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CN100371403C - mfg. method of soaking adaptable liquid epoxy resin compound, and generator thereof - Google Patents

mfg. method of soaking adaptable liquid epoxy resin compound, and generator thereof Download PDF

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Publication number
CN100371403C
CN100371403C CNB031225748A CN03122574A CN100371403C CN 100371403 C CN100371403 C CN 100371403C CN B031225748 A CNB031225748 A CN B031225748A CN 03122574 A CN03122574 A CN 03122574A CN 100371403 C CN100371403 C CN 100371403C
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epoxy resin
liquid
mentioned
weight
imidazolium compounds
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CN1539899A (en
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猪狩聪
川野崇之
本木启博
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SAKUMA CORP
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Abstract

An agent A contains 30 to 50 parts by weight of bisphenol A epoxy resin with the mean molecular weight of 300 to 600, and 50 to 70 parts by weight of alicyclic epoxy resin with condensed epoxy groups on rings. An agent B contains acid anhydride in a liquid state at ordinary temperature and imidazole compounds in a liquid state at ordinary temperature. The present invention relates to a method for preparing liquid epoxy resin compositions by mixing and stirring the agent A and the agent B which have the same weight, and a generator made by that the liquid epoxy resin compositions are immerged and hardened among enamelled wires. The quantity of the acid anhydride is larger than that of the imidazole compounds, and 2 to 4 parts by weight of the imidazole compounds are contained in 100 parts by weight of the agent A.

Description

The manufacture method of the liquid epoxy resin composition that is suitable for flooding
Technical field
The invention relates to the manufacture method and the generator of the liquid epoxy resin composition that is suitable for flooding.
Technical background
In the past, as the composition epoxy resin that is suitable for flooding usefulness, the known product that forms by alicyclic epoxy resin, dihydroxy-benzene class and acid anhydrides (the clear 57-174314 of JP-A-).When being used for the enameled wire of motor such as automobile and generator stator and rotor in making, disclosed composition epoxy resin and fixedly during enameled wire in this communique of dipping between this enameled wire, this composition epoxy resin can be immersed between the enameled wire well.Yet, because its setting rate is slow, so there is significantly low shortcoming of operating efficiency.And then, because hardening resin is insufficient to the enameled wire binding property by overlay film, so, at enameled wire and at the interface, also exist and peel off and the disruptive problem by overlay film.
Harden after making composition epoxy resin be impregnated between enameled wire, former composition epoxy resin is sold with the form that contains stiffening agent and hardening accelerator.Therefore, behind the manufacturing composition epoxy resin, through hardening after a while, so there is the problem that is difficult to preserve management.
Abstract of invention
The objective of the invention is to overcome the problems referred to above, a kind of liquid epoxy resin composition manufacture method that is suitable for flooding is provided.And then purpose of the present invention also provides a kind of generator that has used by the enameled wire of this liquid epoxy resin composition lining.
According to first point of the present invention, the liquid epoxy resin composition manufacture method that provides, the condensed epoxy base will be had on the ring, normal temperature is liquid alicyclic epoxy resin 50~70 weight parts down, revolution with regulation stirs, and under the temperature of regulation, heat, bisphenol A type epoxy resin 30~50 weight parts with molecular-weight average 300~600, slowly add in the above-mentioned alicyclic epoxy resin of stirring (A agent), normal temperature is heated under the temperature of regulation for liquid acid anhydrides down, and with the regulation revolution stir, normal temperature is heated for liquid imidazolium compounds down, and this imidazolium compounds is added in the above-mentioned acid anhydrides of stirring, and the mixture (B agent) of above-mentioned acid anhydrides and imidazolium compounds carried out froth in vacuum, 90~110 weight parts are contained the above-mentioned A agent of alicyclic epoxy resin and bisphenol A type epoxy resin and manufacturing is stirred in B agent that 90~110 weight parts contain above-mentioned acid anhydrides and imidazolium compounds.Above-mentioned A agent and above-mentioned B agent are equivalent.The amount of acid anhydrides is more than the amount of above-mentioned imidazolium compounds.Have the above-mentioned A agent of alicyclic epoxy resin and bisphenol A type epoxy resin for 100 weight parts, imidazolium compounds is 2~4 weight parts.
