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CN100405036C - Method for testing and adjusting optical assembly - Google Patents

Method for testing and adjusting optical assembly Download PDF

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Publication number
CN100405036C
CN100405036C CNB2005100650871A CN200510065087A CN100405036C CN 100405036 C CN100405036 C CN 100405036C CN B2005100650871 A CNB2005100650871 A CN B2005100650871A CN 200510065087 A CN200510065087 A CN 200510065087A CN 100405036 C CN100405036 C CN 100405036C
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lens
test
circuit board
optical
adjustment
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CN1844874A (en
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奚国元
萧纪南
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Microjet Technology Co Ltd
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Microjet Technology Co Ltd
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Abstract

The invention relates to a method for testing and adjusting an optical component, which comprises the following steps: detecting the position of the central point of the optical sensor and the position of the central point of the lens; (b) aligning the optical sensor with the center point of the lens and fixing the lens mount on the second circuit board; (c) placing the optical assembly on a moving platform of a testing device; (d) moving the moving platform to align the optical assembly with the central point of a test chart of the test device; (f) performing image test and analysis; (g) clamping the lens in the lens mount by a focusing tool of the testing device, and adjusting the focal range of the lens according to the image testing result; and (h) fixing the focal length of the lens to complete the testing and adjustment of the optical assembly. The invention can improve the test accuracy and the image quality of the optical component, avoid the problem of test misjudgment caused by shaking the optical component during moving, and improve the test and adjustment efficiency of the optical component.

Description

光学组件的测试与调整方法 Optical components testing and adjustment methods

技术领域technical field

本发明有关一种测试与调整方法,尤指一种光学组件的测试与调整方法。The invention relates to a testing and adjusting method, in particular to a testing and adjusting method of an optical component.

背景技术Background technique

影像撷取装置的原理是利用光线照射于欲撷取影像的物体上,于光线反射回来后由影像撷取装置内的光学组件接收,并将光学信号转换为模拟信号,最后再转换为可以显示、编辑、储存和输出的数字信号格式,以借由显示装置显示或打印装置打印。The principle of the image capture device is to use light to shine on the object to capture the image, and after the light is reflected back, it is received by the optical components in the image capture device, and the optical signal is converted into an analog signal, and finally converted into a displayable , edited, stored and output digital signal format to be displayed by a display device or printed by a printing device.

图1是影像撷取装置的光学组件结构分解图。光学组件1主要包含有第一电路板10、光传感器11、镜头座12、透镜13以及第二电路板14,其中第一电路板10的顶面布设有各种不同的电子元件101。光传感器11为电耦合元件(CCD)、互补式金属氧化半导体传感器(CMOS sencor)或是其他感光元件等。光传感器11的侧边设有复数个接触端子111,接触端子111可电连结于第一电路板10的孔洞102。镜头座12是由矩形框架121及从框架121向上延伸的圆筒形环架122所构成,此环架122可供透镜13设置于其内部。框架121与环架122的相隔处形成有一间隔板123,于间隔板123的中心处设有一贯穿孔124。于框架121内部设有一容置室125,此容置室125可容收设置于第一电路板10上的电子元件101及光传感器11,且框架121的底面积与第一电路板10的面积基本相等。框架121另延伸有复数个定位脚126,而第二电路板14则设有复数个对应的定位孔141,于框架121的定位脚126固设于第二电路板14的定位孔141后,可使镜头座12与透镜13的组合固定于第二电路板14上,以组成光学组件1。FIG. 1 is an exploded view of an optical component structure of an image capture device. The optical assembly 1 mainly includes a first circuit board 10 , an optical sensor 11 , a lens holder 12 , a lens 13 and a second circuit board 14 , wherein various electronic components 101 are arranged on the top surface of the first circuit board 10 . The light sensor 11 is a charge coupled device (CCD), a complementary metal oxide semiconductor sensor (CMOS sencor) or other photosensitive elements. The side of the light sensor 11 is provided with a plurality of contact terminals 111 , and the contact terminals 111 can be electrically connected to the holes 102 of the first circuit board 10 . The lens holder 12 is composed of a rectangular frame 121 and a cylindrical ring frame 122 extending upward from the frame 121 , and the ring frame 122 can accommodate the lens 13 inside it. A spacer plate 123 is formed between the frame 121 and the ring frame 122 , and a through hole 124 is defined at the center of the spacer plate 123 . An accommodating chamber 125 is provided inside the frame 121, and the accommodating chamber 125 can accommodate the electronic components 101 and the light sensor 11 arranged on the first circuit board 10, and the bottom area of the frame 121 is the same as the area of the first circuit board 10 Basically equal. The frame 121 is extended with a plurality of positioning pins 126, and the second circuit board 14 is provided with a plurality of corresponding positioning holes 141. After the positioning pins 126 of the frame 121 are fixed in the positioning holes 141 of the second circuit board 14, The combination of the lens holder 12 and the lens 13 is fixed on the second circuit board 14 to form the optical assembly 1 .

