[go: up one dir, main page]

CN100454503C - Manufacturing method of triode lead frame - Google Patents

Manufacturing method of triode lead frame Download PDF

Info

Publication number
CN100454503C
CN100454503C CNB2007100676404A CN200710067640A CN100454503C CN 100454503 C CN100454503 C CN 100454503C CN B2007100676404 A CNB2007100676404 A CN B2007100676404A CN 200710067640 A CN200710067640 A CN 200710067640A CN 100454503 C CN100454503 C CN 100454503C
Authority
CN
China
Prior art keywords
lead frame
tape
cutting
row
outer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CNB2007100676404A
Other languages
Chinese (zh)
Other versions
CN101030542A (en
Inventor
曹光伟
段华平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO KANGQIANG ELECTRONICS CO Ltd
Original Assignee
NINGBO KANGQIANG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NINGBO KANGQIANG ELECTRONICS CO Ltd filed Critical NINGBO KANGQIANG ELECTRONICS CO Ltd
Priority to CNB2007100676404A priority Critical patent/CN100454503C/en
Publication of CN101030542A publication Critical patent/CN101030542A/en
Application granted granted Critical
Publication of CN100454503C publication Critical patent/CN100454503C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

本发明公开了一种三极管引线框架的制造方法,包括:a.从同一工件上冲压出由分切点(3、4)或/和分切条相互并列对称相接的四排单排引线框架卷带(5、6、7、8);b.对所述引线框架卷带(5、6、7、8)的头部(9)及设于引线框架卷带头部(9)外沿的分切点(3)或/和分切条所形成的区域(B)进行电镀;c.切除分切点(3、4)或/和分切条,得到四排分开的单排引线框架卷带(5、6、7、8);d.将所述单排引线框架卷带(5、6、7、8)切断,获得多个引线框架片,每个引线框架片中包括多个引线框架。该制造方法生产效率高、质量稳定且节省生产成本。

Figure 200710067640

The invention discloses a method for manufacturing a triode lead frame. Tape (5, 6, 7, 8); b. the head (9) of the lead frame tape (5, 6, 7, 8) and the outer edge of the lead frame tape head (9) The area (B) formed by the slitting point (3) or/and the slitting strip is electroplated; c. cutting off the slitting point (3, 4) or/and the slitting strip to obtain four separate single-row lead frame rolls Strips (5, 6, 7, 8); d. cutting said single-row lead frame roll tape (5, 6, 7, 8) to obtain a plurality of lead frame sheets, each lead frame sheet comprising a plurality of leads frame. The manufacturing method has high production efficiency, stable quality and low production cost.

Figure 200710067640

Description

三极管引线框架的制造方法 Manufacturing method of triode lead frame

技术领域 technical field

本发明涉及一种引线框架的制造方法,特别是一种三极管引线框架的制造方法。The invention relates to a method for manufacturing a lead frame, in particular to a method for manufacturing a triode lead frame.

背景技术 Background technique

现有技术引线框架的制造方法大体分为两种,一种是通过蚀刻来制造引线框架;一种是通过冲压来制造引线框架。与蚀刻方法相比,通过冲压来制造引线框架的方法具有高速加工的能力。但现有技术通过冲压来制造三极管引线框架如TO-92(行业通用型号)三极管引线框架的制造方法,是首先冲压出单排的引线框架卷带,再通过电镀工序对单排的引线框架卷带的头部区域进行电镀,然后进入分离工序,把引线框架卷带分离成单个的引线框架片,其中,每个引线框架片都包括多个引线框架。由于该方法冲压出的引线框架卷带是单排的,所以,其生产效率较低,质量控制不够稳定,各工序人力及物料消耗成本较高,尤其在电镀工序上,浪费了能源,增加了电镀成本,所以,生产成本相对较高;且由于电镀分散,增加了电镀排放的有害物质,加重了对环境的污染。There are generally two methods for manufacturing lead frames in the prior art, one is to manufacture the lead frame by etching; the other is to manufacture the lead frame by stamping. Compared with the etching method, the method of manufacturing the lead frame by punching has the capability of high-speed processing. But the prior art manufactures the triode lead frame by stamping such as TO-92 (industry general model) the manufacture method of the triode lead frame, is to punch out the lead frame tape of single row at first, then through the electroplating process to the lead frame coil of single row The head region of the tape is plated and then enters a separation process to separate the lead frame web into individual lead frame sheets, wherein each lead frame sheet includes a plurality of lead frames. Because the lead frame tapes punched out by this method are single-row, so its production efficiency is low, quality control is not stable enough, and the cost of manpower and material consumption in each process is high. Especially in the electroplating process, energy is wasted and increased. The cost of electroplating, so the production cost is relatively high; and due to the dispersion of electroplating, the harmful substances discharged by electroplating are increased, and the pollution to the environment is aggravated.

