CN100411196C - 受光或发光用半导体装置 - Google Patents
受光或发光用半导体装置 Download PDFInfo
- Publication number
- CN100411196C CN100411196C CNB018239005A CN01823900A CN100411196C CN 100411196 C CN100411196 C CN 100411196C CN B018239005 A CNB018239005 A CN B018239005A CN 01823900 A CN01823900 A CN 01823900A CN 100411196 C CN100411196 C CN 100411196C
- Authority
- CN
- China
- Prior art keywords
- light
- spherical
- semiconductor device
- solar
- solar cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/148—Shapes of potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
- H10F77/315—Coatings for devices having potential barriers for photovoltaic cells the coatings being antireflective or having enhancing optical properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/488—Reflecting light-concentrating means, e.g. parabolic mirrors or concentrators using total internal reflection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/93—Interconnections
- H10F77/933—Interconnections for devices having potential barriers
- H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1017—Shape being a sphere
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2001/011416 WO2003056633A1 (en) | 2001-12-25 | 2001-12-25 | Light receiving or emitting semiconductor apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1582502A CN1582502A (zh) | 2005-02-16 |
CN100411196C true CN100411196C (zh) | 2008-08-13 |
Family
ID=11738072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018239005A Expired - Fee Related CN100411196C (zh) | 2001-12-25 | 2002-12-25 | 受光或发光用半导体装置 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7109528B2 (zh) |
EP (2) | EP1717867B1 (zh) |
JP (1) | JP3899073B2 (zh) |
KR (1) | KR100633519B1 (zh) |
CN (1) | CN100411196C (zh) |
AU (1) | AU2002217500B2 (zh) |
CA (1) | CA2469002C (zh) |
DE (2) | DE60132722T2 (zh) |
TW (1) | TW519769B (zh) |
WO (1) | WO2003056633A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102931307A (zh) * | 2012-11-06 | 2013-02-13 | 华东理工大学 | 一种led器件 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4113118B2 (ja) * | 2001-08-13 | 2008-07-09 | 仗祐 中田 | 半導体デバイス及びその製造方法 |
EP1427026A4 (en) * | 2001-08-13 | 2006-12-20 | Kyosemi Corp | LIGHT EMITTING SEMICONDUCTOR MODULE OR LIGHT RECEIVER AND METHOD FOR MANUFACTURING SAME |
WO2003036731A1 (fr) * | 2001-10-19 | 2003-05-01 | Josuke Nakata | Module a semi-conducteur emetteur ou recepteur de lumiere et son procede de fabrication |
JP3902210B2 (ja) * | 2002-05-02 | 2007-04-04 | 仗祐 中田 | 受光又は発光用パネルおよびその製造方法 |
JP3848210B2 (ja) * | 2002-05-29 | 2006-11-22 | キヤノン株式会社 | 電子回路基板 |
EP1553638B1 (en) * | 2002-06-21 | 2008-12-10 | Kyosemi Corporation | Light receiving or light emitting device and its production method |
US7387400B2 (en) * | 2003-04-21 | 2008-06-17 | Kyosemi Corporation | Light-emitting device with spherical photoelectric converting element |
ATE406607T1 (de) | 2003-06-09 | 2008-09-15 | Kyosemi Corp | Generatorsystem |
JP4437657B2 (ja) * | 2003-10-03 | 2010-03-24 | 富士機械製造株式会社 | 光発電パネルの製造方法 |
CN1771608A (zh) * | 2003-10-24 | 2006-05-10 | 京半导体股份有限公司 | 受光或发光模块板及其制造方法 |