Aforesaid method can be in the shorter time, more effectively the uniform and stable liquid-state epoxy resin of workmanship.In addition, aforesaid method can be made A agent, B agent respectively, as before the liquid epoxy resin composition, immediately A agent and B agent is mixed.Because A agent, B agent are taken care of respectively, so A agent, B agent can keep stable status in long-time.
According to the 2nd point of the present invention, a kind of generator with rotor and stator is provided, this rotor and stator are reeled by enameled wire respectively, and above-mentioned enameled wire is covered with liquid epoxy resin composition in the following order.Order with liquid epoxy resin composition lining enameled wire is: will have the condensed epoxy base on 50~70 weight part rings, normal temperature is liquid alicyclic epoxy resin down, stir with the regulation revolution, and under the temperature of regulation, heat, with molecular-weight average 300~600 bisphenol A type epoxy resin 30~50 weight parts, slowly add in the alicyclic epoxy resin of above-mentioned stirring, obtain having the A agent of alicyclic epoxy resin and bisphenol A type epoxy resin, normal temperature is heated under the temperature of regulation for liquid acid anhydrides down, revolution with regulation stirs, normal temperature is liquid imidazolium compounds heating down, and this imidazolium compounds is added in the above-mentioned acid anhydrides of stirring.Froth in vacuum is carried out in the B agent that will have above-mentioned acid anhydrides and imidazolium compounds, the B agent that will have the above-mentioned A agent of alicyclic epoxy resin and bisphenol A type epoxy resin and have above-mentioned acid anhydrides and an imidazolium compounds is carried out equivalent and is stirred, obtain liquid epoxy resin composition, with stator and rotor heating, and be wound on stator and epitrochanterian enameled wire with above-mentioned liquid state composition epoxy resin dipping, again stator and rotor are cooled off.
Therefore, before making generator, with A agent and B agent mixing stirring.Therefore, can liquid epoxy resin composition be immersed in be wound between stator and the epitrochanterian enameled wire with long-time stable status.And, can produce the stay-in-grade generators such as pickup of liquid epoxy resin composition.
Brief Description Of Drawings
Fig. 1 shows the rotor of embodiment of the present invention.
Fig. 2 shows the stator of embodiment of the present invention.
The detailed description of best example
Below describe optimum implementation of the present invention in detail.
(I) modulation of A agent
At first, prepare following material.
The bisphenol A type epoxy resin of 30~50 weight part molecular-weight average 300~600
50~70 weight part alicyclic epoxy resins
In the alicyclic epoxy resin tank filling that the viscosity ratio bisphenol A type epoxy resin is low, the alicyclic epoxy resin in the tinning is stirred on the limit, and the limit is heated to 30 ℃, and viscosity is further reduced.Ester ring type epoxy fat has the epoxy group(ing) of condensation on the ring, be in a liquid state at normal temperatures.
Connect and see,, in this alicyclic ring epoxide resin, slowly add being preheating to 80 ℃ bisphenol A type epoxy resin on one side on one side with the alicyclic epoxy resin of 7~13rpm stirring heating.
In the present embodiment, limit heating, the lower alicyclic epoxy resin of stirring viscosity, the bisphenol A type epoxy resin of viscosity higher is added on the limit in this ring type Resins, epoxy.In view of the above, can at short notice bisphenol A type epoxy resin and alicyclic epoxy resin be mixed.So, improved production efficiency
In the present embodiment, as long as satisfy the condition of molecular-weight average 300~600, any bisphenol-type epoxy resin all can use.
As having the condensed epoxy base on the ring, normal temperature for liquid alicyclic epoxy resin, is enumerated down down.
(1) 3,4-epoxycyclohexyl methyl-(3, the 4-epoxy) hexanaphthene carboxylate
Figure C0312257400061
(2) 1-epoxy ethyl-3, the 4-epoxy cyclohexane
Figure C0312257400062
(3) two (3,4-epoxycyclohexyl methyl) adipic acid ester
Figure C0312257400063
The diester diepoxide of (4) two cyclic aliphatics
Figure C0312257400071
Certainly, the alicyclic epoxy resin that uses in the present embodiment is not limited in these examples.
