CN100448038C - Light emitting module and light emitting diode packaging structure - Google Patents

Abstract

A light-emitting module includes a light source, a reflective component and a lens portion. The light source is suitable for providing a light, and the reflective component is arranged above the light source. The lens portion is arranged between the light source and the reflective component, and has a refractive surface and a bottom surface opposite to each other. In addition, the light-emitting module has a central axis, and the transmission path of the light after being reflected by the reflective component is substantially perpendicular to the central axis, and the transmission path of part of the light after being refracted by the refractive surface is substantially perpendicular to the central axis. In addition, the present invention further proposes a light-emitting diode packaging structure.

Description

Light-emitting module and light-emitting diode packaging structure

technical field

The present invention relates to a light emitting module and a light emitting diode package structure (LED package structure), and in particular to a side light emitting light module and a light emitting diode package structure.

Background technique

FIG. 1A and FIG. 1B are schematic structural diagrams of two conventional side-emitting light-emitting modules. Please refer to FIG. 1A and FIG. 1B, the traditional side-emitting light-emitting module 100a/100b includes a light-emitting diode chip (LED chip) 110 and a lens portion 120a/120b, and the lens portion 120a/120b includes a bottom surface 122a/122b, A reflective surface 124a/124b and a refractive surface 126a/126b. Wherein, the reflection surface 124a/124b is opposite to the refraction surface 126a/126b, and the refraction surface 126a/126b is connected to the reflection surface 124a/124b.

In the above-mentioned light emitting module 100a/100b, the light emitting diode chip 110 is suitable for providing a light 112, wherein a part of the light 112 enters the lens part 120a/120b from the bottom surface 122a/122b, and will be transmitted to the reflective surface 124a/124b, and because of The incident angle on the reflective surface 124a/124b is greater than the total reflection angle of the reflective surface 124a/124b, so it will be reflected by the reflective surface 124a/124b and output from the refraction surface 126a. Another part of the light 112 enters the lens portion 120a/120b from the bottom surface 122a/122b, and then directly exits from the refraction surface 126a. In addition, the transmission direction of the light 122 emitted from the lens portion 120 a / 120 b is substantially perpendicular to the central axis 50 .

In the traditional light-emitting module 100a/100b, because part of the light 112 will be reflected from the refraction surface 126a/126b and transmitted to the reflection surface 124a/124b again, and because the incident angle of the reflection surface 124a/124b is smaller than the reflection surface 124a/124b , so it will penetrate the reflective surface 124a/124b. This not only reduces the efficiency of side light emission, but also causes loss of light energy, and also forms bright spots or apertures above the lens portion 120a/120b, resulting in unexpected light shapes. expected light shape.

In addition, since the junction of the reflection surface 124a/124b and the refraction surface 126a/126b is thinner, the structure is relatively fragile, so it is easy to break, and it is easy to cause molding failure during injection molding.

Contents of the invention

In view of this, the object of the present invention is to provide a light-emitting module to improve luminous efficiency.

Another object of the present invention is to provide a light emitting diode packaging structure to improve luminous efficiency.

Based on the above and other objectives, the present invention proposes a light emitting module, which includes a light source, a reflective component, and a lens portion. Wherein, the light source is suitable for providing a light, and the reflection component is arranged above the light source. The lens part is disposed between the light source and the reflection component, and has a refraction surface and a bottom surface opposite to each other. In addition, the light-emitting module has a central axis, the transmission path of a part of the light refracted by the refracting surface is approximately perpendicular to the central axis, and the transmission path of the rest of the light reflected by the reflective component is approximately perpendicular to the central axis.

The present invention further provides an LED packaging structure, which includes a carrier substrate, an LED chip, a reflective component, and a lens portion. Wherein, the light-emitting diode chip is arranged on the carrier substrate, and the reflection component is arranged above the light-emitting diode chip. The lens part covers the carrier base material and is connected with the reflective component. The lens part is located between the light-emitting diode chip and the reflective component, and has a refraction surface and a bottom surface opposite to each other. In addition, the LED packaging structure has a central axis, and the LED chip is suitable for providing a light. The transmission path of a part of the light rays refracted by the refracting surface is approximately perpendicular to the central axis, and the transmission path of the rest of the light rays reflected by the reflecting component is approximately perpendicular to the central axis.

Because the present invention uses a reflective component to reflect the light, it can improve the disadvantage of energy loss in the traditional technology that part of the light will penetrate the reflective surface because the incident angle of the reflective surface is smaller than the total reflection angle. In addition, since the reflective assembly and the lens part of the present invention are different parts, it is possible to avoid the thinner junction of the reflective surface of the lens part and the first refracting surface in the conventional technology, resulting in a relatively fragile structure and prone to failure during injection molding. Poor molding phenomenon.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are described below in detail with accompanying drawings.

