CN100389497C - Structure for packaging image sensor - Google Patents

Abstract

The present invention discloses an image sensor package structure, which includes an image sensor chip; a package body, the package body accommodates and holds the image sensor chip inside; and a package lens, the package lens seals the package body to form A confined space; wherein, the packaging lens is a light-condensing meniscus lens, and the concave surface of the meniscus lens faces the light-receiving surface of the image sensing chip, and the present invention utilizes the meniscus lens package that has a converging effect on image signal light The image sensor chip can effectively shorten the imaging focal length and reduce the height of the entire image sensor packaging structure, which is beneficial to the miniaturization application of the image sensor packaging structure.

Description

Image Sensor Package Structure

【Technical field】

The invention relates to an image sensor packaging structure.

【Background technique】

Image sensing is widely used in various optoelectronic products, such as medical equipment, digital cameras, digital video cameras, etc., because it can detect images and convert them into electronic signals. It is one of the key components of such imaging products. As consumers have higher requirements for digital products that are thinner, lighter, and smaller, effectively reducing the size of the image sensor package structure has become a focus of the industry's efforts.

Referring to FIG. 1 , it is an existing image sensor package structure 10. The image sensor chip 14 is pasted on the substrate 12 by metal bonding, and a barrier 16 with a certain height is arranged around the image sensor chip 14, and a glass The cover 18 seals the enclosure 16 to form an airtight space (not shown), wherein the glass cover 18 and the image sensing chip 14 are separated by a certain distance, so that the imaging track P is imaged on the image sensing chip 14 after passing through the glass cover 18 . The lead wires 13 connect the internal circuit of the image sensor chip 14 with the external circuit, and output the image signal to the printed circuit board (not shown). The substrate 12 and the glass cover 18 of the existing image sensor packaging structure occupy a large volume, so that the height of the entire image sensor packaging structure 10 is relatively high, which makes it difficult for the image sensor packaging structure 10 to be used in medical applications. Ultra-small applications such as speculum and camera phones are widely used.

An existing improved image sensor package structure 20 is disclosed by a Chinese patent with a publication date of May 1, 2002 and a publication number of CN1347151. For the image sensor package structure 20 disclosed in this patent, see In FIG. 2 , the circuit 221 is directly fabricated on the bottom surface of the glass plate 22 by using the flip-chip packaging technology, and combined with the image sensing chip 14 in flip-chip packaging. The improved image sensor package structure 20 can reduce the height of the entire image sensor package structure 20 . In addition, the packaging method uses the substrate as the sealing cover, which can save raw materials.

Please refer to FIG. 3 , which is a schematic diagram of the imaging optical path of the existing image sensor packaging structure. The image sensor chip 14 is sealed in the airtight space formed by the glass cover 18, the packaging barrier 16 and the substrate 12. The image signal light (not shown) ) is converged by an imaging lens 48 and received by the image sensing chip 14 through the glass cover 18 . The glass cover 18 only acts as a seal to prevent contamination particles from entering the image sensing chip 14 and affecting the reception of signal light. Since the glass cover 18 has no converging effect on the image signal light, the entire imaging focal length is relatively long, resulting in a relatively large size of the entire imaging module.

In addition, when the image sensor module manufactured by the above-mentioned improved packaging method is used together with an imaging lens group, it is not conducive to reducing the height of the system.

【Content of invention】

The object of the present invention is to provide an image sensor package structure, which can effectively reduce the package thickness of the image sensor.

To achieve the above object, the present invention provides an image sensor packaging structure, which includes an image sensing chip, the image sensing chip has a light receiving surface and a bottom surface, and the light receiving surface is used to receive image signal light; a packaging body, the packaging body accommodates and holds the image sensing chip inside, the bottom surface of the image sensing chip is in contact with the packaging body; and a packaging lens, the packaging lens seals the packaging body to form a closed space, the The packaging lens is a light-condensing meniscus lens, and the concave surface of the meniscus lens faces the light receiving surface of the image sensing chip.

An improved image sensor package structure of the present invention includes an image sensor chip having a light receiving surface and a bottom surface for receiving image signal light, and a package body for accommodating and holding the image sensor chip in Inside and the bottom surface of the image sensor chip is in contact with the package body, and an imaging lens group is used to capture images and complete the output of image signal light. The imaging lens group includes an imaging lens and a packaging lens, wherein the The image sensing chip is packaged through the packaging lens, the packaging lens is a light-condensing meniscus lens, the meniscus lens seals the package body to form a closed space, and the concave surface of the meniscus lens faces the light of the image sensing chip. The receiving surface, the convex surface of the meniscus lens faces the image-taking lens.