In above-mentioned A agent, when the ratio of bisphenol A type epoxy resin during less than above-mentioned scope, the fracture-resistant of resulting liquid epoxy resin composition worsens.On the other hand, when the ratio of bisphenol A type epoxy resin during greater than above-mentioned scope, the dipping deterioration of resulting liquid epoxy resin composition.According to circumstances, thermotolerance also can worsen.Therefore, the mixture ratio of two kinds of Resins, epoxy must be in above-mentioned scope.
(II) modulation of B agent
At first prepare following material.
Liquid anhydride under the normal temperature
Liquid imidazolium compounds under the normal temperature
In the acid anhydrides tank filling, be heated to 80~120 ℃ while stirring, viscosity is reduced.Then, the limit is with the acid anhydrides of 3~7rpm stirring heating, and the limit is preheating to 80~120 ℃ imidazolium compounds toward wherein slowly adding.At this moment, the imidazolium compounds of interpolation lacks than the acid anhydrides amount that stirs.Then, the mixture to whole acid anhydrides and imidazolium compounds carries out froth in vacuum.When above-mentioned stirring, the most handy big blade stirs.
In the present embodiment, so that (3~7rpm) stir, and carry out froth in vacuum after the mixing at a slow speed.Therefore, when packing acid anhydrides and imidazolium compounds into container, can prevent from mixture, to discharge carbon dioxide gas, cause container to expand.
Above-mentioned normal temperature for liquid acid anhydrides, plays the effect of stiffening agent down.As the acid anhydrides that uses in the present embodiment, for example, can enumerate methyl tetrahydrochysene anhydride phthalic acid, methyl six hydrogen anhydride phthalic acids, methyl Nasik acid anhydrides etc.Certainly, the acid anhydrides that uses in the present embodiment is not limited in these.
Normal temperature for liquid imidazolium compounds, plays the effect of hardening accelerator down.As the imidazolium compounds that uses in the present embodiment, can adopt 2-ethyl-4-methylimidazole and 1 benzyl 2 methyl imidazole etc.Certainly, spendable imidazolium compounds is not limited to these in the present embodiment.
(III) mixing of A agent and B agent (modulation liquid epoxy resin composition)
Liquid epoxy resin composition is immersed between the enameled wire,, obtains the liquid epoxy resin composition that is suitable for flooding fixedly the time, the A agent and the B agent of equivalent (90~110 weight part) can being mixed with enameled wire.By A agent and B agent balanced mix, be easy to form the uniform mixing liquid of A agent and B agent.Yet when inequality, a kind of medicament is easy to local the existence in the liquid.The result is, because differences such as setting time cause quality inhomogeneous.
In the present embodiment, the usage rate of imidazolium compounds is 2~4 weight parts for above-mentioned A agent 100 weight parts.When surpassing this scope, can damage the dipping and the stiffening agent of liquid epoxy resin composition, therefore the binding property with enameled wire worsens, and also shortens working lipe, and on the other hand, when less than this scope, hardening significantly worsens.The use level of acid anhydrides is not done special restriction in the present embodiment.Yet generally speaking, for A agent 1 equivalent epoxy group(ing), acid anhydrides is 0.5~1.5 equivalent, is preferably 0.8~1.2 equivalent.
(IV) generator enameled wire
Use the liquid epoxy resin composition that obtains in (III), make rotor and stator that generator uses in the following order.At first, winding number layer enameled wire on rotor winding pipe 1 forms rotor (with reference to Fig. 1).This rotor is heated to 120~160 ℃, drips the dipping liquid epoxy resin composition from the top.120~160 ℃ of sclerosis down, by cooling, composition epoxy resin is covered in its surface, obtains rotor.By same order, also can obtain the stator (with reference to Fig. 2) of winding number layer enameled wire on stator core 2.
(V) structure of stator
Secondly, the stator structure that the present embodiment is related to is illustrated.As shown in Figure 2, stator is to be made of cylindric stator core 2 with a plurality of groovings 3 and the enameled wire 4 that is wound on the stator core 2 by grooving 3.Enameled wire more than 4 time by each grooving 3, be wound on the stator 2.Above-mentioned enameled wire 4 is covered by liquid-state epoxy resin.Whereby, enameled wire 4 set each other can suppress the vibration of enameled wire 4.