由于光学组件1为影像撷取装置中决定撷取影像品质的重要关键,因此对于光学组件1皆会进行多项的测试与调整,例如电气测试、模量传递函数(ModulationTransfer Function,MTF)测试与焦距调整、影像品质测试等,以确保光学组件1的影像品质。图2是以传统方式进行光学组件的模量传递函数(ModulationTransfer Function,MTF)测试与焦距调整的方法流程图。如图2所示,当进行光学组件1的模量传递函数(Modulation Transfer Function,MTF)测试与焦距调整时,首先将组装后的光学组件1放置于模量传递函数(MTF)测试仪器中,如步骤S11。然后,将光学组件1移至一测试图(Test chart)下方,如步骤S12。接着,以光学组件1撷取测试图的影像,并进行光学组件1的MTF分析。之后,依据取得的数据与图表判断光学组件1的影像品质是否正常,如步骤S14。如判断光学组件1的影像品质不正常时,则依步骤S15,拆解光学组件、调整焦距或替换光学元件,然后重复进行先前的测试。如判断光学组件1的影像品质正常,则续行后续的测试与调整程序,如步骤S16。Since the optical component 1 is an important key to determine the quality of captured images in the image capture device, multiple tests and adjustments will be performed on the optical component 1, such as electrical tests, modulus transfer function (Modulation Transfer Function, MTF) tests and Focus adjustment, image quality test, etc., to ensure the image quality of the optical component 1 . FIG. 2 is a flow chart of a method for performing modulus transfer function (Modulation Transfer Function, MTF) testing and focal length adjustment of an optical component in a conventional manner. As shown in Figure 2, when carrying out the modulus transfer function (Modulation Transfer Function, MTF) test and focus adjustment of the optical component 1, first the optical component 1 after the assembly is placed in the modulus transfer function (MTF) testing instrument, Such as step S11. Then, the optical assembly 1 is moved under a test chart (Test chart), as in step S12. Then, the optical component 1 is used to capture the image of the test pattern, and the MTF analysis of the optical component 1 is performed. Afterwards, it is judged whether the image quality of the optical component 1 is normal according to the acquired data and graph, as in step S14. If it is judged that the image quality of the optical component 1 is not normal, the optical component is disassembled, the focal length is adjusted or the optical component is replaced according to step S15, and then the previous test is repeated. If it is judged that the image quality of the optical component 1 is normal, the subsequent testing and adjustment procedure is continued, such as step S16.

然而,由于现今的光传感器11是以表面贴装技术(SMT)设置于第一电路板10上,因此光传感器11的中心点会因表面贴装技术以及镜头座12的零件外形关系使其与透镜13的中心点产生偏移或无法对位,而影响光学组件1的测试精准度以及影像品质。再者,光学组件1是以第二电路板14上的定位孔141与镜头座12的定位脚126定位,因此光传感器11与镜头座12上的透镜13,亦容易因公差因素,影响测试精准度以及影像撷取的品质。此外,于移动光学组件1进行测试时,会因移动时震颤到该光学组件1,而产生测试误判影响产品品质。再则,传统的测试方式与设备无法直接依据测试结果调整镜头13的焦距范围,造成测试与调整的不便。However, since the current optical sensor 11 is arranged on the first circuit board 10 with surface mount technology (SMT), the central point of the optical sensor 11 will be different from the surface mount technology and the external shape of the lens holder 12. The center point of the lens 13 is shifted or out of alignment, which affects the test accuracy and image quality of the optical component 1 . Furthermore, the optical component 1 is positioned by the positioning hole 141 on the second circuit board 14 and the positioning foot 126 of the lens holder 12, so the optical sensor 11 and the lens 13 on the lens holder 12 are also easily affected by tolerance factors and affect the accuracy of the test. and image capture quality. In addition, when the optical component 1 is moved for testing, the optical component 1 will vibrate during the movement, which will cause test misjudgment and affect product quality. Furthermore, traditional testing methods and equipment cannot directly adjust the focal length range of the lens 13 according to the test results, which causes inconvenience in testing and adjustment.

