CN100454503C - Manufacturing method of triode lead frame - Google Patents
Manufacturing method of triode lead frame Download PDFInfo
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- CN100454503C CN100454503C CNB2007100676404A CN200710067640A CN100454503C CN 100454503 C CN100454503 C CN 100454503C CN B2007100676404 A CNB2007100676404 A CN B2007100676404A CN 200710067640 A CN200710067640 A CN 200710067640A CN 100454503 C CN100454503 C CN 100454503C
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000005520 cutting process Methods 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000009713 electroplating Methods 0.000 description 26
- 238000010586 diagram Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
本发明公开了一种三极管引线框架的制造方法,包括:a.从同一工件上冲压出由分切点(3、4)或/和分切条相互并列对称相接的四排单排引线框架卷带(5、6、7、8);b.对所述引线框架卷带(5、6、7、8)的头部(9)及设于引线框架卷带头部(9)外沿的分切点(3)或/和分切条所形成的区域(B)进行电镀;c.切除分切点(3、4)或/和分切条,得到四排分开的单排引线框架卷带(5、6、7、8);d.将所述单排引线框架卷带(5、6、7、8)切断,获得多个引线框架片,每个引线框架片中包括多个引线框架。该制造方法生产效率高、质量稳定且节省生产成本。
The invention discloses a method for manufacturing a triode lead frame. Tape (5, 6, 7, 8); b. the head (9) of the lead frame tape (5, 6, 7, 8) and the outer edge of the lead frame tape head (9) The area (B) formed by the slitting point (3) or/and the slitting strip is electroplated; c. cutting off the slitting point (3, 4) or/and the slitting strip to obtain four separate single-row lead frame rolls Strips (5, 6, 7, 8); d. cutting said single-row lead frame roll tape (5, 6, 7, 8) to obtain a plurality of lead frame sheets, each lead frame sheet comprising a plurality of leads frame. The manufacturing method has high production efficiency, stable quality and low production cost.
Description
技术领域 technical field
本发明涉及一种引线框架的制造方法,特别是一种三极管引线框架的制造方法。The invention relates to a method for manufacturing a lead frame, in particular to a method for manufacturing a triode lead frame.
背景技术 Background technique
现有技术引线框架的制造方法大体分为两种,一种是通过蚀刻来制造引线框架;一种是通过冲压来制造引线框架。与蚀刻方法相比,通过冲压来制造引线框架的方法具有高速加工的能力。但现有技术通过冲压来制造三极管引线框架如TO-92(行业通用型号)三极管引线框架的制造方法,是首先冲压出单排的引线框架卷带,再通过电镀工序对单排的引线框架卷带的头部区域进行电镀,然后进入分离工序,把引线框架卷带分离成单个的引线框架片,其中,每个引线框架片都包括多个引线框架。由于该方法冲压出的引线框架卷带是单排的,所以,其生产效率较低,质量控制不够稳定,各工序人力及物料消耗成本较高,尤其在电镀工序上,浪费了能源,增加了电镀成本,所以,生产成本相对较高;且由于电镀分散,增加了电镀排放的有害物质,加重了对环境的污染。There are generally two methods for manufacturing lead frames in the prior art, one is to manufacture the lead frame by etching; the other is to manufacture the lead frame by stamping. Compared with the etching method, the method of manufacturing the lead frame by punching has the capability of high-speed processing. But the prior art manufactures the triode lead frame by stamping such as TO-92 (industry general model) the manufacture method of the triode lead frame, is to punch out the lead frame tape of single row at first, then through the electroplating process to the lead frame coil of single row The head region of the tape is plated and then enters a separation process to separate the lead frame web into individual lead frame sheets, wherein each lead frame sheet includes a plurality of lead frames. Because the lead frame tapes punched out by this method are single-row, so its production efficiency is low, quality control is not stable enough, and the cost of manpower and material consumption in each process is high. Especially in the electroplating process, energy is wasted and increased. The cost of electroplating, so the production cost is relatively high; and due to the dispersion of electroplating, the harmful substances discharged by electroplating are increased, and the pollution to the environment is aggravated.
发明内容 Contents of the invention
本发明要解决的技术问题是,提供一种生产效率高、质量稳定且节省生产成本的引线框架的制造方法。The technical problem to be solved by the present invention is to provide a method for manufacturing a lead frame with high production efficiency, stable quality and low production cost.
