CN100399593C - Edge-emitting light-emitting diode and packaging mirror thereof - Google Patents

Abstract

An edge-emitting light-emitting diode and a packaging mirror thereof are provided, wherein the packaging mirror comprises a bottom surface, an incident surface, a reflecting surface, a first refraction surface, a second refraction surface and a third refraction surface. The light generated by the LED enters the packaging mirror from the incident surface, part of the light is reflected to the second refraction surface by the internal total reflection on the reflection surface, and is emitted out of the packaging mirror along the first light path after passing through the second refraction surface, and the rest of the light directly passes through the first refraction surface and the third refraction surface and is respectively refracted by the first refraction surface and the third refraction surface and then is emitted out of the packaging mirror. A transition surface is arranged between the first refraction surface and the reflection surface, and the light entering the packaging mirror from the incident surface is designed not to intersect with the transition surface, so that improper reflection or refraction can be avoided; the packaging mirror is used for packaging the LED, and can reduce light loss and reduce the processing stress of manufacturing.

Description

Edge-emitting light-emitting diode and its packaging mirror

【Technical field】

The invention relates to a light-emitting diode, in particular to a side-firing light-emitting diode and its encapsulation mirror.

【Background technique】

Generally speaking, the light emitting method of traditional light emitting diodes (LED; Light Emitting Diodes) is that the light emitting path is perpendicular to the light emitting surface of the LED chip and presents in a Lambert type (Lambert ion) energy distribution (see Figure 1A), which is usually used in traffic signs , lighting or other guiding signs. However, limited by the shape of its energy distribution, if you want to mix several light-emitting diodes for optical properties (such as light intensity, color light mixing, etc.), you usually need to leave the light-emitting surface of the light-emitting diode for a certain distance before you can get the mixed result. effect (see Figure 1B), so there will be an invalid distance L1 where mixing cannot be performed. However, if the light-emitting type of a single light-emitting diode can be flattened, the ineffective distance can be greatly shortened.

Lumileds published a Side Emitting LED in the 2003 SID Symposium, which disclosed a side emitting LED with a special packaging structure (as shown in Figure 2). Only a small part of the light energy (less than 10%) of the edge-emitting light-emitting diode with the structure will be emitted from the top (the central optical axis direction 14 of the LED chip), and most of the light energy will be emitted from the side direction. In practical applications, this edge-emitting light-emitting diode will reflect its upward outgoing light energy by attaching a light-shielding sheet 16 above it, and the company has also obtained related technology patents, including US Patent No. 6,679,621 " SIDE EMITTING LED AND LENS".

In addition, another packaging structure (as shown in FIG. 3 ) is disclosed in the aforementioned US Patent No. 6,679,621 of Lumileds Company, which includes: an incident surface 10, a reflective surface 11, a first refraction surface 12 and a second refraction surface. Surface 13, wherein the first refraction surface 12 has an oblique angle with the central optical axis 14 (Central Optic Axis) of the LED chip, and the second refraction surface 13 connects the first refraction surface 12 and the bottom surface 15 smoothly. The light emitted by the LED chip enters the package structure from the incident surface 10 and exits mainly along two paths P1 and P2, wherein the path P1 is after the light enters the package structure from the incident surface 10, and is reflected on the reflective surface by total internal reflection. 11 is reflected to the first refraction surface 12, and then exits along the path P1 through the first refraction surface 12; the path P2 is that after the light enters the package structure from the incident surface 10, it directly passes through the second refraction surface 13 and follows the path P2 shoot out. The design of Figure 3 has the following problems:

1. Since all light rays are only divided into two optical paths, it is easy to produce "optical axis path overlap" at the junction of the two optical paths, so that inappropriate reflection or refraction occurs. As shown in Figure 4, there is an overlapping interval α of the light path between the first refracting surface 12 and the second refracting surface 13, if the light entering this package structure from the incident surface 10 enters this overlapping interval α, it will directly reaches the first refraction surface 12 so that undue reflection or refraction occurs.

