CN100444000C - Backlight module and its light source structure - Google Patents
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Abstract
Description
技术领域 technical field
本发明有关于一种背光模块及其光源结构,且特别是关于一种应用发光二极管(LED,Light Emitting Diode)而使导光板结构轻量化及薄型化的背光模块及其光源结构。The present invention relates to a backlight module and its light source structure, and in particular to a backlight module and its light source structure which use light emitting diode (LED, Light Emitting Diode) to make the light guide plate structure lightweight and thin.
背景技术 Background technique
由于导光板在整个背光模块的厚度、重量上均占有很大的比例,面对现今面板市场薄型化、轻量化的需求,导光板的薄型化已是必然的趋势。然而以目前的技术而言,以发光二极管当作发光源的背光模块尚无法跟上导光板薄型化的速度,亦即目前导光板的厚度最薄可达0.3mm,而开发出最薄的发光二极管厚度却为0.4mm。特别是,当薄型化导光板采取侧边入光方式时,发光二极管发光区的高度将大于导光板的厚度,造成部分光线无法进入导光板内,使光能量使用效率降低。此外,若导光板采用滚压或押出工艺制作,且裁切每一适当大小的导光板时,导光板侧边形成的刀痕,及/或组装发光二极管与导光板之间造成的错位或间隙等,均会降低入光的效率。Since the light guide plate occupies a large proportion in the thickness and weight of the entire backlight module, facing the demand for thinner and lighter panels in the current panel market, the thinning of the light guide plate is an inevitable trend. However, with the current technology, the backlight module using light-emitting diodes as the light source cannot keep up with the speed of thinning the light guide plate. Diode thickness is 0.4mm. In particular, when the thinned light guide plate adopts the side light input method, the height of the light-emitting area of the LED will be greater than the thickness of the light guide plate, so that part of the light cannot enter the light guide plate, reducing the efficiency of light energy use. In addition, if the light guide plate is made by rolling or extrusion process, and each light guide plate of appropriate size is cut, the knife marks formed on the side of the light guide plate, and/or the dislocation or gap caused between the assembled LED and the light guide plate etc., will reduce the efficiency of incident light.
有鉴于上述情况,公知技术存在一种薄型化导光板的光源结构,如图1所示。公知光源结构10包含导光板12、发光二极管14及楔形结构16。楔形结构16形成在导光板12表面及发光二极管14之间。换言之,发光二极管14的入光侧会设计成楔形,使导光板12的厚度与发光二极管14的厚度彼此配合,以避免光能量使用效率降低的问题。In view of the above situation, there is a light source structure of a thinned light guide plate in the known technology, as shown in FIG. 1 . The known
然而上述结构在薄型导光板的制作上会遭遇一个很大的困难。以射出成型而言,目前射出技术的厚度限制在0.3mm,厚度小于0.3mm的尺寸则无法成型。此外,若采用滚压或押出的方式时,显然无法达到一边是相当薄的平板而另一侧是楔形结构的成品。However, the above structure will encounter a big difficulty in the manufacture of the thin light guide plate. In terms of injection molding, the thickness of the current injection technology is limited to 0.3mm, and the size of the thickness less than 0.3mm cannot be molded. In addition, if rolling or extruding is adopted, it is obviously impossible to achieve a finished product with a relatively thin flat plate on one side and a wedge-shaped structure on the other side.
发明内容 Contents of the invention
本发明要解决的技术问题是:提供一种有效降低导光板厚度及重量减轻的背光源组及其光源结构。The technical problem to be solved by the present invention is to provide a backlight source group and its light source structure which can effectively reduce the thickness and weight of the light guide plate.
本发明的另一目的在于提供一种使光能量使用效率增加的背光源组及其光源结构。Another object of the present invention is to provide a backlight group and a light source structure thereof which can increase the light energy usage efficiency.
本发明的另一目的在于提供一种背光模块及其光源结构,具有提高组装的便利性,而易于施作的特点。Another object of the present invention is to provide a backlight module and its light source structure, which have the characteristics of improving the convenience of assembly and being easy to implement.
本发明的另一目的在于提供一种可让光线于导光板内形成全反射的背光模块及其光源结构。Another object of the present invention is to provide a backlight module capable of total reflection of light in the light guide plate and a light source structure thereof.