(VI) structure of rotor
The rotor structure that the present embodiment is related to is illustrated.As shown in Figure 1, rotor is made of rotor winding pipe 1, cooling fan 5, turning axle 6, magnetic pole 7, enameled wire 8.Turning axle 6 is given prominence to the above-below direction at rotor winding pipe 1.Magnetic pole 7 is given prominence in the external diameter direction from rotor winding pipe 1, last direction and direction intersection extension down.Cooling fan 5 is installed on the turning axle 6, be configured in magnetic pole 7 about.Cooling fan 5 have outstanding up to or several blades of direction down, when rotated, can make cooling around it.Rotor winding pipe 1, cooling fan 5, magnetic pole 7 can rotate with turning axle 6.Therefore, during the rotor rotation of disposing in the generator housing that the stator of not shown the present embodiment and rotor constitute, cooling fan 5 makes the housing internal cooling, can prevent that the temperature of generator from rising.Enameled wire 8 is repeatedly reeled on rotor winding pipe 1, as mentioned above, and with liquid epoxy resin composition its surface that is covered.Whereby, enameled wire 8 set each other.Can suppress the vibration of rotor.
Like this, owing to rotor is heated to 120~160 ℃ in advance, so, can improve liquid epoxy resin composition dipping property.And, shortened the setting time of liquid epoxy resin composition, improved production efficiency.
Embodiment
Below embodiments of the invention are illustrated.
Embodiment 1~4
In ratio shown in the table 1, use エ ピ コ one ト 828 (bisphenol A type epoxy resin, molecular weight 380, ジ セ パ Application エ Port キ シ society system), セ ロ キ サ イ De 2021 (3,4-epoxycyclohexyl methyl (3, the 4-epoxy) hexanaphthene carboxylate, ダ イ セ Le chemical industry society system), HN2200R (methyl tetrahydrochysene anhydride phthalic acid, Hitachi change into industrial society system), 2E4Mz (2-ethyl-4-methylimidazole, four countries change into industrial society system).Order blending A agent, B agent with identical with embodiment mix, and obtain liquid epoxy resin composition.Then,, by the interface peel of its dipping property of laxative remedy, hardening, enameled wire and hardening resin, crack-free, thermotolerance and working lipe are arranged, and carry out performance evaluation, the results are shown in table 1 said composition.
Comparative example 1~8
In comparative example 1~4, use the bisphenol A type epoxy resin (エ ピ コ one ト 828) and the alicyclic epoxy resin (セ ロ キ サ イ De 2021) of the scope ratio of introducing in the embodiment in addition, modulation A agent.In the comparative example 5, the use level of hardening accelerator is the ratio beyond the scope of the invention.In the comparative example 8,, use DMP-30 (2,4,6-three (dimethylaminomethyl) phenol) as hardening accelerator.In the comparative example 7,, use boron trifluoride monomethyl amine (BF3-MA) as hardening accelerator.The result of comparative example also is shown in table 1.
Performance evaluation
(1) dipping property
On the rotor core that generator is used, the enameled wire of about 10 layer lines footpath 2mm that reels forms rotor.This rotor is heated to 160 ℃, drips, flood liquid epoxy resin composition from it, after sclerosis under 160 ℃, cooling is at the transversely cutting rotor with respect to the winding line direction.Subsequently, observe the dipping situation of hardening resin between enameled wire.Will the differentiation of dipping property as follows, it is good that " zero " is evaluated as dipping property.
On whole enameled wire aspect, flooded hardening resin: zero
Enameled wire has only 3~9 layers to flood hardening resin: △
Enameled wire has only 1 or 2 layer to flood hardening resin: *
(2) hardening
According to JIS C-2104, under 150 ℃ of hot plate temperatures, measure gelation time.Gelation time is distinguished as follows, and it is good that " zero " is evaluated as hardening.
70~120 seconds: zero
Above 120 seconds: △
Be lower than 70 seconds: *
(3) interface peel of enameled wire and hardening resin, flawless is arranged
The same with above-mentioned (1) dipping measuring method, to enameled wire dipping liquid epoxy resin composition, obtain rotor after the sclerosis.Rotor is carried out the thermal cycling of 155 ℃/30 minutes~-40 ℃/30 clocks in air, carry out 10 times.Under the room temperature, observe the interface of enameled wire and hardening resin with magnifying glass, judge have or not peel off, crackle.