发明内容 Contents of the invention

本发明要解决的技术问题是,提供一种生产效率高、质量稳定且节省生产成本的引线框架的制造方法。The technical problem to be solved by the present invention is to provide a method for manufacturing a lead frame with high production efficiency, stable quality and low production cost.

本发明的技术方案是:提供一种三极管引线框架的制造方法,包括:The technical solution of the present invention is: provide a kind of manufacturing method of triode lead frame, comprising:

a、从同一工件上冲压出相互连接的四排单排引线框架卷带,所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接,或a. Punch out four interconnected single-row lead frame tapes from the same workpiece, and the single-row lead frame tapes pass through the slitting points or slitting strips arranged on the outer edge of the lead frame tape head and The slitting points or slitting strips located on the outer edge of the lead frame tape edge are connected side by side, or

所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接;The single row of lead frame tapes are arranged side by side with each other through the cut points or cut strips arranged on the outer edge of the lead frame tape head and the cut points or cut strips arranged on the outer edge of the lead frame tape edge strips. catch;

b、对所述引线框架卷带的头部及设于引线框架卷带头部外沿的分切点或/和分切条所形成的区域进行电镀;b. Electroplating the head of the lead frame tape and the area formed by the cutting point or/and the cutting strip located on the outer edge of the head of the lead frame tape;

c、切除分切点或/和分切条得到四排分开的单排引线框架卷带;c, cutting off the slitting point or/and slitting strip to obtain four separate rows of single-row lead frame tapes;

d、将所述单排引线框架卷带切断,获得多个引线框架片,每个引线框架片中包括多个引线框架。d. Cutting the single-row lead frame tape to obtain a plurality of lead frame sheets, and each lead frame sheet includes a plurality of lead frames.

所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接,或所述单排引线框架卷带相互之间通过设于引线框架卷带头部外沿的分切点或分切条和设于引线框架卷带边带外沿的分切点或分切条并列相接,均优选为相互对称并列相接。The single row of lead frame tapes are arranged side by side with each other through the cut points or cut strips arranged on the outer edge of the lead frame tape head and the cut points or cut strips arranged on the outer edge of the lead frame tape edge strips. connected, or the single row of lead frame tapes pass through the cutting point or slitting strip set on the outer edge of the lead frame tape head and the cutting point or cutting strip set on the outer edge of the lead frame tape edge The bars are connected side by side, and are preferably mutually symmetrically connected side by side.

本发明的制造方法使相互连接的四排单排引线框架卷带形成两个电镀区域,电镀工序中,只要对这两个电镀区域实施电镀,即实现了对四排单排引线框架卷带上电镀区域进行电镀的目的。The manufacturing method of the present invention makes the four-row single-row lead frame tapes connected to each other form two electroplating areas. The purpose of electroplating in the electroplating area.

