speed control of the cooling fan. With the temperature change caused by the operation of the computer system, the temperature of the computer hardware equipment is obtained by using the hardware monitoring method, and then the operating intensity of the fan is adjusted, that is, the temperature of different computer hardware equipment is corresponding to the temperature of the different computer hardware equipment, and the different speeds of the fan are controlled to make the computer system at a certain temperature. In a stable ambient temperature, the operating efficiency of the computer system is further improved. At present, the industry's main method to improve the above-mentioned heat dissipation problem is to install a baseboard management controller (BMC) in the computer system to monitor the hardware and implement related hardware control functions. This also increases the cost of the computer system and the complexity of system design. At present, this hardware monitoring method is generally used in high-end computer systems, while low-end computer systems are mostly unable to use hardware monitoring due to cost and system complexity considerations. The method is to adjust the operating intensity of the fan according to the temperature of the computer hardware device. In order to solve the above problems, some existing manufacturers use software to control the speed of the fan. On the one hand, additional design and installation programs are required, and on the other hand, different software must be designed for different computer operating systems. not convenient.

As mentioned above, the heat dissipation management of the existing computer system still has the above-mentioned problems. Therefore, how to realize the control of the computer hardware by changing the operating intensity of the heat dissipation fan without adding a baseboard management controller or installing software. Temperature adjustment, so that low-end computer systems can also have the same function, is a topic that needs to be solved urgently.

Contents of the invention

To overcome the above-mentioned problems in the prior art, the main purpose of the present invention is to provide a heat dissipation method that can monitor the temperature of the hardware and control the operating intensity of the heat dissipation unit without installing additional software or hardware.

Another object of the present invention is to provide a heat dissipation method suitable for low-end computer systems.

In order to achieve the above disclosure and other objectives, the present invention is a heat dissipation method, which is applied to a computer system with a timing query mechanism and a temperature sensing unit. The method includes: setting the computer system with a temperature sensor for sensing the hardware device Measuring unit; Execute the cooling temperature working mode setting program, set the cooling temperature working mode in the basic input and output system, wherein, the cooling temperature working mode is to make the cooling unit produce different intensities of cooling performance according to the different temperatures of the hardware device ; and output a periodic signal to the basic input and output system regularly by the timing inquiry mechanism of the computer system, and make the temperature sensing unit regularly sense the temperature of the hardware device, and use the pulse width modulation controller according to the temperature sense The temperature measured by the measurement unit and the heat dissipation temperature working mode set in the basic input and output system output the corresponding pulse width modulation signal as a control signal to make the heat dissipation unit of each hardware device perform heat dissipation treatment, wherein the heat dissipation treatment refers to When the hardware device of the computer system is in a specific temperature range, the heat dissipation unit can reach a specific operating intensity.

Compared with the existing heat dissipation method, the present invention uses a timing inquiry mechanism to regularly output signals to the basic input and output system to control the operating intensity of the heat dissipation unit. Therefore, hardware monitoring can be performed without additional software or hardware installation, improving Heat dissipation and operating performance of computer system hardware devices.

Description of drawings

Fig. 1 is the flow chart of the basic steps of the cooling method of the present invention;

Fig. 2 is a detailed representation of the operational step flow process of step S4 of Fig. 1;

Fig. 3 is a table corresponding to a temperature range and a fan speed, showing that the heat dissipation method of the present invention controls the speed of the fan within a specific temperature range; and

Fig. 4 is a schematic block diagram of the basic structure required to apply the heat dissipation method of the present invention.

Detailed ways

Example

FIG. 1 is a schematic flow chart of the heat dissipation method of the present invention. With the schematic flow chart and detailed description, an embodiment of the heat dissipation method of the present invention is described. The following drawings are all simplified schematic diagrams, and only show the parts relevant to the present invention.

Fig. 1 is a schematic diagram of the operation flow of the heat dissipation method of the present invention, which is applied in a computer system (which can be a notebook computer or a desktop computer) with a timing inquiry mechanism, and the basic input of the computer system is coordinated by the timing inquiry mechanism Output system (Basic InputOutput System; BIOS), and according to the temperature of each hardware device of the computer system, drive each cooling unit (such as a cooling fan) for reducing the temperature of the hardware device, thereby improving the cooling and operating performance of the computer system, the above The hardware device can be the central processing unit (CPU), hard disk (HD), memory (Memory), optical drive (CD/DVD-ROM), floppy drive (Floppy), power supply (Power Supply) and case (Case) of the computer system wait.

The method first executes step S1, setting the cooling temperature working mode. This step is to first select the heat dissipation temperature working mode of the storage unit established in the computer system. The heat dissipation temperature working mode is that each hardware device of the computer system makes the heat dissipation unit produce different intensities of heat dissipation in different temperature ranges. Its content is pre-built by the user and stored in the storage unit of the computer system by writing. The storage unit is preferably flash memory (flash ROM), and others such as programmable read-only memory (PROM), programmable Memories such as erasable read-only memory (EPROM) and electrically erasable read-only memory (EEPROM) are also applicable; this step S1 is performed by the basic input and output system during the power-on self-test (Power-On Self Test; POST) stage of the computer system. Execute, after completing the setting in step S1, proceed to step S2.

