CN100424512C - Modular high-frequency probe card - Google Patents

Abstract

The invention relates to a modular high-frequency probe card, which mainly comprises a probe panel, a circuit carrier and an interface panel between the probe panel and the circuit carrier, the probing panel has a plurality of receiving cavities on the back surface thereof, a plurality of decoupling elements are embedded in the receiving cavities and are connected to the power/ground circuit of the probing panel by a bypass, the interface board has a plurality of terminals on the covering surface, the covering surface covers the back of the touch panel, and part of the terminals are connected to the decoupling elements, to be connected to the grounding layer of the circuit carrier board, so as to form the decoupling element inside the probe card under the condition of low module cost for filtering the noise transmitted by the internal circuit of the probe card, and the touch panel does not need to be internally provided with a capacitor, and the cost required by the touch panel is not increased, so that the touch panel is more practical.

Description

Modular high-frequency detection card

technical field

The invention relates to a detection card for integrated circuit testing equipment, in particular to a modular high-frequency detection card.

Background technique

Integrated circuits are developing toward high frequency and high density. The existing conventional integrated circuit testing equipment is equipped with a probe card. The conventional conventional technology can only test one integrated circuit product in one detection operation. Such as the chip in the wafer, the tape or the chip package on the substrate, in order to improve the test speed, the probe card should be designed with dense and complex circuits, which can probe multiple integrated circuit products in one detection operation. During the test process, Increasingly sensitive to electromagnetic interference, it is impossible to know the quality of integrated circuit products, resulting in test inaccuracy and low test efficiency.

U.S. Patent No. 5,491,426 discloses a combination structure of a probe card. A plurality of cantilever probes are fixed on the lower surface of a probe card, and a decoupling device (decoupling apparatus) is installed on the upper surface of a probe card and positioned on a probe card. In the hole of the load board to eliminate the noise caused by electromagnetic wave interference, but it can only filter the noise generated by the connecting cable between the test equipment and the probe card, because the noise generated by the probe card itself will be Cannot be filtered by this decoupler, has limited effect and only works with probe cards of older cantilever probes.

The Taiwan patent announcement No. 586627 of the original applicant "A probe head that can eliminate noise" discloses a probe head that can be combined with a probe card. A grounded conductive layer is formed inside the probe head. Between the ground conductive layer and the connection pads below the plurality of probe terminals is a dielectric layer with an appropriate interval to form an internal bypass capacitor (internal bypass capacitor), which can filter impurities closer to the probe terminals. As a built-in decoupling component, however, because the existing known probe head (or touch panel) is a high-density multilayer ceramic circuit board, it needs to be implanted The type probe end has a low manufacturing yield and a relatively high unit price. If a dielectric layer with a built-in bypass capacitor needs to be made inside the probe head, the circuit process of the general ceramic substrate will not be different due to its different materials and processes. It is easy to manufacture and shape, thereby increasing the cost of the probe head.

It can be seen that the above-mentioned existing probe cards obviously still have inconveniences and defects in structure and use, and need to be further improved urgently. In order to solve the problems existing in the probe cards, relevant manufacturers have tried their best to find a solution. However, no suitable design has been developed for a long time, and general products do not have a suitable structure to solve the above problems. This is obviously a problem that the relevant industry is eager to solve. Therefore, how to create a modularization of a new structure The high-frequency detection card has become the goal that the current industry needs to improve.

In view of the defects in the above-mentioned existing probe cards, the inventor actively researches and innovates based on years of rich practical experience and professional knowledge in the design and manufacture of such products, and cooperates with the application of academic theories, in order to create a new structure of the module. The grouped high-frequency detection card can improve the general existing detection card and make it more practical. After continuous research, design, and repeated trial and improvement, the invention with real practical value is finally created .

Contents of the invention

The purpose of the present invention is to overcome the defects of the existing detection card and provide a modular high-frequency detection card with a new structure. The technical problem to be solved is to make it mainly include a detection panel and a circuit carrier board. and an interface board between the probe panel and the circuit carrier. The probe panel has a plurality of accommodation holes on its back side, and a plurality of decoupling components are buried in the accommodation holes and beside The circuit is connected to the power/ground line of the touch panel, the interface board has a plurality of conductive terminals on the cover surface, the cover surface covers the back of the touch panel, and part of the conductive terminals are connected to the Some decoupling components are used to lead to the ground layer of the circuit carrier board, so as to achieve the condition of low module cost. The decoupling components are formed inside the probe card to filter the noise transmitted by the internal lines of the probe card, and the The touch panel does not require a built-in capacitor, and does not increase the cost of the touch panel (probing head), making it more practical.