本发明的另一目的在于提供一种背光模块及其光源结构,供与发光二极管配合使用。Another object of the present invention is to provide a backlight module and its light source structure for use with light emitting diodes.
本发明的光源结构包含光学板件、发光元件及透镜体。发光元件设置于光学板件的表面上。发光元件具有一光线射出方向,光线射出方向与光学板件的表面夹一夹角θ。透镜体设置于表面上且连接发光元件。透镜体更包含斜面,斜面一端系连接发光元件,且另一端与光学板件连接。The light source structure of the present invention includes an optical plate, a light emitting element and a lens body. The light emitting element is arranged on the surface of the optical plate. The light emitting element has a light emitting direction, and the light emitting direction forms an angle θ with the surface of the optical plate. The lens body is arranged on the surface and connected with the light emitting element. The lens body further includes a slope, one end of the slope is connected with the light-emitting element, and the other end is connected with the optical plate.
在较佳实施例中,透镜体的折射率n2较佳是介于光学板件的折射率n1及发光元件的折射率n3之间,且光学板件的折射率n1较佳是大于或等于发光元件的折射率n3。发光元件还包含发光体及封装部,封装部包覆发光体。发光体与光学板件及透镜体相邻接。光源结构较佳更包含反射板。反射板较佳设于光学板件的底面。光学板件与反射板间更具有低折射率层。低折射率层较佳为空气,且其折射率为n4=1。光学板件较佳为导光板,根据司乃耳定律(Snall’slaw),夹角θ较佳小于或等于sin-1(n4/n1),使光线射出方向在光学板件内进行全反射。In a preferred embodiment, the refractive index n2 of the lens body is preferably between the refractive index n1 of the optical plate and the refractive index n3 of the light-emitting element, and the refractive index n1 of the optical plate is preferably greater than or equal to the light-emitting element. The refractive index n3 of the element. The light-emitting element further includes a luminous body and a packaging part, and the packaging part covers the luminous body. The luminous body is adjacent to the optical plate and the lens body. Preferably, the light source structure further includes a reflector. The reflection plate is preferably disposed on the bottom surface of the optical plate. There is a low refractive index layer between the optical plate and the reflection plate. The low refractive index layer is preferably air, and its refractive index is n4=1. The optical plate is preferably a light guide plate. According to Snall's law, the included angle θ is preferably less than or equal to sin -1 (n4/n1), so that the light emitting direction is totally reflected in the optical plate.
此外,光源结构更包含框架、电路模块及至少一微结构。框架设置于反射板的一端上,且通过黏着层与反射板接合。电路模块则耦接发光元件。由于不同光源结构的设计,电路模块可设置于发光元件的上表面、侧面或下表面上。尤有甚者,电路模块更可设置于发光元件及光学板件的表面间。在此所述的电路模块较佳为铜膜。微结构设于反射板内表面上,并供反射上述光线射出方向。表面较佳是指光学板件的底面或出光顶面。In addition, the light source structure further includes a frame, a circuit module and at least one microstructure. The frame is arranged on one end of the reflective plate, and is connected with the reflective plate through the adhesive layer. The circuit module is coupled to the light emitting element. Due to the design of different light source structures, the circuit module can be arranged on the upper surface, the side surface or the lower surface of the light emitting element. What's more, the circuit module can be arranged between the surface of the light-emitting element and the optical plate. The circuit modules described herein are preferably copper films. The microstructure is arranged on the inner surface of the reflecting plate, and is used for reflecting the light emitting direction. The surface preferably refers to the bottom surface or the light emitting top surface of the optical plate.
本发明另一较佳实施例更提供一种背光模块,包含光学板件、发光元件及透镜体。发光元件设置于光学板件的表面上,发光元件具有一光线射出方向。光线射出方向与光学板件的表面夹一夹角θ。发光元件更包含发光体及封装材料,封装材料包覆发光体。透镜体设置于表面上且连接光学板件与发光元件。透镜体更包含斜面。斜面一端连接发光元件,且另一端与该光学板件连接。发光体更与光学板件及透镜体相邻接。Another preferred embodiment of the present invention further provides a backlight module, including an optical plate, a light emitting element and a lens body. The light emitting element is arranged on the surface of the optical plate, and the light emitting element has a light emitting direction. The light emitting direction forms an angle θ with the surface of the optical plate. The light-emitting element further includes a light-emitting body and an encapsulation material, and the encapsulation material covers the light-emitting body. The lens body is arranged on the surface and connected with the optical plate and the light emitting element. The lens body further includes a bevel. One end of the slope is connected to the light-emitting element, and the other end is connected to the optical plate. The luminous body is further adjacent to the optical plate and the lens body.