Compared with the existing image sensor packaging structure, the present invention provides an image sensing chip packaging structure that replaces the ordinary glass sheet with a light-condensing meniscus lens, which can further converge the image signal light, effectively shorten the imaging focal length, and reduce the cost of the entire module. In addition, the improved packaging structure of the image sensor can save packaging materials.

【Description of drawings】

FIG. 1 is a schematic diagram of a conventional image sensor package structure.

FIG. 2 is a schematic diagram of an improved package structure of an existing image sensor.

FIG. 3 is a schematic diagram of an imaging optical path of a conventional image sensor package structure.

FIG. 4 is a schematic diagram of the packaging structure of the image sensor of the present invention.

FIG. 5 is a schematic diagram of an improved package structure of an image sensor and its imaging optical path according to the present invention.

【Detailed ways】

Please refer to FIG. 4, the image sensor package structure of the present invention includes an image sensor chip 14, the image sensor chip 14 includes a light receiving surface 141 and a bottom surface 142 corresponding to the light receiving surface 141; a package The main body 34, the packaging main body 34 is provided with an inner cavity (not marked), the depth of the inner cavity is greater than the thickness of the image sensing chip 14, the image sensing chip 14 is accommodated and held inside the packaging main body 34, and its bottom surface 142 and The bottom surface of the package body 34 is bonded; and a package lens 36, the package lens 36 seals the package body 34 to form a closed space; the package lens 36 is a converging meniscus lens, and the concave surface of the meniscus lens faces the described The light-receiving surface 141 of the image sensor chip 14, so that the meniscus lens can converge the image signal light transmitted to the image sensor chip 14, thereby effectively shortening the imaging focal length and reducing the package size of the image sensor package structure .

Please refer to FIG. 5, which is an improvement of the package structure of the image sensor of the present invention. The package structure of the image sensor includes an image sensor chip 14 for receiving image signal light, and a package body 34 for the The image sensing chip 14 is housed and held inside and the bottom surface of the image sensing chip 14 is in contact with the package body 34 , and an imaging lens group 30 is used to capture images and output the image signal light to the image sensing chip 14 , the imaging lens group 30 includes a packaging lens 36 and a taking lens 38, wherein the image sensing chip 14 is encapsulated by the packaging lens 36, the packaging lens 36 is a light-condensing meniscus lens, and the image sensing chip 14 is located on the concave side of the meniscus lens and seals the package body 34 to form a closed space. The package lens 36 further converges, which can effectively shorten the imaging focal length, so the image sensor chip 14 is packaged with the package lens 36 which has a converging function for the image signal light, so that the thickness of the entire module can be effectively reduced. In addition, by the imaging lens group 30 The last lens 36 encapsulates the image sensing chip 14 so that the image sensing chip 14 and the imaging lens group 30 are integrated, so that the encapsulating lens 36 has the functions of both imaging and packaging. In addition to further reducing the height of the entire imaging system, it can also save packaging materials. .

Claims (2)

1. An image sensor packaging structure, which includes an image sensor chip with a light receiving surface and a bottom surface, the light receiving surface is used to receive image signal light; a package body, the package body accommodates and holds the image The sensing chip is inside, the bottom surface of the image sensing chip is in contact with the package body; and a package lens, which seals the package body to form a closed space, is characterized in that the package lens is a converging meniscus lens , and the concave surface of the meniscus lens faces the light receiving surface of the image sensing chip. 2. An image sensor package structure, which includes an image sensor chip with a light receiving surface and a bottom surface for receiving image signal light, and a package body for accommodating and holding the image sensor chip Inside and the bottom surface of the image sensor chip is in contact with the package body, and an imaging lens group is used to capture images and complete the output of image signal light. The imaging lens group includes an imaging lens and a packaging lens, which It is characterized in that the image sensing chip is packaged by the package lens, the package lens is a light-condensing meniscus lens, the meniscus lens seals the package body to form a closed space, and the concave surface of the meniscus lens faces the image sensor On the light-receiving surface of the chip, the convex surface of the meniscus lens faces the image-taking lens.

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