CN100377327C - Method for replanting ball of integrated circuit packaged by ball grid array - Google Patents
Method for replanting ball of integrated circuit packaged by ball grid array Download PDFInfo
- Publication number
- CN100377327C CN100377327C CNB2004100157269A CN200410015726A CN100377327C CN 100377327 C CN100377327 C CN 100377327C CN B2004100157269 A CNB2004100157269 A CN B2004100157269A CN 200410015726 A CN200410015726 A CN 200410015726A CN 100377327 C CN100377327 C CN 100377327C
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- ball
- integrated circuit
- replanting
- frame
- balls
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Abstract
The present invention provides a ball replanting method for an integrated circuit with ball grid array package. The traditional ball replanting method has the problems of need of dedicated fittings and high cost. The present invention comprises the steps that rims which are cut when the integrated circuit with ball grid array package is produced are collected and reserved; the integrated circuit to be replanted with balls is processed to remove tin balls; the integrated circuit from which the tin balls are removed is spliced to the rims; the rims which are spliced with the integrated circuit to be replanted with the balls are put in a ball replanting device for replanting the balls. The present invention has the advantages of high quality of replanted balls, high efficiency and low cost.
Description
Technical field
The present invention relates to the ball-establishing method again of integrated circuit, relate in particular to a kind of ball-establishing method again of the integrated circuit to BGA Package.
Background technology
BGA Package technology (BGA-Ball Grid Array) is a kind of common semiconductor product packing forms, and its application is that the tin ball by the integrated circuit (IC) products back side is attached on the printed circuit board (PCB) (PCB).When suspecting that a BGA integrated circuit (IC) products is out of order, it need be taken off the failure analysis of being correlated with again usually from pcb board.But the tin ball of the BGA integrated circuit (IC) products of taking off from pcb board is incomplete certainly, some also can clinkering together, this just makes the test of back and analyzes and can't carry out.So the tin ball of BGA integrated circuit (IC) products is regained one's integrity is a primary problem that solves.
The method that present each producer takes mainly contains two kinds, simply introduces respectively below.The first step of all methods all is to remove the tin ball that remains on the product clean earlier.Just plant again on the method for ball and have difference how.
First method is manual operations.This method utilizes filter screen and tweezers that the tin spherical pendulum is placed on the ball position of planting of product, carries out high temperature reflux welding (REFLOW) then.The shortcoming of manual method is that efficient is low, and is not easy to operate when the nodule number of product is a lot, and the tin spherical pendulum is put and had deviation easily to cause failure welding slightly.
Second method is: some companies have have therefore designed and developed special mould and technology is planted ball again, principle is earlier the tin ball to be fixed on the special scraps of paper, make its spherical array with product arranged evenly in full accord, then the scraps of paper are overlayed on the ball position of planting of waiting to plant the ball product, put into special stainless steel mould together, carry out the high temperature reflux weldering, at last the scraps of paper are taken off.The advantage of this method is that to plant the quality of ball again good, speed is fast, shortcoming is to buy special instrument, and the BGA product of every kind of different size and the different ball grid array scraps of paper that distribute and all will buy corresponding with it mould and embed the tin ball, and the price of these accessories is relatively more expensive.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of simple and easy to do, and the integrated circuit that quality is good, efficient is high, cost is low ball-establishing method again.
According to above-mentioned purpose, the integrated circuit to BGA Package of the present invention ball-establishing method again comprises the following step:
Collect and the frame under the cutting when keeping the integrated circuit of production BGA Package;
Treat the integrated circuit of planting ball again and carry out tin ball removal process;
The above-mentioned integrated circuit of having removed the tin ball is spliced on the above-mentioned frame;
The frame that splicing is remained to be planted again the integrated circuit of ball is put into and is planted ball in the ball attachment machine again.
In above-mentioned integrated circuit ball-establishing method again, utilize adhesive tape that integrated circuit is spliced on the described frame.
From as can be seen above-mentioned, method of the present invention has following advantage:
1, quality height: owing to be to be operated by ball attachment machine, the quality of planting ball when making the quality of planting ball again and volume production is duplicate;
2, at the bottom of the cost: use the ball attachment machine of original production BGA product to plant ball again, do not need to acquire any accessory; And used frame also is to produce remaining waste material, and can reuse when planting ball.
Description of drawings
Fig. 1 is the schematic diagram of planting the used substrate of ball on ball attachment machine;
Fig. 2 plants after the ball, has cut the schematic diagram of the frame behind the integrated circuit;
Fig. 3 is a schematic diagram for the treatment of to plant again the integrated circuit of ball.
Embodiment
The present invention considers that general integrated circuit encapsulation factory had all possessed the used ball attachment machine of large-scale production originally, is that this ball attachment machine can only be planted the ball exercise work at whole long substrate, can not handle single integrated circuit (IC) products after cutting.The present invention simultaneously also notices under present manufacturing condition, the substrate of whole piece is after cutting down integrated circuit, left frame, because high-quality cutting technique, residual frame can also coincide well in incision with the integrated circuit (IC) products of cutting-out and be in the same place.Fig. 1 shows the schematic diagram of planting the used substrate of ball on ball attachment machine, and Fig. 2 shows and plants after the ball, has cut the schematic diagram of the frame behind the integrated circuit.