通过上述结构,本发明为一种应用发光二极管(LED,Light Emitting Diode)而使导光板结构轻量化及薄型化的背光模块及其光源结构,其可效降低导光板厚度并减轻重量,而且可增加光能量的使用效率,还可提高组装的便利性,而具有易于施作的特点;此外,可让光线于导光板内形成全反射,便于与发光二极管配合使用。Through the above structure, the present invention is a light emitting diode (LED, Light Emitting Diode) to make the light guide plate structure light and thin backlight module and its light source structure, which can effectively reduce the thickness and weight of the light guide plate, and can The use efficiency of light energy is increased, and the convenience of assembly can also be improved, so it has the characteristics of easy construction; in addition, the light can be fully reflected in the light guide plate, which is convenient for use with light-emitting diodes.
附图说明 Description of drawings
图1为公知薄型化导光板的光源结构示意图;FIG. 1 is a schematic diagram of a light source structure of a known thin light guide plate;
图2为本发明背光模块及其光源结构的俯视图;2 is a top view of the backlight module and its light source structure of the present invention;
图3为图2的A-A剖视图;Fig. 3 is A-A sectional view of Fig. 2;
图4为本发明光线射入方向于光学板件内进行全反射的示意图;Fig. 4 is the schematic diagram of total reflection in the optical plate in the light incident direction of the present invention;
图5为本发明增设微结构以增加光的使用效率的示意图;FIG. 5 is a schematic diagram of adding microstructures to increase light use efficiency in the present invention;
图6为本发明对透镜体进行光学模拟实验结果的比较图;Fig. 6 is the comparative figure that the present invention carries out optical simulation experiment result to lens body;
图7a为本发明设置电路模块的第一实施例图;Fig. 7a is a diagram of the first embodiment of the present invention setting the circuit module;
图7b为本发明设置电路模块的第二实施例图;Fig. 7b is a diagram of a second embodiment of a circuit module provided by the present invention;
图7c为本发明设置电路模块的第三实施例图;Fig. 7c is a diagram of a third embodiment of a circuit module provided in the present invention;
图7d为本发明设置电路模块的第四实施例图;Fig. 7d is a diagram of a fourth embodiment of the present invention with a circuit module;
图8为本发明背光模块及其光源结构的另一较佳实施例图;FIG. 8 is a diagram of another preferred embodiment of the backlight module and its light source structure of the present invention;
图9为本发明背光模块及其光源结构结合框架的示意图;及FIG. 9 is a schematic diagram of the backlight module and its light source structure combined frame of the present invention; and
图10为本发明背光模块及其光源结构结合框架的一实施例图。FIG. 10 is a diagram of an embodiment of the backlight module and its light source structure combined with the frame of the present invention.
