CN100371726C - Chip probe tester - Google Patents

Abstract

A chip probe tester. In order to provide an auxiliary device for manufacturing a liquid crystal display panel, which can inspect the quality of unpackaged semiconductors, reduce the cost of a packaging process and improve the yield of the packaging process, the invention is provided, which comprises a bearing seat, a tray arranged on the surface of the bearing seat and a probe card arranged above the tray; the tray comprises at least one groove for bearing at least one unpackaged liquid crystal silicon crystal display panel and a conductive connecting structure arranged on one side of the groove; the connecting structure comprises a first part and a second part, wherein the first part is used for being electrically contacted with the first contact pad, and the second part is electrically connected with the first part; the probe card is arranged on the tray and comprises at least two probes for electrically contacting the second contact pad and the second part of the connecting structure.

Description

Chip needle testing machine

technical field

The invention belongs to an auxiliary device for manufacturing a liquid crystal display panel, in particular to a chip needle testing machine.

Background technique

The liquid crystal on silicon display panel (LCOS) not only has technical advantages such as small pixel size, high brightness and high resolution, but also has the advantages of simple manufacturing process, low cost and small size. Therefore, LCD silicon display panels have been widely used in portable personal communication audio-visual equipment such as portable cameras, mobile phones with Internet access, and audio-visual equipment such as projection TVs and multimedia projectors.

As shown in Fig. 1 and Fig. 2, when conventionally making liquid crystal silicon crystal display panels, firstly, a semiconductor substrate 10 is provided; and the semiconductor substrate 10 includes several chips 14, and each chip 14 includes a An active matrix circuit (active matrix array, not shown) of the pixel circuit of the panel 16 and several welding pads 26 for electrically connecting the liquid crystal silicon display panel 16 to external circuits. Next, an alignment film 20 a is formed on the surface of the semiconductor substrate 10 ; and then a sealant pattern 22 is formed on the peripheral area of each chip 14 .

Next, a glass substrate 12 parallel to and opposite to the semiconductor substrate 10 is provided, and a conductive photoresist layer 18 and an alignment film 20 b are sequentially formed on the surface of the transparent substrate 12 . The conductive photoresist layer 18 is used as a common electrode and a color filter, and the alignment films 20a and 20b are used to adjust the alignment direction of liquid crystal molecules, which include polyimide resin, silicon dioxide (SiO ₂ ) Or silicon nitride (SiNx) and other materials. Then, an assembly process is carried out so that the glass substrate 12 is bonded to the semiconductor substrate 10 through the sealant patterns 22, and then along the dicing lines 13 on the glass substrate 12 and the dicing lines 11 on the semiconductor substrate 10. , cutting the glass substrate 12 and the semiconductor substrate 10 into individual liquid crystal silicon display panels 16 . Then, a filling process is performed to pour liquid crystal molecules between the glass substrate 12 and the semiconductor substrate 10 to form a liquid crystal molecule layer 24 between the glass substrate 12 and the semiconductor substrate 10 , thereby completing each liquid crystal silicon display panel 16 . Finally, an encapsulation process is performed to encapsulate each liquid crystal silicon display panel 16 into display elements required by various electronic devices.

It is worth noting that, due to the low process yield of forming the conductive photoresist layer 18 on the glass substrate 12 and bonding the glass substrate 12 to the semiconductor substrate 10, the liquid crystal silicon display panel 16 often has defects, thereby degrading the display. quality or the picture cannot be displayed. However, as shown in FIG. 2 , for an unpackaged liquid crystal display panel 16 , the conductive photoresist layer 18 of the glass substrate 12 and the contact pad 26 of the semiconductor substrate 10 are located on opposite sides. The design of the present invention cannot conduct electrical tests on such elements, so these liquid crystal silicon display panels 16 that have defects before packaging are usually detected after the packaging is completed, thereby increasing the packaging cost and reducing the packaging quality. Therefore, finding a needle testing machine that can be used to test the unpackaged liquid crystal silicon display panel 16 is an important key to solve the above problems.