本发明三极管引线框架的(冲压)制造方法与现有技术通过冲压来制造三极管引线框架如型号为TO-92单排的三极管引线框架的制造方法相比,由于采用了四排引线框架卷带同时进行冲压,四排引线框架卷带同时进行电镀,然后进行分离,所以,每道工序上的生产效率都大为提高。从生产成本上看,第一、大大减少了冲压和分离工序的模具及其维修费用,大幅度节省了的人力成本和物料消耗成本;第二、在电镀工序上,节省了能源,减少了电镀工序的人力成本和物料消耗成本。所以,其生产成本相对较低。同时,由于多排引线框架卷带同时制造同时控制,使产品质量稳定。由于电镀工序集中生产,减少了电镀排放的有害物质,降低了对环境的污染。The (stamping) manufacturing method of the triode lead frame of the present invention is compared with the manufacturing method of the triode lead frame of the prior art by punching such as the triode lead frame that the model is TO-92 single row, owing to adopted four rows of lead frame tapes at the same time Stamping is carried out, and four rows of lead frame tapes are electroplated at the same time, and then separated, so the production efficiency of each process is greatly improved. From the point of view of production cost, firstly, it greatly reduces the mold and its maintenance costs in the stamping and separation process, and greatly saves labor costs and material consumption costs; secondly, in the electroplating process, it saves energy and reduces the cost of electroplating The labor cost and material consumption cost of the process. Therefore, its production cost is relatively low. At the same time, since multiple rows of lead frame tapes are manufactured and controlled at the same time, the product quality is stable. Due to the concentrated production of the electroplating process, the harmful substances discharged by electroplating are reduced, and the pollution to the environment is reduced.

附图说明 Description of drawings

图1是现有技术制造方法冲压出的单排引线框架卷带及电镀区域示意图。FIG. 1 is a schematic diagram of a single-row lead frame tape and an electroplating area punched out by a manufacturing method in the prior art.

图2是本发明三极管引线框架的制造方法冲压出的四排(TO-92)引线框架一种实施例的卷带、连接部分及其电镀区域示意图。Fig. 2 is a schematic diagram of a four-row (TO-92) lead frame punched out by the manufacturing method of the triode lead frame of the present invention, a schematic diagram of an embodiment of the tape, the connection part and the electroplating area.

图3是本发明三极管引线框架的制造方法冲压出的四排(TO-92)引线框架另一种实施例的卷带、连接部分及其电镀区域示意图。3 is a schematic diagram of another embodiment of the four-row (TO-92) lead frame punched out by the manufacturing method of the triode lead frame of the present invention, the connection part and the electroplating area.

图4是本发明三极管引线框架的制造方法冲压出的四排(TO-92)引线框架再另一种实施例的卷带、连接部分及其电镀区域示意图。Fig. 4 is a schematic diagram of another embodiment of the four-row (TO-92) lead frame punched out by the manufacturing method of the triode lead frame of the present invention, the connection part and the electroplating area.

图中所示1、中筋,2、边带,3、4、分切点,5、6、7、8、单排引线框架卷带,9、引线框架卷带头部,10、11、分切条,A、现有技术卷带电镀区域,B、本发明卷带电镀区域,W1、分切点3的宽度,W2、引线框架卷带头部9的宽度。As shown in the figure 1, middle rib, 2, side strip, 3, 4, cutting point, 5, 6, 7, 8, single-row lead frame tape, 9, lead frame tape head, 10, 11, cut Bar, A, the prior art tape plating area, B, the present invention tape plating area, W1, the width of the cutting point 3, W2, the width of the lead frame tape head 9.

具体实施方式 Detailed ways

下面结合附图和具体实施例对本发明作进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

如图1所示,现有技术通过冲压来制造三极管引线框架如型号为TO-92单排的三极管引线框架的制造方法,冲压出的TO-92单排引线框架卷带,其连接部分是中筋1和边带2,其需要电镀的区域为引线框架卷带的头部9区域,即图中所示的A区域。引线框架卷带分离时,横向(行业内习惯称纵向,即沿图1中上下垂直方向)切断中筋1和边带2,即可以获得多个引线框架片,每个引线框架片中包括多个引线框架。As shown in Figure 1, the prior art manufactures the triode lead frame by stamping, such as the manufacturing method of the TO-92 single-row triode lead frame, the TO-92 single-row lead frame tape that is punched out, and its connecting part is 1 and side strip 2, the area that needs to be electroplated is the area of the head 9 of the lead frame tape, that is, the area A shown in the figure. When the lead frame tape is separated, cut the middle rib 1 and the side tape 2 horizontally (customarily called the longitudinal direction in the industry, that is, along the vertical direction in Figure 1), and then obtain multiple lead frame sheets, and each lead frame sheet includes multiple lead frame.