【主要元件符号说明】[Description of main component symbols]
100光源结构 102光学板件100
104表面 106反射板104
107出光顶面 108底面107 light
110发光元件 112发光体110 light-emitting
114封装部 116光线射入方向114
120透镜体 122斜面120
130电路模块 132上表面130
134侧面 136下表面134
140低折射率层 142黏着层140 low
150框架 200其他光学板件150
具体实施方式 Detailed ways
本发明为一种光学板件薄型化且能提高光能量使用率的背光模块及其光源结构。在较佳实施例中,光源结构的发光元件为发光二极管。特别是,发光二极管较佳是与光学板件的表面倾斜一角度入光方式设置。换言之,发光二极管较佳是分别与光学板件及透镜体邻接设置。此外,增设的透镜体(lens)较佳是以涂布的方式设于光学板件与发光元件间。然而在其他不同的实施例中,透镜体亦可以电脑数值控制(CNC)或其他方式制造而成。以下即配合附图,进一步说明本发明的各具体实施例及其步骤:The invention relates to a backlight module and a light source structure thereof with thinned optical boards and improved light energy utilization rate. In a preferred embodiment, the light emitting elements of the light source structure are light emitting diodes. In particular, the light-emitting diodes are preferably disposed in a manner of incident light at an angle inclined to the surface of the optical plate. In other words, the light emitting diodes are preferably disposed adjacent to the optical plate and the lens respectively. In addition, the additional lens body (lens) is preferably disposed between the optical plate and the light-emitting element by coating. However, in other different embodiments, the lens body can also be manufactured by computer numerical control (CNC) or other methods. Below promptly coordinate accompanying drawing, further illustrate each specific embodiment of the present invention and steps thereof:
如图2及图3所示,于本实施例中的光源结构100包含光学板件102、发光元件110及透镜体120。发光元件110设于光学板件102的表面104上。在如图2所示的实施例中,较佳是以多个发光元件110分设于光学板件102的一侧端上。然而在其他不同的实施例中,亦可以单一发光元件110提供发光。光学板件102较佳为导光板(LGP)或其他透光板材。透镜体120设于表面104上,且连接发光元件110。在如图3所示的实施例中,发光元件110较佳是以发光体112发光,并与光学板件102的表面104倾斜一角度入光。发光元件110还包含封装部114,供包覆/封装发光体112。由此,发光元件110具有一光线射出方向116,使与光学板件102的表面104夹一夹角θ入光。此外,在光学板件102的表面104上较佳还设置若干其他光学板件200,诸如:扩散片或菱镜片等元件。As shown in FIG. 2 and FIG. 3 , the
透镜体120较佳具有斜面122。在此所述的斜面122较佳是当注入/涂布透镜体120时,利用表面张力所形成。斜面122的一端较佳连接发光元件110,另一端则连接光学板件102。然而在其他不同的实施例中,透镜体120亦可以电脑数值控制或其他方式制作而成。但若以电脑数值控制制造时,光学板件102与透镜体120间须设高透光性的黏着材料/层,以增加固着力。在如图3所示的实施例中,为避免光效率的损失,设置具斜面122的透镜体120结构,主要用于反射发光体112的光线,并使光线从光学板件102倾斜一角度入光。此外,注入透镜体120结构更可提高产品组装的便利性,避免因组装误差或些微公差产生错位或缝隙,而与光学板件102间造成光效率的损失。特别是,还可在透镜体120的斜面122或不与发光元件110及光学板件102相邻接的两侧表面上设置反射物质,以增加光使用效率。换言之,当光线从光学板件102反射时,可避免从上述位置射出。The
在此需说明的是,封装部114的材质可为树脂或其他透光性的封装材料。透镜体120的材质较佳亦为树脂或者是其他高透光性材质,其通过加工过程中的热硬化、热塑化、光硬化或室温硬化而达到固化。It should be noted here that the material of the
如图4所示,光源结构100较佳还包含反射板106,其设于光学板件102的底面108上。光学板件102与反射板106间更具有低折射率层140。在如图4所示的实施例中,低折射率层140较佳为空气或真空,且其折射率假设为n4=1。然而在其他不同的实施例中,低折射率层140亦可为黏着材料。此外,为了减少光线穿透两不同介质产生反射能量损失,或者是在引导光线进入光学板件102的过程中,使反射能量损失达到最小,而不致使光线在光学板件102前端出光,假设光学板件102的折射率为n1,透镜体120的折射率为n2,且发光元件110的折射率则为n3,则透镜体120的折射率n2较佳是介于光学板件102的折射率n1及发光元件110的折射率n3之间,且光学板件102的折射率n1较佳是大于或等于发光元件110的折射率n3。换言之,光学板件102、透镜体120及发光元件110的折射率是必须相当接近的,即n3≤n2≤n1。As shown in FIG. 4 , the