The purpose of the present invention and its technical problems are achieved by adopting the following technical solutions. According to a modular high-frequency detection card proposed by the present invention, it includes: a detection panel, which has a front, a back and a plurality of a plurality of accommodating holes on the back; a plurality of probe ends, which are arranged on the front of the probe panel; a plurality of decoupling components, each decoupling component has a first electrode, and the decoupling components Components are buried in the accommodating holes and electrically connected to the probing ends of the part through the first electrodes; a circuit carrier board is used to connect to a test head of a test device; and an interface board is arranged on the Between the touch panel and the circuit carrier, the interface board has a cover surface and a plurality of first lead terminals on the cover surface, the cover surface covers the back of the touch panel, and part of the first The leads are connected to these decoupling components.

The purpose of the present invention and its technical problem can also be further realized by adopting the following technical measures.

In the aforementioned modularized high-frequency probe card, the circuit carrier board has a ground layer, and is electrically connected to the decoupling elements through the interface board.

The aforementioned modularized high-frequency detection card, wherein the interface board has a plurality of second conducting ends, which are formed on the other surface of the interface board corresponding to the covering surface, for conducting to the circuit board ground plane.

The aforementioned modularized high-frequency probe card, wherein the interface board or the probe board is a ceramic circuit board.

The aforementioned modularized high-frequency probe card, wherein the interface board and the probe board are selected from one of a glass substrate, a wafer, and a printed circuit board.

In the aforementioned modularized high-frequency detection card, the first conductive terminals are studbumps.

In the aforementioned modularized high-frequency detection card, the first connecting ends include dielectric elastic blocks, and the first connecting ends further include at least one metal layer surrounding the elastic blocks.

The aforementioned modularized high-frequency detection card further includes a combination kit for combining the detection panel and the interface board with the circuit carrier.

The aforementioned modular high-frequency detection card, wherein the detection panel includes a plurality of power/ground pads on the back, a plurality of bypass lines and a plurality of power/ground lines, and these power/ground lines are connected to The power/ground pads are connected to the corresponding power/ground probe terminals, and the bypass lines are tapped to the corresponding power/ground lines.

In the aforementioned modularized high-frequency detection card, the bypass lines include via holes.

In the aforementioned modular high-frequency detection card, each of the decoupling elements has a second electrode exposed on the back side of the detection panel for the electrical properties of the first conductive end of the interface panel. connect.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. It can be seen from the above technical solutions that the modularized high-frequency detection card of the present invention has at least the following advantages:

The present invention uses a plurality of decoupling components embedded in a plurality of accommodating cavities on the back of a touch panel and bypasses the power/ground lines connected to the touch panel, and an interface board covers the touch panel. On the back side, and the leading end of the interface board part is connected to the decoupling components, which can be connected to the ground layer of a circuit carrier board, so that the decoupling component is formed inside the probe card and closer to the probe card under the condition of low module cost. The plurality of probe terminals located on the front of the probe panel can effectively filter the noise transmitted by the internal circuit of the probe card, and the probe panel does not need built-in capacitors.

In the present invention, a ground layer of a circuit carrier can be electrically connected to a plurality of decoupling components inside a probe panel through an interface board, and can eliminate the internal noise of the modular high-frequency probe card.

To sum up, the modularized high-frequency detection card with special structure of the present invention has the above-mentioned many advantages and practical value, and no similar structural design has been published or used in similar products, so it is indeed an innovation. No matter in product structure or function, there are great improvements, great progress in technology, and produced easy-to-use and practical effects. Compared with the existing probe cards, it has a number of enhanced functions, so it is more suitable for For practicality, it is a novel, progressive and practical new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following special preferred embodiments, and with the accompanying drawings, are described in detail as follows.

Description of drawings

Fig. 1 is the first specific embodiment of the present invention, a schematic diagram of an exploded cross-section of components of a modular high-frequency detection card.

Fig. 2 is a second specific embodiment of the present invention, a schematic diagram of an exploded cross-section of components of a modular high-frequency detection card.

Fig. 3 is a second specific embodiment of the present invention, a schematic cross-sectional view of the interface panel of the modularized high-frequency detection card.

