CN100384584C - Method for manufacturing heat radiation structure of light emitting diode - Google Patents

Abstract

A method for manufacturing a heat dissipation structure of a light emitting diode comprises the following steps: providing a thin base material which is continuously conveyed; stamping the thin base material by a stamping mechanism to form a continuous foot rest with a cathode body and an anode body; after the foot rest is formed by punching, uncut waste materials exist between the cathode main bodies, and the uncut thin waste materials on the cathode main bodies are extruded by an extrusion mechanism to form a heat dissipation structure which has a certain thickness and can be integrated with the cathode main bodies.

Description

Manufacturing method of heat dissipation structure of light emitting diode

technical field

The invention relates to a method for manufacturing a heat dissipation structure of a light-emitting diode, in particular to a method for making a heat dissipation structure integrated with the cathode body by extruding uncut waste materials on the cathode body of the light-emitting diode by means of extrusion .

Background technique

At present, light-emitting diodes have been widely used in lighting equipment, and light-emitting diodes have also been manufactured into products with characteristics such as high efficiency, high power, and high brightness. Therefore, high-efficiency, high-power and high-brightness light-emitting diodes will relatively generate extremely high heat when they are used. Therefore, when making the tripod of the light-emitting diode, those skilled in the art will form a heat dissipation structure on the tripod, which can Dissipate the heat generated by the light emitting diodes to ensure the service life of the light emitting diodes. However, when the traditional light-emitting diode is formed on the tripod, a heat dissipation structure is formed on the two wings of the cathode main body of the tripod to carry the chip at the same time. Because the heat dissipation structure is small in size and thin in thickness, the heat conduction efficiency is not good and the heat dissipation effect is caused. If it is not good, the service life of the light-emitting diode will be shortened. Therefore, in order to improve the heat dissipation structure of light-emitting diodes, those skilled in the art use thick metal substrates to etch or lithography the pins of the cathode and anode bodies into thin shapes, so that The area where the chip is carried by the cathode main body maintains the original thickness to form a heat dissipation structure. The other is to weld a heat dissipation structure with a thickness on the supporting part of the cathode main body of the footstand that carries the chip directly after the footstand is stamped and formed, so as to form the heat dissipation structure of the cathode main body. Although this heat dissipation structure with a certain thickness has a high-efficiency heat transfer effect, it can quickly dissipate the heat generated by the light-emitting diodes and ensure the service life of the light-emitting diodes. However, these two thick heat dissipation structures are time-consuming and difficult to manufacture, which relatively increases the manufacturing cost.

Contents of the invention

The main purpose of the present invention is to solve the above-mentioned defects in the prior art. The invention utilizes an extrusion method to extrude a thin metal base material to form a heat dissipation structure with a certain thickness and can be integrated with the cathode body of the light-emitting diode. In addition to having better heat conduction characteristics, it can also save materials and greatly The manufacturing cost is reduced, and the heat dissipation structure of the light-emitting diode is easier to manufacture.

In order to achieve the above object, the manufacturing method of the heat dissipation structure of the light-emitting diode of the present invention provides a thin base material that is continuously transported; the thin base material is stamped by a stamping mechanism to form a tripod that has a continuity and has a cathode and an anode body; After the tripod is stamped and formed, there are uncut waste materials between the cathode main body, and then the uncut thin waste materials on the cathode main body are extruded by an extrusion mechanism, and the thin waste materials are extruded into a A heat dissipation structure that has a certain thickness and can be integrated with the cathode body.

The method of the invention can make the light-emitting diode have a better heat dissipation effect, can also save materials, greatly reduce the manufacturing cost, and make the heat dissipation structure of the light-emitting diode easier to manufacture.

Brief description of the drawings

Fig. 1 is a schematic diagram of a substrate of a single sheet of the present invention;

Fig. 2 is a schematic diagram of the tripod after stamping of the base material of the present invention;

Fig. 3, Fig. 4 and Fig. 5 are the schematic diagrams of the extruding process of the base material waste in the cross section of Fig. 2 at position 3-3;

Fig. 6 is a schematic diagram of a heat dissipation structure formed by extruding base material waste in the present invention;

7 is a schematic cross-sectional view of a light emitting diode of the present invention;

FIG. 8 is another schematic cross-sectional view of the light emitting diode of the present invention.

In the accompanying drawings, the list of parts represented by each label is as follows:

1-Thin metal substrate 2-Cathode main body

3-Anode body 4-Pod

5-Connection part 21, 21a, 31, 31a-pin

22, 32-electrode terminal 23-carrying part

6-Extrusion mechanism 11-Scrap

7-Heat dissipation structure 8-Chip

9-Package

Detailed ways

Relevant technical content and detailed description of the present invention, now cooperate accompanying drawing to explain as follows:

FIG. 1 and FIG. 2 are schematic diagrams of a single-piece base material and a tripod after the base material is stamped according to the present invention. As shown in Figure 1 and Figure 2: the manufacturing method of the heat dissipation structure of the light-emitting diode of the present invention mainly uses the thin metal base material to punch the tripod of the light-emitting diode, and squeezes the uncut thin waste material on the tripod pressure to form a heat dissipation structure with a certain thickness of the cathode main body to achieve the purpose of saving materials, which can greatly reduce the production cost and make the heat dissipation structure of the light emitting diode easier to manufacture.