Contents of the invention

The purpose of the present invention is to provide a chip needle testing machine capable of inspecting the quality of unpackaged semiconductors, reducing the cost of the packaging process, and improving the yield of the packaging process.

The present invention is used to test at least one liquid crystal silicon display panel including first and second substrates respectively provided with first and second contact pads and a liquid crystal molecular layer arranged between the first and second substrates; The tray on the surface of the bearing seat and the probe card installed above the tray; the tray includes at least one groove for supporting at least one unpackaged liquid crystal silicon display panel and a conductive The connection structure; the connection structure includes a first part used to electrically contact the first contact pad and a second part electrically connected to the first part; the probe card is arranged on the tray, which includes a second part used to electrically contact the second contact pad and the second part electrically connected to the first part; At least two probes of the second portion of the structure are connected.

in:

The first substrate of the liquid crystal silicon display panel partially overlaps the second substrate, and the first contact pad is located on the surface of the first substrate that does not overlap the second substrate; the second contact pad is located on the surface of the second substrate that does not overlap the first substrate .

The second substrate is a semiconductor substrate; the first substrate is a transparent substrate.

The first contact pad on the first substrate is a conductive photoresist layer; the second contact pad on the second substrate is a welding pad.

The first substrate is a semiconductor substrate; the second substrate is a transparent substrate.

The first contact pad on the first substrate is a welding pad; the second contact pad on the second substrate is a conductive photoresist layer.

The second part of the connection structure is the contact pad.

The first part of the connection structure is a conductive clip.

The first part of the connecting structure includes at least one conductive probe.

The first part of the connection structure is a contact pad arranged on the surface of the tray.

An unpackaged liquid crystal silicon display panel is placed in each groove of the tray.

Several connected unpackaged liquid crystal silicon display panels are placed in each groove of the tray.

A chip needle testing machine, which is used to test a chip comprising at least one first contact pad and at least one second contact pad; it includes a carrier, a tray arranged on the surface of the carrier, and a probe installed above the tray The card; the tray includes at least one groove for holding at least one unpackaged chip and a conductive connection structure installed on one side of the groove; the connection structure includes a first part for electrical contact with the first contact pad and a The first part is electrically connected to the second part; the probe card is arranged on the tray, which includes at least two probes for electrically contacting the second contact pad and the second part of the connection structure.

Unpackaged chips are unpackaged liquid crystal silicon display panels.

The unencapsulated liquid crystal silicon display panel includes a transparent substrate, a semiconductor substrate partially overlapping the transparent substrate, a layer of liquid crystal molecules disposed between the transparent substrate and the semiconductor substrate, and a liquid crystal molecule layer disposed on the surface of the transparent substrate and partially located between the transparent substrate and the liquid crystal molecules. The conductive photoresist layer between them and at least one welding pad arranged on the surface of the semiconductor substrate that does not overlap with the transparent substrate.

The first contact pad is a conductive photoresist layer; the second contact pad is a welding pad.

The first contact pad is a welding pad; the second contact pad is a conductive photoresist layer.

The second part of the connection structure is a contact pad disposed on the surface of the tray.

The first part electrically connected to the second part is a conductive clip.

The first part electrically connected to the second part includes at least one conductive probe.

The first portion electrically connected to the second portion is a contact pad disposed on the surface of the tray.

One unpackaged chip is placed in each groove of the tray.

Several connected unpackaged chips are placed in each groove of the tray.