2. The geometric shape of this packaging structure has narrow and long parts, which easily leads to insufficient structural strength.

3. Due to the sharp angles of the shape, it is easy to produce processing stress concentration during manufacturing, resulting in deformation, which in turn changes its optical properties.

【Content of invention】

One object of the present invention is to propose a kind of optical axis path overlap effect that is not easy to occur at the junction of two optical paths so that improper reflection or refraction occurs, and it is not easy to produce processing stress concentration during manufacturing, which can maintain stable optical characteristics and can be used. Encapsulation lens (lens) of edge-emitting light-emitting diodes with enhanced mechanical strength.

Another object of the present invention is to propose a side-firing light-emitting diode, which can guide the light emitted by the LED chip toward the side to irradiate, so as to achieve the purpose of flattening the light pattern, so that the light-emitting mode can be changed to that of the LED. The planes are parallel and the angle distribution is more convergent to improve the collection efficiency; it can also reduce the influence caused by the difference in luminous efficiency of different LED grains.

A package mirror of the present invention is applied to a light source, and is characterized in that: comprising:

bottom surface;

The incident surface is connected to the bottom surface, and the light source is arranged below it;

The reflective surface forms an included angle with the central optical axis of the package mirror;

first refracting surface;

a first transition surface, between the reflection surface and the first refraction surface;

a second refraction surface connected to the first refraction surface;

a third refracting surface connected to the bottom surface; and

a second transition surface between the second refraction surface and the third refraction surface;

Wherein the light provided by the light source enters the interior of the package mirror from the incident surface, a part of the light is reflected to the second refraction surface on the reflective surface, and the light is refracted after passing through the second refraction surface and follows the first light path exits the encapsulated mirror;

The rest of the light entering the encapsulation mirror from the incident surface is refracted directly through the first refraction surface and exits the encapsulation mirror along a second light path, and is refracted after directly passing through the third refraction surface. refracted to exit the packaged mirror along a third optical path.

A preferred feasible embodiment of the present invention achieves the above-mentioned purpose by redesigning the geometric shape of the package mirror (lens); this package mirror is installed in the light path of a light source, including: bottom surface, incident surface, reflector Surface, the first refraction surface, the second refraction surface and the third refraction surface, a part of the light entering the encapsulation mirror from the incident surface is reflected by the reflective surface and exits through the second refraction surface, while the rest of the light will directly flow from the first refraction surface respectively. The refraction surface and the third refraction surface exit the packaging mirror, so there is no problem of overlapping optical paths, and improper reflection or refraction can be avoided to reduce light loss. This packaging mirror does not have an overly narrow geometry, which can reduce the processing stress impact. The edge-emitting light-emitting diode proposed by the present invention has a semiconductor light-emitting device (such as an LED chip), and a package mirror, and the package mirror includes: a bottom surface, an incident surface, a reflective surface, a first refraction surface, a second refraction surface and The third refraction surface, the light emitted by the LED chip enters the interior of the package mirror from the incident surface, and a part of the light is reflected to the second refraction surface by internal total reflection on the reflection surface, and the light is refracted by the second refraction surface and then directed to the side The rest of the light entering the package mirror directly passes through the first refraction surface and the third refraction surface and then refracts out of the package mirror toward the side. After the light passes through the reflecting surface, the first refracting surface, the second refracting surface and the third refracting surface, the traveling direction of the light is corrected to be a horizontal traveling direction.

【Description of drawings】

FIG. 1A is a light pattern diagram of a conventional LED chip.

FIG. 1B shows the mixed distribution of light using a plurality of conventional LED chips for optical property mixing.

Fig. 2 is a lens structure of a known edge-emitting light-emitting diode.

FIG. 3 is another lens structure of a known edge-emitting LED.

FIG. 4 is a distribution diagram of light paths in the lens of the known edge-firing LED shown in FIG. 3 .

