CN100424860C - Heat dissipation type flip chip package structure - Google Patents

Abstract

The invention relates to a heat dissipation type flip chip packaging structure, which comprises a substrate with an upper surface, a flip chip connected to the upper surface of the substrate, and a radiator arranged on the back surface of the flip chip, wherein the radiator comprises a heat dissipation shell and a coolant, the heat dissipation shell is provided with a bottom heat exchange part, a top heat exchange part and a coolant collection part, the bottom heat exchange part comprises a plurality of heat dissipation convex columns to increase the heat dissipation area, the coolant collection part is connected with the bottom heat exchange part and a preheating exchange part and is used for collecting the coolant, when a heat dissipation circulation is carried out in the heat dissipation shell, the coolant can flow to the heat dissipation convex columns and evaporate, and the heat dissipation shell and the coolant are used for improving the heat conduction efficiency of the heat dissipation type flip chip packaging structure to maintain the normal working temperature.

Description

Heat-dissipating flip-chip package structure

technical field

The invention relates to a heat dissipation flip-chip package structure, in particular to a heat dissipation flip chip package structure with a heat sink.

Background technique

Since today's electronic products emphasize high functionality and extremely high performance, the chips of these electronic products are in a high-computing state for a long time, which will cause a large amount of heat energy to be generated by the chip. If it is emitted, it will easily cause the chip to warp or crack, which will cause these electronic products to fail or be scrapped, thereby reducing the lifespan of the product. Therefore, today's highly computing chips are equipped with heat dissipation Installed on a non-active surface of the chip to speed up the dissipation of heat energy.

Please refer to FIG. 1 , which is a conventional heat dissipation package structure, which includes a substrate 10 , a plurality of solder balls 20 , a flip chip 30 , a plurality of bumps 40 and a heat sink 50 . The solder balls 20 are disposed on the lower surface 11 of the substrate 10, the flip chip 30 is disposed on the upper surface 12 of the substrate 10, and the bumps 40 are formed on an active surface 31 of the flip chip 30 to electrically connect the substrate. 10 and the flip chip 30, the heat sink 50 is arranged on the upper surface 12 of the substrate 10 through a stiffener 60, and is thermally coupled with a back surface 32 of the flip chip 30, wherein the thermal energy generated by the flip chip 30 is conducted to the heat sink 50, and then dissipate heat energy through the heat sink 50, so the size of the heat sink 50 is the most important key for the entire component, and the above-mentioned flip-chip chip 30 only dissipates heat energy through the heat sink 50, when the When the heat sink 50 is installed on a heat source with a high temperature, the heat energy of the heat source cannot be dissipated in time due to the insufficient heat dissipation area of the heat sink 50 , which in turn causes the product temperature to be too high and affect performance.

It can be seen that the above-mentioned existing heat dissipation flip-chip packaging structure obviously still has inconveniences and defects in structure and use, and needs to be further improved. In order to solve the problems existing in the heat-dissipating flip-chip packaging structure, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems. , this is obviously a problem that relevant industry players are eager to solve. Therefore, how to create a new type of heat-dissipating flip-chip packaging structure has become a goal that needs to be improved in the current industry.

In view of the defects in the above-mentioned existing heat-dissipating flip-chip packaging structure, the inventor actively researches and innovates based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, and cooperates with the application of academic theories, in order to create a The novel heat-dissipating flip-chip packaging structure can improve the general existing heat-dissipating flip-chip packaging structure, making it more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Contents of the invention

The purpose of the present invention is to overcome the defects of the existing heat dissipation type flip chip packaging structure, and provide a novel heat dissipation type flip chip packaging structure. The technical problem to be solved is to make it include a substrate, a flip chip and A heat sink, the flip chip is bonded to an upper surface of the substrate, the heat sink is arranged on a back side of the flip chip, the heat sink includes a heat dissipation case and a coolant, the heat dissipation case includes a bottom heat exchange part, a top heat exchange part and a coolant collection part, the coolant collection part connects the bottom heat exchange part and the top heat exchange part to form a closed space, wherein the coolant collection part It is used to collect the coolant to facilitate a heat dissipation cycle in the enclosed space. The coolant can flow to the heat dissipation protrusions and evaporate to facilitate the dissipation of heat energy of the flip chip, which is more suitable for practical use.

