CN100437993C - Electronic package component - Google Patents

Abstract

An electronic packaging element comprises a packaging body, a plurality of magnetic elements arranged inside the packaging body, and a silicon material covering the surface of the magnetic elements; wherein at least one heat dissipation hole is opened on at least one side of the packaging body to accelerate heat dissipation and allow the silicon material to have space for expansion.

Description

Electronic packaging components

technical field

The invention relates to an electronic packaging component, in particular to an electronic packaging component with heat dissipation holes.

Background technique

In response to the increasing awareness of environmental protection, the European Union has formulated requirements for electronic component technology, among which lead-free technology prohibits the use of lead metal in the process of manufacturing electronic components, because lead will not only harm nature, but also cause harm to human body. And this lead-free process has become a factor that countries need to consider in the process of producing electronic components. Under the requirements of lead-free technology, the soldering technology of electronic components has encountered a major change, and the conventional solder is tin/lead alloy, which can no longer be used. After researching for a while, finally found some lead-free solders, such as tin/silver/copper alloys.

Please refer to FIG. 1, a conventional electronic packaging component 1 is a surface mount component (SurfaceMount Device, SMD), which is irradiated by infrared light emitted by a light source 12 during the reflow soldering process. , the heat generated by the infrared light melts the solder to complete the soldering. In the known reflow process, tin/lead alloy is used as solder, and the temperature irradiated by infrared light only needs to be about 220°C to melt the solder; but in the lead-free process, lead-free metals such as tin/silver/ Copper alloy is used as solder, which requires a high temperature of about 260°C to melt the solder.

Please refer to FIG. 2A , the package body 11 of the electronic package component 1 covers at least one coil 112 ; and the surface of the coil 112 is covered by a silicon material 113 . When the package body 11 is subjected to high temperature reflow of 260° C., the silicon material 113 of the package body 11 will expand due to heat, and the generated stress will be transmitted to the package body 11 , causing cracks 114 on the surface of the package body 11 . As shown in Fig. 2B, its reliability is reduced.

Therefore, how to provide an electronic packaging component that can be applied to a lead-free process without damaging the package body is one of the current important issues.

Contents of the invention

In view of the above problems, the object of the present invention is to provide an electronic packaging component that can be applied to a lead-free process without damaging the package body.

Therefore, in order to achieve the above purpose, an electronic package component of the present invention includes a package body, a plurality of magnetic components disposed inside the package body, and a silicon material covering the surface of the magnetic components. Wherein the package body is made of a molding material, and at least one heat dissipation hole is opened on at least one side thereof.

Based on the above, the electronic package of the present invention has at least one heat dissipation hole on the side of the package body, so in the high temperature environment of lead-free reflow, the heat can be quickly discharged through the heat dissipation hole, and the heated silicon material can also There is room to expand. Compared with the conventional technology, the present invention can reduce the temperature borne by the silicon material in the package body, and make the silicon material have room for expansion, so that the package body will not be cracked due to the stress generated by the thermal expansion of the silicon material cause damage.

Description of drawings

FIG. 1 is a schematic diagram of a conventional electronic packaging component in a reflow process;

2A is a schematic cross-sectional view of a conventional electronic package component during reflow;

FIG. 2B is a schematic perspective view of the electronic packaging component of FIG. 2A;

FIG. 3 is a schematic perspective view of an embodiment of an electronic packaging element not containing silicon material of the present invention; and

FIG. 4 is a schematic cross-sectional view of the silicon-containing material in FIG. 3 .

Description of component symbols:

1, 2 electronic package components 11, 21 package body

112 coils 22 magnetic components

113, 23 silicon material 114 cracks

12 Light Sources 24 Pins

211, 211', 212 sides 213 cooling holes

Detailed ways

An electronic package component according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same reference symbols.

Please refer to FIG. 3 and FIG. 4 at the same time. An electronic package component 2 according to a preferred embodiment of the present invention includes a package body 21 , a plurality of magnetic components 22 , a silicon material 23 and a plurality of pins 24 .

The package body 21 is made of a molding material covering the magnetic elements 22. In this embodiment, the magnetic element 22 can be a coil, and the molding material can contain epoxy resin. As shown in FIG. 3 , the silicon material 23 covers the surfaces of the magnetic elements 22 (the coils are clearly shown in FIG. 4 , so the silicon material 23 is not shown) to protect the magnetic elements 22 . The plurality of pins 24 are disposed on opposite sides 211, 211' of the package body 21 for electrical connection with other devices or components. The electronic packaging component 2 is preferably a surface mount component (SMD), such as a LAN filter (LAN Filter).

Please refer to FIG. 3 and FIG. 4 at the same time. At least one heat dissipation hole 213 is opened on one side 212 of the package body 21 . In this embodiment, two heat dissipation holes 213 are opened on the same side 212 .

When the electronic package element 2 enters the high-temperature environment of lead-free reflow, at least one heat dissipation hole 213 is provided on one side 212 of the package body 21, so the heat can be quickly discharged through the heat dissipation hole 213, and the heated silicon material 23 also has extra space for expansion, so that the package body 21 will not be damaged due to cracks caused by the stress generated by the thermal expansion of the silicon material 23 .

Certainly, the package body can also be covered by a heat conduction clip, and the heat conduction clip tightly covers the top surface and the side surface of the package body 21 without contacting the pins 24 . The heat conduction fixture is preferably made of a metal material with good heat conduction, such as copper, so as to achieve a good heat dissipation effect. In this way, during the reflow process, the high temperature on the surface of the package body 21 can be quickly discharged to the outside through the heat-conducting jig.

The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope defined by the appended rights area.

Claims (10)

1. electronic encapsulated components comprises:

A plurality of magnetic elements;

One potted element coats these magnetic elements;

Wherein the bottom surface of this encapsulation main body offers at least one heat radiation hole.

2. electronic encapsulated components as claimed in claim 1 also comprises a silicon material, is covered in the surface of this magnetic element.

3. electronic encapsulated components as claimed in claim 1, wherein this encapsulation main body is made of a moulding material.

4. electronic encapsulated components as claimed in claim 3, wherein this moulding material contains epoxy resin.

5. electronic encapsulated components as claimed in claim 1, wherein this magnetic element is a coil.

6. electronic encapsulated components as claimed in claim 1, it also comprises a plurality of pins, is arranged at the relative dual-side of this potted element respectively.

7. electronic encapsulated components as claimed in claim 6, it is an element pasted on surface.

8. electronic encapsulated components as claimed in claim 7, it is a LAN filter.

9. electronic encapsulated components as claimed in claim 1, wherein this encapsulation main body is coated by heat conduction anchor clamps.

10. electronic encapsulated components as claimed in claim 9, wherein these heat conduction anchor clamps are made by copper or metal material.

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