FIG. 5 is a structure diagram of a packaging mirror of an edge-emitting light-emitting diode according to the present invention.

FIG. 6 is a light path distribution diagram of the edge-emitting light-emitting diode of the present invention.

FIG. 7A is a distribution diagram of the light emitting light shape of the edge-emitting light-emitting diode of the present invention.

FIG. 7B shows the mixed distribution of light using a plurality of edge-emitting LEDs of the present invention for optical property mixing.

【Detailed ways】

The preferred embodiments of the present invention are described below with reference to the drawings.

Please refer to FIG. 5 for a preferred embodiment disclosed according to the present invention, wherein the packaged mirror 20 disclosed includes: a bottom surface 21 (bottom surface), an incident surface 22 (incident surface), a reflective surface 23 (reflective surface), a first Refractive surface 31 (first refractive surface), second refractive surface 32 (second refractive surface) and third refractive surface 33 (third refractive surface), first transitional surface 34 and second transitional surface 35 . This package mirror 20 can be used as a package structure of a semiconductor light emitting device such as a light emitting diode (LED) 40 (as shown in FIG. 6 ).

As shown in FIG. 6, the light emitted by the LED chip 40 enters the inside of the package mirror 20 from the incident surface 22, and a part of the light is reflected to the second refracting surface 32 by internal total reflection on the reflecting surface 23, The light is refracted after passing through the second refraction surface 32, and exits the encapsulation mirror 20 from the side along the first optical path P1, and the rest of the light entering the encapsulation mirror 20 from the incident surface 22 directly passes through the first refraction surface 31 respectively and the third refraction surface 33, and then refract the package mirror 20 from the side along the second optical path P2 and the third optical path P3 respectively, and the extension of the first optical path P1, the second optical path P2 and the third optical path P3 The direction is substantially perpendicular to the central optical axis C (central optical axis) of the packaging mirror 20 , and is used to guide the light emitted by the LED chip 40 toward the side of the packaging mirror 20 to irradiate.

According to a preferred embodiment of the present invention, the reflective surface 23 is adjacent to one side of the central optical axis C of the package mirror 20, and forms an included angle with the central optical axis C; wherein the first transition surface 34 is interposed between the first refracting surface 31 and the reflecting surface 23, while the first refracting surface 31 smoothly connects the transition surface 34 and the second refracting surface 32, and the angle between the second refracting surface 32 and the central optical axis C of the package mirror 20 is determined by the reflecting surface 23 The angle determines that there is a second transition surface 35 between the second refraction surface 32 and the third refraction surface 33, and the third refraction surface 33 has a smooth arc and is located between the second transition surface 35 and the bottom surface 21 .

In order to continue to illustrate the structure of the package mirror 20, here is an explanation of several symbols marked in Fig. 5: generally speaking, the LED chip 40 can be regarded as a point light source, and the first intersection point c1 shown in the figure is The intersection point of the central optical axis C and the light-emitting surface of the LED chip 40, the second intersection point c2 is the connection between the first transition surface 34 and the first refraction surface 31, and the third intersection point c3 is the connection between the third refraction surface 33 and the second transition surface. At the junction of the surfaces 35 , the fourth intersection point c4 is the junction of the first refraction surface 31 and the second refraction surface 32 .