有鉴于上述习知技术的缺失,如何有效率地测试与调整光学组件,且亦可避免其他外在因素导致测试误判,实为目前相关从业者所迫切需要解决的问题。In view of the lack of the above-mentioned conventional technologies, how to efficiently test and adjust optical components and avoid misjudgments caused by other external factors is an urgent problem for relevant practitioners to solve.

发明内容Contents of the invention

本发明的主要目的在于提供一种光学组件的测试与调整方法,借以改善现有测试方法因光传感器的中心点会因表面贴装技术打印以及镜头座的零件外形关系产生公差因素,而影响光学组件的测试精准度以及影像品质。The main purpose of the present invention is to provide a test and adjustment method for optical components, so as to improve the existing test method. Because the center point of the optical sensor will be due to surface mount technology printing and the tolerance factors of the parts of the lens holder, which will affect the optics. Component test accuracy and image quality.

本发明的另一目的在于提供一种光学组件的测试方法,借以解决现有技术中于移动光学组件进行测试时,会因移动时震颤到该光学组件,而产生测试误判的问题。Another object of the present invention is to provide a testing method for an optical component, so as to solve the problem in the prior art that when the optical component is moved for testing, the optical component vibrates during the movement, resulting in test misjudgment.

为达上述目的,根据本发明一方面提供一种光学组件的测试与调整方法,其中该光学组件具有一镜头座、一透镜、一光传感器、一第一电路板以及一第二电路板,该光传感器设置于第一电路板上,该第一电路板设置于第二电路板上,该透镜设置于镜头座内。本发明的方法包括步骤:(a)检测光传感器的中心点位置以及透镜的中心点位置;(b)使光传感器与透镜的中心点位置对位,并固定镜头座于第二电路板上;(c)将光学组件置于一测试装置的移动平台;(d)移动该移动平台,使光学组件与测试装置的一测试图的中心点位置对位;(f)进行影像测试与分析;(g)以测试装置的一调焦用具夹持设置于镜头座内的透镜,并依据影像测试结果调整透镜的焦距范围;以及(h)固定透镜的焦距,以完成光学组件的测试与调整。To achieve the above object, according to one aspect of the present invention, a method for testing and adjusting an optical component is provided, wherein the optical component has a lens holder, a lens, a light sensor, a first circuit board and a second circuit board, the The light sensor is arranged on the first circuit board, the first circuit board is arranged on the second circuit board, and the lens is arranged in the lens seat. The method of the present invention comprises the steps of: (a) detecting the position of the center point of the optical sensor and the position of the center point of the lens; (b) aligning the position of the center point of the light sensor and the lens, and fixing the lens seat on the second circuit board; (c) placing the optical component on a mobile platform of a test device; (d) moving the mobile platform so that the optical component is aligned with the center point of a test chart of the test device; (f) performing image testing and analysis; ( g) Clamp the lens set in the lens holder with a focusing tool of the test device, and adjust the focal length range of the lens according to the image test result; and (h) fix the focal length of the lens to complete the test and adjustment of the optical component.

根据本发明的构想,其中光传感器为电耦合元件或互补式金属氧化半导体传感器。According to the idea of the present invention, the light sensor is an electrical coupling element or a complementary metal oxide semiconductor sensor.

根据本发明的构想,其中步骤(b)是借由黏胶固定镜头座于第二电路板。According to the concept of the present invention, the step (b) is to fix the lens mount on the second circuit board by glue.

根据本发明的构想,其中步骤(c)还包括步骤(c1)利用测试装置的一夹具,使光学组件与移动平台的一侧边靠紧。According to the idea of the present invention, the step (c) further includes the step (c1) using a fixture of the test device to make the optical component close to one side of the moving platform.

根据本发明的构想,其中测试装置为模量传递函数测试装置。According to the idea of the present invention, the testing device is a modulus transfer function testing device.

根据本发明的构想,其中步骤(f)为进行模量传递函数测试。According to the idea of the present invention, wherein step (f) is to carry out modulus transfer function test.