如图2所示,本发明三极管引线框架的制造方法第一个实施例:As shown in Figure 2, the first embodiment of the manufacturing method of the triode lead frame of the present invention:

a、冲压引线框架卷带:从同一工件上冲压出相互连接的四排单排引线框架卷带5、6、7、8,其连接部分也是中筋1和边带2。所述单排引线框架卷带5、6、7、8相互之间通过设于引线框架卷带头部9外沿的分切点3和设于引线框架卷带边带2外沿的分切点4相互对称并列相接。每个分切点3和分切点4分别连接一对相互对称并列相接的引线框架,这样分布后,就形成了两个电镀区域B。a. Stamping lead frame tapes: Punch out four interconnected single-row lead frame tapes 5, 6, 7, 8 from the same workpiece, and the connecting parts are also the middle rib 1 and the side tape 2. The single-row lead frame tapes 5, 6, 7, 8 pass through the cutting point 3 arranged on the outer edge of the lead frame tape head 9 and the cutting point arranged on the outer edge of the lead frame tape side tape 2 4 are symmetrically connected side by side. Each splitting point 3 and splitting point 4 are respectively connected to a pair of lead frames symmetrically connected side by side, so that two electroplating regions B are formed after being distributed in this way.

所述设于引线框架卷带头部9外沿的分切点3的宽度W1大于引线框架卷带头部9的宽度W2,这样,保证了在切除分切点3时不影响引线框架卷带头部9边上的光滑平整。The width W1 of the cutting point 3 located on the outer edge of the lead frame tape head 9 is greater than the width W2 of the lead frame tape head 9, so that the lead frame tape head 9 is not affected when the cut point 3 is cut off. The edges are smooth and even.

由于各种原因,电镀工序中拉卷带的设备的拉力大小有所不同,预计设备拉力较小时,所述设于引线框架卷带头部9外沿的分切点3在引线框架卷带的长度方向上每间隔四个引线框架出现一次,这样,在设备拉力较小时,既保证了生产过程中的两排单排引线框架卷带间的连接强度,又节省了电镀面积。Due to various reasons, the pulling force of the equipment for pulling the tape in the electroplating process is different. When it is estimated that the pulling force of the equipment is small, the cutting point 3 located on the outer edge of the lead frame tape head 9 is within the length of the lead frame tape. In this way, when the pulling force of the equipment is small, the connection strength between the two rows of single-row lead frame tapes in the production process is ensured, and the electroplating area is saved.

b、电镀:对所述引线框架卷带5、6、7、8的头部9及设于引线框架卷带头部9外沿的分切点3所形成的区域B进行电镀。b. Electroplating: Electroplating is performed on the region B formed by the head 9 of the lead frame tape 5 , 6 , 7 , 8 and the cutting point 3 arranged on the outer edge of the lead frame tape head 9 .

分离:Separation:

c、切除分切点3和分切点4,得到四排分开的单排引线框架卷带5、6、7、8;c. cut off the cutting point 3 and the cutting point 4 to obtain four separate rows of single-row lead frame tapes 5, 6, 7, and 8;

d、将所述单排引线框架卷带5、6、7、8横向(行业内习惯称纵向,即沿图1中上下垂直方向)切断,获得多个引线框架片,每个引线框架片中又包括多个引线框架。d. Cut the single-row lead frame tapes 5, 6, 7, and 8 horizontally (customarily called longitudinal in the industry, that is, along the vertical direction in Fig. 1) to obtain a plurality of lead frame sheets, each lead frame sheet Also includes a plurality of lead frames.

