CN100401467C - Processing device - Google Patents

Abstract

Even in the case where adhesive chips are attached to the frame (F) due to the processing of the wafer integrated with the frame (F) through the adhesive tape (T), it can be smoothly and smoothly without being affected by the adhesive chips. Carry out subsequent conveyance etc., in the processing apparatus of the present invention, in the accepting device (11) of the wafer (W) transfer when carrying out feeding into wafer (W), have by the first bottom surface supporting part (112) The first L-shaped guide rail (110) constituted with the first side support portion (113), and the second bottom surface support portion (114) and the second side support portion (115) constitute and the first L-shaped guide rail ( 110) The second L-shaped guide rail (111) that is arranged oppositely; On the top of the first bottom surface support part (112) and the top of the second bottom surface support part (114), the upper part of the second bottom surface support part (114) is arranged oppositely to limit the output from the wafer box. A first drawout restricting part (116) and a second drawout restricting part (117) for movement of the frame.

Description

Processing device

technical field

The present invention relates to a processing device for processing wafers.

Background technique

A semiconductor wafer having a plurality of integrated circuits formed on its surface separated by scribing lines is diced and divided into individual semiconductor chips, which are used in various electronic devices and the like.

For example, when dicing a semiconductor wafer, in order to stably support a thin semiconductor wafer, as shown in FIG. The frame F is pasted on the outer peripheral portion of the contact surface, whereby the semiconductor wafer W2 is integrated with the frame F through the adhesive tape T. As shown in FIG. The semiconductor wafer W2 integrally formed with the frame F is housed in the wafer cassette 300, the frame F is gripped and taken out from the wafer cassette 300 by the carry-in device 301, and then the frame F is held on a suction plate ( not shown in the figure) and transported to the chuck table. The semiconductor wafer W2 held on the chuck table is divided into individual semiconductor chips by dicing, and after cleaning and removing cutting chips, etc., the frame F is transported and held on the transport device for transport, and the output and delivery device 301 is then transported. It is housed in a wafer case. Thus, when processing the semiconductor wafer W2, the semiconductor wafer W2 and the frame F must be integrated with the adhesive tape T to transport and hold the frame F (for example, refer to JP-A-2003-257896).

However, when cutting the semiconductor wafer attached to the adhesive tape with a high-speed rotating cutting blade, the cutting blade must also be slightly cut into the adhesive tape in order to cut the semiconductor wafer completely. The adhesive layer tends to fly out as adhesive crumbs and adhere to the frame. If adhesive waste adheres to the frame, the frame cannot be released when the frame is released from the holding state when the frame is held and the semiconductor wafer or the like is transported. In this case, the frame cannot be positioned at a desired position, but falls off at an unexpected position, often causing problems such as damage to the semiconductor wafer integrated with the frame, or damage to the processing equipment.

In addition, the adhesive shavings adhering to the frame cannot be completely removed by washing, and when it is used in other processing equipment in this state, the same problem occurs in other processing equipment.

Contents of the invention

Therefore, the problem to be solved by the present invention is to reliably detach the frame even when adhesive chips are attached to the frame.

The processing device provided by the present invention is characterized in that the processing device at least has an output and feeding device for transferring the wafer from the wafer cassette to the receiving device and into the wafer cassette, and the wafer and the frame are pasted on the bonding surface. On the belt, thereby being integrated with the frame by adhesive tape, the receiving device has a first L-shaped guide rail and a second L-shaped guide rail, the first L-shaped guide rail is supported by a first bottom surface which slidably supports the bottom surface of the frame The second L-shaped guide rail is composed of a second bottom surface support portion that slidably supports the bottom surface of the frame and a second side portion that supports the side portion of the frame. The first L-shaped guide rail and the second L-shaped guide rail are configured to be movable toward the direction of mutual approach or the direction of mutual separation; the first bottom support part The upper part of the upper part and the upper part of the second bottom surface supporting part are oppositely disposed with a first drawing-out restricting part and a second drawing-out restricting part for restricting the horizontal movement of the frame output from the wafer cassette by the loading and unloading device.

