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CN100456309C - Wiring rule setting system and method - Google Patents

Wiring rule setting system and method Download PDF

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Publication number
CN100456309C
CN100456309C CNB2006100574232A CN200610057423A CN100456309C CN 100456309 C CN100456309 C CN 100456309C CN B2006100574232 A CNB2006100574232 A CN B2006100574232A CN 200610057423 A CN200610057423 A CN 200610057423A CN 100456309 C CN100456309 C CN 100456309C
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China
Prior art keywords
attribute
sub
copper
area
wiring rule
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Expired - Fee Related
Application number
CNB2006100574232A
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Chinese (zh)
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CN101038600A (en
Inventor
许岩
杨淑敏
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Inventec Corp
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Inventec Corp
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Priority to CNB2006100574232A priority Critical patent/CN100456309C/en
Publication of CN101038600A publication Critical patent/CN101038600A/en
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Publication of CN100456309C publication Critical patent/CN100456309C/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a wiring rule setting system and a method, wherein the wiring rule setting system comprises: the device comprises an input module, a classification module and a processing module. The wiring rule setting method includes the steps of: inputting a preselected area to be subjected to a copper laying procedure; performing a classification procedure according to the attributes of the plurality of sub-regions; and connecting the copper layers in the sub-regions classified as the first attribute of the preselected region to each other and not connecting the copper layers in the sub-regions classified as the second attribute of the preselected region to each other according to the result of the classification procedure. The wiring rule setting system and the method automatically disconnect the copper layer in the area below the element which is easy to be interfered with from the copper layer in other areas in the design, avoid the influence on the working performance of the printed circuit board due to the interference, avoid the defect of cutting the copper layer by adopting the Cut Fill function, realize the automatic mutual separation of the copper layers and relatively improve the working efficiency.