Another object of the present invention is to provide a heat-dissipating flip-chip package structure. The technical problem to be solved is to make a heat exchanging part of the bottom include a plurality of heat-dissipating protrusions, so as to increase the heat dissipation area of the heat exchanging part of the bottom. When the flip-chip chip generates heat energy, the dissipating speed of the heat energy can be accelerated by the heat dissipation protrusions to maintain the operation of the flip-chip chip and prolong the life of the product, so that it is more suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A heat-dissipating flip-chip packaging structure proposed according to the present invention includes: a substrate having an upper surface; a flip-chip chip bonded to the upper surface of the substrate, the flip-chip chip having a back surface; and a heat-dissipating chip The heat sink is arranged on the back of the flip chip. The heat sink includes a heat dissipation shell and a coolant. The heat dissipation shell is a closed space. The heat dissipation shell has: a bottom heat exchange part attached to the cover The back side of the crystal wafer and includes a plurality of heat dissipation protrusions in the confined space; a top heat exchange part; and a coolant collecting part, connecting the bottom heat exchange part and the top heat exchange part, for collecting the Coolant; wherein, when a heat dissipation cycle is performed in the heat dissipation housing, the coolant can flow to the heat dissipation protrusions and evaporate.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned heat dissipation type flip-chip package structure, wherein the heat dissipation protrusions are integrally formed on the heat dissipation housing.

In the aforementioned heat dissipation type flip-chip package structure, the heat dissipation protrusions are bonded to the bottom heat exchanging portion by bonding or soldering.

In the aforementioned heat dissipation type flip-chip package structure, wherein the heat dissipation protrusions are conical or arc-shaped hollow structures and include a heat conduction filler filled in the hollow area of the heat dissipation protrusions.

In the aforementioned heat dissipation type flip-chip package structure, wherein the heat dissipation housing has an inclined surface in the enclosed space, connecting the bottom heat exchange part and the coolant collection part, so as to facilitate the capillary flow of the coolant into the bottom heat exchange section.

In the aforementioned heat dissipation type flip-chip package structure, wherein the preheat exchange portion of the heat dissipation housing is a fin-shaped structure.

The aforementioned heat dissipation flip-chip package structure further includes a reinforcing member disposed on the upper surface of the substrate to support the heat sink and the substrate.

The aforementioned heat-dissipating flip-chip package structure further includes a heat-dissipating fin plate disposed on the top heat exchanging portion.

The aforementioned heat dissipation flip-chip package structure further includes a heat dissipation adhesive thermally coupled to connect the back surface of the flip chip with the bottom heat exchange portion of the heat dissipation housing.

The aforementioned heat dissipation flip-chip package structure further includes a plurality of solder balls disposed on the lower surface of the substrate.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. From the above technical solutions, it can be known that the heat dissipation flip-chip packaging structure of the present invention has at least the following advantages:

According to the heat dissipation flip chip package structure of the present invention, it includes a substrate, a flip chip and a heat sink, the substrate has an upper surface, the flip chip is bonded to the upper surface of the substrate, and the heat sink is arranged on The flip chip, the heat sink includes a heat dissipation shell and a coolant, wherein the heat dissipation shell has a bottom heat exchange part, a top heat exchange part and a coolant collection part, the bottom heat exchange part is attached to A back side of the flip chip includes a plurality of heat dissipation protrusions, the top heat exchanging part can conduct heat energy generated by the flip chip, and the coolant collection part connects the bottom heat exchanging part and the top heat exchanging part, which can Collecting the coolant facilitates a heat dissipation cycle in the enclosed space, wherein, when the heat energy generated by the flip chip is transferred to the bottom heat exchange part, the coolant absorbs the heat energy transferred to the bottom heat exchange part That is, it turns into a vapor coolant, then climbs up to the top heat exchange part, and transfers heat energy to the top heat exchange part and recondenses into liquid coolant, and then flows back to the coolant collection part, because the bottom heat The exchanging part includes the heat dissipation protrusions, so the heat energy generated by the flip chip is quickly dissipated to the top heat exchanging part due to the increase of the heat dissipation area, so as to maintain the operating efficiency of the flip chip.