In this step S2, a signal is regularly output. This step is followed by step S1, which is executed after entering the operating system (OS) stage of the computer system, and a periodic signal is regularly output to the basic input output system and the temperature sensing unit by the timing inquiry mechanism of the computer system. The timing inquiry mechanism is Set in the chipset (chipset), preferably the South Bridge chipset (South BridgeChip), the above-mentioned periodic signal is a system management interrupt (System Management Interrupt; SMI) signal, and then enter step S3.

In this step S3, temperature is sensed. In this step, the periodic signal is regularly output through the timing inquiry mechanism of the computer system, so that the temperature sensing unit regularly senses the temperature of the hardware device, and then proceeds to step S4.

In the step S4, heat dissipation processing is performed according to the sensed temperature and the heat dissipation temperature working mode. This step is to use the temperature measured by the temperature sensing unit to use the control signal according to the heat dissipation temperature working mode set in the basic input and output system to make the heat dissipation unit of each hardware device perform heat dissipation processing. The control signal is pulse width Modulate (Pulse Width Modulation; PWM) the pulse width modulation signal output by the controller, and the above pulse width modulation controller is set in the chipset (chipset), preferably SIO (Super I/O) chipset; the above heat dissipation treatment is It means that when the hardware device of the computer system is in a specific temperature range, the heat dissipation unit reaches a specific operating intensity, and after completing step S4, return to step S2, so as to control the operating intensity of the heat dissipation unit repeatedly.

FIG. 2 shows a more detailed flow chart of the operation of step S4 in FIG. 1 . After the boot self-test phase of the computer system is over (step S1 as shown in Figure 1), enter the operating system phase of the computer system, and after the steps S2 and S3, execute the steps included in the dotted box in Figure 2. First execute step S40 or step S41, wherein, if step S40 is executed, the pulse width modulation control interval value corresponding to the sensed temperature is obtained by the computer system, and if step S41 is executed, the pulse width modulation control value of the actual cooling unit is obtained, Then step S42 is executed to determine whether the pulse width modulation control value of the actual cooling unit is within the pulse width modulation control interval value corresponding to the sensed temperature, if so, then return to step S2, and then output the signal regularly by the timing inquiry mechanism; if If not, go to step S43, change the PWM control value of the actual cooling unit according to the heat dissipation temperature working mode of the basic input and output system, and return to step S2 after completion.

From the detailed steps of the above and FIG. 2, the heat dissipation method of the present invention can be further understood. It uses the hardware monitoring function of the SIO chipset, and compares the pulse width modulation control interval value corresponding to the sensed temperature, and then uses the pulse width modulation The controller changes the pulse width modulation control value of the actual heat dissipation unit to make the heat dissipation unit reach a specific operating intensity.

In order to more clearly show the above-mentioned heat dissipation temperature working mode and the preferred implementation mode of heat dissipation treatment, now take Fig. 3 as an example to illustrate, it shows the table of the heat dissipation method of the present invention to control the heat dissipation unit to reach a specific operating intensity within a specific temperature range, The content of the table is the heat dissipation temperature working mode established by the user through the above step S1, and the heat dissipation treatment performed in the above step S4 relative to the heat dissipation temperature working mode; wherein, the heat dissipation unit is a heat dissipation fan, as shown in the figure, it Including a highest temperature range (T ≥ 35 ℃), a moderate temperature range (35 ℃ > T ≥ 31 ℃), a low temperature range (31 ℃ > T ≥ 27 ℃) and a lowest temperature range (27 ° C > T).

During the heat dissipation process, the heat dissipation unit will reach the highest operating intensity (Sx100%) in the highest temperature range (T≥35°C), where the symbol S means that the fan is running at full speed, which is the actual sensed If the temperature (T) is greater than or equal to 35°C, the fan will run at full speed; in the moderate temperature range (35°C>T≥31°C), the cooling unit will reach a moderate operating intensity (Sx90%), that is, the actual If the sensed temperature (T) is between 35°C and 31°C or equal to 31°C, the fan will run at 90% of full speed; in the low temperature range (31°C>T≥27°C), it will dissipate heat The unit reaches a low operating intensity (Sx70%), that is, if the actual sensed temperature (T) is between 31°C and 27°C or equal to 27°C, the fan will run at a full speed of 70%; at a minimum In the temperature range (27°C>T), the heat dissipation unit will reach the lowest operating intensity (Sx60%), that is, if the actual sensed temperature (T) is less than 27°C, the fan will run at 60% of the full speed, replace In other words, in different temperature ranges, the hardware devices of the computer system will cause the heat dissipation units to produce different intensities of heat dissipation performance for heat dissipation treatment; the above and the numerical values shown in Figure 3 are just an example, and in actual implementation , which can be converted into different values according to the needs of users.