In conjunction with above-mentioned situation, the present invention proposes a kind of ball-establishing method again of the integrated circuit to BGA Package, it comprises the following step:
At first, for the BGA product of present production, the frame (as shown in Figure 2) that cutting stays during with volume production is collected and is kept; Then, treat the integrated circuit (as shown in Figure 3) of planting ball again and carry out tin ball removal process, the method for removal can use conventional methods carries out.
Then, the integrated circuit (as shown in Figure 3) of having removed the tin ball is spliced on the frame (as shown in Figure 2); And the frame that splicing remains to be planted again the integrated circuit of ball put into plant ball in the ball attachment machine again.
Purpose during splicing, can integrated circuit be spliced on the frame, also can adopt other bonding way, as long as can bond to integrated circuit on the frame again identically by adhesive tape.
Claims (2)
1. one kind to the integrated circuit of BGA Package ball-establishing method again, comprises the following step:
Collect and the frame under the cutting when keeping the integrated circuit of production BGA Package;
Treat the integrated circuit of planting ball again and carry out tin ball removal process;
The above-mentioned integrated circuit of having removed the tin ball is spliced on the above-mentioned frame;
The frame that splicing is remained to be planted again the integrated circuit of ball is put into and is planted ball in the ball attachment machine again.
2. the integrated circuit to BGA Package as claimed in claim 1 is ball-establishing method again, it is characterized in that, utilizes adhesive tape that integrated circuit is spliced on the described frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100157269A CN100377327C (en) | 2004-01-09 | 2004-01-09 | Method for replanting ball of integrated circuit packaged by ball grid array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100157269A CN100377327C (en) | 2004-01-09 | 2004-01-09 | Method for replanting ball of integrated circuit packaged by ball grid array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1641850A CN1641850A (en) | 2005-07-20 |
| CN100377327C true CN100377327C (en) | 2008-03-26 |
Family
ID=34868073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100157269A Expired - Fee Related CN100377327C (en) | 2004-01-09 | 2004-01-09 | Method for replanting ball of integrated circuit packaged by ball grid array |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100377327C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076178B (en) * | 2010-11-23 | 2013-05-08 | 东莞技研新阳电子有限公司 | Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5729894A (en) * | 1992-07-21 | 1998-03-24 | Lsi Logic Corporation | Method of assembling ball bump grid array semiconductor packages |
| US5884396A (en) * | 1997-05-01 | 1999-03-23 | Compeq Manufacturing Company, Limited | Transfer flat type ball grid array method for manufacturing packaging substrate |
| US5926696A (en) * | 1994-01-12 | 1999-07-20 | Lucent Technologies Inc. | Ball grid array plastic package |
| US6083776A (en) * | 1995-11-07 | 2000-07-04 | Philips Electronics North America Corporation | Molded lead frame ball grid array |
| US20030034553A1 (en) * | 2001-08-15 | 2003-02-20 | Kazuaki Ano | Low profile ball-grid array package for high power |
| US20030170444A1 (en) * | 2002-03-05 | 2003-09-11 | Stewart Steven L. | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
-
2004
- 2004-01-09 CN CNB2004100157269A patent/CN100377327C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5729894A (en) * | 1992-07-21 | 1998-03-24 | Lsi Logic Corporation | Method of assembling ball bump grid array semiconductor packages |
| US5926696A (en) * | 1994-01-12 | 1999-07-20 | Lucent Technologies Inc. | Ball grid array plastic package |
| US6083776A (en) * | 1995-11-07 | 2000-07-04 | Philips Electronics North America Corporation | Molded lead frame ball grid array |
| US5884396A (en) * | 1997-05-01 | 1999-03-23 | Compeq Manufacturing Company, Limited | Transfer flat type ball grid array method for manufacturing packaging substrate |
| US20030034553A1 (en) * | 2001-08-15 | 2003-02-20 | Kazuaki Ano | Low profile ball-grid array package for high power |
| US20030170444A1 (en) * | 2002-03-05 | 2003-09-11 | Stewart Steven L. | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1641850A (en) | 2005-07-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090116 Address after: Shanghai Guo Shou Jing Road, Pudong Zhangjiang hi tech Park No. 669 Patentee after: Riyueguang Packaging & Test (shanghai) Co., Ltd. Address before: Shanghai Guo Shou Jing Road, Pudong Zhangjiang hi tech Park No. 669 Patentee before: Weiyu Tech Test Packing Co., Ltd. |
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| ASS | Succession or assignment of patent right |
Owner name: RIYUEGUANG ENCAPSULATION TESTING ( SHANGHAI ) CO., Free format text: FORMER OWNER: WEIYU TECHNOLOGY TEST ENCAPSULATION CO., LTD. Effective date: 20090116 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080326 Termination date: 20160109 |
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| CF01 | Termination of patent right due to non-payment of annual fee |