To sum up, the special heat-dissipating flip-chip packaging structure of the present invention has the above-mentioned many advantages and practical value, and no similar structural design has been published or used in similar products, so it is indeed an innovation. The product structure or function has been greatly improved, and the technology has made great progress, and has produced easy-to-use and practical effects, and has improved multiple functions compared with the existing heat-dissipating flip-chip packaging structure, so that It is more suitable for practicality, and it is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional heat-dissipating package structure.

FIG. 2 is a schematic cross-sectional view of a heat dissipation flip-chip package structure according to a first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a heat dissipation flip-chip package structure according to a second embodiment of the present invention.

10: Substrate 11: Lower surface

12: Upper surface 20: Solder ball

30: Flip chip 31: Active surface

32: Back 40: Bump

50: heat sink 60: reinforcement

100: heat dissipation flip-chip package structure 110: substrate

111: upper surface 112: lower surface

120: flip chip 121: back

122: Bump 130: Radiator

131: Cooling shell 132: Coolant

133: Bottom heat exchange part 133a: Radiation boss

134: Top heat exchange unit 135: Coolant collection unit

136: Inclined surface 137: Thermally conductive filler

140: Solder balls 150: Thermal paste

200: heat dissipation flip-chip package structure 210: substrate

211: Upper surface 220: Flip chip

221: Back 222: Bump

230: radiator 231: cooling shell

232: Coolant 233: Bottom heat exchange unit

233a: Radiation boss 234: Top heat exchange part

235: Coolant Collection Department 236: Thermal Conductive Filler

240: reinforcement 250: cooling fins

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and details of the heat dissipation flip-chip packaging structure proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its effect is described in detail below.

Please refer to FIG. 2 , which is a first embodiment of the heat dissipation flip chip package structure of the present invention. The heat dissipation flip chip package structure 100 includes a substrate 110 , a flip chip chip 120 and a heat sink 130 . The substrate 110 has an upper surface 111 . In this embodiment, the heat dissipation flip chip package structure 100 includes a plurality of solder balls 140 disposed on the lower surface 112 of the substrate 110 . The flip chip 120 is bonded to the upper surface 111 of the substrate 110 , and the flip chip 120 has a back surface 121 . In this embodiment, the flip chip 120 is electrically connected to the substrate 110 through a plurality of bumps 122 .

The radiator 130 is arranged on the back surface 121 of the flip chip 120, wherein the radiator 130 includes a heat dissipation shell 131 and a coolant 132, the heat dissipation shell 131 is a closed space, and includes a bottom heat exchange part 133, A top heat exchange part 134 and a coolant collection part 135, the bottom heat exchange part 133 is attached to the back surface 121 of the flip chip 120, and includes a plurality of heat dissipation protrusions 133a in the enclosed space to increase heat dissipation area. In this embodiment, the heat dissipation protrusions 133a are conical. In addition, the top heat exchange part 134 of the heat dissipation housing 131 is formed with heat dissipation fins to facilitate the dissipation of heat energy. Preferably, the heat dissipation type cover The chip package structure 100 further includes a thermal paste 150 thermally coupled to connect the back surface 121 of the flip chip 120 with the bottom heat exchanging portion 133 . The top heat exchange part 134 is the top of the heat dissipation housing 131 for dissipating heat energy, and the coolant collection part 135 is connected to the bottom heat exchange part 133 and the top heat exchange part 134 to collect the coolant 132 for use in a closed space. When a heat dissipation cycle is performed inside, the coolant 132 can flow to the heat dissipation protrusions 133a and evaporate. Preferably, the heat dissipation housing 131 has an inclined surface 136 in the enclosed space, which is connected to the bottom heat exchange part 133 and the coolant collecting portion 135 , so that the coolant 132 can capillary flow into the bottom heat exchange portion 133 through the inclined surface 136 to facilitate a heat dissipation cycle. In this embodiment, the heat dissipation protrusions 133a are further bonded or welded to the bottom heat exchange portion 133. Preferably, the heat dissipation protrusions 133a are hollow structures. In addition, the heat dissipation protrusions 133a It also includes a thermally conductive filler 137, such as solder, thermal interface material (Thermal Interface Material, TIM), etc., which is filled in the hollow areas of the heat dissipation protrusions 133a.

