CN100392782C - Keyboard with a keyboard body - Google Patents

Abstract

A keyboard, comprising: several keys, a seat board and a circuit board. The circuit board is arranged between the seat board and the keys, and the circuit board is provided with a chip and arranged on the circuit board. The thickness of the chip is reduced to a specific thickness by grinding, and the chip is arranged on the circuit board by wire bonding.

Description

keyboard

technical field

The invention relates to a keyboard, in particular to a keyboard with an ultra-thin size.

Background technique

With the trend of thinner and smaller electronic products, the size of the keyboard is getting thinner and thinner to meet the visual and portable needs of users. When the size is reduced, the space occupied by each component in the keyboard is also relatively compressed. Therefore, the size of each keyboard component will affect the overall thickness of the keyboard. In a notebook computer with a "separate" keyboard, the keyboard itself has a keyboard control chip and can be separated from the notebook computer casing to work independently, and can communicate with other keyboards by means of a PS/2, USB interface or wireless transmission interface. The computer does the data entry. Since the thickness of the keyboard control chip will affect the thickness design of the keyboard itself, if the thickness of the keyboard control chip can be reduced, the thickness of the keyboard can be effectively reduced.

Contents of the invention

In order to solve the problems of the above-mentioned known technologies, the present invention provides a keyboard, which includes: a plurality of keys, a seat board and a circuit board. The circuit board is arranged between the seat board and the key. The circuit board has a chip and is arranged on the circuit board. The chip is ground down to a thickness of 0.2mm and placed on a circuit board by wire bonding.

The present invention also provides a method for manufacturing a flexible printed circuit board, comprising the following steps: providing a wafer, the wafer has a first thickness; grinding the wafer to reduce the thickness of the wafer to a second thickness, and The first thickness is greater than the second thickness; the wafer is cut to obtain at least one chip; the chip is set on a flexible printed circuit board by wire bonding; and the flexible printed circuit board The surface of the chip is coated with sealant.

The keyboard of the present invention is light, thin and short in size, which can meet the user's visual and carrying needs, and effectively enhance the competitiveness of the product.

Description of drawings

Fig. 1 shows an embodiment of the present invention;

Fig. 2 a shows the situation that the chip is arranged on the circuit board by wire bonding;

Fig. 2b shows the situation of encapsulating the chips on the circuit board.

Explanation of reference symbols:

1～keyboard

11～seat plate

12～Film components

13～button

14～chip

15 ~ glue

16～circuit board

Y～specific thickness

X, X'～connection part

Detailed ways

The embodiment of the present invention, as shown in FIG. 1 , is a keyboard, which includes a plurality of keys 13 , a base plate 11 , a membrane component 12 and a circuit board 16 . The film assembly 12 is disposed on the seat plate 11 . The circuit board 16 is disposed between the base plate 11 and the key 13 , and the circuit board 16 has a chip 14 . The chip 14 is ground to a specific thickness Y without damaging the circuit structure of the chip, and is mounted on the circuit board 16 by wire bonding.

In this embodiment, the film assembly 12 and the circuit board 16 are electrically coupled through the connection parts X and X'. The film assembly 12 has a plurality of switch assemblies (not shown), and each switch assembly corresponds to a button. When the switch When the component senses the touch of the key 13, it will send a key signal to the chip 14. The chip 14 is a keyboard controller (controller), which is used to transmit the key signal to an information processing device through a transmission protocol, such as computer. Since the thickness of the chip 14 is reduced from 0.8 mm before grinding to 0.2 mm without damaging the circuit structure of the chip, the space between the key 13 and the seat plate 11 is effectively saved, thereby reducing the thickness of the keyboard 1 .

Before the chips 14 are diced from the wafer, the entire wafer is ground from a thickness of 0.8 mm (first thickness) to 0.2 mm (second thickness). Chips 14 are then diced from the wafer. Next, as shown in FIG. 2 a , the chip 14 is disposed on the flexible printed circuit board 16 by wire bonding (bounding). Finally, referring to FIG. 2 b , the step of sealing with glue 15 is performed. Using the above-mentioned process steps, the height of the component after sealing can be reduced from 1.3 mm to 0.7 mm. Therefore, the thickness of the keyboard can be effectively reduced.

The above-mentioned circuit board is a flexible printed circuit board (FPC).

The above-mentioned chip 14 can be disposed in one of the keys 13 to further reduce the thickness of the keyboard 1 .

The keyboard of the present invention is light, thin and short in size, which can meet the user's visual and carrying needs, and effectively improve the competitiveness of the product.

Although the present invention has been disclosed above in preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can still make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the claims of the application.

Claims (4)

1. keyboard comprises:

One seat board;

Be arranged at a plurality of buttons on this seat board in the mode that can move up and down; And

One is located at the circuit board between this seat board and these buttons, and this circuit board has a chip, is located on this circuit board, and utilizes the mode of grinding that the thickness of chip is reduced to 0.2 millimeter.

2. keyboard as claimed in claim 1 is characterized in that: this chip is to utilize the mode of lead-in wire bonding to be located on this circuit board.

3. keyboard as claimed in claim 1 is characterized in that: this circuit board is a flexible print wiring board.

4. keyboard as claimed in claim 1 is characterized in that: in this chip button located therein.

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