100: Modular high-frequency detection card 110: Detection panel

111: Front 112: Back

113: Storage hole 114: Power supply/grounding line

115: Bypass line 116: Signal transmission line

117: Power/ground pad 118: Signal pad

119: Notch 120: Probing end

130: decoupling element 131: first electrode

132: Second electrode 140: Circuit carrier

141: Ground layer 142: Inner connection pad

143: Line 144: External connection pad

150: interface panel 151: cover surface

152: Engagement surface 153: First lead-in end

154: Second guide terminal 160: Combination kit

161: Opening hole 162: Adjusting bolt

170: Guide pin 200: Modular high-frequency detection card

210: Touch panel 211: Front

212: Back side 213: Storage hole

214: Power/ground line 215: Bypass line

216: Signal transmission line 217: Power/ground pad

218: Signal pad 220: Probing end

230: decoupling element 231: first electrode

232: Second electrode 240: Circuit carrier

241: Ground plane 242: Inner connection pad

243: Line 244: External connection pad

250: interface panel 251: cover surface

252: Engagement surface 253: First lead-in end

253a: elastic block 253b: metal layer

254: Second guide terminal 254a: Elastic block

254b: Metal layer 255: Via hole

260: Combination kit 261: Hole opening

Detailed ways

In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and details of the modularized high-frequency detection card proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its effects are described in detail below.

Please refer to Fig. 1, which is the first specific embodiment of the present invention. This modular high-frequency detection card 100 mainly includes a detection panel 110, a plurality of decoupling components 130 (decouplingcomponent), and a circuit carrier board. 140 and an interface board 150, the probe panel 110 is used as the first electrical transmission substrate for probing the integrated circuit to be tested. In this embodiment, the probe panel 110 is a multilayer ceramic circuit with dense circuits In other embodiments, the probe panel 110 can be selected from one of glass substrates, wafers and printed circuit boards. The probe panel 110 has a front side 111, a back side 112 and a plurality of The accommodating cavities 113 of 112, preferably, these accommodating cavities 113 are arranged in a matrix, and the touch panel 110 includes a plurality of power/ground lines 114, a plurality of bypass lines 115 and a plurality of signal transmission lines 116, A plurality of power/ground pads 117 and a plurality of signal pads 118 are formed on the back surface 112 of the touch panel 110, and the power/ground lines 114 are connected to the power/ground pads 117 and the corresponding power/ground. The probe end 120, the bypass lines 115 are tapped to the corresponding power/ground lines 114, and the signal transmission lines 116 are connected to the signal pads 118 and the corresponding signal probe ends 120. Preferably, The lengths of the bypass lines 115 are shorter than the lengths of the corresponding power/ground lines 114, so that the decoupling elements 130 are closer to the corresponding power/ground probe terminals 120. In this embodiment, the The bypass lines 115 include via holes so that the decoupling elements 130 are vertically aligned with the power/ground probe terminals 120.

A plurality of probing ends 120 are arranged on the front surface 111 of the probing panel 110. In this embodiment, these probing ends 120 are elastic probes for contacting the electrode portion of the integrated circuit to be tested, such as the solder of the chip. Pads, bumps, or connection pads or solder balls of the substrate, these probe terminals 120 can be distinguished as power/ground probe terminals and signal probe terminals, so as to be electrically connected to the power/ground of the probe panel 110 respectively The line 114 and the signal transmission line 116. The decoupling elements 130 are embedded in the receiving holes 113, and the decoupling elements 130 can be selected from bypass capacitors, decoupling capacitors, and ultra-wideband One of the band filters, these decoupling elements 130 are independent components and can be composed of any material, and do not need to be built into the probe panel 110. Each decoupling element 130 has a first electrode 131 and a The second electrode 132, when the decoupling elements 130 are embedded in the receiving holes 113, the first electrode 131 is electrically connected to the part via the bypass lines 115 or/with the power/ground lines 114 The second electrodes 132 of the probe terminals 120 (ie power supply/ground probe terminals) are exposed on the back surface 112 of the probe panel 110.