由于夹角θ系光线射出方向116与光学板件102的表面104的夹角,而δ与θ的和为90度。换言之,θ+δ=90度,若希望光线射入方向116在光学板件102中形成全反射,根据司乃耳定律(Snall’s law),必须使δ≥sin-1(n4/n1)(全临界反射角),得知夹角θ较佳是小于或等于sin-1(n4/n1)(即θ≤sin-1(n4/n1))。在如图4所示的实施例中,假设光学板件102的折射率n1为1.48,低折射率层140为空气(n4=1)时,经实验结果证实,当θ<48度,δ>42度时,光线可在光学板件102内进行全反射。然而当θ>48度,δ<42度时,光线将在光学板件102前端即会出光(如图4的虚线所示)。当光线无法透过全反射传导至光学板件102另一端(即后段)时,对于光源结构或背光模块的亮度及均齐度均会有影响。Since the included angle θ is the included angle between the light emitting
虽然发光体112较佳是与光学板件102的表面104夹一角度入光,但不可避免的会有部分光线射入角度不符合预期。换言之,当光线入射方向116角度太大,甚至垂直于光学板件102入光时,光线无法导引至光学板件102后方。由此,如图5所示,光源结构100较佳还包含数个微结构170,其分别设于反射板106的内表面上,用于将前述的光线导引或反射至光学板件102后方,即光源结构100的另一端,以提高光能量的使用效率。在如图5所示的实施例中,微结构170较佳为单个分散设置的三角形微结构。然而在其他不同的实施例中,亦可为连续设置的三角形微结构,或为多角形、圆形或其他形状的微结构。Although the
如图6所示,关于有无设置透镜体120,或者是透镜体120的宽a与长b的比例差异对光效率的影响为何,经光学实验模拟可知。显而易见的,有设置或涂布透镜体120而达到引导光线进入光学板件102的效率均较无设置透镜体120的效果为佳。特别是,透镜体120的宽长比(a∶b)在1∶2时,可得最高的光使用效率。换言之,设置或涂布透镜体120时,确实可将光线引导进入光学板件102。As shown in FIG. 6 , regarding whether the
如图7a~7d所示,光源结构100还包含电路模块130。在此所述的电路模块130尤指软性电路板(FPC)、印刷电路板或其组合结构。电路模块130耦接于发光元件110。由于不同背光模块及其光源结构100的设计,电路模块130可设置于发光元件110的上表面132,如图7a所示。然而在如图7b所示的实施例中,电路模块130亦可设于发光元件110的侧面134或下表面136上(如图7c的实施例中所示)。尤有甚者,电路模块130还可以铜膜(Cu Foil)或铜导线取代,并将发光元件110焊接或以其他方式定位于其上,如图7d所示。在如图7d所示的实施例中,铜膜或铜导线较佳是设于发光元件110及光学板件102的表面104间。此外,在发光体112与光学板件102间更以类似于透镜体120的材质或黏着层142涂布或设置,以免阻碍发光体112的光线进入光学板件102。As shown in FIGS. 7 a to 7 d , the
在前述所述的实施例中,发光元件110设置于光学板件102的表面104。前述所言的表面104是指光学板件102的出光顶面107。然而如图8所示的实施例中,发光元件110所设置的表面104是指光学板件102的底面108。此外,在本实施例中,光学板件102的出光顶面107上较佳还设置反射板106或其他反射材质,供导引光线进入光学板件102内。其余结构同前所述,在此不再赘述。In the aforementioned embodiments, the
如图9所示,光源结构100还包含框架150。框架150设置于反射板106的一端上,且通过黏着层142与反射板106接合定位。然而如图10所示的实施例中,框架150亦可定位或设置于光学板件102上。若框架150固定于光学板件102上,光学板件102与反射板106间较佳为设置黏着层142。在此所言的黏着层142必须为低折射率材质,例如:硅胶、树脂或其他胶体等。如此以利光线在光学板件102内进行全反射,减少光线穿透黏着层142再经由反射板106反射所造成的能量损失。As shown in FIG. 9 , the
本发明已由上述相关实施例加以描述,然而上述实施例仅为实施本发明的范例。必需指出的是,已揭露的实施例并未限制本发明的范围。根据本发明的精神及原则所做的修改及均等设置均包含于所附申请专利范围内。The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. The modifications and equivalent arrangements made according to the spirit and principles of the present invention are included in the appended patent scope.
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US20050285133A1 (en) * | 2004-06-18 | 2005-12-29 | Chi Mei Optoelectronics Corp. | Light emitting diode package |
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US20050285133A1 (en) * | 2004-06-18 | 2005-12-29 | Chi Mei Optoelectronics Corp. | Light emitting diode package |
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