In the heat dissipation type flip chip package structure 100, the heat energy generated by the flip chip 120 is transferred to the bottom heat exchange part 133 and absorbed by the liquid coolant 132 flowing into the bottom heat exchange part 122. After the liquid coolant 132 absorbs the heat energy Turn into the vapor coolant 132, at this time, the vapor coolant 132 climbs up to the top heat exchange part 134, when the vapor coolant 132 reaches the top heat exchange part 134, it will transfer heat energy to the top heat exchange part 134 and The liquid coolant 132 is re-condensed in the top heat exchange part 134, and then flows back to the coolant collection part 135, and because the bottom heat exchange part 133 includes these heat dissipation protrusions 133a, the heat energy generated by the flip chip 120 is dissipated The increase in the area quickly dissipates heat to the top heat exchanging portion 134 to maintain the normal operating temperature of the flip chip 120 and avoid reducing the operating efficiency of the flip chip 120 due to excessive temperature.

Please refer to FIG. 3 , which is a second specific embodiment of the heat dissipation flip chip package structure of the present invention. The heat dissipation flip chip package structure 200 includes a substrate 210, a flip chip 220 and a heat sink 230. The substrate 210 has An upper surface 211 , the flip chip 220 is bonded to the upper surface 211 of the substrate 210 and has a back surface 221 . In this embodiment, the flip chip 220 includes a plurality of bumps 222 for bonding the flip chip 220 and the substrate 210 . The heat sink 230 is arranged on the back side 221 of the flip chip 220 and includes a heat dissipation shell 231 and a coolant 232. The heat dissipation shell 231 is a closed space, wherein the heat dissipation shell 231 includes a bottom heat exchange part 233, a The top heat exchanging part 234 and a coolant collection part 235, the bottom heat exchanging part 233 is attached to the back of the flip chip 220 and includes a plurality of heat dissipation protrusions 233a in the enclosed space to increase the heat dissipation area. In this embodiment, the heat dissipation housing 231 and the heat dissipation protrusions 233a are integrally formed in an arc shape. Preferably, the heat dissipation protrusions 233a are hollow. In addition, the heat dissipation type flip-chip package structure The 200 further includes a heat conduction filler 236 filled in the hollow areas of the heat dissipation protrusions 233a.

The top heat exchange part 234 is used for dissipating heat energy, and the coolant collection part 235 connects the bottom heat exchange part 233 and the top heat exchange part 234 for collecting the coolant 232 to perform a heat dissipation cycle in the enclosed space. In this embodiment, the heat dissipation type flip chip package structure 200 includes a stiffener 240 disposed on the upper surface 211 of the substrate 210 to support the heat sink 230 and the substrate 210. In addition, the heat dissipation type flip chip package structure 200 further includes A cooling fin 250 is disposed outside the top heat exchanging portion 234 to enhance the cooling speed.

In the heat-dissipating flip-chip package structure 200, since the coolant 232 has been performing a heat exchange cycle between the bottom heat exchange part 233 and the preheat exchange part 234 of the heat dissipation housing 231, and utilizes the heat generated by the heat dissipation protrusions 233a The heat dissipation area accelerates the heat dissipation speed of the flip chip 220, and the heat dissipation fins 250 strengthen the heat exchange rate of the contact surface between the top heat exchange part 234 and the outside world, so that the flip chip 220 can be maintained at a normal operating temperature and avoid excessive temperature. High, which reduces the working efficiency of the flip chip 200 .

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solution of the present invention.

