CN100451708C - Ceramic insert needle of coaxial packaged semiconductor laser - Google Patents
Ceramic insert needle of coaxial packaged semiconductor laser Download PDFInfo
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- CN100451708C CN100451708C CNB2004100348711A CN200410034871A CN100451708C CN 100451708 C CN100451708 C CN 100451708C CN B2004100348711 A CNB2004100348711 A CN B2004100348711A CN 200410034871 A CN200410034871 A CN 200410034871A CN 100451708 C CN100451708 C CN 100451708C
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- optical fiber
- semiconductor laser
- ceramic rod
- hollow ceramic
- rod
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- 239000000919 ceramic Substances 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000013307 optical fiber Substances 0.000 claims abstract description 36
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- 239000000835 fiber Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
一种同轴封装半导体激光器陶瓷插针，其特征在于，其中包括：一光纤；一中空陶瓷棒，该中空陶瓷棒为圆柱形，在中空陶瓷棒的轴向中心开有一圆孔，所述的光纤位于中空陶瓷棒中心轴上的圆孔中。采用这种改变了光纤端面几何形状的陶瓷插针，能够比较容易匹配封帽后同轴封装半导体激光器的出射光场，从而达到提高耦合效率的效果，最终实现提高光功率，延长半导体激光器使用寿命的目的。
A coaxially packaged semiconductor laser ceramic ferrule is characterized in that it includes: an optical fiber; a hollow ceramic rod, the hollow ceramic rod is cylindrical, and a circular hole is opened in the axial center of the hollow ceramic rod. The optical fiber is located in a circular hole on the central axis of the hollow ceramic rod. Using this kind of ceramic ferrule that changes the geometric shape of the fiber end face can easily match the outgoing light field of the coaxially packaged semiconductor laser after sealing the cap, so as to achieve the effect of improving the coupling efficiency, and finally realize the improvement of optical power and prolong the service life of the semiconductor laser. the goal of.
Description
技术领域 technical field
本发明属于光纤通信技术领域，更具体说是同轴封装半导体激光器陶瓷插针，其是用于半导体激光器同轴封装器件的配件。The invention belongs to the technical field of optical fiber communication, and more specifically relates to a coaxially packaged semiconductor laser ceramic ferrule, which is an accessory for a semiconductor laser coaxially packaged device.
背景技术 Background technique
在光纤通信技术中，广泛使用半导体激光器作为信号源。通常半导体激光器发出的激光需要光纤或透镜耦合将激光引出才能应用于光纤通信系统。因此产生了许多种不同的耦合封装形式，例如同轴封装、双列直插封装和蝶形封装等。其中同轴封装形式的器件由于其体积小、成本低、连接方便的特点，广泛使用在接入网、城域网、机架交换和有线电视等场合。通常半导体激光器同轴器件，光纤和激光器必须进行人工的耦合对准工作。具体过程通常是将激光器管座在氮气下用带有透镜的管帽密封，然后用一段内有单模光纤的陶瓷芯与其耦合将光引出，在获得最大的出纤功率之后，通过激光焊接、锡焊或者胶粘的办法将陶瓷芯与封帽激光器连接并固定在一个金属套筒上，形成同轴封装。在这个过程中，与封帽激光器耦合的陶瓷芯通常的加工方法是，将单模光纤放入事先做好的陶瓷预置棒内用胶固定，然后通过分步抛磨法将内含单模光纤的陶瓷预置棒两端抛磨成光洁度较高的平面，斜面或小弧面。由于光纤端面同陶瓷预置棒一起被抛磨成平面，斜面或小弧面，这些端面受光与透镜出光并不匹配。因此，直接导致陶瓷芯与封帽激光器的耦合效率偏低，出光功率不高，器件的应用受至很大限制。In optical fiber communication technology, semiconductor lasers are widely used as signal sources. Usually, the laser light emitted by semiconductor lasers needs optical fiber or lens coupling to extract the laser light before it can be applied to optical fiber communication systems. Therefore, many different coupling packaging forms have been produced, such as coaxial packaging, dual in-line packaging and butterfly packaging. Among them, coaxial packaged devices are widely used in access networks, metropolitan area networks, rack switching, and cable TV due to their small size, low cost, and convenient connection. Usually semiconductor laser coaxial devices, optical fibers and lasers must be manually coupled and aligned. The specific process is usually to seal the laser tube base with a tube cap with a lens under nitrogen, and then use a ceramic core with a single-mode fiber inside to couple it to extract the light. After obtaining the maximum fiber output power, through laser welding, The ceramic core and capped laser are connected and fixed on a metal sleeve by soldering or gluing to form a coaxial package. In this process, the usual processing method for the ceramic core coupled with the capping laser is to put the single-mode optical fiber into the pre-made ceramic pre-rod and fix it with glue, and then use the step-by-step polishing method to remove the single-mode optical fiber. The two ends of the optical fiber ceramic pre-rod are polished into a plane, a slope or a small arc with a high degree of smoothness. Since the end faces of the optical fiber are polished together with the ceramic pre-rods to form planes, slopes or small arcs, the light received by these end faces does not match the light emitted by the lens. Therefore, the coupling efficiency between the ceramic core and the capped laser is directly low, and the light output power is not high, which greatly limits the application of the device.