Furthermore, the present invention also provides a processing device, the processing device has at least a carrying-in device and a conveying device, and the carrying-in device transfers wafers from a wafer cassette to a receiving device and feeds them into the wafer cassette, so that The wafer and the frame are attached to the adhesive tape, thereby being integrated with the frame through the adhesive tape, and the transport device attracts and holds the frame integrated with the wafer delivered to the receiving device, and moves in the vertical direction to transport the wafer. At the same time, the wafer is sent into the receiving device, which is characterized in that: the receiving device has a first L-shaped guide rail and a second L-shaped guide rail, and the first L-shaped guide rail is slidably supported by a second L-shaped guide rail that slidably supports the bottom surface of the frame. A bottom surface support portion and a first side portion support portion that supports the side portion of the frame, and the second L-shaped guide rail is composed of a second bottom surface support portion that slidably supports the bottom surface of the frame and a second bottom surface support portion that supports the side portion of the frame. The side support part is formed and arranged opposite to the first L-shaped guide rail; the first L-shaped guide rail and the second L-shaped guide rail are configured to move toward a direction approaching each other or a direction away from each other; The upper portion of the side support portion and the upper portion of the second side support portion are disposed at opposing positions with a first frame holding portion and a second frame holding portion for restricting movement in the vertical direction of the frame. In this processing device, a horizontal support for the frame carried out from the wafer cassette by the carrying-in device may be disposed opposite to the upper part of the first bottom support part and the upper part of the second bottom support part. The direction movement is restricted by the first drawing-out restricting part and the second drawing-out restricting part.

In the present invention, since the first bottom surface support portion of the first L-shaped guide rail and the second bottom surface support portion of the second L-shaped guide rail constituting the receiving device are respectively provided opposite to each other, the first drawing-out restrictions that limit the horizontal movement of the frame are provided. part and the second drawing-out restricting part, so that when the frame is drawn out by the feeding-in device, for example, even if the frame is attached with adhesive scraps and the frame cannot be separated from the feeding-in device, since the frame abuts against the two If the lead-out restricting portion is located at a certain position, the frame can be reliably disengaged from the loading and unloading device, and the wafer unit can be located at a desired position. Therefore, damage to the wafer or damage to the processing equipment will not be caused.

In addition, in the present invention, since the first clamping portion and the second clamping portion are provided on the side support portion of the L-shaped guide rail constituting the receiving device, even when the conveying device releases the suction of the frame and moves in the vertical direction, When the frame cannot be detached from the conveying device due to adhesive chips adhering to the frame, since the frame abuts against the two pressing parts, the movement of the frame in the vertical direction is restricted, thereby enabling the frame to be detached from the conveying device reliably . Damage to the wafer or damage to the processing device can thereby be avoided.

On the first bottom surface support portion of the first L-shaped guide rail and the second bottom surface support portion of the second L-shaped guide rail that constitute the receiving device, a first drawing-out restricting portion and a second drawing-out restricting portion are respectively provided. The side support portion of the guide rail and the side support portion of the second L-shaped guide rail are respectively provided with a first pressing portion and a second pressing portion, therefore, for example, even if adhesive chips are attached to the frame, the The frame abuts against the two lead-out restricting parts, so that the frame can be detached from the output and feeding device. The device disengages.

Description of drawings

FIG. 1 is a perspective view showing a cutting device as an example of a processing device.

Fig. 2 is a perspective view showing a wafer integrated with a frame by an adhesive tape.

Fig. 3 is a perspective view showing the configuration of the feeding-in device.

Fig. 4 is a perspective view showing the configuration of the receiving device.

Fig. 5 is a perspective view showing a state in which a wafer is cut.

Fig. 6 is a cross-sectional view schematically showing a state in which bonding chips are scattered by cutting.

Fig. 7 is a perspective view showing a state in which a frame to which adhesive scraps are attached is to be conveyed.

Fig. 8 is a cross-sectional view schematically showing a state in which a frame to which adhesive chips are adhered is sucked.

Fig. 9 is a cross-sectional view schematically showing a state in which a wafer unit is placed on a receiving device.

Fig. 10 is a cross-sectional view schematically showing a state before the frame is detached from the conveying device.

Fig. 11 is a cross-sectional view schematically showing a state in which the frame is detached from the conveying device.

Fig. 12 is a plan view showing a state in which the movement of the frame is restricted by the first drawing-out regulating portion and the second drawing-out regulating portion.

Fig. 13 is a sectional view taken along line A-A of Fig. 10 .

Fig. 14 is a plan view showing a state in which the frame is detached from the loading and unloading device.