Description

The designing wiring rule system and method
Technical field
The invention relates to a kind of designing wiring rule system and method, particularly carry in the design software of making the printed circuit pattern on the printed circuit board (PCB) (PCB), can judge automatically whether the copper layer needs interconnective designing wiring rule system and method about a kind of.
Background technology
The Electronics Engineer finishes by all kinds of softwares (for example Protel software) usually for the design of printed circuit board (PCB) now, its design process comprises spreads the copper setting, and this setting is meant that in the zone of not wishing to have cabling (for example zone of heating radiator, crystal oscillator and place, white space below wiring layer) is provided with packed layer and spread copper.Generally for current all kinds of design softwares, each packed layer is set to be connected with the large tracts of land packed layer in can same automatically line properties in the copper setting up procedure of shop, this way is influential for the class component of crystal oscillator, more therefore, the stability of class component is not enough indirectly, impact for the printed circuit board (PCB) serviceability that is provided with, in case this class component is interfered, can have a strong impact on the normal operation of printed circuit board (PCB), for this reason, this class component below often needs to lay digital grounding end (DGND), and the packed layer of its below is connected with the large tracts of land packed layer.
After finishing above-mentioned way, then can carry out cutting (cut) program, this cutting process adopts the subsidiary Cut Fill function of software, be subject to disturb the packed layer and the large tracts of land packed layer of element below to carry out dividing processing in crystal oscillator and so on, guarantee the job stability of this class component with manual type.
Yet above-mentioned way is to relend by manual type to carry out Cut Fill operation after shop copper set handling flow process finishes, and very easily the careless mistake because of artificial treatment causes the monoblock PCB design unreasonable, and severe patient can make this printed circuit board (PCB) normally move.In addition, carry out artificial dividing processing again after the treatment scheme of shop copper setting finishes, the treatment scheme that can make the copper setting of whole shop is divided into two steps but not automatic integratedization finished, and has reduced shop copper efficiency of operation.Have again; by the software design printed circuit board (PCB); connect the treatment scheme of shape setting at large-area shop copper after; it is excessive to make that document takies the storage area; when needs are made amendment operation to this electronic data file; regular meeting reduces because of its excessive occupied system resources causes system handles speed, has significantly influenced work efficiency.
Therefore, how to solve above-mentioned disappearance, become the technical matters that industry needs to be resolved hurrily in fact.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, fundamental purpose of the present invention is to provide a kind of designing wiring rule system and method, copper layer in the element lower zone that in design, automatically will not be subject to disturb with other the zone in the copper layer be connected, avoid being subjected to the serviceability of this printed circuit board (PCB) of disturbing effect because of it.
Another object of the present invention is to provide a kind of designing wiring rule system and method, avoid adopting Cut Fill function that the copper layer is separated from each other, realize that the copper layer is separated from each other automatically, increases work efficiency relatively.
For realizing above-mentioned main and other purpose, designing wiring rule of the present invention system, carry in the design software of making the circuit pattern on the printed circuit board (PCB), has the preselected area that to spread the copper program in this printed circuit pattern, and this preselected area is made up of a plurality of subregions that are used to lay the copper layer, this designing wiring rule system comprises: load module provides the user to import the preselected area that will carry out this shop copper program; Classifying module, the attribute separately according to a plurality of subregions in this preselected area carries out sorting process, these a plurality of subregions is classified as first attribute or second attribute of this preselected area; And processing module, the result of the sorting process that carries out according to this classifying module interconnects the copper layer that classifies as in the subregion of this preselected area first attribute, and the copper layer that classifies as in the subregion of this preselected area second attribute does not then interconnect.
Wherein, if attribute be subject to disturb ground plane maybe must be set, then this classifying module classifies as this subregion second attribute of this preselected area.
With respect to above-mentioned designing wiring rule system, designing wiring rule method of the present invention, carry in the design software of making the printed circuit pattern on the printed circuit board (PCB), has the preselected area that to spread the copper program in this printed circuit pattern, and this preselected area is made up of a plurality of subregions that are used to lay the copper layer, and this designing wiring rule method may further comprise the steps: input will be spread the preselected area of copper program; Attribute according to these a plurality of subregions carries out sorting process, these subregions is classified as first attribute or second attribute of this preselected area; And according to the result of the sorting process that carries out, the copper layer that classifies as in the subregion of this preselected area first attribute is interconnected, the copper layer that classifies as in the subregion of this preselected area second attribute does not then interconnect.
Wherein, for attribute be subject to disturb maybe ground plane must be set, then this subregion is classified as second attribute of this preselected area.
In sum, designing wiring rule system and method for the present invention makes the copper layer of the subregion that is subject to disturb separate, improve the stability of its work, after also can avoiding simultaneously prior art shop copper program to finish, adopt the subsidiary Cut Fill function of the design software of printed circuit pattern corresponding copper layer to be cut the disappearance that produces when (cut) program.