本发明的技术方案是:提供一种三极管引线框架的制造方法,包括:The technical solution of the present invention is: provide a kind of manufacturing method of triode lead frame, comprising:
a、从同一工件上冲压出相互连接的四排单排引线框架卷带,所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接,或a. Punch out four interconnected single-row lead frame tapes from the same workpiece, and the single-row lead frame tapes pass through the slitting points or slitting strips arranged on the outer edge of the lead frame tape head and The slitting points or slitting strips located on the outer edge of the lead frame tape edge are connected side by side, or
所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接;The single row of lead frame tapes are arranged side by side with each other through the cut points or cut strips arranged on the outer edge of the lead frame tape head and the cut points or cut strips arranged on the outer edge of the lead frame tape edge strips. catch;
b、对所述引线框架卷带的头部及设于引线框架卷带头部外沿的分切点或/和分切条所形成的区域进行电镀;b. Electroplating the head of the lead frame tape and the area formed by the cutting point or/and the cutting strip located on the outer edge of the head of the lead frame tape;
c、切除分切点或/和分切条得到四排分开的单排引线框架卷带;c, cutting off the slitting point or/and slitting strip to obtain four separate rows of single-row lead frame tapes;
d、将所述单排引线框架卷带切断,获得多个引线框架片,每个引线框架片中包括多个引线框架。d. Cutting the single-row lead frame tape to obtain a plurality of lead frame sheets, and each lead frame sheet includes a plurality of lead frames.
所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接,或所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接,均优选为相互对称并列相接。The single row of lead frame tapes are arranged side by side with each other through the cut points or cut strips arranged on the outer edge of the lead frame tape head and the cut points or cut strips arranged on the outer edge of the lead frame tape edge strips. connected, or the single row of lead frame tapes pass through the cutting point or slitting strip set on the outer edge of the lead frame tape head and the cutting point or cutting strip set on the outer edge of the lead frame tape edge The bars are connected side by side, and are preferably mutually symmetrically connected side by side.
本发明的制造方法使相互连接的四排单排引线框架卷带形成两个电镀区域,电镀工序中,只要对这两个电镀区域实施电镀,即实现了对四排单排引线框架卷带上电镀区域进行电镀的目的。The manufacturing method of the present invention makes the four-row single-row lead frame tapes connected to each other form two electroplating areas. The purpose of electroplating in the electroplating area.
本发明三极管引线框架的(冲压)制造方法与现有技术通过冲压来制造三极管引线框架如型号为TO-92单排的三极管引线框架的制造方法相比,由于采用了四排引线框架卷带同时进行冲压,四排引线框架卷带同时进行电镀,然后进行分离,所以,每道工序上的生产效率都大为提高。从生产成本上看,第一、大大减少了冲压和分离工序的模具及其维修费用,大幅度节省了的人力成本和物料消耗成本;第二、在电镀工序上,节省了能源,减少了电镀工序的人力成本和物料消耗成本。所以,其生产成本相对较低。同时,由于多排引线框架卷带同时制造同时控制,使产品质量稳定。由于电镀工序集中生产,减少了电镀排放的有害物质,降低了对环境的污染。The (stamping) manufacturing method of the triode lead frame of the present invention is compared with the manufacturing method of the triode lead frame of the prior art by punching such as the triode lead frame that the model is TO-92 single row, owing to adopted four rows of lead frame tapes at the same time Stamping is carried out, and four rows of lead frame tapes are electroplated at the same time, and then separated, so the production efficiency of each process is greatly improved. From the point of view of production cost, firstly, it greatly reduces the mold and its maintenance costs in the stamping and separation process, and greatly saves labor costs and material consumption costs; secondly, in the electroplating process, it saves energy and reduces the cost of electroplating The labor cost and material consumption cost of the process. Therefore, its production cost is relatively low. At the same time, since multiple rows of lead frame tapes are manufactured and controlled at the same time, the product quality is stable. Due to the concentrated production of the electroplating process, the harmful substances discharged by electroplating are reduced, and the pollution to the environment is reduced.
附图说明 Description of drawings
图1是现有技术制造方法冲压出的单排引线框架卷带及电镀区域示意图。FIG. 1 is a schematic diagram of a single-row lead frame tape and an electroplating area punched out by a manufacturing method in the prior art.