根据本发明的构想,其中步骤(h)是借由黏胶固定透镜于镜头座。According to the idea of the present invention, the step (h) is to fix the lens on the lens holder by glue.

为达上述目的,根据本发明另一方面提供一种光学组件调整焦距的测试方法,其中该光学组件具有一镜头座、一透镜、一光传感器、一第一电路板以及一第二电路板,该光传感器设置于第一电路板上,该第一电路板设置于第二电路板上,该透镜设置于镜头座内,该镜头座设置于第二电路板上。本发明的方法包括步骤:(a)将光学组件置于一测试装置的移动平台;(b)移动该移动平台,使光学组件与测试装置的一测试图的中心点位置对位;(c)进行影像测试与分析;(d)以测试装置的一调焦用具夹持设置于镜头座内的透镜,并依据影像测试结果调整透镜的焦距范围;以及(e)固定透镜的焦距,以完成光学组件的测试与调整。In order to achieve the above object, according to another aspect of the present invention, a method for testing the focal length of an optical component is provided, wherein the optical component has a lens holder, a lens, a light sensor, a first circuit board and a second circuit board, The light sensor is arranged on the first circuit board, the first circuit board is arranged on the second circuit board, the lens is arranged in the lens seat, and the lens seat is arranged on the second circuit board. The method of the present invention comprises the steps of: (a) placing the optical assembly on a mobile platform of a test device; (b) moving the mobile platform so that the optical assembly is in alignment with a center point of a test chart of the test device; (c) Carry out image testing and analysis; (d) clamp the lens set in the lens holder with a focusing device of the test device, and adjust the focal length range of the lens according to the image test result; and (e) fix the focal length of the lens to complete the optical Component testing and tuning.

附图说明Description of drawings

图1是影像撷取装置的光学组件结构分解图。FIG. 1 is an exploded view of an optical component structure of an image capture device.

图2是以传统方式进行光学组件的模量传递函数测试与焦距调整的方法流程图。FIG. 2 is a flow chart of a method for performing modulus transfer function testing and focal length adjustment of an optical component in a conventional manner.

图3是实施本发明光学组件测试与调整方法的一示范性光学组件结构分解图。FIG. 3 is an exploded view of an exemplary optical component structure implementing the method for testing and adjusting the optical component of the present invention.

图4是以本发明方式进行光学组件的模量传递函数测试与焦距调整的方法流程图。FIG. 4 is a flowchart of a method for testing the modulus transfer function and adjusting the focal length of the optical component in the manner of the present invention.

图5(a)~(c)是图4所示流程步骤的结构示意图。Figure 5(a)~(c) are schematic structural diagrams of the process steps shown in Figure 4.

具体实施方式Detailed ways

体现本发明特征与优点的一些典型实施例将在后段的说明中详细叙述。应理解的是本发明能够在不同的态样上具有各种的变化,其皆不脱离本发明的范围,且其中的说明及图示在本质上是当作说明之用,而非用以限制本发明。Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the invention is capable of various changes in different aspects without departing from the scope of the invention, and that the description and illustrations therein are illustrative in nature and not limiting. this invention.

