CN100381918C - Method for confirming attachment position of anisotropic conductive adhesive - Google Patents

Abstract

The invention relates to a method for confirming the attaching position of anisotropic conductive adhesive, which comprises providing a panel having a plurality of contacts formed thereon. And forming at least one mark pattern on the panel. Then, the anisotropic conductive adhesive is attached to the panel to cover the contacts and the mark pattern. Next, the chip is placed on the anisotropic conductive paste corresponding to these contacts. Then, a bonding process is performed to electrically connect the chip and the contacts on the panel with each other by the anisotropic conductive adhesive. Particularly, if the anisotropic conductive film is not attached to the correct position, the mark pattern will be exposed, so that the mark pattern can be used as a reference for determining whether the anisotropic conductive film is attached to the correct position. The problem that part of the first contact points cannot be conducted with the chip due to incorrect attaching position can be solved; the problem that the second anisotropic conductive adhesive is poor in attaching effect due to the fact that the attached second anisotropic conductive adhesive is overlapped with the first anisotropic conductive adhesive can be avoided.

Description

How to confirm the attachment position of anisotropic conductive adhesive

technical field

The present invention relates to a construction method of a liquid crystal display, in particular to a method for confirming the anisotropy of anisotropic conductive glue (anisotropic conductor film, ACF) attachment position in the construction process of a liquid crystal display The method of attaching the conductive adhesive.

Background technique

Liquid crystal displays have advantages that cannot be achieved by displays made of traditional cathode ray tubes (Cathode Ray Tube, CRT), such as low-voltage operation, no radiation scattering, light weight, and small size. It is different from other flat-panel displays, such as plasma ( Plasma) displays and Electroluminance (EL) displays have become the main subjects of display research in recent years, and are even regarded as the mainstream of displays in the 21st century.

The manufacturing process of the liquid crystal display can be divided into three parts, namely thin film transistor (Thin Film Transistor, TFT) manufacturing process, liquid crystal unit (cell) manufacturing process, and construction process. Among them, the construction process includes the construction of the driver integrated circuit and the bonding of the external driver circuit.

Today's driving circuit construction methods include two types: one is Tape Chip Package (Tape Chip Package) technology, and the other is Chip-On Glass (COG) technology. .

Please refer to FIG. 1A to FIG. 1C , which are schematic top views of a conventional COG bonding process for assembling a driving circuit of a liquid crystal display panel. Wherein, the driving circuit assembly is carried out after the related manufacturing process of the liquid crystal display panel is completed, and FIG. 1A to FIG. 1C show a partial area of the liquid crystal display panel.

1A, a liquid crystal display panel 100 is provided, which is composed of a color filter film (ColorFilter, referred to as CF) array (that is, an array, hereinafter referred to as an array) substrate 102, a thin film transistor (Thin Film Transistor, referred to as TFT) ) array substrate 104 and a liquid crystal layer (not shown in the figure). Wherein the liquid crystal layer is located between the color filter film array substrate 102 and the thin film transistor array substrate 104, and the overlapping part of the color filter film array substrate 102 and the thin film transistor array substrate 104 is the display area 103, and is not covered by the color filter film array substrate. The TFT array substrate 104 covered by the substrate 102 is a peripheral circuit area 105 . In the peripheral circuit area 105, several contacts (106a and 106b) have been formed, and the contact 106a is subsequently electrically connected to an IC (Integrated Circuit) chip, and the contact 106b is subsequently connected to a flexible printed circuit (FPC) board, referred to as FPC) electrical connection.

Then, as shown in FIG. 1A , an anisotropic conductive adhesive 107 a is pasted to cover the contact 106 a.

Next, please refer to FIG. 1B , place the IC chip 108 on the anisotropic conductive glue 107a corresponding to the contacts 106a. Then, a bonding process is performed to electrically connect the IC chip 108 and the contact 106a through the anisotropic conductive glue 107a.

Then, as shown in FIG. 1C , another anisotropic conductive adhesive 107b is pasted to cover the contact 106b. Next, the flexible circuit board 110 is placed on the anisotropic conductive adhesive 107b corresponding to the contacts 106b. Then, a bonding process is performed to electrically connect the flexible circuit board 110 and the contacts 106b through the anisotropic conductive adhesive 107b.

It is worth noting that there is currently no way to confirm whether the anisotropic conductive adhesive is attached to the correct position when the IC chip is assembled in the liquid crystal display panel. During the process, the following problems may arise:

If the anisotropic conductive adhesive 107a is not attached to the correct position, part of the contacts 106a may not be covered by the anisotropic conductive adhesive 107a (as shown in FIG. There is no conduction between the chip 108 and the exposed contact 106a because there is no anisotropic conductive adhesive.

In addition, if the anisotropic conductive adhesive 107a is not attached to the correct position, when another anisotropic conductive adhesive 107b is attached to cover the contact 106b, part of the anisotropic conductive adhesive 107b will be different from the previous anisotropic conductive adhesive. The directional conductive glue 107a overlaps (shown by reference numeral 109 in FIG. 1C ). Moreover, the sticking effect of the anisotropic conductive adhesive 107b attached to the overlapping region 109 is not good, which makes the anisotropic conductive adhesive 107b easy to fall off.

It is worth noting that, from the above, it can be seen that whether the attachment position of the anisotropic conductive adhesive 107a is correct or not will affect whether there is a good electrical connection between the IC chip 108 and the contact 106a, and even affect the subsequent attachment. Whether the another anisotropic conductive adhesive 107b is not easy to attach. However, since there is currently no method for confirming whether the anisotropic conductive adhesive is attached to the correct position, it is still impossible to effectively avoid the occurrence of the above problems.

It can be seen that there is no method for confirming whether the anisotropic conductive adhesive is attached to the correct position in the above-mentioned prior art, and further improvement is urgently needed. In order to solve the above-mentioned problems, relevant manufacturers have tried their best to seek a solution, but no suitable design has been developed for a long time. This is obviously a problem that relevant manufacturers are eager to solve.

In view of the problem that there is no method for confirming whether the anisotropic conductive adhesive is attached to the correct position in the above-mentioned prior art, the inventor actively researches and innovates based on the rich practical experience and professional knowledge engaged in the design and manufacture of such products for many years, It is expected to create a method for confirming the attachment position of the anisotropic conductive adhesive, which can improve the defects in the prior art and make it more practical. Through continuous research, design, and after repeated trials and improvements, the present invention with practical value is finally created.

Contents of the invention

The purpose of the present invention is to overcome the defects in the prior art that there is no method for confirming whether the anisotropic conductive adhesive is attached to the correct position, and to provide a method for confirming the attachment position of the anisotropic conductive adhesive. The technology to be solved The problem is that it can solve the problem in the prior art that it is impossible to check whether the anisotropic conductive adhesive is attached to the correct position through the configuration of a marking pattern, so that it is more suitable for practical use and has industrial utilization value.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A method for confirming the attachment position of the anisotropic conductive adhesive according to the present invention comprises the following steps: providing a panel on which a plurality of contacts have been formed; forming at least one marking pattern on the panel; An anisotropic conductive adhesive is attached on the panel to cover the contacts and the marking pattern; a chip is placed on the anisotropic conductive adhesive corresponding to the contacts; and a bonding process is performed to enable The chip and the contacts on the panel are electrically connected to each other through the anisotropic conductive adhesive, wherein if the anisotropic conductive adhesive is not attached to the correct position, the marking pattern will be exposed.

The purpose of the present invention and the solution to its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned method for confirming the sticking position of the anisotropic conductive adhesive, the marking pattern is made of the same material as the contacts.

In the aforementioned method for confirming the sticking position of the anisotropic conductive adhesive, the marking pattern is different from the material of the contacts.

In the aforementioned method for confirming the sticking position of the anisotropic conductive adhesive, the marking patterns are arranged on both sides of the contacts.

The aforementioned method for confirming the sticking position of the anisotropic conductive adhesive further includes forming another marking pattern on the panel to confirm whether the length of the anisotropic conductive adhesive is sufficient.

The purpose of the present invention and the solution to its technical problem also adopt the following technical solutions to achieve. A method for confirming the attachment position of the anisotropic conductive adhesive according to the present invention comprises the following steps: providing a panel on which a plurality of first contacts and a plurality of second contacts have been formed; on the panel forming at least one first mark pattern and at least one second mark pattern, wherein the first mark pattern is formed on both sides of the first contacts, and the second mark pattern is formed on both sides of the second contacts; The first anisotropic conductive adhesive is pasted on the panel, covering the first contacts and the first marking pattern; placing a chip on the first anisotropic conductive adhesive corresponding to the first contacts ; performing a first bonding process to electrically connect the chip to the first contacts on the panel, wherein if the first anisotropic conductive adhesive is attached to the correct position, the first marking pattern will be will not be exposed; attach a second anisotropic conductive adhesive on the panel to cover the second contacts and the second marking pattern; place a flexible circuit board corresponding to the second on the second anisotropic conductive glue of the contacts; and perform a second bonding process to electrically connect the flexible circuit board with the second contacts on the panel, wherein if the second anisotropic conductive When the glue is attached to the correct position, the second marking pattern will not be exposed.

The purpose of the present invention and the solution to its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned method for confirming the sticking position of the anisotropic conductive adhesive, the first marking pattern and the second marking pattern are made of the same material as the contacts.

In the aforementioned method for confirming the sticking position of the anisotropic conductive adhesive, the first marking pattern and the second marking pattern are made of different materials from those of the contacts.

The aforementioned method for confirming the sticking position of the anisotropic conductive adhesive further includes forming at least one third marking pattern on the panel to confirm whether the length of the first anisotropic conductive adhesive is sufficient.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. As can be seen from the above technical solutions, in order to achieve the aforementioned object of the invention, the main technical contents of the present invention are as follows:

The present invention proposes a method for confirming the attachment position of the anisotropic conductive adhesive. The method is to firstly provide a panel on which several contacts have been formed, and at least one marking pattern is formed on the panel, wherein the marking pattern is The materials of the contacts are the same or different, and the marking patterns are arranged on both sides of the contacts. Afterwards, anisotropic conductive adhesive is pasted on the panel to cover these contacts and marking patterns. Next, the chip is placed on the anisotropic conductive paste corresponding to these contacts. Subsequently, a bonding process is performed to electrically connect the contacts on the chip and the panel with an anisotropic conductive adhesive. Wherein if the anisotropic conductive adhesive is not attached to the correct position, the marking pattern will be exposed.

Since in the present invention, before the anisotropic conductive adhesive is pasted, the marking pattern will be formed on the panel, so after the bonding process is completed, it can be confirmed whether the anisotropic conductive adhesive is pasted by checking whether the marking pattern is exposed to the outside. Attached to the correct position, this can solve the problem in the prior art that some contacts cannot be connected to the chip due to incorrect attachment position.

The present invention also proposes another method for confirming the attaching position of the anisotropic conductive adhesive. In the method, a panel is firstly provided, and several first contacts and several second contacts have been formed on the panel. Then, forming at least one first mark pattern and at least one second mark pattern on the panel, wherein the first mark pattern is formed on both sides of the first contacts, and the second mark pattern is formed on both sides of the second contacts, And the first mark pattern and the second mark pattern are the same as or different from the material of these contacts. Next, attach the first anisotropic conductive adhesive on the panel to cover the first contacts and the first marking pattern. Then, place the chip on the first anisotropic conductive glue corresponding to the first contacts. Afterwards, a first bonding process is performed to electrically connect the chip to the first contacts on the panel, wherein if the first anisotropic conductive adhesive is attached to the correct position, the first marking pattern will not be exposed come out. Then, a second anisotropic conductive adhesive is pasted on the panel to cover the second contacts and the second marking patterns. Next, the flexible circuit board is placed on the second anisotropic conductive adhesive corresponding to the second contacts. Then, a second bonding process is performed to electrically connect the flexible circuit board to the second contacts on the panel, wherein if the second anisotropic conductive adhesive is attached to the correct position, the first The second marking pattern will not be exposed.

Because in the present invention, before pasting the first anisotropic conductive adhesive, the first mark pattern will be formed on the panel first, so after the bonding process is completed, it can be detected by checking whether the first mark pattern is exposed to the outside. Confirming whether the first anisotropic conductive adhesive is pasted at the correct position can solve the problem in the prior art that some of the first contacts cannot be connected to the chip due to incorrect pasting position. In addition, it is also possible to avoid the problem that the attached second anisotropic conductive adhesive overlaps with the first covering anisotropic conductive adhesive, resulting in poor attachment effect of the second anisotropic conductive adhesive.

In addition, the second marking pattern formed on the panel by the present invention can be used as a reference to identify whether the second anisotropic conductive adhesive is attached to the correct position, thereby ensuring a good connection between the flexible circuit board and the second contact. electrical connection.

In summary, the method for confirming the attachment position of the anisotropic conductive adhesive of the present invention can solve the problem in the prior art that it is impossible to check whether the anisotropic conductive adhesive is attached to the correct position by configuring a marking pattern. , so that it is more suitable for practical use, and has industrial utilization value. No similar method has been published or used, and it is indeed an innovation. It has a large improvement in both method and function, and has a technical advantage. It has made great progress, and has produced easy-to-use and practical effects, so it is more suitable for practical use, and has wide application value in the industry. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present invention. In order to understand the technical means of the present invention more clearly and implement them according to the contents of the description, the preferred embodiments of the present invention and accompanying drawings are described in detail below.

Description of drawings

FIGS. 1A to 1C are schematic top views of a conventional process for assembling a driving circuit of a liquid crystal display panel using COG bonding technology.

FIGS. 2A to 2D are schematic top views of a process for assembling a driving circuit of a liquid crystal display panel using a COG bonding technique according to a preferred embodiment of the present invention.

FIGS. 3A to 3D are schematic top views of another process of assembling a driving circuit of a liquid crystal display panel using a COG bonding technique according to a preferred embodiment of the present invention.

100: Liquid crystal display panel 102: Color filter film array (array) substrate

104: TFT array (array) substrate 106a, 106b, 206a, 206b: contacts

107a, 107b: Anisotropic conductive adhesive 108, 210: Chip (wafer)

109: Overlapping area 110, 212: Flexible circuit board

200: Panel 202: Color filter film array (array) substrate

203: Display area 204: Thin film transistor array (array) substrate

205: Peripheral circuit area 207a, 207b: Anisotropic conductive adhesive

208, 211: marking patterns 214a, 214b, 216: marking patterns

Detailed ways

The specific methods, steps, features and effects of the method for confirming the attachment position of the anisotropic conductive adhesive according to the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

FIG. 2A to FIG. 2D are schematic top views of a process of assembling a driving circuit of a liquid crystal display panel using COG bonding technology according to a preferred embodiment of the present invention. Wherein, the driving circuit is constructed after the liquid crystal display panel-related processes are completed, and FIG. 2A to FIG. 2D show partial areas of the liquid crystal display panel.

2A, a panel 200 is provided, such as a liquid crystal display panel, and the liquid crystal display panel is composed of a color filter film array substrate 202, a thin film transistor array substrate 204 and a liquid crystal layer (not shown). Wherein the liquid crystal layer is located between the color filter film array substrate 202 and the thin film transistor array substrate 204, and the overlapping part of the color filter film array substrate 202 and the thin film transistor array substrate 204 is the display area 203, and is not covered by the color filter film array substrate. The TFT array substrate 204 covered by the substrate 202 is a peripheral circuit area 205 . In the peripheral circuit area 205, several contacts (206a and 206b) have been formed, wherein the contact 206a is subsequently electrically connected to a chip (such as an IC chip), and the contact 206b is subsequently electrically connected to a flexible circuit board. The materials of these contacts ( 206 a and 206 b ) are conductive materials such as aluminum, chromium, indium tin oxide (ITO), etc., and the forming method is, for example, completed during the process related to the liquid crystal display panel.

Please continue to refer to FIG. 2A, at least one marking pattern 208 is also formed on the panel 200, wherein the marking pattern 208 is formed on both sides of these contacts 206a, and the material of the marking pattern 208 is, for example, the same as the contact points (206a and 206b). The materials are the same or different, and they can be conductive or non-conductive. In a preferred embodiment, the material of the marking pattern 208 is, for example, the same as that of the contacts ( 206 a and 206 b ), such as conductive materials such as aluminum, chromium, and indium tin oxide. In particular, if the material of the marking pattern 208 is metal, if the attached anisotropic conductive adhesive is not attached to the correct position after the construction process of the liquid crystal display panel is completed, the marking pattern 208 will be exposed. Then the metallic luster of the mark pattern 208 can be directly perceived by naked eyes immediately.

In addition, the formation method of the mark pattern 208 is, for example, simultaneously formed during the relevant process of the liquid crystal display panel, and is not limited to be formed in a specific process step.

It is worth mentioning that the mark pattern 208 formed on the panel 200 can serve as a reference for whether the anisotropic conductive adhesive is attached to the correct position later. That is, if the subsequently attached anisotropic conductive adhesive cannot completely cover the contact 206a, the marking pattern 208 will be exposed. Therefore, the position of the marking pattern 208 is based on the principle of whether the subsequently attached anisotropic conductive adhesive is located at the correct position and covers the contact point 206a. In other words, the position of the marking pattern 208 is not particularly limited, and it can be determined according to the requirements of different products.

In addition, in a preferred embodiment of the present invention, another marking pattern 211 is formed on the panel 200 . In particular, the marking pattern 211 formed on the panel 200 is used to confirm whether the length of the subsequently attached anisotropic conductive adhesive is sufficient to cover the contact 206a.

Next, please refer to FIG. 2B , attach the anisotropic conductive adhesive 207a on the panel 200 to cover the contacts 206a. Wherein, the anisotropic conductive adhesive 207a has a plurality of conductive particles (not shown in the figure) uniformly dispersed therein.

Next, as shown in FIG. 2C , the chip 210 is placed on the anisotropic conductive adhesive 207a corresponding to the contact 206a. Afterwards, a bonding process is performed to electrically connect the chip 210 to the contacts 206 a on the panel 200 . The chip 210 is, for example, an IC chip, and it has a logic circuit to control the operation of the liquid crystal display. In addition, during the bonding process, for example, appropriate pressure and temperature are applied to the chip 210 so that the chip 210 is electrically connected to the contact 206 a through the conductive particles in the anisotropic conductive adhesive 207 a.

It is worth mentioning that since the marking patterns ( 208 and 211 ) have been previously formed on the panel 200 , the marking patterns 208 will not be exposed if the anisotropic conductive adhesive 207 a is pasted at the correct position.

Then, as shown in FIG. 2D , the anisotropic conductive adhesive 207b is pasted on the panel 200 to cover the contacts 206b. It is worth noting that since the anisotropic conductive adhesive 207a has been attached to the correct position before, the conventionally known anisotropic conductive adhesive 207b overlaps with the anisotropic conductive adhesive 207a, resulting in poor attachment effect , will not occur in the present invention.

Next, please continue to refer to FIG. 2D , place the flexible circuit board 212 on the anisotropic conductive adhesive 207b corresponding to the contact 206b. Then, another bonding process is performed to electrically connect the flexible circuit board 212 to the contact point 206 b on the panel 200 , and complete the assembly of the driving circuit of the liquid crystal display panel.

Since the present invention forms the mark patterns (208 and 211) on the panel 200 before attaching the anisotropic conductive adhesive 207a, after the bonding process is completed, it is possible to check whether the mark patterns (208 and 211) are exposed on the panel 200. In addition, it is confirmed whether the anisotropic conductive adhesive 207a is attached to the correct position, which can solve the problem in the prior art that part of the contacts 206a cannot be connected to the chip 210 due to incorrect attachment positions. In addition, it is also possible to avoid the problem that another anisotropic conductive adhesive 207b to be attached overlaps with the anisotropic conductive adhesive 207a and cause poor attachment effect.

Of course, in another preferred embodiment, another marking pattern can be formed on the panel 200 as a reference for identifying whether the anisotropic conductive adhesive 207b is attached to the correct position, so as to ensure the flexibility of the flexible circuit board. There is a good electrical connection between 212 and the contact point 206b, and its related description is as follows. In the following description, parts with the same numbers as those in the above-mentioned embodiments will not be described again.

Please refer to FIG. 3A to FIG. 3D , which are top schematic diagrams of another process of utilizing COG bonding technology to construct a driving circuit of a liquid crystal display panel according to a preferred embodiment of the present invention. Likewise, the driving circuit is constructed after the liquid crystal display panel-related processes are completed, and FIG. 3A to FIG. 3D show partial areas of the liquid crystal display panel.

3A, a panel 200 is provided, such as a liquid crystal display panel, and the liquid crystal display panel is composed of a color filter film array substrate 202, a thin film transistor array substrate 204 and a liquid crystal layer (not shown). Where the color filter array substrate 202 overlaps the TFT array substrate 204 is the display area 203 , and the TFT array substrate 204 not covered by the color filter array substrate 202 is the peripheral circuit area 205 . In the peripheral circuit area 205, several contacts (206a and 206b) have been formed.

Please continue to refer to FIG. 3A , there are marking patterns ( 214 a and 214 b ) formed on the panel 200 , wherein the marking patterns ( 214 a and 214 b ) are formed on both sides of the corresponding contacts ( 206 a and 206 b ).

It is worth mentioning that the marking patterns ( 214 a and 214 b ) formed on the panel 200 can be subsequently used as a reference for whether the anisotropic conductive adhesive is attached to the correct position. That is, if the subsequently attached anisotropic conductive adhesive cannot completely cover the contact 206a (or 206b ), the mark pattern 214a (or 214b ) will be exposed. Therefore, the position of the marking patterns ( 214 a and 214 b ) is based on the principle of checking whether the subsequently attached anisotropic conductive adhesive is in the correct position and covers the contacts ( 206 a and 206 b ).

Likewise, another marking pattern 216 is formed on the panel 200 . In particular, the mark pattern 216 formed on the panel 200 is used to confirm whether the length of the anisotropic conductive adhesive attached later is sufficient to cover the contact 206a.

Next, please refer to FIG. 3B , attach the anisotropic conductive adhesive 207 a on the panel 200 to cover the contacts 206 a. Next, as shown in FIG. 3C , the chip 210 is placed on the anisotropic conductive adhesive 207a corresponding to the contact 206a. Afterwards, a bonding process is performed to electrically connect the chip 210 to the contacts 206 a on the panel 200 .

It is worth mentioning that since the marking patterns ( 214 a and 216 ) have been previously formed on the panel 200 , the marking patterns ( 214 a and 216 ) will not be exposed if the anisotropic conductive adhesive 207 a is pasted at the correct position.

Then, as shown in FIG. 3C , the anisotropic conductive adhesive 207b is pasted on the panel 200 to cover the contacts 206b. Since the previous anisotropic conductive adhesive 207a has been attached to the correct position, in the prior art, the anisotropic conductive adhesive 207b overlaps with the anisotropic conductive adhesive 207a, resulting in poor attachment effect. In the present invention will not happen.

Next, please refer to FIG. 3D , place the flexible circuit board 212 on the anisotropic conductive adhesive 207b corresponding to the contact 206b. Then, another bonding process is performed to electrically connect the flexible circuit board 212 to the contact point 206 b on the panel 200 , and complete the assembly of the driving circuit of the liquid crystal display panel.

It is worth mentioning that since the marking pattern 214b has been formed on the panel 200 before, if the anisotropic conductive adhesive 207b is attached to the correct position, the marking pattern 214b will not be exposed, thus ensuring that the flexible circuit board 212 There is a good electrical connection with the contact 206b.

In addition, since the marking patterns (214a and 216) are formed on the panel 200 before the anisotropic conductive adhesive 207a is pasted in the present invention, after the bonding process is completed, the marking patterns (214a and 216) can be inspected. It is confirmed whether the anisotropic conductive adhesive 207a is attached to the correct position, so as to solve the problem in the prior art that part of the contacts 206a cannot be connected to the chip 210 due to incorrect attachment positions. In addition, it can also avoid the problem that another anisotropic conductive adhesive 207b to be attached overlaps with the anisotropic conductive adhesive 207a, resulting in poor attachment effect.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the method and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solutions of the present invention.

Claims (4)

1. A method for confirming the attached position of anisotropic conductive adhesive is characterized in that it comprises the following steps: providing a panel on which a plurality of first contacts and a plurality of second contacts have been formed; At least one first mark pattern and at least one second mark pattern are formed on the panel, wherein the first mark pattern is formed on both sides of the first contacts, and the second mark pattern is formed on the second contacts on both sides; attaching a first anisotropic conductive adhesive on the panel to cover the first contacts and the first marking pattern; placing a chip on the first anisotropic conductive adhesive corresponding to the first contacts; performing a first bonding process to electrically connect the chip to the first contacts on the panel, wherein if the first anisotropic conductive adhesive is attached to the correct position, the first marking pattern will not will be exposed; attaching a second anisotropic conductive adhesive on the panel to cover the second contacts and the second marking pattern; placing a flexible circuit board on the second anisotropic conductive adhesive corresponding to the second contacts; and performing a second bonding process to electrically connect the flexible circuit board to the second contacts on the panel, wherein if the second anisotropic conductive adhesive is attached to the correct position, the second mark Patterns will not be exposed. 2. The method for confirming the attachment position of the anisotropic conductive adhesive according to claim 1, wherein the first marking pattern and the second marking pattern are made of the same material as the contacts. 3 . The method for confirming the attachment position of the anisotropic conductive adhesive according to claim 1 , wherein the first marking pattern and the second marking pattern are made of different materials from those of the contacts. 4 . 4. The method for confirming the attachment position of the anisotropic conductive adhesive according to claim 1, further comprising forming at least one third marking pattern on the panel to confirm the first anisotropic conductive adhesive Is the length sufficient.

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