When the heat dissipation structure of the above-mentioned light-emitting diode is produced, firstly, a continuous thin metal substrate 1 is stamped by a punching machine (not shown in the figure), and then a cathode body 2 and an anode body 3 are formed on the substrate 1. Tripod 4. The stand 4 is integrally connected with the base material 1 through the connecting portion 5 . The cathode main body 2 has pins 21 , 21 a connected to the connecting portion 5 . An electrode end 22 is formed between the two pins 21, 21a, and the electrode end 22 is provided with a carrying portion 23 capable of carrying a light-emitting chip (not shown in the figure). The anode main body 3 has pins 31 , 31 a connected to the connecting portion 5 . An electrode terminal 32 is formed between the two pins 31, 31a, and a wire (not shown in the figure) can be welded on the electrode terminal 32, and the wire is connected to the light-emitting chip provided in the carrying portion 23 by welding. After the stand 4 is punched and formed, the pins 21, 21a, 31, 31a of the cathode and anode bodies 2, 3 and the base material 1 between the electrode terminals 22, 32 and the connecting part 5 are all cut, only the surrounding parts 23 It is integrally connected with the waste material 11 after being cut. After the tripod 4 is stamped and cut into shape, the extrusion mechanism 6 is used to extrude the waste material 11 . During the extrusion process (as shown in Figures 3, 4, and 5), the extrusion mechanism 6 will squeeze the waste material 11 toward the center of the bearing part 23, so that the waste material 11 is squeezed and integrated with the bearing part 23 to form a There is a heat dissipation structure with a certain thickness (as shown in FIG. 6 ). The heat dissipation structure 7 with a certain thickness provides the light emitting diode with a good heat conduction efficiency, and can conduct the heat generated by the light emitting diode to the outside of the light emitting diode. After the above-mentioned heat dissipation structure is manufactured, follow-up manufacturing steps such as chip implantation, wire welding, packaging, and cutting of the tripod 4 are carried out, that is, the light-emitting diode with an integrally formed heat dissipation structure is completed.

7 and 8 are a cross-sectional view and another schematic cross-sectional view of the light emitting diode of the present invention. As shown in Figure 7 and Figure 8: when the diode of the present invention is completed and in use, after the pins 21, 21a, 31, 31a of the cathode body 2 and the anode body 3 are powered on, the bearing part 23 is implanted The chip 8 will generate a light source, and the generated light source will be projected out by the transparent package 9, and in the process of generating the light source, the heat generated by the chip 8 will be quickly conducted to the heat dissipation structure 7, and then dissipated by the heat dissipation structure 7, so as to To ensure the service life of light emitting diodes.

A further feature of the present invention is that the volume and thickness of the heat dissipation structure 7 can be controlled through the extrusion process to adjust the heat conduction efficiency of the heat dissipation structure 7 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made by using the description and drawings of the present invention are directly or indirectly used in other related technical fields. , are all included in the patent scope of the present invention in the same way.

Claims (8)

1. the method for fabricating structure of heat elimination of a light emitting diode is characterized in that, described method includes:

A) the slim base material that provides a continuity to carry;

B) utilize a punching mechanism that described base material is carried out punching press, described base material formed have the foot rest of a continuity and tool negative electrode, anode body, after described foot rest drawing, have not cropped waste material between described cathode body:

C) utilize pressing mechanism that the not cropped slim waste material of described cathode body is pushed making, described slim waste material is squeezed into the radiator structure that has certain thickness and can form one with cathode body.

2. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 1 is characterized in that described base material is a metal material.

3. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 1 is characterized in that described foot rest links into an integrated entity by connecting portion and described base material.

4. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 1 is characterized in that having two pins that are connected with connecting portion on the described cathode body, is formed with an electrode tip between described pin, and described electrode tip is provided with a supporting part.

5. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 4 is characterized in that implantation has a luminescence chip on the described supporting part.

6. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 1, it is characterized in that having two pins that are connected with connecting portion on the described anode body, be formed with an electrode tip between described pin, welding one lead on the described electrode tip, set luminescence chip is welded to connect in described lead and the supporting part.

7. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 1, after it is characterized in that described radiator structure is formed on the foot rest punch forming, base material between the pin of described cathode and anode main body and electrode tip and connecting portion is all by severing, and around the supporting part with cropped after waste material be connected and be integral, utilize the pressing mechanism extruding to form radiator structure again.

8. the method for fabricating structure of heat elimination of light emitting diode as claimed in claim 1 is characterized in that the volume of described radiator structure, the size of thickness, can control by extrusion process, to adjust the radiator structure heat conduction efficiency.

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