发明内容 Contents of the invention
为了解决以上问题，本发明的目的在于提供一种陶瓷插针，通过改变陶瓷插芯内单模光纤的表面形状，可以提高封帽激光器的光耦合效率，延长半导体激光器使用寿命。In order to solve the above problems, the object of the present invention is to provide a ceramic ferrule, which can improve the optical coupling efficiency of the capped laser and prolong the service life of the semiconductor laser by changing the surface shape of the single-mode fiber in the ceramic ferrule.
本发明解决其技术问题的技术方案是The technical scheme that the present invention solves its technical problem is
本发明是一种同轴封装半导体激光器陶瓷插针，其特征在于，其中包括：The present invention is a coaxial package semiconductor laser ceramic ferrule, which is characterized in that it includes:
一光纤；an optical fiber;
一中空陶瓷棒，该中空陶瓷棒为圆柱形，在中空陶瓷棒的轴向中心开有一圆孔，所述的光纤位于中空陶瓷棒中心轴上的圆孔中。A hollow ceramic rod, the hollow ceramic rod is cylindrical, and a circular hole is opened in the axial center of the hollow ceramic rod, and the optical fiber is located in the circular hole on the central axis of the hollow ceramic rod.
其中光纤使用的是一端加工成非球面形状的无涂敷层单模光纤。Among them, the optical fiber is an uncoated single-mode optical fiber with one end processed into an aspherical shape.
其中中空陶瓷棒是由纳米氧化锆微粉材料制成。Wherein the hollow ceramic rod is made of nano zirconia powder material.
其中该中空陶瓷棒的圆孔的孔径与光纤外径为间隙配合。Wherein the hole diameter of the hollow ceramic rod and the outer diameter of the optical fiber are clearance fit.
其中所述的光纤在放入中空陶瓷棒的圆孔后用耐高低温并粘结陶瓷的胶进行固定。The optical fiber described therein is fixed with high and low temperature resistant and bonding ceramic glue after being put into the round hole of the hollow ceramic rod.
本发明的有益效果是：采用这种改变了光纤端面几何形状的陶瓷插针，能够比较容易匹配封帽后同轴封装半导体激光器的出射光场，从而达到提高耦合效率的效果，最终实现提高光功率，延长半导体激光器使用寿命的目的。The beneficial effects of the present invention are: adopting the ceramic ferrule that changes the geometric shape of the end face of the optical fiber can easily match the outgoing light field of the coaxially packaged semiconductor laser after the cap is sealed, thereby achieving the effect of improving the coupling efficiency and finally realizing the improvement of the optical fiber. Power, the purpose of prolonging the service life of semiconductor lasers.
附图说明 Description of drawings
为进一步说明本发明的技术内容，以下结合附图和实施例对本发明作进一步说明，其中：In order to further illustrate the technical content of the present invention, the present invention will be further described below in conjunction with accompanying drawing and embodiment, wherein:
图1是本发明陶瓷插针的顶视图。Fig. 1 is a top view of the ceramic ferrule of the present invention.
图2是本发明陶瓷插针的侧视剖面图。Fig. 2 is a side sectional view of the ceramic ferrule of the present invention.