Fig. 15 is an explanatory diagram showing a state in which the frame is taken out of the wafer cassette.

Detailed ways

A cutting device 1 shown in FIG. 1 is one type of processing device using the present invention, and has a function of cutting a semiconductor wafer or the like. As shown in FIG. 2, the wafer W to be chipped is attached to the central portion of the adhesive tape T. As shown in FIG. In addition, the frame F is attached to the outer peripheral portion of the adhesive tape T. As shown in FIG. In this way, the wafer W is housed in the wafer cassette 100 mounted on the cassette elevating table 10a positioned on the cassette elevating table 10a as shown in FIG. in the loading area 10. The structure in which the wafer W is integrated with the frame F via the adhesive tape T is called a wafer unit U. A plurality of wafer units U are accommodated in the wafer cassette 100 .

In the vicinity of the cassette loading area 10 shown in FIG. Unit U. In the vicinity of the receiving device 11, an output and delivery device 12 and a delivery device 14 are arranged, and the output and delivery device 12 is used for outputting the wafer unit U from the wafer cassette 100 and sending the wafer unit U into the wafer cassette 100. The transport device 14 is used to transport the wafer unit U between the receiving device 11 and the chuck table 13 or between the cleaning area 17 .

The conveying device 14 is composed of an arm 140 movable in the Y-axis direction, a vertical part 141 suspended downward from the arm 140, a lifting part 142 vertically (Z-axis direction) lifted on the vertical part 141, and a device. The suction pad 143 at the lower end of the lifting portion 142 is configured so that the wafer unit U can be transported by the arm portion 140 moving in the Y-axis direction while the frame F is suctioned by the suction pad 143 .

As shown in FIG. 3 , the output and feeding device 12 is composed of a ball screw 120 and a guide rail 121 arranged in the Y-axis direction, a motor 122 for rotating the ball screw 120, and a screw threaded and slidably combined with the ball screw 120. The moving part 123 of the guide rail 121 is composed of two flange-shaped handle parts 124 that are arranged on the moving part 123 and can move up and down in the direction of approaching or separating from each other to clamp or release the frame F. The driving rotates the ball screw 120, and the moving part 123 moves in the Y-axis direction.

As enlarged and shown in FIG. 4 , the receiving device 11 is constituted by a first L-shaped guide rail 110 and a second L-shaped guide rail 111 provided to face each other. The first L-shaped guide rail 110 is composed of a first bottom surface support portion 112 for slidably supporting the bottom surface of the frame F constituting the wafer unit U shown in FIGS. 1 and 2 , and a first side portion support portion for supporting the side portion of the frame F. 113; the second L-shaped guide rail 111 is composed of a second bottom support 114 that slidably supports the bottom of the frame F, and a second side support 115 that supports the side of the frame F. Either of the first L-shaped guide rail 110 and the second L-shaped guide rail 111 has an L-shaped cross section, and the frame F can be clamped or released by moving toward each other in the direction of the X-axis or in the direction of mutual separation. .

A first draw-out restricting portion 116 is arranged on the top of the first bottom support portion 112, and a second draw-out restricting portion 117 is arranged on the top of the second bottom support portion 114. The first draw-out restricting portion 116 and the second draw-out restricting portion 117 The X direction faces each other. In addition, a first frame pressing portion 118 protrudes from the first side supporting portion 113 in the −X direction, and a second frame pressing portion 119 protrudes from the second side supporting portion 115 in the +X direction. The tightening portion 118 and the second frame pressing portion 119 are formed at opposite positions.

Referring to FIG. 1 and FIG. 4 together, the chuck table 13 for holding the wafer unit U is movably arranged below the receiving device 11 along the X direction, at the adjacent position of the chuck table 13 in the +X direction 1. A cutting device 16 with a cutting blade and a calibration device 15 for detecting the position to be cut are provided.

When the wafer W accommodated in the wafer cassette 100 is to be cut, the wafer unit U is positioned at a predetermined height by the cassette elevating table 10a located in the cassette loading area 10, and the loading and unloading device 12 moves in the +Y direction, The handle portion 124 holds the frame F constituting the wafer unit U. Then, the loading and unloading device 12 moves in the -Y direction, and the grip of the handle part 124 is released at a predetermined position, so that the wafer unit U can be placed on the first L-shaped guide rail 110 and the second L-shaped guide rail 110 constituting the receiving device 11. The top of the L-shaped guide rail 111. In this way, when the wafer unit U is drawn out from the wafer cassette 100, the first L-shaped guide rail 110 and the second side support portion 115 are not in contact with the outer peripheral side of the frame F. The L-shaped guide rail 111 leaves.