Description of drawings
Fig. 1 is the basic framework synoptic diagram of designing wiring rule of the present invention system;
Fig. 2 is the steps flow chart synoptic diagram of designing wiring rule method of the present invention; And
Fig. 3 is the synoptic diagram of designing wiring rule method of the present invention.
Embodiment
Embodiment
At first, see also Fig. 1, it is the basic framework synoptic diagram of designing wiring rule of the present invention system 1; Designing wiring rule of the present invention system 1 carries in the design software of making the printed circuit pattern on the printed circuit board (PCB) 2 (PCB), wherein, has the preselected area 21 that to spread the copper program in this printed circuit pattern, and this preselected area 21 is made up of a plurality of subregions that are used to lay the copper layer, as shown in the figure, in the present embodiment, this preselected area 21 is made up of subregion 211, subregion 212 and subregion 213, wherein, this subregion 211 zone that is crystal oscillator places.
This designing wiring rule system 1 comprise a load module 11, one and the classifying module 12 that electrically connects of this load module 11 and one with the processing module 13 of these classifying module 12 electric connections.
The preselected area 21 that this load module 11 provides the user to import will to spread the copper program.
This classifying module 12 is carried out sorting process according to the attribute separately of subregion 211, subregion 212 and the subregion 213 of this preselected area 21, these subregions are classified as first attribute or second attribute of this preselected area 21, if the attribute of these subregions is subject to disturb, then it is classified as second attribute of this preselected area 21.For example, this subregion 211 is the zones at crystal oscillator place, and then its attribute is subject to disturb, and then this classifying module 12 classifies as this subregion 211 second attribute of this preselected area 21.In addition, if attribute is the subregion that ground plane need be set, this classifying module 12 also classifies as it second attribute of this preselected area 21, and here, this ground plane is meant digital grounding layer (DGND).Moreover in this embodiment, according to the attribute of this subregion 212 and this subregion 213, this classifying module 12 classifies as this both first attribute of this preselected area 21.
This processing module 13 is carried out the result of sorting process according to this classifying module 12, be connected classifying as the subregion 212 of these preselected area 21 first attributes and the copper layer in this subregion 213, classify as the copper layer in the subregion 211 of these preselected area 21 second attributes, then be not connected with copper layer in subregions 212 and this subregion 213 in this preselected area 21.
See also Fig. 2 again, it is the basic step process flow diagram of designing wiring rule method of the present invention; Designing wiring rule method of the present invention, carry in the design software of making the circuit pattern on the printed circuit board (PCB) 2 (PCB), wherein, has the preselected area 21 that to spread the copper program in this printed circuit pattern, and this preselected area 21 is made up of the subregion 211 that is used to lay the copper layer, subregion 212 and subregion 213, wherein, this subregion 211 zone that is crystal oscillator places.
At first execution in step S20 imports the preselected area 21 that needs shop copper, then enters step S21.
In step S21, this classifying module 12 is carried out sorting process according to the attribute separately of subregion 211, subregion 212 and the subregion 213 of this preselected area 21, these subregions are classified as first attribute or second attribute of this preselected area 21, in the present embodiment, this subregion 211 is subject to disturb, therefore it is classified as second attribute of this preselected area 21,213 of this subregion 212 and this subregions classify as first attribute of this preselected area 21.In addition, for attribute the subregion of ground plane need be set, also it be classified as second attribute of this preselected area 21, in this embodiment, this ground plane is meant the digital grounding layer, then enters step S22.
In step S22, this processing module 13 is according to the classification result of this classifying module 12, and the copper layers in these subregion 211 zones are not connected with the copper layer of this subregion 212 and this subregion 213, and the copper layer of this subregion 212 is connected with the copper layer of this subregion 213.
See also Fig. 3 again, it is the synoptic diagram of designing wiring rule method of the present invention.As shown in the figure, set in the interface 3 in this rule, have input subregion name region " Net Name " 31, one setting key 32 and and determine key 33, import the title of this subregion 211 in this subregion name region, for example, A.net, attribute according to this subregion 211, be classified as second attribute of preselected area 21, then do not need to press this setting key 32, copper layer in these subregion 211 zones is not connected with the regional interior copper layer of other subregion, and setting finishes, and presses definite key 33 and preserves this time setting.In addition if press this setting key 32, then in the corresponding subregion of this subregion name region input title in the copper layer in the zone and the same attribute subregion the interior copper layer in zone be connected.
In sum, the setting of the copper layer concatenate rule of designing wiring rule system and method for the present invention by a plurality of subregions in the preselected area being used to spread copper, make that the copper layer in the zone is not connected in copper layer and other subregion in the element region that crystal oscillator and so on is subject to disturb, therefore avoid class component to be interfered and influence the serviceability of this printed circuit board (PCB), moreover this setting is to carry out before the copper operation of shop, avoid prior art after shop copper program is finished, adopt the subsidiary Cut Fill function of the design software of printed circuit pattern corresponding copper layer to be cut the disappearance that produces when (cut) program.