如图3所示,本发明三极管引线框架的制造方法第二个实施例:As shown in Figure 3, the second embodiment of the manufacturing method of the triode lead frame of the present invention:

制造方法基本与第一个实施例相同,其不同点在于:预计设备拉力适中时,所述单排引线框架卷带5、6之间和单排引线框架卷带7、8之间通过设于引线框架卷带头部9外沿的分切条10和分切点3相互对称并列相接。分切条10和分切点3在引线框架卷带的长度方向上的排列为:每间隔一个引线框架出现一次分切条10,该分切条10连接二对相互对称并列相接的引线框架,再间隔一个引线框架出现一次分切点3,该分切点3连接一对相互对称并列相接的引线框架,再间隔一个引线框架出现一次分切条10……,如此循环反复。第一个实施例的电镀和切除只涉及分切点3和分切点4,而本实施例的电镀和切除还包括分切条10。采用本实施例的目的是,在设备拉力适中时,能保证生产过程中的两排单排引线框架卷带间的连接强度,即任何情况下不产生变形,以利于以下工序的顺利进行。The manufacturing method is basically the same as that of the first embodiment, the difference is that: when the tension of the device is expected to be moderate, between the single-row lead frame tapes 5 and 6 and between the single-row lead frame tapes 7 and 8 are provided The slitting strip 10 and the slitting point 3 on the outer edge of the lead frame winding head 9 are symmetrically connected side by side. The arrangement of the slitting strip 10 and the slitting point 3 in the length direction of the lead frame tape is: a slitting strip 10 appears every other lead frame, and the slitting strip 10 connects two pairs of lead frames symmetrically connected side by side. , there is a cutting point 3 every other lead frame, and this cutting point 3 is connected to a pair of lead frames symmetrically connected side by side, and then a cutting strip 10 appears once every other lead frame, and so on. The electroplating and cutting in the first embodiment only involve the cutting point 3 and the cutting point 4 , while the electroplating and cutting in this embodiment also include the cutting strip 10 . The purpose of adopting this embodiment is to ensure the connection strength between the two rows of single-row lead frame tapes in the production process when the tension of the equipment is moderate, that is, no deformation occurs under any circumstances, so as to facilitate the smooth progress of the following processes.

如图4所示,本发明三极管引线框架的制造方法第三个实施例:As shown in Figure 4, the third embodiment of the manufacturing method of the triode lead frame of the present invention:

制造方法基本与第一个实施例相同,其不同点在于:预计设备拉力较大时,所述单排引线框架卷带5、6之间和单排引线框架卷带7、8之间通过设于引线框架卷带头部9外沿的分切条11相互对称并列相接。分切条11沿引线框架卷带的长度方向延伸。第一个实施例的电镀和切除涉及的是分切点3和分切点4,而本实施例的电镀和切除涉及的是分切条11和分切点4。采用本实施例的目的是,在设备拉力较大时,能保证生产过程中的两排单排引线框架卷带间的连接强度,即任何情况下不产生变形,以利于以下工序的顺利进行。The manufacturing method is basically the same as that of the first embodiment, with the difference that: when the device is expected to have a relatively large pulling force, between the single-row lead frame tapes 5 and 6 and between the single-row lead frame tapes 7 and 8 are set The slitting strips 11 on the outer edge of the lead frame take-up head 9 are symmetrically connected side by side. The slitting strip 11 extends along the length direction of the lead frame tape. The electroplating and cutting in the first embodiment involve the cutting point 3 and the cutting point 4 , while the electroplating and cutting in this embodiment involve the cutting strip 11 and the cutting point 4 . The purpose of adopting this embodiment is to ensure the connection strength between the two rows of single-row lead frame tapes in the production process, that is, no deformation under any circumstances, so as to facilitate the smooth progress of the following processes.

上述实施例用来解释本发明,而不是对本发明的限制。在本发明的权利要求保护范围内,对本发明作出的非实质性地修改和改变,如三个实施例中的分切点3、4与分切条10、11相互之间的互换、分切点及分切条具体宽度的变化等,都落入本发明的保护范围内。The above-mentioned embodiments are used to explain the present invention, but not to limit the present invention. Within the protection scope of the claims of the present invention, non-substantial modifications and changes made to the present invention, such as the mutual exchange and separation of the cutting points 3, 4 and the cutting strips 10, 11 in the three embodiments. The change of the cutting point and the specific width of the slitting strip, etc., all fall within the protection scope of the present invention.