The circuit carrier 140 is used to be connected to a test head (not shown in the figure) of a testing device. Generally, the circuit carrier 140 is a disc-shaped multilayer printed circuit board to carry the probe panel 110 and The interface board 150, the circuit carrier 140 has at least one ground layer 141, a plurality of internal connection pads 142 on its lower surface, a plurality of external connection pads 144 on its upper surface, and part of the internal connections are connected by lines 143 The pad 142 is connected to the ground layer 141. The interface board 150 is disposed between the probe panel 110 and the circuit carrier board 140. In this embodiment, the interface board 150 is a ceramic circuit with conductive lines. board, in other embodiments, the interface board 150 can be selected from one of glass substrates, wafers and printed circuit boards, the interface board 150 has a covering surface 151 and a corresponding bonding surface 152, the interface board The cover surface 151 of the interface plate 150 is aligned towards the touch panel 110. Preferably, the interface panel 150 is the same size as the touch panel 110, and the bonding surface 152 of the interface panel 150 is aligned towards a side of the circuit carrier 140. Predetermined positions, such as a plurality of first lead terminals 153 of the stud bump are formed on the cover surface 151 of the interface board 150, such as a plurality of second lead ends 154 of the stud bump Formed on the joint surface 152 of the interface board 150, after the modular combination, the cover surface 151 of the interface board 150 covers the back surface 112 of the probe panel 110, and some of the first conductive terminals 153 are connected to the The second electrodes 132 of the decoupling elements 130, the other first conductive terminals 153 are connected to the power/ground pads 117 and the plurality of signal pads 118 of the probe panel 110, and the second conductive terminals The terminals 154 are connected to the internal connection pads 142 of the circuit carrier 140, and some of them are electrically connected to the first conductive terminals 153 of the decoupling elements 130 via the internal connection pads 142 of the circuit carrier 140 and the circuit. 143 is electrically connected to the ground layer 141, and the second conductive ends 154 electrically connected to the power/ground pads 117 and signal pads 118 pass through the ground layer 141 and are electrically connected to the circuit The outer connection pad 144 of the carrier board 140.

The modularized high-frequency detection card 100 further includes a combination set 160 and a plurality of guide pins 170, the combination set 160 has an opening 161, which aligns with and exposes the front side 111 of the probe panel 110, the combination set 160 combines the probe panel 110 and the interface board 150 on the circuit carrier 140, and the guide pins 170 pass through the corner holes of the probe panel 110 and the corner holes of the interface board 150, preferably A notch 119 is formed around the front surface 111 of the probe panel 110 to facilitate the mating alignment of the joint kit 160. The joint kit 160 can be provided with a plurality of adjustment bolts 162 to finely adjust the X-Y of the probe panel 110. to the position.

Therefore, with the above-mentioned modularized high-frequency detection card 100, the decoupling elements 130 can be embedded in the detection panel 110 and covered and protected by the interface board 150, and can be electrically connected to The ground layer 141 of the circuit carrier 140 is used to eliminate the noise generated by the internal circuit of the probe card 100, and there is no need to build capacitors in the probe panel 110, so that high-frequency modularization can be achieved at the manufacturing cost of the general probe panel. effect.

Please refer to FIG. 2 , which is the second specific embodiment of the present invention. This modular high-frequency detection card 200 mainly includes a detection panel 210, a plurality of decoupling elements 230, a circuit carrier 240 and an interposer. Panel 250, the probe panel 210 has a front side 211, a back side 212 and a plurality of accommodating holes 213 on the back side 212, the probe panel 210 includes a plurality of power/ground lines 214, a plurality of bypass lines 215 and A plurality of signal transmission lines 216, a plurality of power/ground pads 217 and a plurality of signal pads 218 are formed on the back 212 of the touch panel 210, and the power/ground lines 214 are connected to the power/ground pads 217 and the corresponding power/ground probe terminal 220, the bypass lines 215 are connected to the corresponding power/ground lines 214, and the signal transmission lines 216 are connected to the signal pads 218 and the corresponding signal probes Terminal 220. Preferably, the lengths of the bypass lines 215 are shorter than the lengths of the corresponding power/ground lines 214, so that the decoupling elements 230 are closer to the corresponding power/ground probe terminals 220.

A plurality of probe ends 220 are arranged on the front surface 211 of the probe panel 210. In this embodiment, these probe ends 220 are conductive bumps, but these probe ends 220 can also be micro-electromechanical probes, The probe terminals 220 can be distinguished as power/ground probe terminals and signal probe terminals to be electrically connected to the power/ground circuit 214 and the signal transmission circuit 216 of the probe panel 210 respectively. The decoupling elements 230 are embedded in the receiving holes 213, these decoupling elements 230 are independent elements, and do not need to be built into the probe panel 210, each decoupling element 230 has a first electrode 231 and a second electrode 232 , when the decoupling elements 230 are buried in the receiving holes 213, the first electrodes 231 are electrically connected to some of the probe terminals 220 via the bypass lines 215 or with the power/ground lines 214 (i.e. power/ground probe end), its second electrode 232 is exposed on the back side 212 of the probe panel 210.