The light emitted by the LED chip 40 is presented in a Lambert-type (Lambert ion) energy distribution (please refer to FIG. 1A). In a preferred embodiment of the present invention, referring to FIG. 6, after the light emitted by the LED chip 40 enters the packaging mirror 20 of the present invention, it can be divided into interval 1, interval 2 and interval 3 according to its energy intensity distribution. . Section 1 is between the central optical axis C and the line connecting the first intersection point c1 to the second intersection point c2. Section 2 is between the line connecting the first intersection point c1 to the fourth intersection point c4 and section 1 (the third intersection point C3 is also on the line connecting the first intersection point c1 to the fourth intersection point c4). Section 3 is located between section 2 and the bottom surface 21 . The energy distribution in interval 1 is the strongest, followed by interval 2, and interval 3 is the weakest. The light in interval 1 with the strongest energy distribution is reflected by the reflection surface 23 to the second refraction surface 32, resulting in the lowest energy. The strong part is arranged in the central part of the overall lateral luminous light shape of the encapsulating mirror 20 (as shown in FIG. 7A ), the light in interval 2 is directly refracted by the first refraction surface 31, and the light in interval 3 is directly refracted by the first refraction surface 31. The three refraction surfaces 33 are refracted, so the first refraction surface 31 , the second refraction surface 32 and the third refraction surface 33 are respectively responsible for controlling the outgoing path of the source light in a single section, and will not affect each other.

The extension direction of the surface of the first transition surface 34 is specially designed so that the light entering the package mirror 20 from the incident surface 22 will not intersect with the first transition surface 34. The preferred design is as shown in Figure 5, the first transition The extending direction of the surface of the surface 34 is overlapped with the direction of the connecting line from the first intersection point c1 to the second intersection point c2, so that improper reflection or refraction can be avoided.

In the embodiment of FIG. 6, there is a slight distance between the first intersection point c1 and the incident point where the light enters the incident surface 22, and this distance will affect the position of the first transition surface 34; therefore, a better design must also consider the LED According to the refraction phenomenon of the light emitted by the chip 40 after passing through the incident surface 22, according to a preferred embodiment of the present invention, the packaging mirror 20 can be directly packaged on the light-emitting side of the LED chip 40. At this time, the optical axis of the LED chip 40 That is, it overlaps with the central optical axis C of the package mirror 20, and the first intersection point c1 is closest to the incident point where light enters the incident surface 22. At this time, the extension direction of the surface of the first transition surface 34 can be the same as the first intersection point c1 to the second intersection point The connection direction of c2 overlaps.

The edge-emitting light-emitting diode proposed by the present invention can converge the light pattern of the LED chip 40 through the package mirror 20 (as shown in FIG. 7A ), so as to improve the collection efficiency. The LED module made with the packaging mirror 20 of the present invention can be used in the field of backlight modules and general lighting, especially in the application of multiple LED chips 40, the light-emitting light pattern of a single LED chip 40 can be flattened, making invalid The distance L2 is greatly shortened (as shown in FIG. 7B ), which can further reduce the influence caused by the difference in luminous efficiency of different LED chips 40 .

Although the present invention has been disclosed above by the preferred embodiments, it is not intended to limit the present invention. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should still be regarded as the present invention. Protection category.

[Description of main component symbols]

〔Known technology〕

10.......incident surface

11.......reflective surface

12.......First refraction surface

13..........Second refraction surface

14..The direction of the central optical axis of the LED chip

15.....Bottom

16.......Shading film

LED.......Light emitting diode

L1.....invalid distance

P1, P2... the path of the ray

〔this invention)

20.......Package mirror

21.....bottom surface (bottom surface)

22........ incident surface (incident surface)

23........ reflective surface (reflective surface)

31........The first refractive surface (first refractive surface)

32...........Second refractive surface (second refractive surface)

33.......The third refractive surface (third refractive surface)

34.....the first transitional surface

35..........Second transition surface

P1.......First light path

P2.......Second optical path

P3.......Third light path

C.....The central optical axis of the packaging mirror 20 (central optical axis)

c1.....first point of intersection

c2..........Second point of intersection

c3.......the third point of intersection

c4.......the fourth point of intersection

L2.......Invalid distance

Claims (12)