Claims (4)

1.一种布线规则设定系统,搭载到制作印刷电路板上的电路图案的设计软件中,其特征在于,该印刷电路图案中具有需要进行铺铜程序的预选区域,且该预选区域由多个用于铺设铜层的子区域组成,该布线规则设定系统包括:1. A wiring rule setting system, which is carried in the design software for making the circuit pattern on the printed circuit board, is characterized in that, in the printed circuit pattern, there is a pre-selected area that needs to carry out the copper laying program, and the pre-selected area is composed of multiple It consists of two sub-areas for laying copper layers, and the wiring rule setting system includes: 输入模块,提供使用者输入要进行该铺铜程序的预选区域;The input module provides the user to input the preselected area where the copper laying procedure is to be performed; 归类模块,依据该预选区域中的多个子区域的各自属性,进行归类程序,将该多个子区域归类为该预选区域的第一属性或第二属性,其中该子区域的属性若是易受干扰的属性或是须设置接地层的属性,则该归类模块将该子区域归类为该预选区域的第二属性;以及The classification module performs a classification procedure according to the respective attributes of the multiple sub-regions in the pre-selected area, and classifies the multiple sub-regions as the first attribute or the second attribute of the pre-selected area, wherein if the attribute of the sub-region is easy If the attribute is disturbed or the attribute must be provided with a ground layer, the classification module classifies the sub-area as the second attribute of the pre-selected area; and 处理模块,依据该归类模块进行归类程序的结果,将归类为该预选区域第一属性的子区域内的铜层相互连接,归类为该预选区域的第二属性的子区域内的铜层则不相互连接。The processing module, according to the result of the classification procedure performed by the classification module, connects the copper layers in the sub-regions classified as the first attribute of the pre-selected area to each other, and classifies them as the copper layers in the sub-regions of the second attribute of the pre-selected area The copper layers are not connected to each other. 2.如权利要求1所述的布线规则设定系统,其特征在于,该接地层是数字接地层。2. The wiring rule setting system according to claim 1, wherein the ground plane is a digital ground plane. 3.一种布线规则设定方法,搭载到制作印刷电路板上的印刷电路图案的设计软件中,其特征在于,该印刷电路图案中具有需进行铺铜程序的预选区域,且该预选区域由多个用于铺设铜层的子区域组成,该布线规则设定方法包括以下步骤:3. A wiring rule setting method, carried in the design software for making the printed circuit pattern on the printed circuit board, it is characterized in that, there is a preselected area that needs to carry out the copper laying program in the printed circuit pattern, and the preselected area is composed of Composed of a plurality of sub-regions for laying copper layers, the wiring rule setting method includes the following steps: 输入要进行铺铜程序的预选区域;Enter the pre-selected area where the copper laying process will be carried out; 依据该多个子区域的属性进行归类程序,将这些子区域归类为该预选区域的第一属性或第二属性,其中该子区域的属性若是易受干扰的属性或是须设置接地层的属性,则将该子区域归类为该预选区域的第二属性;以及performing a classification procedure according to the attributes of the plurality of sub-areas, and classifying these sub-areas as the first attribute or the second attribute of the pre-selected area, wherein the attribute of the sub-area is an attribute that is susceptible to interference or an attribute that requires a ground layer attribute, classify the sub-area as the second attribute of the pre-selected area; and 依据进行的归类程序的结果,将归类为该预选区域第一属性的子区域内的铜层相互连接,归类为该预选区域第二属性的子区域内的铜层则不相互连接。Copper layers within subareas classified as the first attribute of the preselected area are interconnected and copper layers within subareas classified as the second attribute of the preselected area are not interconnected as a result of the classification procedure performed. 4.如权利要求3所述的布线规则设定方法,其特征在于,该接地层是数字接地层。4. The wiring rule setting method according to claim 3, wherein the ground plane is a digital ground plane.
CNB2006100574232A 2006-03-15 2006-03-15 Wiring rule setting system and method Expired - Fee Related CN100456309C (en)

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CN100456309C true CN100456309C (en) 2009-01-28

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CN109325285B (en) * 2018-09-14 2022-03-08 郑州云海信息技术有限公司 Method, device, equipment and computer readable storage medium for automatically paving multiple layers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974139A (en) * 1995-09-06 1997-03-18 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit and the layout and wiring methods thereof
CN1437437A (en) * 2002-02-04 2003-08-20 华为技术有限公司 Copper-cladding method in circuit board design
CN1701418A (en) * 2003-04-30 2005-11-23 富士通株式会社 Manufacturing method of semiconductor device, semiconductor wafer and semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974139A (en) * 1995-09-06 1997-03-18 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit and the layout and wiring methods thereof
CN1437437A (en) * 2002-02-04 2003-08-20 华为技术有限公司 Copper-cladding method in circuit board design
CN1701418A (en) * 2003-04-30 2005-11-23 富士通株式会社 Manufacturing method of semiconductor device, semiconductor wafer and semiconductor device

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