Since the present invention includes a bearing base, a tray arranged on the surface of the bearing base, and a probe card installed above the tray; the tray includes at least one groove and a device for supporting at least one unpackaged liquid crystal silicon display panel A conductive connection structure on one side of the groove; the second connection structure includes a first part used to electrically contact the first contact pad and a second part electrically connected to the first part; the probe card is arranged on the tray, which includes At least two probes for electrically contacting the second contact pad and the second part of the connection structure. Compared with the prior art, the present invention has a tray that includes a groove and a connecting structure on one side of the groove, and since each probe on the probe card can be electrically contacted to the unpackaged through the connecting structure Therefore, the present invention can conduct an electrical test on the unpackaged liquid crystal silicon display panel, that is, the present invention can first check the display quality of the unpackaged liquid crystal silicon display panel, and then distinguish the liquid crystal silicon display panel. Whether the display panel can be used to display the picture, if the liquid crystal silicon display panel can be used to display the picture, continue the subsequent packaging process; but if the test results show that the liquid crystal silicon display panel cannot be used to display the picture, the liquid crystal silicon display will be scrapped directly The panel or rework process can not only inspect the quality of unpackaged semiconductors, but also reduce the cost of the packaging process and improve the yield of the packaging process, so as to achieve the purpose of the present invention.

Description of drawings

FIG. 1 is a schematic diagram of a conventional method for manufacturing a liquid crystal silicon display panel.

Fig. 2 is a schematic side view of the structure of an unpackaged liquid crystal silicon display panel.

Fig. 3 is a schematic diagram of a partial structure of the present invention.

Fig. 4 is a schematic top view of the tray structure of the present invention.

Fig. 5 is a schematic diagram of the use state of the present invention.

Fig. 6 is a schematic top view of the tray structure of the present invention (the first part of the connection structure includes at least one conductive probe).

Fig. 7 is a schematic top view of the tray structure of the present invention (the first part of the connection structure is the contact pad).

Fig. 8 is a schematic top view of the tray structure of the present invention (including several grooves respectively supporting an unpackaged liquid crystal silicon display panel).

Fig. 9 is a schematic top view of the tray structure of the present invention (including several grooves respectively supporting several unpackaged liquid crystal silicon display panels).

FIG. 10 is a schematic top view of the structure of several connected unpackaged liquid crystal silicon display panels.

Detailed ways

The chip needle testing machine 30 of the present invention is used to test at least one unpackaged liquid crystal silicon display panel 16 .

The unpackaged liquid crystal silicon display panel 16 includes a first substrate 12 , a second substrate 10 and a liquid crystal molecule layer 24 disposed between the first and second substrates 12 , 10 . The first substrate 12 is a transparent substrate on which a conductive photoresist layer 18 serving as a first contact pad is disposed. The second substrate 10 is a semiconductor substrate, on which are provided second contact pads 26 which are solder pads. The first and second substrates 12 and 10 are partially overlapped.

The first substrate 12 can also be a semiconductor substrate; the second substrate 10 is a transparent substrate. The first contact pads on the first substrate 12 are solder pads. The second contact pad on the second substrate 10 is a conductive photoresist layer 18 .

Wherein the first and second substrates 12 and 10 are partially overlapped. The first contact pad is located on the surface of the first substrate 12 not overlapping the second substrate 10 . The second contact pad is located on the surface of the second substrate 10 not overlapping the first substrate 12 . When the first contact pad is the conductive photoresist layer 18 , the first contact pad is also located on the surface of the first substrate 10 overlapping with the second substrate 10 . When the second contact pad is the conductive photoresist layer 18 , the second contact pad is also located on the surface of the second substrate 10 overlapping with the first substrate 12 .

The chip needle tester 30 of the present invention can also be used to test at least one unpackaged chip including at least one first contact pad and second contact pad. The unpackaged chip can be an unpackaged liquid crystal silicon display panel 16 . chip.

The unencapsulated liquid crystal silicon display panel 16 comprises a transparent substrate 12, a semiconductor substrate 10 partially overlapping with the transparent substrate 12, a liquid crystal molecule layer 24 arranged between the transparent substrate 12 and the semiconductor substrate 10, a liquid crystal molecule layer 24 arranged on the surface of the transparent substrate 12 and The conductive photoresist layer 18 partially located between the transparent substrate 12 and the liquid crystal molecule layer 24 and at least one soldering pad disposed on the surface of the semiconductor substrate 10 not overlapped with the transparent substrate 12 .