Description of drawings

FIG. 1A and FIG. 1B are schematic structural diagrams of two conventional side-emitting light-emitting modules.

Fig. 2 shows a schematic structural diagram of a light emitting module according to an embodiment of the present invention.

Fig. 3 shows a schematic structural diagram of a light emitting module according to another embodiment of the present invention.

FIG. 4 shows a schematic diagram of an LED packaging structure according to an embodiment of the present invention.

Explanation of main component symbols

50: central axis

100a, 100b, 200, 200': light emitting modules

110, 320: LED chip

112, 212, 322: light

120a, 120b, 230, 340: lens part

122a, 122b, 234, 344: bottom surface

124a, 124b: reflective surfaces

126a, 126b, 232, 342: refraction surfaces

210: light source

220, 330: reflective components

222, 332: conical reflective surface

232a, 342a: Part I

232b, 342b: Part II

236, 346: extension

300: LED packaging structure

310: Carrying substrate

Detailed ways

Fig. 2 shows a schematic structural diagram of a light emitting module according to an embodiment of the present invention. Please refer to FIG. 2 , the light emitting module 200 of this embodiment includes a light source 210 , a reflective component 220 and a lens portion 230 . Wherein, the light source 210 is adapted to provide a light 212 , and the reflection component 220 is disposed above the light source 210 . The lens part 230 is disposed between the light source 210 and the reflection component 220 , and has a refraction surface 232 and a bottom surface 234 opposite to each other. In addition, the light emitting module 200 has a central axis 50, and the transmission path of the light 212 reflected by the reflective component 220 is substantially perpendicular to the central axis 50, and the transmission path of a part of the light 212 after being refracted by the refraction surface 232 is approximately perpendicular to the center. shaft 50.

In the above-mentioned light emitting module 200 , the reflection component 220 has, for example, a tapered reflection surface 222 which is suitable for reflecting a part of the light 212 . In addition, the central axis 50 passes through the light source 210 , the vertex of the tapered reflective surface 222 and the central point of the refracting surface 232 , and at least a part of the bottom surface 234 of the lens portion 230 is perpendicular to the central axis 50 .

In a preferred embodiment of the present invention, the light source 210 is, for example, a light emitting diode or other suitable light source, and part of the light 212 emitted by it will be transmitted to the conical reflective surface of the reflective component 220 through the refraction of the first part 232a of the refractive surface 232 222 , and then transmitted along a direction substantially perpendicular to the central axis 50 by reflection from the tapered reflective surface 222 . After being refracted by the second portion 232 b of the refraction surface 232 , another part of the light 212 is transmitted along a direction substantially perpendicular to the central axis 50 . In other words, in this embodiment, the transmission path of the light 212 is changed by the tapered reflective surface 222 and the second portion 232b of the refractive surface 232 to achieve the effect of side lighting.

In this embodiment, the conical reflective surface 222 is, for example, coated with a reflective film layer on the reflective component 220 or formed by other methods, which can prevent the light 212 from penetrating the cone in addition to being used to reflect the light 212. The reflective surface 222 causes loss of light energy. In this way, not only the efficiency of the side light emission can be improved, but also the unexpected light shape caused by the formation of bright spots or apertures above the reflection component 220 can be avoided. Compared with the conventional technology, in this embodiment, there is no need to use a shading sheet or a diffusion sheet to modify the unintended light shape, so the cost of the shading sheet or the diffusion sheet can be saved. In addition, since the structures of the reflective component 220 and the lens portion 230 are relatively simple, they are relatively easy to manufacture, so the probability of poor molding of the reflective component 220 and the lens portion 230 can be reduced.

It is worth mentioning that in this embodiment, when it is necessary to adjust the light shape of the light emitting module 200 , only one of the reflective component 220 and the lens portion 230 needs to be trimmed, so it is easier to trim the mold. In addition, when a plurality of light emitting modules 200 are arranged in one direction, the reflective assembly 220 of each light emitting module 200 can be integrated into one component.

Fig. 3 shows a schematic structural diagram of a light emitting module according to another embodiment of the present invention. Please refer to FIG. 3 , the light emitting module 200' of this embodiment is similar to the above light emitting module 200, the difference is that the lens part 230 of the light emitting module 200' has an extension part 236, which is connected with the reflection component 220, and the extension part 236 is substantially parallel to central axis 50 .