Claims (16)

1. A cooling type flip-chip packaging structure, characterized in that it comprises: a substrate having an upper surface; a flip chip bonded to the upper surface of the substrate, the flip chip having a backside; and A heat sink is arranged on the back of the flip chip. The heat sink includes a heat dissipation case and a coolant. The heat dissipation case is a closed space. The heat dissipation case includes: A bottom heat exchanging part, attached to the back of the flip chip and including a plurality of heat dissipation protrusions in the enclosed space, these heat dissipation protrusions are integrally formed on the heat dissipation housing, and are conical or arc-shaped The hollow structure includes a heat conduction filler filled in the hollow area of the heat dissipation protrusions; a heat exchange section; and a coolant collection part, connected to the bottom heat exchange part and the top heat exchange part, for collecting the coolant; Wherein, when a heat dissipation cycle is performed in the heat dissipation housing, the coolant can flow to the heat dissipation protrusions and evaporate. 2. The heat-dissipating flip-chip package structure according to claim 1, wherein the heat-dissipating housing has an inclined surface in the enclosed space, which connects the bottom heat exchange part and the coolant collection part, so that the coolant capillary flows into the bottom heat exchange part. 3. The heat-dissipating flip-chip package structure according to claim 1, wherein the top heat exchanging portion of the heat-dissipating case is a fin-shaped structure. 4. The heat dissipation flip-chip package structure according to claim 1, further comprising a reinforcing member disposed on the upper surface of the substrate to support the heat sink and the substrate. 5. The heat dissipation flip chip package structure according to claim 1, further comprising a heat dissipation fin disposed on the top heat exchanging portion. 6. The heat-dissipating flip-chip package structure according to claim 1, further comprising a heat-dissipating adhesive thermally coupled to connect the back surface of the flip-chip with the bottom heat exchange portion of the heat-dissipating case. 7. The heat dissipation flip-chip package structure according to claim 1, further comprising a plurality of solder balls disposed on the lower surface of the substrate. 8. A heat-dissipating flip-chip package structure, characterized in that it comprises: a substrate having an upper surface; a flip chip bonded to the upper surface of the substrate, the flip chip having a backside; and A heat sink is arranged on the back of the flip chip. The heat sink includes a heat dissipation case and a coolant. The heat dissipation case is a closed space. The heat dissipation case includes: a bottom heat exchange part, which is attached to the back of the flip chip and includes a plurality of heat dissipation protrusions in the enclosed space; a heat exchange section; and a coolant collection part, connected to the bottom heat exchange part and the top heat exchange part, for collecting the coolant; Wherein, when a heat dissipation cycle is performed in the heat dissipation housing, the coolant can flow to the heat dissipation protrusions and evaporate; The heat dissipation housing has an inclined surface in the closed space, which connects the bottom heat exchanging part and the coolant collection part, so as to facilitate the capillary flow of the coolant into the bottom heat exchanging part. 9. The heat dissipation flip-chip package structure according to claim 8, wherein the heat dissipation protrusions are integrally formed on the heat dissipation housing. 10. The heat dissipation type flip chip package structure according to claim 8, wherein the heat dissipation protrusions are bonded to the bottom heat exchange portion by bonding or welding. 11. The heat-dissipating flip-chip package structure according to claim 8 or 9, wherein the heat-dissipating protrusions are conical or arc-shaped hollow structures and include a heat-conducting filler, which is filled in the The hollow area of some heat dissipation bosses. 12. The heat-dissipating flip-chip package structure according to claim 8, wherein the top heat exchanging portion of the heat-dissipating housing is a fin-shaped structure. 13. The heat dissipation flip-chip package structure according to claim 8, further comprising a reinforcing member disposed on the upper surface of the substrate to support the heat sink and the substrate. 14. The heat dissipation flip chip package structure according to claim 8, further comprising a heat dissipation fin disposed on the top heat exchanging portion. 15. The heat-dissipating flip-chip package structure according to claim 8, further comprising a heat-dissipating adhesive thermally coupled to connect the back surface of the flip-chip with the bottom heat exchange portion of the heat-dissipating case. 16. The heat dissipation flip chip package structure according to claim 8, further comprising a plurality of solder balls disposed on the lower surface of the substrate.

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