Claims (2)

1、一种三极管引线框架的制造方法,包括:1. A method for manufacturing a triode lead frame, comprising: a、从同一工件上冲压出相互连接的四排单排引线框架卷带(5、6、7、8),所述单排引线框架卷带(5、6、7、8)相互之间通过设于引线框架卷带头部(9)外沿的分切点(3)或分切条(10、11)和设于引线框架卷带边带(2)外沿的分切点(4)或分切条并列相接,或a. Punch out four interconnected single-row lead frame tapes (5, 6, 7, 8) from the same workpiece, and the single-row lead frame tapes (5, 6, 7, 8) pass through each other The cutting point (3) or cutting strip (10, 11) arranged on the outer edge of the lead frame tape head (9) and the cutting point (4) arranged on the outer edge of the lead frame tape side tape (2) or the slitting strips are joined side by side, or 所述单排引线框架卷带(5、6、7、8)相互之间通过设于引线框架卷带头部(9)外沿的分切点(3)和分切条(10)和设于引线框架卷带边带(2)外沿的分切点(4)或分切条并列相接,The single-row lead frame tapes (5, 6, 7, 8) pass through the cutting point (3) and the cutting strip (10) arranged on the outer edge of the lead frame tape head (9) and are arranged on the The slitting points (4) or slitting strips on the outer edge of the lead frame tape side strip (2) are connected side by side, b、对所述引线框架卷带(5、6、7、8)的头部(9)及设于引线框架卷带头部(9)外沿的分切点(3)或/和分切条(10、11)所形成的区域(B)进行电镀;b. The head (9) of the lead frame tape (5, 6, 7, 8) and the cutting point (3) or/and cutting strip arranged on the outer edge of the lead frame tape head (9) (10,11) The formed region (B) is electroplated; c、切除分切点(3、4)或/和分切条(10、11),得到四排分开的单排引线框架卷带(5、6、7、8):c. Cut off the slitting points (3, 4) or/and slitting strips (10, 11) to obtain four separate rows of single-row lead frame tapes (5, 6, 7, 8): d、将所述单排引线框架卷带(5、6、7、8)切断,获得多个引线框架片,每个引线框架片中包括多个引线框架。d. Cutting the single row of lead frame tapes (5, 6, 7, 8) to obtain a plurality of lead frame sheets, each lead frame sheet including a plurality of lead frames. 2、根据权利要求1所述的三极管引线框架的制造方法,其特征在于:所述单排引线框架卷带(5、6、7、8)相互之间通过设于引线框架卷带头部(9)外沿的分切点(3)或分切条(10、11)和设于引线框架卷带边带(2)外沿的分切点(4)或分切条并列相接,或所述单排引线框架卷带(5、6、7、8)相互之间通过设于引线框架卷带头部(9)外沿的分切点(3)和分切条(10)和设于引线框架卷带边带(2)外沿的分切点(4)或分切条并列相接,均指相互对称并列相接。2. The method for manufacturing a triode lead frame according to claim 1, characterized in that: said single-row lead frame tapes (5, 6, 7, 8) pass through the lead frame tape head (9 ) on the outer edge of the cutting point (3) or the cutting strip (10, 11) and the cutting point (4) or the cutting strip on the outer edge of the lead frame tape (2) are connected side by side, or the The single-row lead frame tapes (5, 6, 7, 8) pass through the cutting point (3) and the cutting strip (10) arranged on the outer edge of the lead frame tape head (9) and the lead wires The slitting points (4) or slitting strips on the outer edge of the frame tape side band (2) are connected side by side, all referring to mutual symmetric side by side connection.
CNB2007100676404A 2007-03-21 2007-03-21 Manufacturing method of triode lead frame Active CN100454503C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2007100676404A CN100454503C (en) 2007-03-21 2007-03-21 Manufacturing method of triode lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2007100676404A CN100454503C (en) 2007-03-21 2007-03-21 Manufacturing method of triode lead frame

Publications (2)

Publication Number Publication Date
CN101030542A CN101030542A (en) 2007-09-05
CN100454503C true CN100454503C (en) 2009-01-21