As shown in FIG. 3 , the chip needle tester 30 of the present invention includes a cavity (not shown in FIG. 3 ), a carrier (chuck) 32 arranged in the cavity, and a tray (tray) arranged on the surface of the carrier 32 34. A probe card (probe card) 36 installed on the top of the tray 34 and a control structure 38 for controlling the probe card 36.

The probe card 36 includes several probes 361 for electrically contacting the chip under test. In addition, the chip needle measuring machine 30 includes a positioning structure (not shown in FIG. 3 ), the positioning structure is used to measure the position of the carrier 32 or the tray 34, and move the carrier 32 and the tray 34 to the correct position, and the chip needle Other detailed structures inside the tester 30 are similar to general chip needle testers such as TSK UF200, and will not be repeated here.

As shown in FIGS. 4 and 5 , the tray 34 includes a groove 40 , an insulating material layer 41 covering the inner wall of the groove 40 , and a conductive connection structure 42 installed on one side of the groove 40 .

The groove 40 is located at the center of the tray 34 and is used to accommodate the unpackaged LCD-Silicon display panel 16 .

The connection structure 42 has a first portion 421 and a second portion 422 electrically connected to the first portion 421 . In a preferred embodiment of the present invention, the first part 421 is a conductive clamp, which is made of a metal with excellent conductivity, such as gold. The second part 422 is a contact pad, which is made of copper metal and fixed on the tray 34 via a locking structure 46, such as a screw.

The insulating material layer 41 is made of ceramic material. In addition, the tray 34 further includes three guide pins 44 and two holes 48 at the bottom of the groove 40 .

The guide pins 44 are used to removably fix the tray 34 on the surface of the supporting seat 32 .

The hole 48 passes through the tray 34 to reach the surface of the bearing seat 32 .

Therefore, in the electrical testing process, the vacuum environment in the chip needle tester 30 can closely attract and fix the tray 34 and the liquid crystal silicon display panel 16 on the surface of the bearing seat 32, so as to prevent the liquid crystal silicon display panel 16 from being damaged by the electric current. detached during sex testing.

As shown in FIG. 5 , when the chip needle testing machine 30 intends to perform an electrical test on the unpackaged liquid crystal silicon display panel 16, firstly, the unpackaged liquid crystal silicon display panel 16 is loaded into the recess of the tray 34 by machine or manually. groove 40, and make the conductive jig 421 clamp the glass substrate 12, and allow the conductive jig 421 to electrically contact the conductive photoresist layer 18 on the surface of the glass substrate 12; then fix the tray 34 on the surface of the bearing seat 32; then , carry out the wafer alignment step (wafer alignment step), use the aforementioned positioning structure to measure and move the positions of the bearing seat 32 and the tray 34, so that the contact pad 26 of the semiconductor substrate 10 is located at the correct position to be measured. It must be noted that, The two sides of the contact pads 26 for alignment must have the same pattern to ensure the precision of this chip alignment step. Subsequently, a needle alignment step is performed to calibrate the position of each probe 361. After the calibration of each probe 361 is completed, each probe 361 is electrically contacted with the contact pad 26 and the connection structure 42 respectively. The second portion 422 of the contact pad. Finally, the control structure 38 inputs a predetermined test program (test program) to the probe card 36, so that the probe card 36 uses each probe 361 to input electronic signals to the contact pad 26 and the connection structure 42 according to the predetermined test program. Two parts 422, and the second part 422, which is a contact pad, transmits electronic signals to the conductive photoresist layer 18 through the first part 421, which is a conductive fixture, so as to perform the electrical test of the liquid crystal silicon display panel 16. , and the result of the electrical test is sent back to the control structure 38 via the probes 361, and the control structure 38 processes and analyzes the result of the electrical test.