图2是本发明三极管引线框架的制造方法冲压出的四排(TO-92)引线框架一种实施例的卷带、连接部分及其电镀区域示意图。Fig. 2 is a schematic diagram of a four-row (TO-92) lead frame punched out by the manufacturing method of the triode lead frame of the present invention, a schematic diagram of an embodiment of the tape, the connection part and the electroplating area.
图3是本发明三极管引线框架的制造方法冲压出的四排(TO-92)引线框架另一种实施例的卷带、连接部分及其电镀区域示意图。3 is a schematic diagram of another embodiment of the four-row (TO-92) lead frame punched out by the manufacturing method of the triode lead frame of the present invention, the connection part and the electroplating area.
图4是本发明三极管引线框架的制造方法冲压出的四排(TO-92)引线框架再另一种实施例的卷带、连接部分及其电镀区域示意图。Fig. 4 is a schematic diagram of another embodiment of the four-row (TO-92) lead frame punched out by the manufacturing method of the triode lead frame of the present invention, the connection part and the electroplating area.
图中所示1、中筋,2、边带,3、4、分切点,5、6、7、8、单排引线框架卷带,9、引线框架卷带头部,10、11、分切条,A、现有技术卷带电镀区域,B、本发明卷带电镀区域,W1、分切点3的宽度,W2、引线框架卷带头部9的宽度。As shown in the figure 1, middle rib, 2, side strip, 3, 4, cutting point, 5, 6, 7, 8, single-row lead frame tape, 9, lead frame tape head, 10, 11, cut Bar, A, the prior art tape plating area, B, the present invention tape plating area, W1, the width of the
具体实施方式 Detailed ways
下面结合附图和具体实施例对本发明作进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
如图1所示,现有技术通过冲压来制造三极管引线框架如型号为TO-92单排的三极管引线框架的制造方法,冲压出的TO-92单排引线框架卷带,其连接部分是中筋1和边带2,其需要电镀的区域为引线框架卷带的头部9区域,即图中所示的A区域。引线框架卷带分离时,横向(行业内习惯称纵向,即沿图1中上下垂直方向)切断中筋1和边带2,即可以获得多个引线框架片,每个引线框架片中包括多个引线框架。As shown in Figure 1, the prior art manufactures the triode lead frame by stamping, such as the manufacturing method of the TO-92 single-row triode lead frame, the TO-92 single-row lead frame tape that is punched out, and its connecting part is 1 and
如图2所示,本发明三极管引线框架的制造方法第一个实施例:As shown in Figure 2, the first embodiment of the manufacturing method of the triode lead frame of the present invention:
a、冲压引线框架卷带:从同一工件上冲压出相互连接的四排单排引线框架卷带5、6、7、8,其连接部分也是中筋1和边带2。所述单排引线框架卷带5、6、7、8相互之间通过设于引线框架卷带头部9外沿的分切点3和设于引线框架卷带边带2外沿的分切点4相互对称并列相接。每个分切点3和分切点4分别连接一对相互对称并列相接的引线框架,这样分布后,就形成了两个电镀区域B。a. Stamping lead frame tapes: Punch out four interconnected single-row
所述设于引线框架卷带头部9外沿的分切点3的宽度W1大于引线框架卷带头部9的宽度W2,这样,保证了在切除分切点3时不影响引线框架卷带头部9边上的光滑平整。The width W1 of the
由于各种原因,电镀工序中拉卷带的设备的拉力大小有所不同,预计设备拉力较小时,所述设于引线框架卷带头部9外沿的分切点3在引线框架卷带的长度方向上每间隔四个引线框架出现一次,这样,在设备拉力较小时,既保证了生产过程中的两排单排引线框架卷带间的连接强度,又节省了电镀面积。Due to various reasons, the pulling force of the equipment for pulling the tape in the electroplating process is different. When it is estimated that the pulling force of the equipment is small, the
b、电镀:对所述引线框架卷带5、6、7、8的头部9及设于引线框架卷带头部9外沿的分切点3所形成的区域B进行电镀。b. Electroplating: Electroplating is performed on the region B formed by the
分离:Separation:
c、切除分切点3和分切点4,得到四排分开的单排引线框架卷带5、6、7、8;c. cut off the
d、将所述单排引线框架卷带5、6、7、8横向(行业内习惯称纵向,即沿图1中上下垂直方向)切断,获得多个引线框架片,每个引线框架片中又包括多个引线框架。d. Cut the single-row
如图3所示,本发明三极管引线框架的制造方法第二个实施例:As shown in Figure 3, the second embodiment of the manufacturing method of the triode lead frame of the present invention:
制造方法基本与第一个实施例相同,其不同点在于:预计设备拉力适中时,所述单排引线框架卷带5、6之间和单排引线框架卷带7、8之间通过设于引线框架卷带头部9外沿的分切条10和分切点3相互对称并列相接。分切条10和分切点3在引线框架卷带的长度方向上的排列为:每间隔一个引线框架出现一次分切条10,该分切条10连接二对相互对称并列相接的引线框架,再间隔一个引线框架出现一次分切点3,该分切点3连接一对相互对称并列相接的引线框架,再间隔一个引线框架出现一次分切条10……,如此循环反复。第一个实施例的电镀和切除只涉及分切点3和分切点4,而本实施例的电镀和切除还包括分切条10。采用本实施例的目的是,在设备拉力适中时,能保证生产过程中的两排单排引线框架卷带间的连接强度,即任何情况下不产生变形,以利于以下工序的顺利进行。The manufacturing method is basically the same as that of the first embodiment, the difference is that: when the tension of the device is expected to be moderate, between the single-row
如图4所示,本发明三极管引线框架的制造方法第三个实施例:As shown in Figure 4, the third embodiment of the manufacturing method of the triode lead frame of the present invention:
制造方法基本与第一个实施例相同,其不同点在于:预计设备拉力较大时,所述单排引线框架卷带5、6之间和单排引线框架卷带7、8之间通过设于引线框架卷带头部9外沿的分切条11相互对称并列相接。分切条11沿引线框架卷带的长度方向延伸。第一个实施例的电镀和切除涉及的是分切点3和分切点4,而本实施例的电镀和切除涉及的是分切条11和分切点4。采用本实施例的目的是,在设备拉力较大时,能保证生产过程中的两排单排引线框架卷带间的连接强度,即任何情况下不产生变形,以利于以下工序的顺利进行。The manufacturing method is basically the same as that of the first embodiment, with the difference that: when the device is expected to have a relatively large pulling force, between the single-row
上述实施例用来解释本发明,而不是对本发明的限制。在本发明的权利要求保护范围内,对本发明作出的非实质性地修改和改变,如三个实施例中的分切点3、4与分切条10、11相互之间的互换、分切点及分切条具体宽度的变化等,都落入本发明的保护范围内。The above-mentioned embodiments are used to explain the present invention, but not to limit the present invention. Within the protection scope of the claims of the present invention, non-substantial modifications and changes made to the present invention, such as the mutual exchange and separation of the cutting points 3, 4 and the cutting strips 10, 11 in the three embodiments. The change of the cutting point and the specific width of the slitting strip, etc., all fall within the protection scope of the present invention.
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CN103617990A (en) * | 2013-11-21 | 2014-03-05 | 沈健 | Double-row plastic package lead frame |
CN108198798A (en) * | 2018-01-12 | 2018-06-22 | 广州新星微电子有限公司 | A kind of triode and its packaging method |
CN112595908B (en) * | 2020-11-25 | 2023-11-17 | 四川金湾电子有限责任公司 | Lead frame detection system and detection method |
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US5317189A (en) * | 1992-06-29 | 1994-05-31 | Rohm Co., Ltd. | Axial lead frame |
JPH06196602A (en) * | 1992-12-25 | 1994-07-15 | Rohm Co Ltd | Manufacture of electronic component |
CN1169032A (en) * | 1996-06-14 | 1997-12-31 | Lg半导体株式会社 | Lead frame and semiconductor package |
CN1177210A (en) * | 1996-08-13 | 1998-03-25 | 摩托罗拉公司 | Leadframe structure |
US5920113A (en) * | 1996-08-13 | 1999-07-06 | Motorola, Inc. | Leadframe structure having moveable sub-frame |
US20030071344A1 (en) * | 2001-10-16 | 2003-04-17 | Shinko Electric Industries Co., Ltd. | Leadframe and method of manufacturing a semiconductor device using the same |
CN2618302Y (en) * | 2003-03-24 | 2004-05-26 | 上海仪电科技有限公司 | Improved semiconductor integrated circuit lead wire frame |
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CN101030542A (en) | 2007-09-05 |
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