请参阅图3,其是实施本发明光学组件测试与调整方法的一示范性光学组件结构分解图。该示范性的光学组件2主要包含有第一电路板20、光传感器21、镜头座22、透镜23以及第二电路板24,其中第一电路板20的顶面布设有各种不同的电子元件201。光传感器21为电耦合元件(CCD)、互补式金属氧化半导体传感器(CMOS sencor)或是其他感光元件等。光传感器21的侧边设有复数个接触端子211,接触端子211可电连结于第一电路板20的孔洞202。镜头座22是由矩形框架221及从框架221向上延伸的圆筒形环架222所构成,此环架222可供透镜23设置于其内部。框架221与环架222的相隔处形成有一间隔板223,于间隔板223的中心处设有一贯穿孔224。于框架221内部设有一容置室225,此容置室225可容收设置于第一电路板20上的电子元件201及光传感器21,且框架221的底面积与第一电路板20的面积基本相等。于框架221借由黏胶(未图示)固设于第二电路板24后,可使镜头座22与透镜23的组合固定于第二电路板24上,以组成光学组件2。Please refer to FIG. 3 , which is an exploded view of an exemplary optical component structure implementing the method for testing and adjusting the optical component of the present invention. The exemplary optical assembly 2 mainly includes a first circuit board 20, an optical sensor 21, a lens holder 22, a lens 23 and a second circuit board 24, wherein various electronic components are arranged on the top surface of the first circuit board 20. 201. The light sensor 21 is a charge coupled device (CCD), a complementary metal oxide semiconductor sensor (CMOS sencor) or other photosensitive elements. A plurality of contact terminals 211 are disposed on a side of the light sensor 21 , and the contact terminals 211 can be electrically connected to the holes 202 of the first circuit board 20 . The lens holder 22 is composed of a rectangular frame 221 and a cylindrical ring frame 222 extending upward from the frame 221 , and the ring frame 222 can accommodate the lens 23 inside it. A spacer plate 223 is formed between the frame 221 and the ring frame 222 , and a through hole 224 is defined at the center of the spacer plate 223 . Inside the frame 221, there is an accommodating chamber 225. This accommodating chamber 225 can accommodate the electronic components 201 and the light sensor 21 arranged on the first circuit board 20, and the bottom area of the frame 221 is the same as the area of the first circuit board 20. Basically equal. After the frame 221 is fixed on the second circuit board 24 by glue (not shown), the combination of the lens holder 22 and the lens 23 can be fixed on the second circuit board 24 to form the optical component 2 .

同样地,由于光学组件2为影像撷取装置中决定撷取影像品质的重要关键,因此对于光学组件2皆须进行多项的测试与调整,例如电气测试、模量传递函数(Modulation Transfer Function,MTF)测试与焦距调整、影像品质测试等,以确保光学组件2的影像品质。图4是以本发明方式进行光学组件的模量传递函数(Modulation Transfer Function,MTF)测试与焦距调整的方法流程图。如图4所示,当进行光学组件的模量传递函数(Modulation TransferFunction,MTF)测试与焦距调整时,首先进行步骤S21,检测光传感器21的中心点位置以及检测固设于镜头座22内的透镜23的中心点位置。然后,如图5(a)所示,将光传感器21以及固设于镜头座22内的透镜23的中心点位置对位,并以黏胶25将镜头座22定位于第二电路板24上,俾使光传感器21与透镜23精准对位。此步骤可以避免表面贴装技术设置光传感器21以及镜头座22外形尺寸造成公差影响,改善影像品质。Similarly, since the optical component 2 is an important key to determine the image quality of the image capture device, a number of tests and adjustments must be performed on the optical component 2, such as electrical testing, modulus transfer function (Modulation Transfer Function, MTF) test, focus adjustment, image quality test, etc., to ensure the image quality of the optical component 2. Fig. 4 is the flow chart of the method for testing the modulus transfer function (Modulation Transfer Function, MTF) of the optical component and adjusting the focal length in the present invention. As shown in Figure 4, when performing the modulus transfer function (Modulation Transfer Function, MTF) test and focus adjustment of the optical assembly, first perform step S21, detect the center point position of the optical sensor 21 and detect the position fixed in the lens holder 22 The center point position of the lens 23. Then, as shown in FIG. 5( a), the center point positions of the optical sensor 21 and the lens 23 fixed in the lens holder 22 are aligned, and the lens holder 22 is positioned on the second circuit board 24 with glue 25 , so that the optical sensor 21 and the lens 23 are accurately aligned. This step can avoid the impact of tolerance caused by the external dimensions of the light sensor 21 and the lens holder 22 provided by the surface mount technology, and improve the image quality.