Compared with the general chip testing machine, the chip testing machine 30 of the present invention has a detachable tray 34 , and the tray 34 is provided with a groove 40 and a connecting structure 42 . The connection structure 42 includes a first portion 421 which is a conductive clip and a second portion 422 which is a contact pad. It should be noted that since the first part 421 of the connecting structure 42 is a conductive jig, it is electrically connected to the second part 422 of the contact pad on the surface of the tray 34, and can electrically contact the conductive photoresist layer 18 on the surface of the glass substrate 12, Therefore, each probe 361 on the probe card 36 can electrically contact the second part 422 of the contact pad 26 and the connection structure 42 to measure the electrical performance of the unpackaged liquid crystal silicon display panel 16, Then judge whether the liquid crystal silicon display panel 16 can be used for displaying images, if the liquid crystal silicon display panel 16 can be used for displaying images, then proceed to the subsequent packaging process; but if the test results show that the liquid crystal silicon display panel 16 cannot be used for displaying images , the liquid crystal silicon display panel 16 is directly scrapped or reworked, so that the cost of the packaging process can be reduced and the yield rate of the packaging process can be improved.

In addition, the tray 34 shown in FIG. 3 , FIG. 4 , and FIG. 5 is not the only embodiment of the present invention.

As shown in FIG. 6, the tray 34a includes a groove 40a, an insulating material layer 41 covering the inner wall of the groove 40a, and a conductive connection structure 42a installed on one side of the groove 40a.

The groove 40 a is located at the center of the tray 34 a and is used to accommodate the unpackaged LCD-Silicon display panel 16 .

The connection structure 42a includes a first portion 421a, a second portion 422a, and a wire 423 electrically connected to the first portion 421a and the second portion 422a.

The first part 421a includes at least one conductive probe.

The second portion 422a is a contact pad.

The conductive probes of the first part 421 a can be electrically connected to the second part 422 a which is a contact pad via wires 423 . Moreover, each conductive probe of the first part 421a is used to electrically contact the conductive photoresist layer 18 on the surface of the glass substrate 12, so each probe 361 on the probe card 36 can electrically contact the contact pad 26 and the connection structure. 42a is the second part 422a of the contact pad, so as to measure the electrical performance of the unpackaged liquid crystal silicon display panel 16 .

As shown in FIG. 7, the tray 34b includes a groove 40b, an insulating material layer 41 covering the inner wall of the groove 40b, and a conductive connection structure 42b installed on one side of the groove 40b.

The groove 40b is located at the center of the tray 34b and is used to accommodate the unpackaged LCD-Silicon display panel 16 .

The connection structure 42b includes a first portion 421b and a second portion 422b electrically connected to the second portion 422b and electrically connected to the first portion 421b.

Both the first and second parts 421b and 422b are contact pads.

The first part 421b, which is the contact pad, is used to electrically contact the conductive photoresist layer 18 on the surface of the glass substrate 12, so that each probe 361 on the probe card 36 can be a contact pad through electrical contact with the contact pad 26 and the connection structure 42b. The second part 422b of the second part 422b is used to measure the electrical performance of the unpackaged liquid crystal silicon display panel 16 .

Alternatively, as shown in FIG. 8 , the tray 34c includes a plurality of grooves 40c disposed therein in a matrix arrangement and a plurality of conductive connection structures respectively fixed on one side of each groove 40c. It is worth noting that each groove 40c is used to support an unpackaged liquid crystal silicon display panel 16, and each connection structure can be any connection structure 42 shown in FIG. 3, FIG. 6, and FIG. 7 ( 42a, 42b), so the chip needle testing machine 30 of this embodiment can load several liquid crystal silicon display panels 16 at the same time, and then conduct electrical tests on each liquid crystal silicon display panel 16, so that more The time to change pallets can be reduced. However, it must be noted that each LCD silicon display panel 16 must go through the chip alignment step before the probe card 36 can be used for electrical testing to ensure that the positions of each LCD silicon display panel 16 are correct.