DE102005033005A1 (de) * | 2005-07-14 | 2007-01-18 | Osram Opto Semiconductors Gmbh | Optoelektronischer Chip |
CA2654941C (en) | 2006-07-04 | 2013-01-08 | Kyosemi Corporation | Panel-shaped semiconductor module |
CA2656080C (en) | 2006-07-07 | 2012-12-04 | Kyosemi Corporation | Panel-shaped semiconductor module |
EP1950873A1 (en) * | 2007-01-29 | 2008-07-30 | Tendris Holding BV | Apparatus comprising low voltage power source |
CN101355112B (zh) * | 2007-07-25 | 2011-05-04 | 海德威电子工业股份有限公司 | 具有球面透镜的太阳能系统 |
JP4985879B2 (ja) * | 2010-06-08 | 2012-07-25 | Dic株式会社 | 表面に微細な凹凸を有する成形体及びその製造方法 |
KR101262501B1 (ko) * | 2011-04-04 | 2013-05-08 | 엘지이노텍 주식회사 | 태양전지 및 이의 제조방법 |
DE102012102647B4 (de) * | 2012-03-27 | 2024-02-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Konverterelement, optoelektronisches Bauelement mit einem derartigen Konverterelement und Verfahren zum Herstellen eines derartigen Konverterelements |
KR101325572B1 (ko) * | 2012-05-09 | 2013-11-05 | 이성규 | Pcb를 이용한 태양전지 |
WO2014012111A1 (en) * | 2012-07-13 | 2014-01-16 | Triton Systems, Inc. | Nanostring mats, multi-junction devices, and methods for making same |
US8704448B2 (en) | 2012-09-06 | 2014-04-22 | Cooledge Lighting Inc. | Wiring boards for array-based electronic devices |
US8947001B2 (en) * | 2012-09-06 | 2015-02-03 | Cooledge Lighting Inc. | Wiring boards for array-based electronic devices |
US9506633B2 (en) | 2012-09-06 | 2016-11-29 | Cooledge Lighting Inc. | Sealed and sealable lighting systems incorporating flexible light sheets and related methods |
US9525097B2 (en) * | 2013-03-15 | 2016-12-20 | Nthdegree Technologies Worldwide Inc. | Photovoltaic module having printed PV cells connected in series by printed conductors |
US9666733B2 (en) | 2013-09-04 | 2017-05-30 | Hyeon Woo AHN | Solar cell using printed circuit board |
JP6496898B2 (ja) * | 2014-07-02 | 2019-04-10 | アドバンストマテリアルテクノロジーズ株式会社 | 電子部品の製造方法 |
CN104917449B (zh) * | 2015-06-12 | 2017-03-08 | 陈惠远 | 一种柔性太阳能电池组件 |
TWI590433B (zh) * | 2015-10-12 | 2017-07-01 | 財團法人工業技術研究院 | 發光元件以及顯示器的製作方法 |
JP2017175488A (ja) * | 2016-03-25 | 2017-09-28 | 京セラ株式会社 | 携帯機器、携帯機器の制御方法、携帯機器の制御装置および制御プログラム |
US10790426B2 (en) * | 2016-04-01 | 2020-09-29 | Nichia Corporation | Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member |
JP6664848B2 (ja) * | 2016-12-26 | 2020-03-13 | 東芝三菱電機産業システム株式会社 | 光デバイス装置 |
KR102559514B1 (ko) * | 2018-04-13 | 2023-07-27 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2021189775A1 (zh) * | 2020-03-23 | 2021-09-30 | 重庆康佳光电技术研究院有限公司 | 球形微型led及其制造方法、显示面板及其转移方法 |
CN111540819B (zh) | 2020-03-23 | 2025-02-14 | 重庆康佳光电科技有限公司 | 一种球形led芯片及其制造方法、显示面板 |
CN113707787B (zh) * | 2020-05-22 | 2023-07-18 | 重庆康佳光电技术研究院有限公司 | 球形倒装微型led及其制造方法、显示面板 |
EP4376096A1 (en) * | 2022-11-24 | 2024-05-29 | Fei Jiang | Wrapped photovoltaic cell and photovoltaic module |
CN115911219B (zh) * | 2023-01-06 | 2023-05-26 | 惠科股份有限公司 | 球形发光芯片及其制备方法、显示装置 |
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JPH09162434A (ja) * | 1995-12-05 | 1997-06-20 | Hitachi Ltd | 太陽電池およびその製造方法 |
CN1194727A (zh) * | 1996-10-09 | 1998-09-30 | 中田仗祐 | 半导体器件 |
CN1234911A (zh) * | 1997-08-27 | 1999-11-10 | 中田仗祐 | 球状半导体器件及其制造方法和球状半导体器件材料 |