Then, the first L-shaped guide rail 110 and the second L-shaped guide rail 111 are moved toward each other, and the frame F is clamped by the first side support part 113 and the second side part support part 115, so that the wafer unit U is positioned at a certain position. s position.

The conveying device 14 shown in FIG. 1 moves to directly above the wafer unit U, the lifting part 142 descends, and the suction plate 143 suctions the frame F. Then, the first L-shaped guide rail 110 and the second L-shaped guide rail 111 move in a direction away from each other, so that the first frame pressing part 118 and the second frame pressing part 119 are not located directly above the frame F. After that, the lifting part 142 The wafer unit U is raised to raise the wafer unit U, and then the lifting unit 142 is lowered to release the suction of the suction pad 143, whereby the wafer unit U can be placed on the chuck table 13, and the wafer W can be sucked and held.

The chuck table 13 is moved to the +X direction. After the position to be cut is detected by the calibration device 15, the chuck table 13 is further moved in the same direction. As shown in FIG. Cutting is performed by cutting into the scribe lines of the wafer W while rotating. In addition, while the cutting device 16 is indexed and fed in the Y-axis direction, all the scribed lines in the same direction are cut. After that, the chuck table 13 is rotated by 90°, and then the scribed lines in the direction perpendicular to the cut are cut. All the lines are scribed and then cut, and the chips are divided into individual chips by cutting.

When cutting the wafer W, in order to cut the wafer W reliably, the cutting blade 160 also cuts into the adhesive tape T a little, as shown in FIG. 6 . Accordingly, the adhesive tape T is also cut and the adhesive chips 200 are scattered. As shown in FIG. 7 , scattered adhesive chips 200 adhere to the surface of the frame F. As shown in FIG. In Fig. 6 and Fig. 7, the bonding waste 200 is shown larger than it actually is.

After the cutting of the wafer W is completed, the lifting part 142 constituting the conveying device 14 is lowered, as shown in FIG. 140 moves in the Y-axis direction to transport the wafer unit U to the cleaning area 17 (see FIG. 1 ). In the cleaning area 17 shown in FIG. 1 , the holding table 170 holds and rotates the wafer unit U, and cleaning water is sprayed from the nozzle 171 to remove chips adhering to the wafer W. On the other hand, the adhesive chips 200 (see FIG. 6 , FIG. 7 , and FIG. 8 ) adhering to the frame F are not completely removed as far as possible.

Continue to describe with reference to Fig. 1, the wafer unit U after the cleaning, under the state that frame F is adsorbed on the suction disc 143, is conveyed to receiving device 11 by conveying device 14, is placed on the first L-shaped guide rail 110 and the second L-shaped guide rail 110. The top of the glyph guide rail 111. At this time, as shown in FIG. 9, if the first frame pressing part 118 and the second frame pressing part 119 are not located directly below the frame F, when the wafer unit U is placed, the first frame pressing part 118 and the second frame pressing part 119 will not be an obstacle.

Next, as shown in FIG. 10 , make the first L-shaped guide rail 110 and the second L-shaped guide rail 111 approach, so that at least a part of the first frame pressing portion 118 and the second frame pressing portion 119 are directly above the frame F Location. The lifting unit 142 is raised while the suction of the suction pad 143 is released, and the frame is detached from the suction pad 143 . At this time, if the adhesive chips 200 are attached to the frame F, as shown in FIG. 11 , the frame F will not be separated from the suction plate 143 , and the frame F will be lifted upward together with the suction plate 143 . However, the frame F is supported from the first frame pressing portion 118 protruding horizontally from the first side support portion 113 constituting the first L-shaped guide rail 110 and supported from the second side portion constituting the second L-shaped guide rail 111. The second frame pressing part 119 that protrudes from the part 115 in the horizontal direction pushes downward, the frame F is forcibly separated from the suction plate 143, and the wafer unit U is surely loaded on the first L-shaped guide rail 110 and the second L-shaped guide rail 110. the top of the guide rail 111. Therefore, neither the wafer W nor the cutting device 1 is damaged.