Family

ID=38715768

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007100676404A Active CN100454503C (en) 2007-03-21 2007-03-21 Manufacturing method of triode lead frame

Country Status (1)

Country Link
CN (1) CN100454503C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102623357A (en) * 2012-03-29 2012-08-01 宁波康强电子股份有限公司 Manufacture method of triode lead frame
CN103617990A (en) * 2013-11-21 2014-03-05 沈健 Double-row plastic package lead frame
CN108198798A (en) * 2018-01-12 2018-06-22 广州新星微电子有限公司 A kind of triode and its packaging method
CN112595908B (en) * 2020-11-25 2023-11-17 四川金湾电子有限责任公司 Lead frame detection system and detection method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317189A (en) * 1992-06-29 1994-05-31 Rohm Co., Ltd. Axial lead frame
JPH06196602A (en) * 1992-12-25 1994-07-15 Rohm Co Ltd Manufacture of electronic component
CN1169032A (en) * 1996-06-14 1997-12-31 Lg半导体株式会社 Lead frame and semiconductor package
CN1177210A (en) * 1996-08-13 1998-03-25 摩托罗拉公司 Leadframe structure
US20030071344A1 (en) * 2001-10-16 2003-04-17 Shinko Electric Industries Co., Ltd. Leadframe and method of manufacturing a semiconductor device using the same
CN2618302Y (en) * 2003-03-24 2004-05-26 上海仪电科技有限公司 Improved semiconductor integrated circuit lead wire frame

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317189A (en) * 1992-06-29 1994-05-31 Rohm Co., Ltd. Axial lead frame
JPH06196602A (en) * 1992-12-25 1994-07-15 Rohm Co Ltd Manufacture of electronic component
CN1169032A (en) * 1996-06-14 1997-12-31 Lg半导体株式会社 Lead frame and semiconductor package
CN1177210A (en) * 1996-08-13 1998-03-25 摩托罗拉公司 Leadframe structure
US5920113A (en) * 1996-08-13 1999-07-06 Motorola, Inc. Leadframe structure having moveable sub-frame
US20030071344A1 (en) * 2001-10-16 2003-04-17 Shinko Electric Industries Co., Ltd. Leadframe and method of manufacturing a semiconductor device using the same
CN2618302Y (en) * 2003-03-24 2004-05-26 上海仪电科技有限公司 Improved semiconductor integrated circuit lead wire frame

Also Published As

Publication number Publication date
CN101030542A (en) 2007-09-05

Similar Documents

Publication Publication Date Title
CN100454503C (en) Manufacturing method of triode lead frame
CN104412428B (en) Manufacturing electrodes for lead-acid batteries
CN100440463C (en) Method for manufacturing lead frame for surface mounting
CN100407384C (en) Manufacturing method of triode lead frame
CN211966116U (en) Grid burst device
JP6435346B2 (en) Production equipment for heat exchanger fins
CN206504100U (en) a tape structure
JP6435347B2 (en) Manufacturing method of heat exchanger fins
CN201423402Y (en) Continuous Die Machine
WO2021218139A1 (en) Continuous casting plate grid mesh belt structure
CN205309050U (en) Lead frame stamping die
JP2006118304A (en) Manufacturing device for metal form panel
CN211743301U (en) Continuous grid
CN207447056U (en) The asynchronous material strip die cut systems of odd even dislocation
JP3691838B2 (en) Expanded mesh sheet manufacturing equipment
CN108161446B (en) A kind of preparation and packing method of sheet soft solder product
CN222806504U (en) Batch packing buckle production system
CN219359664U (en) Tooth-shaped edge processing and cutting stamping die suitable for multi-size flexible sheet
JPH11260373A (en) Method and apparatus for manufacturing spread mesh sheet
CN210414818U (en) HAF glue stamping device
CN201095204Y (en) Openwork bottom paper forming die capable of saving raw material
CN102431064A (en) Original state bamboo wood multistage dense and thin roller planing unfolding and milling device
CN216067838U (en) Taping equipment for lead frame
JP5725267B2 (en) Expanded lattice manufacturing equipment
CN103153512A (en) Method for producing slit material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant