CN100379330C - Fixing device for heat sink - Google Patents

Abstract

The invention is a kind of heat sink fixing device, which is used to fix a heat sink on a printed circuit board, the heat sink fixing device includes: a connecting part for fixing on one side of the heat sink; an extension part connected to the connection part; a first pin extending downwards from a part of edge of the bottom of the connecting part for being inserted into the printed circuit board; and a second pin extending downwards from part of the edge of the bottom of the extension part, connected with the first pin and used for being inserted into the printed circuit board. The heat sink fixing device can enhance the bending stress born by the pins, increase the tin-absorbing area, avoid influencing the connecting circuit of the printed circuit board and firmly fix the heat sink on the printed circuit board.

Description

Heat sink fixing device

technical field

The invention relates to a fixing device, in particular to a cooling fin fixing device.

Background technique

For a long time, heat sinks have been an indispensable component to solve the internal heat dissipation problems of various electronic devices. Take the power supply system (powersupply) applicable to flat-panel liquid crystal displays or notebook computers as an example. The printed circuit board is equipped with The main electronic components include capacitors, resistors, inductors, transformers, diodes, metal oxide semiconductor field effect transistors (MOSFETs) and bare crystals. When the power supply system is in operation, these electronic components will generate heat of varying power. If the heat is not transferred efficiently, the excess heat can cause electronic components to fail, or even prevent the entire system from functioning. Therefore, the heat sink becomes an important component to solve the internal heat dissipation problem of the power supply system.

In order to effectively remove heat, a common heat dissipation method is to attach a heat sink on top of high-power devices such as chips. In addition, due to the limitation of circuit layout and space, high-power transistors can also be locked on the heat sink, and the heat sink can be fixed to the printed circuit board, so as to provide a heat dissipation area in the direction perpendicular to the printed circuit board to dissipate heat. Please refer to FIG. 1 , which is a structural diagram of a conventional heat sink fixed on a printed circuit board. As shown in FIG. 1 , a fixing device 2 is provided on the bottom of the heat sink 1 for fixing the heat sink 1 on the printed circuit board 3 . The fixing device 2 of the heat sink 1 includes a connecting portion 21 and a pin 22 , wherein the connecting portion 21 is riveted on the side of the bottom of the heat sink 1 , and the pin 22 extends downward from the bottom of the connecting portion 21 . When the heat sink 1 is to be fixed on the printed circuit board 3, the pins 22 of the fixing device 2 are first inserted into the corresponding jacks 31 of the printed circuit board 3, and then the heat sink 1 can be fixed on the printed circuit board 3 after soldering. on the printed circuit board 3.

However, in order to increase the usable area of the printed circuit board 3, the fixing device 2 of the heat sink 1 is made of a thinner metal plate. The heat sink 1 has a certain weight, if it is not firmly positioned on the printed circuit board 3 due to the weak mechanical strength of the pin 22 or insufficient tin due to the small area of the pin 22 during assembly, transportation or use, it will cause The fixing device 2 is deformed and cannot effectively support the heat sink 1 . Furthermore, the shaking force will also be transmitted to the transistor (not shown) locked on the heat sink 1 through the fixing device 2 , causing the pins of the transistor inserted into the printed circuit board 3 to break. In addition, the above-mentioned force will also be transmitted to the printed circuit board 3 through the pins of the transistor (not shown), causing the copper foil on the printed circuit board 3 to lift or break, or to cause the pins 22 to be fixed on the tin of the printed circuit board 3 to break. Or tilting, causing the heat sink 1 to be poorly fixed and topple over, which in turn affects the connection circuit of the printed circuit board 3, causing poor contact in the lighter case, and a short circuit in the more severe case.

Therefore, there is a trend to develop a heat sink fixing device capable of stably fixing the heat sink on the printed circuit board.

Contents of the invention

The main purpose of the present invention is to provide a heat sink fixing device for fixing a heat sink to a printed circuit board, so as to enhance the bending stress that the pins can bear, and prevent the heat sink from toppling and affecting the printed circuit board. Connect the lines.

Another object of the present invention is to provide a heat sink fixing device, which is used to enhance the supporting force of the pins to support the heat sink, so that the weight of the heat sink will not be transmitted to the transistor pins on the heat sink, thereby avoiding the transistor pin Fracture and lifted or broken printed circuit board copper foil.

Another object of the present invention is to provide a heat sink fixing device, which is used to increase the tin area of the pins, and avoid tin cracking or warping after soldering, which will affect the heat sink fixing on the printed circuit board. stability.

To achieve the above purpose, the present invention provides a heat sink fixing device for fixing a heat sink to a printed circuit board. The heat sink fixing device includes: a connection part, which is used to fix on one side of the heat sink; an extension part, which is connected to the connection part; a first pin, which is formed by a part of the edge of the bottom of the connection part extending downwards for insertion into the printed circuit board; and a second pin extending downward from a part of the edge of the bottom of the extension and connected to the first pin for insertion into the printed circuit board the printed circuit board.

According to the concept of the present invention, the widths of the first leg and the second leg are respectively smaller than the bottom widths of the connecting portion and the extending portion.

According to the concept of the present invention, the connection portion, the extension portion, the first leg and the second leg are integrally formed.

According to the concept of the present invention, the first pin is connected to the second pin to form a substantially L-shaped pin structure.

According to the concept of the present invention, the included angle between the extending portion and the connecting portion is substantially 90 degrees.

According to the idea of the present invention, the heat sink fixing device is made of metal plate.

According to the idea of the present invention, the heat sink is made of aluminum or copper.

To achieve the above purpose, the present invention also provides a heat sink fixing device for fixing a heat sink to a printed circuit board. The heat sink fixing device includes: a connecting part, used to be fixed on one side of the heat sink; a first pin, which extends downward from a part of the bottom edge of the connecting part, and is used for inserting and planting on the printed circuit a board; and an extension part connected to the connection part and the first pin for inserting a part of the extension part into the printed circuit board.

According to the concept of the present invention, the width of the first pin is smaller than the width of the bottom of the connecting portion.

According to the concept of the present invention, the connecting portion, the extending portion and the first pin are integrally formed.

According to the concept of the present invention, the first pin is connected with the extension part to form a substantially L-shaped pin structure.

According to the concept of the present invention, the included angle between the extending portion and the connecting portion is substantially 90 degrees.

According to the idea of the present invention, the heat sink fixing device is made of metal plate.

According to the idea of the present invention, the heat sink is made of aluminum or copper.

According to the concept of the present invention, the fixing device further includes an extending rib extending from a portion of the edge of the bottom of the connecting portion in a direction perpendicular to the first pin for assisting in positioning the heat sink.

To achieve the above purpose, the present invention also provides a heat sink structure, which includes: a heat sink; and a fixing device disposed on a side surface of the bottom of the heat sink for fixing the heat sink to a printed circuit board. Wherein, the fixing device includes: a connection part, which is fixed on a side of the heat sink; an extension part, which is connected to the connection part; a first pin, which is downward from a part edge of the bottom of the connection part an extension for plugging into the printed circuit board; and a second pin extending downward from a part of the edge of the bottom of the extension and connected to the first pin for plugging into the printed circuit board circuit board.

To achieve the above purpose, the present invention also provides a heat sink structure, which includes: a heat sink; and a fixing device disposed on a side surface of the bottom of the heat sink for fixing the heat sink to a printed circuit board. Wherein, the fixing device includes: a connecting part, which is fixed on one side of the heat sink; a first pin, which extends downward from a part of the bottom edge of the connecting part, and is used for inserting and planting on the printed circuit board and an extension part connected to the connection part and the first pin for inserting part of the extension part into the printed circuit board.

The heat sink fixing device of the present invention can enhance the mechanical strength of the pins and increase the bending stress that the pins can bear, so the heat sink will not be toppled and affect the connection lines of the printed circuit board. In addition, the pins of the heat sink fixing device can support the front, rear, left, and right forces of the heat sink, so the weight of the heat sink will not be transmitted to the transistor pins on the heat sink, so the breakage of the transistor pins and the lifting of the copper foil on the printed circuit board can be avoided or broken. Furthermore, the L-shaped pin structure of the heat sink fixing device, after being inserted into the printed circuit board, due to the increased tin area, it is not easy to cause tin cracking or warping after soldering, and can firmly fix the heat sink on the printed circuit board.

Description of drawings

FIG. 1 is a schematic diagram of a conventional heat sink fixed on a printed circuit board.

FIG. 2 is a structural diagram showing a heat sink fixed to a printed circuit board using a heat sink fixing device according to a preferred embodiment of the present invention.

FIG. 3 is a structural diagram showing a heat sink fixed to a printed circuit board by using another preferred embodiment of the heat sink fixing device of the present invention.

FIG. 4 is a structural diagram showing a heat sink fixed to a printed circuit board by using a heat sink fixing device according to another preferred embodiment of the present invention.

Wherein, the reference signs are explained as follows:

1, 4 Heat sink 2, 5 Fixing device:

3, 6 Printed circuit board 21, 51 Connection part:

52 Extensions 22 Pins:

53 The first pin 54 The second pin:

55, 56 Edge 57 Extended Rib:

31, 61 jack:

Detailed ways

Please refer to FIG. 2 , which shows a structural diagram of fixing a heat sink to a printed circuit board using a heat sink fixing device according to a preferred embodiment of the present invention. As shown in FIG. 2 , a fixing device 5 is provided at the bottom of the heat sink 4 for fixing the heat sink 4 to the printed circuit board 6 . The heat sink 4 is mainly made of metal materials with high thermal conductivity such as aluminum and copper, and the shape can be changed according to needs to increase the heat dissipation area. The heat sink 4 can lock a high-power transistor (not shown) on the heat sink 4 , thereby providing a heat dissipation area in a direction perpendicular to the printed circuit board 6 to dissipate heat.

The fixing device 5 of the heat sink 4 includes a connecting portion 51, an extension portion 52, a first pin 53 and a second pin 54, wherein the connecting portion 51 is riveted and fixed on any side of the bottom of the heat sink 4, and is connected with The extensions 52 are connected. In this embodiment, the connection angle between the extension part 52 and the connection part 51 is substantially 90 degrees, but it is not limited thereto. The first pin 53 extends downward from a portion of the bottom edge of the connecting portion 51 , and the second pin 54 extends downward from a portion of the bottom edge of the extension portion 52 and is connected to the first pin 53 . In this embodiment, the connection angle between the first pin 53 and the second pin 54 is substantially 90 degrees, but not limited thereto, so as to form an overall L-shaped pin structure. In addition, the widths of the first pin 53 and the second pin 54 are smaller than the widths of the connecting portion 51 and the bottom of the extending portion 52 respectively. In some embodiments, it is preferable that the connecting portion 51 , the extension portion 52 , the first pin 53 and the second pin 54 are integrally formed.

Please refer to FIG. 2 again. When the heat sink 4 is to be fixed on the printed circuit board 6, the L-shaped pin structure formed by connecting the first pin 53 and the second pin 54 of the fixing device 5 will be inserted into the printed circuit board. The corresponding jack 61 of the board 6, and the bottom edge 55 of the connecting part 51 and the bottom edge 56 of the extension part 52 will touch the printed circuit board 6, so that the heat sink 4 is positioned on the printed circuit board 6, and then it can be finished after tinning The heat sink 4 is firmly fixed on the printed circuit board 6 . Since the first pin 53 of the fixing device 5 is connected to the second pin 54, the mechanical strength of the pin is enhanced, and the bending stress can be increased, so the heat sink 4 will not fall and affect the printed circuit board 6 connection lines. In addition, the first pins 53 and the second pins 54 can support the front, rear, left, and right forces of the heat sink, so the weight of the heat sink will not be transferred to the transistor pins on the heat sink, so the breakage of the transistor pins and the printed circuit board can be avoided. Copper foil is warped or broken. Furthermore, the L-shaped pin structure formed by the connection of the first pin 53 and the second pin 54 is not easy to produce tin after soldering due to the increased tin area after being inserted and planted on the printed circuit board 6. cracked or warped, so the heat sink 4 can be firmly fixed to the printed circuit board 6 .

Please refer to FIG. 3 , which shows a structural diagram of fixing a heat sink to a printed circuit board using another preferred embodiment of the heat sink fixing device of the present invention. As shown in FIG. 3 , the fixing device 5 of the heat sink 4 includes a connecting portion 51 , an extension portion 52 and a first pin 53 , wherein the connecting portion 51 is riveted and fixed on any side of the bottom of the heat sink 4 , and is connected to the extension. part 52 is connected. In this embodiment, the connection angle between the extension part 52 and the connection part 51 is substantially 90 degrees, but it is not limited thereto. The first pin 53 extends downward from a portion of the bottom edge of the connection portion 51 and is connected to the extension portion 52 . In this embodiment, the connection angle between the first pin 53 and the extension portion 52 is substantially 90 degrees, but not limited thereto, so as to form an overall L-shaped pin structure. In addition, the width of the first pin 53 is smaller than the width of the bottom of the connecting portion 51 . In some embodiments, it is preferable that the connecting portion 51 , the extension portion 52 and the first pin 53 are integrally formed.

Please refer to FIG. 3 again. When the heat sink 4 is to be fixed on the printed circuit board 6, the L-shaped pin structure formed by the first pin 53 of the fixing device 5 and the extension part 52 will be inserted into the printed circuit board 6. Corresponding to the socket 61, the bottom edge 55 of the connecting portion 51 will be against the printed circuit board 6, so that the heat sink 4 is positioned on the printed circuit board 6, and then the heat sink 4 can be firmly fixed on the printed circuit board after soldering. 6 on.

In some embodiments, in order to fix the heat sink 4 on the printed circuit board 6 more firmly, the heat sink fixing device 5 can also add an extending rib 57 , as shown in FIG. 4 . The extending rib 57 extends from a portion of the bottom edge of the connecting portion 51 in a direction perpendicular to the first pin 53 . When the heat sink 4 is fixed to the printed circuit board 6, the L-shaped pin structure formed by the first pin 53 and part of the connecting portion 52 will be inserted into the corresponding socket 61 on the printed circuit board 6, and the extending rib 57 will Press against the printed circuit board 6 so that the heat sink 4 is positioned on the printed circuit board 6 , and then the heat sink 4 can be firmly fixed on the printed circuit board 6 after soldering.

To sum up, the heat sink fixing device of the present invention can enhance the mechanical strength of the pins and increase the bending stress that the pins can bear, so that the heat sink will not tip over and affect the connection circuit of the printed circuit board. In addition, the pins of the heat sink fixing device can support the front, rear, left, and right forces of the heat sink, so the weight of the heat sink will not be transmitted to the transistor pins on the heat sink, so the breakage of the transistor pins and the lifting of the copper foil on the printed circuit board can be avoided or broken. Furthermore, the L-shaped pin structure of the heat sink fixing device, after being inserted into the printed circuit board, due to the increased tin area, it is not easy to cause tin cracking or warping after soldering, and can firmly fix the heat sink on the printed circuit board.

The present invention can be modified by those skilled in the art without departing from the protection scope of the claims of the present application.

Claims (12)

1. radiating fin fixing device, with so that a fin is fixed in a printed circuit board (PCB), this radiating fin fixing device comprises:

A junction, it is used for fixing the side at this fin;

One extension, it is connected in this connecting portion;

One first pin, it is that part edge by this connecting portion bottom extends downwards, in order to transplanting in this printed circuit board (PCB); And

One second pin, it is that part edge by this extension bottom extends downwards, and is connected with this first pin, in order to transplanting in this printed circuit board (PCB).

2. radiating fin fixing device as claimed in claim 1, the width that it is characterized in that this first pin and this second pin are respectively less than the width of this connecting portion and this extension bottom.

3. radiating fin fixing device as claimed in claim 1 is characterized in that this connecting portion, this extension, this first pin and this second pin are formed in one.

4. radiating fin fixing device as claimed in claim 1 is characterized in that this first pin is connected with this second pin, to constitute the leg structure of L type.

5. radiating fin fixing device as claimed in claim 1, the angle that it is characterized in that this extension and this connecting portion are 90 degree.

6. radiating fin fixing device as claimed in claim 1 it is characterized in that this radiating fin fixing device is to be made by sheet metal, and this fin is to be made of aluminum or copper.

7. radiating fin fixing device, with so that a fin is fixed in a printed circuit board (PCB), this radiating fin fixing device comprises:

A junction, it is used for fixing the side at this fin;

One first pin, it is that part edge by this connecting portion bottom extends downwards, in order to transplanting in this printed circuit board (PCB); And

One extension, it is connected in this connecting portion and this first pin, to be used for this extension transplanting of part in this printed circuit board (PCB).

8. radiating fin fixing device as claimed in claim 7 is characterized in that also comprising that one extends rib, and it is that part edge by this connecting portion bottom extends with the direction perpendicular to this first pin, in order to this fin of assist location.

9. heat radiating fin structure, it comprises:

One fin; And

One fixture, it is arranged at a side of this fin bottom, and in order to fix this fin in a printed circuit board (PCB), this fixture comprises:

A junction, it is fixed in a side of this fin;

One extension, it is connected in this connecting portion;

One first pin, it is that part edge by this connecting portion bottom extends downwards, in order to transplanting in this printed circuit board (PCB); And

One second pin, it is that part edge by this extension bottom extends downwards, and is connected with this first pin, in order to transplanting in this printed circuit board (PCB).

10. heat radiating fin structure as claimed in claim 9, the width that it is characterized in that this first pin and this second pin are respectively less than the width of this connecting portion and this extension bottom.

11. a heat radiating fin structure, it comprises:

One fin; And

One fixture, it is arranged at a side of this fin bottom, and in order to fix this fin in a printed circuit board (PCB), this fixture comprises:

A junction, it is fixed in a side of this fin;

One first pin, it is that part edge by this connecting portion bottom extends downwards, in order to transplanting in this printed circuit board (PCB); And

One extension, it is connected in this connecting portion and this first pin, to be used for this extension transplanting of part in this printed circuit board (PCB).

12. heat radiating fin structure as claimed in claim 11, it is characterized in that this fixture comprises that also one extends rib, it is that part edge by this connecting portion bottom extends with the direction perpendicular to this first pin, in order to this fin of assist location, and wherein this connecting portion, this extension and this first pin are formed in one.

Images