In this way, while the end portion of the frame F is pushed by the moving part 123 of the loading and unloading equipment 12, the loading and unloading equipment 12 moves in the +Y direction, whereby the wafer unit U placed on the receiving equipment 11 is accommodated in the wafer. The prescribed opening of the box 100.

The wafer W thus cut is peeled off from the adhesive tape T one by one; connected as a whole, and then accommodated in the wafer box 100. When the frame F is reused, as shown in FIG. 7 , adhesive chips may adhere to the surface of the frame F.

When cutting a new wafer, it is carried out from the wafer cassette 100 in the same procedure as above, and then cut. That is, first, as shown in FIGS. 12 and 13 , the wafer unit U1 is taken out from the wafer cassette 100 by holding the frame F with the handle portion 124 of the loading and unloading device 12 . At this time, the first L-shaped guide rail 110 is separated from the second L-shaped guide rail 111 so that the outer peripheral side of the frame F and the first side support portion 113 and the second side support portion 115 do not contact each other. The wafer unit U1 is a structure in which the wafer W1 before cutting and the frame F are integrally formed. Since the outer peripheral portion of the frame F abuts against the first lead-out restricting portion 116 and the second lead-out restricting portion 117, even if there are adhesive chips 200 attached to the frame F. In the state where the handle part 124 is bonded to the frame F, the frame F can also be forcibly detached from the handle part 124 by making the output and feeding device 12 move in the -Y direction, and placed on the receiving end. on device 11. Therefore, neither the wafer W1 nor the cutting device is damaged.

After the wafer unit U1 is placed on the receiving device 11, as shown in FIG. It presses against the second side support portion 115 and is positioned at a fixed position. At this time, the side surface of the frame F slides while being in contact with the side surfaces of the first drawing-out regulating portion 116 and the second drawing-out regulating portion 117 , and moves slightly in the +Y direction.

Then, dicing is performed as shown in FIG. 5 , and the wafer W1 divided into individual chips is diced while being integrated with the frame F. As shown in FIG. After being sent to the cleaning area 17 for cleaning, they are stored in the wafer cassette 100 . Furthermore, when the wafer unit U is placed on the suction table 13 for slicing, or the wafer unit U is placed on the holding table 170 of the cleaning area 17 for cleaning after slicing, the suction of the suction pad 143 is released and the suction pad 143 is released. The lifting unit 142 rises, but on the chuck table 13 and the holding table 170, since the suction force for holding the wafer acts in a direction opposite to the moving direction of the lifting unit 142, even if the bonding chips 200 are attached to the frame F, Next, the adsorption pad 143 is detached from the frame F due to the suction force and the lifting part 142 rising.

In this way, since the wafer unit U1 is placed at a desired position during transportation, neither the wafer W1 nor the cutting device 1 is damaged. Furthermore, the above description has been made for a cutting device, but the present invention can also be applied to other processing devices.

Claims (2)

1. processing unit (plant), described processing unit (plant) have output feeder and conveying device at least; From the wafer cassette transport to the receiving device and be sent in this wafer case, described wafer and framework stick on the splicing tape described output feeder, are integral by splicing tape and frame shape thus wafer; Described conveying device attracts to keep forming with the wafer that is output to this receiving device the framework of one, and moves and carry this wafer to vertical direction, simultaneously, this wafer is sent into this receiving device, it is characterized in that:

This receiving device has a L font guide rail and the 2nd L font guide rail, a described L font guide rail is made of the first sidepiece support of the first bottom surface support that supports this framework bottom surface slidably with the sidepiece of this framework of supporting, and described the 2nd L font guide rail is made of second bottom surface support that supports this framework bottom surface slidably and the second sidepiece support that supports this frame side and with a L font guide rail arranged opposite; The one L font guide rail and the 2nd L font guide rail constitute and can move to approaching mutually direction or the direction of leaving mutually;

On the top of this first sidepiece support and the top of this second sidepiece support, the vertical direction that is setting this framework in position in opposite directions moves the first framework compressed part and the second framework compressed part that limits.

2. by the described processing unit (plant) of claim 1, it is characterized in that, on the top of the described first bottom surface support and the top of the described second bottom surface support, disposing opposite to each other moving first drawing restrictions and second and draw restrictions of limiting from the horizontal direction of the framework of described wafer case output by described output feeder.

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