As shown in FIG. 9 and FIG. 10 , the tray 34d includes several parallel grooves 40d and several conductive connection structures 42 respectively fixed on one side of each groove 40d. Moreover, each groove 40d is used to accommodate several connected unpackaged liquid crystal silicon display panels 16, and each connection structure 42 includes a first part 421 which is a conductive clamp and a second part 422 which is a contact pad. . It should be noted that since the glass substrates 12 of the liquid crystal silicon display panels 16 in each groove 40d are connected to each other, the first part 421, which is a conductive clamp, only needs to clamp one of the liquid crystal silicon display panels 16 in each groove 40d. The glass substrate 12 of the liquid crystal display panel 16 is enough, and then the tray 34d can be fixed on the surface of the bearing seat 32, and the electrical test is performed on each liquid crystal silicon display panel 16 in each groove 40d. However, it must be noted that the first liquid crystal silicon display panel 16 in each groove 40d must go through the chip alignment step before using the probe card 36 to align each liquid crystal silicon display panel 16 in each groove 40d. The display panel 16 undergoes an electrical test. Similarly, the chip needle testing machine 30 of this embodiment can simultaneously load several LCD-Silicon display panels 16, and then conduct electrical tests on each LCD-Silicon display panel 16 one by one. In this way, the number of replacement trays 34d can be reduced. time. On the other hand, the first part of the connection structure 42 can be a conductive clamp, and can also be replaced with a conductive probe or a contact pad.

In addition, in the above-mentioned embodiments, the first part 421 (421a, 421b) of the connection structure 42 (42a, 42b) is electrically in contact with the conductive photoresist layer 18 of the glass substrate 12, but the present invention is not limited thereto, and the present invention The liquid crystal silicon crystal display panel 16 can also be loaded into the groove 40 of the chip needle tester 30 of the present invention in an upside-down manner, so that the first part 421 (421a, 421b) of the connecting structure 42 (42a, 42b) is electrically The first part 421 ( 421 a , 421 b ) can be accurately aligned with each pad 26 on the surface of the semiconductor substrate 10 by means of a positioning structure (not shown).

Compared with the prior art, the chip needle tester 30 of the present invention has a detachable tray 34 (34a, 34b, 34c, 34d), and the tray 34 (34a, 34b, 34c, 34d) contains a groove 40 (40a , 40b, 40c) and the connection structure 42 (42a, 42b) disposed on one side of the groove 40 (40a, 40b, 40c). And, since each probe 361 on the probe card 36 can be electrically contacted on the unpackaged liquid crystal silicon display panel 16 through the connection structure 42 (42a, 42b), therefore, the chip probe testing machine 30 of the present invention An electrical test can be performed on the unpackaged liquid crystal silicon display panel 16 . In addition, since the chip needle testing machine 30 can conduct electrical tests on the unpackaged liquid crystal silicon display panel 16, the present invention can first check the display quality of the unpackaged liquid crystal silicon display panel 16, and then proceed to the packaging process. The cost of the packaging process can be reduced, and the yield rate of the packaging process can be improved.

Claims (22)