In addition, the relationship between the basic structures formed by the cooling method of the present invention can be seen more clearly from Fig. 4, which is the timing inquiry mechanism of the central processing unit 10 (such as the above-mentioned south bridge chipset and SIO chipset) of the computer system , regularly output periodic signals to the basic input and output system 20 and the temperature sensing unit 30, and output control signals by means of the temperature measured by the temperature sensing unit 30 and the heat dissipation temperature working mode set in the basic input and output system 20, so that The heat dissipation unit 40 performs heat dissipation processing on the hardware device 50 , and its implementation and steps are as described above.

In a word, the present invention utilizes the timing query mechanism to regularly output signals to the basic input and output system to control the operating intensity of the heat dissipation unit. Therefore, the purpose of hardware monitoring can be achieved without additional software or hardware, and the computer system hardware device is improved. cooling and operating performance.

Claims (19)

1. heat dissipating method, being applied in one has in the computer system of polling mechanism, the Basic Input or Output System (BIOS) that cooperates this computer system by this polling mechanism, and temperature according to each hardware unit of this computer system, each heat-sink unit that driving is used to lower the temperature, improve the heat radiation and the operation usefulness of this computer system whereby, it is characterized in that this heat dissipating method comprises:

Make this computer system be provided with the temperature sensing unit that is used for this hardware unit of sensing;

Carry out exothermic temperature Working mode set program, set the exothermic temperature mode of operation in this Basic Input or Output System (BIOS), wherein, this exothermic temperature mode of operation is the heat dissipation that makes heat-sink unit generation varying strength according to the different temperatures of this hardware unit; And

Regularly export the one-period signal to this Basic Input or Output System (BIOS) by the polling of this computer system mechanism, and make the regularly temperature of this hardware unit of sensing of this temperature sensing unit, and temperature that records according to this temperature sensing unit by PDM keyer and the exothermic temperature mode of operation output relevant pulse width modulation signals that is set in this Basic Input or Output System (BIOS), carry out radiating treatment with the heat-sink unit that makes each hardware unit as control signal, wherein, this radiating treatment is meant this hardware unit of this computer system when specific range of temperatures, makes heat-sink unit reach specific operation intensity.

2. heat dissipating method as claimed in claim 1 is characterized in that, this exothermic temperature Working mode set program is to carry out by this Basic Input or Output System (BIOS).

3. heat dissipating method as claimed in claim 1 or 2 is characterized in that, this exothermic temperature Working mode set program is to carry out in the start selftest stage of this computer system.

4. heat dissipating method as claimed in claim 1 is characterized in that, the content of this exothermic temperature mode of operation is built by the user and put.

5. as claim 1 or 4 described heat dissipating methods, it is characterized in that this exothermic temperature mode of operation is arranged on the storage unit of this computer system.

6. heat dissipating method as claimed in claim 5 is characterized in that, this storage unit is a kind of in flash memory, programmable read only memory, EROM, the electrically-erasable ROM (read-only memory).

7. heat dissipating method as claimed in claim 1 is characterized in that, the polling mechanism of this computer system is to enter operating system after the stage, regularly to this Basic Input or Output System (BIOS) output periodic signal.

8. heat dissipating method as claimed in claim 1 is characterized in that, this temperature sensing unit is in the operating system that enters this computer system after the stage, regularly the temperature of this hardware unit of sensing.

9. heat dissipating method as claimed in claim 8 is characterized in that, this temperature sensing unit is in the operating system that enters this computer system after the stage, by one-period signal make its regularly temperature of this hardware unit of sensing.

10. heat dissipating method as claimed in claim 9 is characterized in that, this periodic signal is by this polling mechanism output.

11., it is characterized in that this periodic signal is a system management interrupt signal as claim 7 or 9 or 10 described heat dissipating methods.

12., it is characterized in that this polling mechanism is arranged on chipset as claim 1 or 7 or 10 described heat dissipating methods.

13. heat dissipating method as claimed in claim 12 is characterized in that, this chipset is the South Bridge chip group.

14. heat dissipating method as claimed in claim 1 is characterized in that, this PDM keyer is arranged on chipset.

15. heat dissipating method as claimed in claim 14 is characterized in that, this chipset is the SIO chipset.

16. heat dissipating method as claimed in claim 1 is characterized in that, this hardware unit is in central processing unit, hard disk, internal memory, CD-ROM drive, floppy drive, power supply unit and the cabinet of this computer system.

17. heat dissipating method as claimed in claim 1, it is characterized in that this radiating treatment is included in and makes this heat-sink unit reach the highest operation intensity, make this heat-sink unit reach medium operation intensity, make this heat-sink unit reach low operation intensity and make this heat-sink unit reach minimum operation intensity in the topnotch temperature range in the most low temperature range in a low temperature range in a moderate temperature range.

18., it is characterized in that this heat-sink unit is a fan as claim 1 or 17 described heat dissipating methods.

19. heat dissipating method as claimed in claim 1 is characterized in that, this computer system is in notebook computer and the desktop PC.

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