Please refer to FIG. 2, the circuit carrier 240 is used to be connected to a test head (not shown) of a testing device to carry the probe panel 210 and the interface board 250, the circuit carrier 240 has at least one The ground layer 241, a plurality of internal connection pads 242 on its lower surface, a plurality of external connection pads 244 on its upper surface, and part of the internal connection pads 242 are connected to the ground layer 241 with lines 243. The interface board 250 Located between the probe panel 210 and the circuit carrier 240, please refer to FIG. 3, in this embodiment, the interface board 250 is a ceramic circuit board with a via hole 255, the interface board 250 has a cover surface 251 and a corresponding bonding surface 252, the cover surface 151 of the interface board 150 is aligned towards the probe panel 210, the bonding surface 252 of the interface plate 250 is aligned towards a predetermined position of the circuit carrier 240 position, a plurality of first conducting ends 253 are formed on the covering surface 251 of the interface board 250, and a plurality of second conducting ends 254 are formed on the bonding surface 252 of the interface board 250, and are electrically connected to the The first lead ends 253 and the second lead ends 254. In this embodiment, each first lead end 253 includes a dielectric elastic block 253a and at least one metal layer surrounding the elastic block 253a. 253b, and similarly, each second lead terminal 254 includes a dielectric elastic block 254a and at least one metal layer 254b surrounding the elastic block 254a, after the modular combination, the cover surface 251 of the interface plate 250 covers The back surface 212 of the probe panel 210, wherein some of the first conductive terminals 253 are connected to the second electrodes 232 of the decoupling elements 230, and other first conductive terminals 253 are connected to the probe panel. The power/ground pads 217 and a plurality of signal pads 218 of 210, the second conductive terminals 254 are connected to the internal connection pads 242 of the circuit carrier 240, some of which are electrically connected to the decoupling elements The second conductive terminals 254 of 230 are electrically connected to the ground layer 241 through the internal connection pads 242 and the lines 243 of the circuit carrier 240, while the other are electrically connected to the power/ground pads 217 and signal terminals. The second conductive ends 254 of the pads 218 are electrically connected to the external connection pads 244 of the circuit carrier 240 through the ground layer 241.

In addition, the modularized high-frequency detection card 200 may further include a combination kit 260 , the opening 261 of the combination kit 260 is aligned with and exposes the front side 211 of the probe panel 210 , and the combination kit 260 is combined with the probe panel 210 and the interface board 250 on the circuit carrier board 240.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made by the technical essence of the above embodiments still belong to the scope of the technical solutions of the present invention.

Claims (11)

1. A modular high-frequency detection card, characterized in that it comprises: A touch panel, which has a front side, a back side and a plurality of receiving holes on the back side; A plurality of probe ends, which are arranged on the front of the probe panel; a plurality of decoupling elements, each decoupling element has a first electrode, and the decoupling elements are embedded in the accommodation holes and pass through the first electrodes. an electrode is electrically connected to the probe ends of the part; a circuit carrier for bonding to a test head of a test equipment; and An interface board, which is arranged between the touch detection panel and the circuit carrier board, the interface board has a cover surface and a plurality of first lead terminals on the cover surface, the cover surface covers the back of the touch detection panel, And part of the first conducting ends are connected to the decoupling elements. 2. The modular high-frequency detection card according to claim 1, wherein the circuit carrier board has a ground layer, which is electrically connected to the decoupling elements through the interface board. 3. The modularized high-frequency detection card according to claim 2, wherein said interface board has a plurality of second conductive terminals formed on the other surface of the interface board corresponding to the cover surface , for connection to the ground plane of the board. 4. The modularized high-frequency probe card according to claim 1, wherein said interface board or probe board is a ceramic circuit board. 5. The modular high-frequency probe card according to claim 1, wherein the interface panel and the probe panel are selected from one of a glass substrate, a wafer, and a printed circuit board. 6. The modularized high-frequency detection card according to claim 1, wherein the first conductive terminals are wiring bumps. 7. The modular high-frequency detection card according to claim 1, wherein the first connecting ends comprise dielectric elastic blocks, and the first connecting ends further include at least one The metal layer of these elastic blocks. 8. The modularized high-frequency detection card according to claim 1, further comprising a combination kit for combining the detection panel and the interface board with the circuit carrier. 9. The modular high-frequency detection card according to claim 1, wherein said detection panel includes a plurality of power/ground pads on the back side, a plurality of bypass lines and a plurality of power/ground pads. The ground lines, the power/ground lines are connected to the power/ground pads and the corresponding power/ground probe ends, and the bypass lines are tapped to the corresponding power/ground lines. 10. The modularized high-frequency detection card according to claim 9, wherein the bypass lines include via holes. 11. The modular high-frequency detection card according to claim 1, wherein each decoupling element has a second electrode exposed on the back side of the detection panel for the The electrical connection of the first conducting end of the interface board.

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