1. A chip needle testing machine, which is used to test the liquid crystal molecular layer comprising the first substrate provided with the first contact pad, the second substrate provided with the second contact pad and the liquid crystal molecule layer arranged between the first and second substrates At least one liquid crystal silicon crystal display panel; it is characterized in that it includes a bearing seat, a tray arranged on the surface of the bearing seat and a probe card installed above the tray; the tray includes at least one unpackaged liquid crystal silicon display panel At least one groove of the panel and a conductive connection structure installed on one side of the groove; the connection structure includes a first part used to electrically contact the first contact pad and a second part electrically connected to the first part; the probe card Set above the tray, it includes at least two probes for electrically contacting the second contact pad and the second part of the connection structure. 2. The chip needle tester according to claim 1, wherein the first substrate of the liquid crystal silicon display panel partially overlaps the second substrate, and the first contact pad is located on the first substrate that does not overlap the second substrate. On a substrate surface; the second contact pad is located on the second substrate surface not overlapped with the first substrate. 3. The chip probe tester according to claim 2, wherein the second substrate is a semiconductor substrate; the first substrate is a transparent substrate. 4. The chip probe tester according to claim 2 or 3, wherein the first contact pad positioned on the first substrate is a conductive photoresist layer; the second contact pad positioned on the second substrate is a solder pad. pad, and the first contact pad is simultaneously located on the surface of the first substrate overlapping the second substrate. 5. The chip probe tester according to claim 2, wherein the first substrate is a semiconductor substrate; the second substrate is a transparent substrate. 6. The chip probe tester according to claim 5, wherein the first contact pad on the first substrate is a solder pad; the second contact pad on the second substrate is a conductive photoresist layer, And the second contact pad is located on the surface of the second substrate overlapping with the first substrate at the same time. 7. The chip probe tester according to claim 1, wherein the second part of the connection structure is a contact pad. 8. The chip probe tester according to claim 1 or 7, characterized in that the first part of the connection structure is a conductive jig. 9. The chip probe tester according to claim 1 or 7, wherein the first part of the connecting structure comprises at least one conductive probe. 10. The chip probe tester according to claim 1 or 7, characterized in that the first part of the connection structure is a contact pad provided on the surface of the tray. 11. The chip probe testing machine according to claim 1, characterized in that an unpackaged liquid crystal silicon display panel is placed in each groove of the tray. 12. The chip probe tester according to claim 1, wherein a plurality of unpackaged liquid crystal silicon display panels are placed in each groove of the tray. 13. A chip needle testing machine, which is used to test an unpackaged chip comprising at least one first contact pad and at least one second contact pad; it is characterized in that it includes a carrier, a tray arranged on the surface of the carrier and The probe card installed above the tray; the tray includes at least one groove for holding at least one unpackaged chip and a conductive connection structure installed on one side of the groove; the connection structure includes a connection structure for connecting with the first contact pad The first part in electrical contact and the second part electrically connected with the first part; the probe card is arranged on the tray, which includes at least two probes for electrically contacting the second contact pad and the second part of the connection structure. 14. The chip probe testing machine according to claim 13, characterized in that said unpackaged chip is an unpackaged liquid crystal silicon display panel. 15. The chip probe testing machine according to claim 14, characterized in that said unpackaged liquid crystal silicon display panel comprises a transparent substrate, a semiconductor substrate partially overlapped with the transparent substrate, and is arranged between the transparent substrate and the semiconductor substrate a layer of liquid crystal molecules, a conductive photoresist layer disposed on the surface of the transparent substrate and partially between the transparent substrate and the layer of liquid crystal molecules, and at least one pad disposed on the surface of the semiconductor substrate that does not overlap with the transparent substrate; the conductive photoresist layer The resistance layer is a first contact pad, and the welding pad is a second contact pad. 16. The chip probe testing machine according to claim 14, characterized in that said unpackaged liquid crystal silicon display panel comprises a transparent substrate, a semiconductor substrate partially overlapped with the transparent substrate, and is arranged between the transparent substrate and the semiconductor substrate a layer of liquid crystal molecules, a conductive photoresist layer disposed on the surface of the transparent substrate and partially between the transparent substrate and the layer of liquid crystal molecules, and at least one pad disposed on the surface of the semiconductor substrate that does not overlap with the transparent substrate; the conductive photoresist layer The resistance layer is the second contact pad, and the welding pad is the first contact pad. 17. The chip probe tester according to claim 15 or 16, characterized in that the second part of the connection structure is a contact pad provided on the surface of the tray. 18. The chip probe tester according to claim 17, characterized in that the first part electrically connected to the second part is a conductive jig. 19. The chip probe tester according to claim 17, wherein the first part electrically connected to the second part comprises at least one conductive probe. 20. The chip probe tester according to claim 17, wherein the first part electrically connected to the second part is a contact pad provided on the surface of the tray. 21. The chip probe tester according to claim 13, wherein an unpackaged chip is placed in each groove. 22. The chip probe testing machine according to claim 13, wherein a plurality of connected unpackaged chips are placed in each groove.

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