1. A packaging mirror is applied to a light source, characterized in that: comprising: bottom surface; The incident surface is connected to the bottom surface, and the light source is arranged below it; The reflective surface forms an included angle with the central optical axis of the package mirror; first refracting surface; a first transition surface, between the reflection surface and the first refraction surface; a second refraction surface connected to the first refraction surface; a third refracting surface connected to the bottom surface; and a second transition surface between the second refraction surface and the third refraction surface; Wherein, the light source is arranged at the position of the central optical axis of the encapsulation mirror, the light provided by the light source enters the interior of the encapsulation mirror from the incident surface, a part of the light is reflected to the second refraction surface on the reflection surface, and the light passes through The second refraction surface is then refracted to exit the package mirror along the first light path; The rest of the light entering the encapsulation mirror from the incident surface is refracted directly through the first refraction surface and exits the encapsulation mirror along a second light path, and is refracted after directly passing through the third refraction surface. refracted to exit the packaged mirror along a third optical path. 2. The packaged mirror as claimed in claim 1, characterized in that: the reflective surface is close to the side of the central optical axis of the packaged mirror, so that part of the light entering the packaged mirror is reflected and passes through the second refracting surface The central part of the light-emitting light shape located laterally to the encapsulated mirror. 3. The packaged mirror as claimed in claim 1, wherein the light entering the packaged mirror from the incident surface does not intersect the first transitional surface. 4. The package mirror according to claim 3, characterized in that: the extension direction of the surface of the first transition surface is from the intersection point of the light exit surface of the light source and the central optical axis to the first transition surface and the first refraction surface The connection directions of the connections overlap. 5. The packaged mirror according to claim 1, characterized in that: the junction of the second transition surface and the third refraction surface is just located at the intersection of the light exit surface of the light source and the central optical axis to the first refraction surface and the first refraction surface On the position of the connecting line at the connection of the second refraction surface. 6. The packaged mirror as claimed in claim 1, wherein the third refracting surface has a smooth arc and is located between the second transition surface and the bottom surface. 7. A side-emitting light-emitting diode, characterized in that: comprising: LED chips; The packaging mirror, located on the light emitting side of the LED chip, includes: bottom surface; The incident surface, the LED chip is arranged under it; The reflective surface forms an included angle with the central optical axis of the package mirror; first refracting surface; a first transition surface, between the reflection surface and the first refraction surface; a second refraction surface connected to the first refraction surface; a third refracting surface connected to the bottom surface; and a second transition surface between the second refraction surface and the third refraction surface; Wherein, the LED chip is arranged at the position of the central optical axis of the packaging mirror, the light emitted by the LED chip enters the inside of the packaging mirror from the incident surface, and a part of the light is reflected to the second refracting surface on the reflecting surface, and the light generating refraction after passing through the second refraction surface and emitting the encapsulation mirror along the first light path; The rest of the light entering the encapsulation mirror from the incident surface is refracted directly through the first refraction surface and exits the encapsulation mirror along a second light path, and is refracted after directly passing through the third refraction surface. refracted to exit the packaged mirror along a third optical path. 8. The edge-emitting light-emitting diode as claimed in claim 7, characterized in that: the reflective surface is close to the side of the central optical axis of the packaging mirror, so that part of the light entering the packaging mirror is reflected and passes through the second The refraction surface is located behind the central part of the light-emitting light shape on the side of the packaging mirror. 9. The edge-emitting light-emitting diode as claimed in claim 7, wherein the light entering the package mirror from the incident surface does not intersect the first transition surface. 10. The edge-emitting light-emitting diode as claimed in claim 9, characterized in that: the extension direction of the surface of the first transition surface is from the intersection of the light-emitting surface and the central optical axis of the LED chip to the first transition surface and Directions of connecting lines of the joints of the first refracting surfaces overlap. 11. The edge-emitting light-emitting diode according to claim 7, characterized in that: the junction of the second transition surface and the third refraction surface is just located at the intersection of the light-emitting surface of the LED chip and the central optical axis to the first On the position of the connecting line between the refraction surface and the second refraction surface. 12. The edge-firing LED as claimed in claim 7, wherein the third refracting surface has a smooth arc and is located between the second transition surface and the bottom surface.

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