然后,进行步骤S22,将组装后的光学组件2置于MTF测试装置的移动平台上,并通过夹具夹固该光学组件2,使其往移动平台的一侧靠紧,以增加后续焦距调整步骤的稳定性,使生产线容易操作,如图5(b)所示。之后,进行步骤S23,移动MTF测试装置的移动平台31,使光学组件的透镜对准测试图32的中心点,以进行MTF分析,如图5(c)所示。然后,进行步骤S24,以一调焦用具33夹持设置于镜头座22内的透镜23,依据MTF分析结果,转动或移动调焦用具33,使镜头座22内的透镜23借由调焦用具33的夹持而沿两者壁面的螺纹向上或向下移动,以调整透镜23的焦距范围,直至最佳的MTF位置。之后,进行步骤S25,将调整好焦距的光学组件2的透镜23上胶定位于镜头座22,以完成光学组件2的测试与调整。Then, proceed to step S22, place the assembled optical assembly 2 on the mobile platform of the MTF testing device, and clamp the optical assembly 2 by a clamp so that it is close to one side of the mobile platform, so as to increase the follow-up focus adjustment steps The stability makes the production line easy to operate, as shown in Figure 5(b). Afterwards, step S23 is performed to move the mobile platform 31 of the MTF testing device so that the lens of the optical component is aligned with the center point of the test chart 32 to perform MTF analysis, as shown in FIG. 5( c ). Then, proceed to step S24, clamp the lens 23 arranged in the lens holder 22 with a focusing tool 33, and rotate or move the focusing tool 33 according to the MTF analysis result, so that the lens 23 in the lens holder 22 is fixed by the focusing tool. 33 to move up or down along the threads of the two wall surfaces to adjust the focal length range of the lens 23 until it reaches the optimal MTF position. Afterwards, step S25 is performed to glue and position the lens 23 of the optical assembly 2 with the adjusted focal length on the lens holder 22 to complete the test and adjustment of the optical assembly 2 .

综上所述,本发明的光学组件测试与调整方法,可改善现有测试方法因光传感器的中心点会因表面贴装技术打印以及镜头座的零件外形关系产生公差因素,而影响光学组件的测试精准度以及影像品质。另外,亦可以解决现有于移动光学组件进行测试时,会因移动时震颤到该光学组件,而产生测试误判的问题。此外,本发明的方法可以增加光学组件的测试与调整效率,而且可以有效地提升产能。In summary, the optical component testing and adjustment method of the present invention can improve the existing testing method because the center point of the optical sensor will have tolerance factors due to surface mount technology printing and the shape relationship of the parts of the lens holder, which will affect the optical component. Test accuracy and image quality. In addition, it can also solve the existing problem of misjudgment caused by the vibration of the optical component when moving the optical component for testing. In addition, the method of the present invention can increase the testing and adjusting efficiency of the optical components, and can effectively increase the production capacity.

Claims (7)

1. the test of an optical module and method of adjustment, wherein this optical module has a lens mount, lens, an optical sensor, a first circuit board and a second circuit board, this optical sensor is arranged on this first circuit board, this first circuit board is arranged on this second circuit board, these lens are arranged in this lens mount, and this method comprises:
Step a detects the center position of this optical sensor and the center position of these lens;
Step b makes the center position contraposition of this optical sensor and these lens, and fixes this lens mount on this second circuit board;
Step c places this optical module on the mobile platform of one proving installation;
Steps d moves this mobile platform, makes the center position contraposition of a test pattern of this optical module and this proving installation;
Step f carries out image test and analysis;
Step g is arranged at these lens in this lens mount with a focusing apparatus clamping of this proving installation, and adjusts the focal range of these lens according to the image test result; And
Step h fixes the focal length of these lens, with test and the adjustment of finishing this optical module.
2. the test of optical module as claimed in claim 1 and method of adjustment is characterized in that this optical sensor is charge coupled device or complementary metal oxide semiconductor transducer.
3. the test of optical module as claimed in claim 1 and method of adjustment is characterized in that this step b fixes this lens mount on this second circuit board by viscose.
4. the test of optical module as claimed in claim 1 and method of adjustment is characterized in that this step c also comprises step c1, utilize anchor clamps of this proving installation in this step c1, and a side of this optical module and this mobile platform is close to.
5. the test of optical module as claimed in claim 1 and method of adjustment is characterized in that this proving installation is the modulation transfer functions proving installation.
6. the test of optical module as claimed in claim 5 and method of adjustment is characterized in that this step f is for carrying out the modulation transfer functions test.
7. the test of optical module as claimed in claim 1 and method of adjustment is characterized in that this step h fixes these lens in this lens mount by viscose, thereby fix the focal length of these lens.
CNB2005100650871A 2005-04-08 2005-04-08 Method for testing and adjusting optical assembly Expired - Fee Related CN100405036C (en)

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CN102662293B (en) * 2012-05-21 2015-06-24 信利光电股份有限公司 Close-range focusing device and method
CN102902077B (en) * 2012-10-12 2014-11-05 宁波舜宇光电信息有限公司 Method for automatically adjusting back focal length (BFL) of unthreaded lens based on inverse projection mode
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