Since the extension portion 236 of the lens portion 230 is substantially parallel to the central axis 50, the part of the light 212 reflected by the reflection assembly 220 through the first part 232a of the refraction surface 232 and the part of the light 212 refracted by the second part 232b of the refraction surface 232 The transmission path of is substantially perpendicular to the extension portion 236 of the lens portion 230 . In other words, the transmission direction of the light 212 after passing through the extension portion 236 of the lens portion 230 will not change (or only slightly change), so it will not affect the light shape of the light emitting module 200'.

FIG. 4 shows a schematic diagram of an LED packaging structure according to an embodiment of the present invention. Referring to FIG. 4 , the LED packaging structure 300 of this embodiment includes a carrier substrate 310 , a LED chip 320 , a reflective component 330 and a lens portion 340 . Wherein, the LED chip 320 is disposed on the carrying substrate 310 to be electrically connected to the carrying substrate 310 , and the reflective component 330 is disposed above the LED chip 320 . The lens portion 340 covers the carrier substrate 310 and is connected to the reflection component 330 . The lens portion 340 is located between the LED chip 320 and the reflection component 330 and has a refraction surface 342 and a bottom surface 344 opposite to each other. In addition, the LED package structure 300 has a central axis 50 , and the LED chip 320 is suitable for providing a light 322 . The transmission path of the light 322 reflected by the reflective component 330 is substantially perpendicular to the central axis 50 , and the transmission path of part of the light 322 refracted by the refraction surface 342 is approximately perpendicular to the central axis 50 .

In the LED packaging structure 200 mentioned above, the carrier substrate 310 is, for example, a lead frame, a circuit board or other substrates. In addition, the transmission path of the reflective assembly 330, the lens portion 340, and the light 322 of the light emitting diode packaging structure 200 of this embodiment is the same as the transmission path of the reflective assembly 220, the lens portion 230, and the light 212 of the light emitting module 200' shown in FIG. similar and will not be repeated here.

To sum up, the light-emitting module and light-emitting diode packaging structure of the present invention have at least the following advantages:

1. The present invention uses a reflective component to reflect part of the light to prevent the light from penetrating the tapered reflective surface and causing loss of light energy. Therefore, the light-emitting module and LED packaging structure of the present invention have higher luminous efficiency.

2. Compared with the traditional technology, the present invention does not need to use shading sheets or diffusion sheets to modify unexpected light shapes, so the cost of shading sheets or diffusion sheets can be saved.

3. Since the structure of the reflective component and the lens portion is relatively simple, it is relatively easy to manufacture, so the probability of poor molding of the reflective component and the lens portion can be reduced.

Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person in the industry may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope is to be determined as defined by the appended claims.

Claims (8)

1. A light emitting module, comprising: a light source adapted to provide a light; a reflective component disposed above the light source; and a lens part, disposed between the light source and the reflection component, the lens part has a refraction surface and a bottom surface opposite to each other, Wherein, the light-emitting module has a central axis, and the transmission path of a part of the light rays refracted by the refracting surface is perpendicular to the central axis, and the transmission path of the rest of the light rays after being reflected by the reflective component is perpendicular to the central axis, and Wherein the reflective component has a conical reflective surface suitable for reflecting a part of the light, and the central axis passes through the light source, the apex of the conical reflective surface and the central point of the refracting surface. 2 . The light emitting module according to claim 1 , wherein the lens portion further has an extending portion parallel to the central axis, connected to the reflective component. 3 . 3. The light emitting module according to claim 1, wherein at least a part of the bottom surface of the lens portion is perpendicular to the central axis. 4. The light emitting module according to claim 1, wherein the light source comprises a light emitting diode. 5. A light-emitting diode packaging structure, comprising: a carrier substrate; a light emitting diode chip, configured on the carrier substrate and electrically connected to the carrier substrate, the light emitting diode chip is suitable for providing a light; a reflective component disposed above the light emitting diode chip; and a lens part covering the carrier substrate, the lens part is located between the LED chip and the reflective component, and the lens part has a refraction surface and a bottom surface opposite to each other, Wherein, the light emitting diode package structure has a central axis, and the transmission path of a part of the light after being refracted by the refraction surface is perpendicular to the central axis, and the transmission path of the rest of the light after being reflected by the reflective component is perpendicular to the center axis, and Wherein the reflective component has a conical reflective surface suitable for reflecting a part of the light, and the central axis passes through the LED chip, the apex of the conical reflective surface and the central point of the refraction surface. 6 . The LED packaging structure according to claim 5 , wherein the lens portion further has an extending portion parallel to the central axis, which is connected to the reflective component. 7 . 7 . The LED package structure according to claim 5 , wherein at least a part of the bottom surface of the lens portion is perpendicular to the central axis. 8 . The LED package structure according to claim 5 , wherein the carrier substrate comprises a lead frame or a circuit board.

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