JP2000022184A (ja) * | 1998-07-03 | 2000-01-21 | Nippon Telegr & Teleph Corp <Ntt> | 球状または棒状結晶太陽電池およびその製造方法 |
JP2001022184A (ja) * | 1999-07-02 | 2001-01-26 | Kyocera Corp | 現像装置 |
JP2001210843A (ja) * | 1999-11-17 | 2001-08-03 | Fuji Mach Mfg Co Ltd | 光発電パネルおよびその製造方法 |
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JP4276758B2 (ja) | 1999-12-09 | 2009-06-10 | 仗祐 中田 | 球状半導体素子を用いた発電装置および球状半導体素子を用いた発光装置 |
JP2001177132A (ja) * | 1999-12-16 | 2001-06-29 | Mitsui High Tec Inc | 球体の切断方法、これを用いた太陽電池およびその製造方法 |
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-
2001
- 2001-12-25 EP EP06013105A patent/EP1717867B1/en not_active Expired - Lifetime
- 2001-12-25 JP JP2003557049A patent/JP3899073B2/ja not_active Expired - Lifetime
- 2001-12-25 CA CA002469002A patent/CA2469002C/en not_active Expired - Fee Related
- 2001-12-25 DE DE60132722T patent/DE60132722T2/de not_active Expired - Lifetime
- 2001-12-25 AU AU2002217500A patent/AU2002217500B2/en not_active Ceased
- 2001-12-25 US US10/497,324 patent/US7109528B2/en not_active Expired - Lifetime
- 2001-12-25 WO PCT/JP2001/011416 patent/WO2003056633A1/ja active IP Right Grant
- 2001-12-25 EP EP01275105A patent/EP1467413B1/en not_active Expired - Lifetime
- 2001-12-25 KR KR1020047008889A patent/KR100633519B1/ko not_active Expired - Fee Related
- 2001-12-25 DE DE60129481T patent/DE60129481T2/de not_active Expired - Lifetime
-
2002
- 2002-01-17 TW TW091100844A patent/TW519769B/zh not_active IP Right Cessation
- 2002-12-25 CN CNB018239005A patent/CN100411196C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09162434A (ja) * | 1995-12-05 | 1997-06-20 | Hitachi Ltd | 太陽電池およびその製造方法 |
CN1194727A (zh) * | 1996-10-09 | 1998-09-30 | 中田仗祐 | 半导体器件 |
CN1234911A (zh) * | 1997-08-27 | 1999-11-10 | 中田仗祐 | 球状半导体器件及其制造方法和球状半导体器件材料 |
JP2000022184A (ja) * | 1998-07-03 | 2000-01-21 | Nippon Telegr & Teleph Corp <Ntt> | 球状または棒状結晶太陽電池およびその製造方法 |
JP2001022184A (ja) * | 1999-07-02 | 2001-01-26 | Kyocera Corp | 現像装置 |
JP2001210843A (ja) * | 1999-11-17 | 2001-08-03 | Fuji Mach Mfg Co Ltd | 光発電パネルおよびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102931307A (zh) * | 2012-11-06 | 2013-02-13 | 华东理工大学 | 一种led器件 |
CN102931307B (zh) * | 2012-11-06 | 2016-02-24 | 华东理工大学 | 一种led器件 |
Also Published As
Publication number | Publication date |
---|---|
JP3899073B2 (ja) | 2007-03-28 |
DE60132722T2 (de) | 2009-01-29 |
US20050121683A1 (en) | 2005-06-09 |
DE60129481T2 (de) | 2008-04-17 |
US7109528B2 (en) | 2006-09-19 |
KR100633519B1 (ko) | 2006-10-13 |
JPWO2003056633A1 (ja) | 2005-05-12 |
EP1467413A1 (en) | 2004-10-13 |
DE60132722D1 (de) | 2008-03-20 |
EP1717867B1 (en) | 2008-02-06 |
CN1582502A (zh) | 2005-02-16 |
EP1717867A2 (en) | 2006-11-02 |
KR20040064300A (ko) | 2004-07-16 |
CA2469002C (en) | 2009-01-13 |
DE60129481D1 (de) | 2007-08-30 |
EP1467413B1 (en) | 2007-07-18 |
EP1717867A3 (en) | 2007-02-28 |
WO2003056633A1 (en) | 2003-07-10 |
HK1091322A1 (zh) | 2007-01-12 |
CA2469002A1 (en) | 2003-07-10 |
AU2002217500B2 (en) | 2005-10-06 |
EP1467413A4 (en) | 2005-01-19 |
AU2002217500A1 (en) | 2003-07-15 |
TW519769B (en) | 2003-02-01 |
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