具体实施方式 Detailed ways
请参阅图1，及图2，在图1和图2的实施例中，本发明一种同轴封装半导体激光器陶瓷插针，其中包括：Please refer to Fig. 1, and Fig. 2, in the embodiment of Fig. 1 and Fig. 2, a kind of coaxial packaging semiconductor laser ceramic ferrule of the present invention includes:
一光纤1，该光纤1使用的是一端已经加工成非球面形状的无涂敷层单模光纤；An
一中空陶瓷棒2，该中空陶瓷棒2为圆柱形，在中空陶瓷棒2的轴向中心开有一圆孔21，所述的光纤1位于中空陶瓷棒2中心轴上的圆孔21中，该中空陶瓷棒2是由纳米氧化锆微粉材料制成，该中空陶瓷棒2的圆孔21的孔径与光纤1外径为间隙配合；A hollow
将所述的光纤1在放入中空陶瓷棒2的圆孔21后用耐高低温并可粘结陶瓷的胶进行固定。After the
其中对中空陶瓷棒2漏出光纤1未加工的一端进行同时分步抛磨。Wherein, the unprocessed end of the hollow
请再参阅图1及图2，首先根据封帽后同轴封装半导体激光器的出射光场，结合腐蚀、抛磨或激光刻蚀工艺将光纤1的一端加工成为具有一定角度和曲率半径的非球面以实现耦合效率最大化。然后，将单模光纤1非球面一端插入到纳米氧化锆微粉制成的中空陶瓷棒2内，调整单模光纤1非球面的插入端露出的部分恰好与陶瓷棒2一端面平齐，然后用353或其它耐高低温并可粘结陶瓷的胶将光纤与陶瓷棒固定。最后将光纤1的另一端在靠近陶瓷棒2附近剪断，用分步抛磨法对剪断的单模光纤1与陶瓷棒2的共端面进行抛磨，形成光洁度较高的端面。Please refer to Figure 1 and Figure 2 again. Firstly, according to the exit light field of the coaxially packaged semiconductor laser after sealing the cap, one end of the
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100348711A CN100451708C (en) | 2004-04-16 | 2004-04-16 | Ceramic insert needle of coaxial packaged semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100348711A CN100451708C (en) | 2004-04-16 | 2004-04-16 | Ceramic insert needle of coaxial packaged semiconductor laser |
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| Publication Number | Publication Date |
|---|---|
| CN1684322A CN1684322A (en) | 2005-10-19 |
| CN100451708C true CN100451708C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100348711A Expired - Lifetime CN100451708C (en) | 2004-04-16 | 2004-04-16 | Ceramic insert needle of coaxial packaged semiconductor laser |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06148471A (en) * | 1992-10-30 | 1994-05-27 | Sumitomo Electric Ind Ltd | Semiconductor laser module |
| US5353294A (en) * | 1991-10-02 | 1994-10-04 | Nec Corporation | Semiconductor laser device and semiconductor laser module |
| CN2289318Y (en) * | 1995-12-20 | 1998-08-26 | 深圳飞通光电子技术有限公司 | Coaxial enclosed semiconductor laser subassembly |
| JP2000298223A (en) * | 1999-04-13 | 2000-10-24 | Nomura Jimusho:Kk | Optical fiber cable |
| CN2494581Y (en) * | 2001-07-18 | 2002-06-05 | 上海恒拓光电科技有限公司 | Full-duplex single optic fibre receiver-transmitter |
| WO2003100482A1 (en) * | 2002-05-20 | 2003-12-04 | Stratos Lightwave, Inc. | Stub having an optical fiber |
-
2004
- 2004-04-16 CN CNB2004100348711A patent/CN100451708C/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5353294A (en) * | 1991-10-02 | 1994-10-04 | Nec Corporation | Semiconductor laser device and semiconductor laser module |
| JPH06148471A (en) * | 1992-10-30 | 1994-05-27 | Sumitomo Electric Ind Ltd | Semiconductor laser module |
| CN2289318Y (en) * | 1995-12-20 | 1998-08-26 | 深圳飞通光电子技术有限公司 | Coaxial enclosed semiconductor laser subassembly |
| JP2000298223A (en) * | 1999-04-13 | 2000-10-24 | Nomura Jimusho:Kk | Optical fiber cable |
| CN2494581Y (en) * | 2001-07-18 | 2002-06-05 | 上海恒拓光电科技有限公司 | Full-duplex single optic fibre receiver-transmitter |
| WO2003100482A1 (en) * | 2002-05-20 | 2003-12-04 | Stratos Lightwave, Inc. | Stub having an optical fiber |
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| Publication number | Publication date |
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| CN1684322A (en) | 2005-10-19 |
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Assignee: Shenzhen Hi-Optel Technology Co.,Ltd. Assignor: INSTITUTE OF SEMICONDUCTORS, CHINESE ACADEMY OF SCIENCES Contract fulfillment period: 2009.3.3 to 2014.3.3 Contract record no.: 2009440000190 Denomination of invention: Ceramic insert needle of coaxial packaged semiconductor laser Granted publication date: 20090114 License type: Exclusive license Record date: 20090318 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.3.3 TO 2014.3.3; CHANGE OF CONTRACT Name of requester: SHENZHEN HI-OPTEL TECHNOLOGY CO., LTD. Effective date: 20090318 |
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