(4) thermotolerance
160 ℃ of following hardened resin sample are placed apparatus for thermal analysis (motor of science society system, TMA determinator), continue to be warmed up to 220 ℃ from room temperature, simultaneously, obtain linear expansivity at each temperature, the temperature that linear expansivity is changed is taken as second-order transition temperature.This second-order transition temperature is distinguished as follows, and it is good that " zero " is evaluated as thermotolerance.
More than 155 ℃: zero
Below 155 ℃: *
(5) working lipe
Under 22 ℃, after A agent and B agent mixed, when its viscosity reached 2 times of mixed viscosity, the needed time was as using working lipe.Can use working lipe more than 6 hours, be evaluated as " well " working lipe.
Table 1
Example No Embodiment Comparative example
1 2 3 4 1 2 3 4 5 6 7 8
エ ピ コ one ト 828 30 40 45 50 60 20 70 45 45 45 45 45
セロキサイド 2021 70 60 55 50 40 80 30 55 55 55 55 55
HN-2200R 100 99 97 94 90 105 88 97 97 97 97 -
2E4MZ 3 3 3 3 3 3 3 1 5 - - 3
DMP-30 - - - - - - - - - 3 - -
BF-MA - - - - - - - - - - 3 -
Dipping property × ×
Hardening
Have or not on the interface of the hardening resin of enameled wire and peel off crackle Do not have Do not have Do not have Do not have Do not have Have Do not have Do not have Have Do not have - Have
Thermotolerance × -
Working lipe Very Very Very Very Very Bad Very Very Bad Bad - Very

Claims (8)

1. the manufacture method of a liquid epoxy resin composition wherein, is liquid acid anhydrides down with normal temperature, 80-120 ℃, stir with 3-7rpm,
With normal temperature is down that liquid imidazolium compounds heats,
Above-mentioned imidazolium compounds is added in the above-mentioned acid anhydrides of stirring,
The mixture of above-mentioned acid anhydrides and imidazolium compounds is carried out froth in vacuum is allocated as solvent,
90~110 weight parts are had the Resins, epoxy of alicyclic epoxy resin and bisphenol A type epoxy resin and above-mentioned solvent that 90~110 weight parts have above-mentioned acid anhydrides and imidazolium compounds stirs, make liquid epoxy resin composition, in this method,
Alicyclic epoxy resin is 50~70 weight parts, and bisphenol A type epoxy resin is 30~50 weight parts,
Above-mentioned Resins, epoxy and above-mentioned solvent for etc. weight part,
The weight part of acid anhydrides is more than the weight part of above-mentioned imidazolium compounds,
Have the above-mentioned Resins, epoxy of alicyclic epoxy resin and bisphenol A type epoxy resin for 100 weight parts, imidazolium compounds is 2~4 weight parts.
2. according to the manufacture method of the liquid epoxy resin composition of claim 1 record, wherein, alicyclic epoxy resin is 3,4-epoxycyclohexyl methyl-(3, the 4-epoxy) cyclohexane carboxylic acid ester.
3. according to the manufacture method of the liquid epoxy resin composition of claim 1 record, wherein, imidazoles is a 2-ethyl-4-methylimidazole.
4. according to the manufacture method of each liquid epoxy resin composition in the claim 1~3, wherein said Resins, epoxy with alicyclic epoxy resin and bisphenol A type epoxy resin makes like this:
And have on 50~70 weight part rings condensed epoxy base, normal temperature is down liquid alicyclic epoxy resin, stir with 7-13rpm, and heating,
Bisphenol A type epoxy resin 30~50 weight parts with molecular-weight average 300~600 slowly add in the above-mentioned alicyclic epoxy resin of stirring.
5. according to the manufacture method of the liquid epoxy resin composition of record in the claim 4, wherein, alicyclic epoxy resin is 3,4-epoxycyclohexyl methyl-(3, the 4-epoxy) cyclohexane carboxylic acid ester.
6. according to the manufacture method of each liquid epoxy resin composition in the claim 1~3, wherein said solvent makes like this:
Normal temperature is down liquid acid anhydrides, 80-120 ℃, stir with 3-7rpm,
With normal temperature is down that liquid imidazolium compounds heats,
This imidazolium compounds is added in the above-mentioned acid anhydrides of stirring, mixture is carried out froth in vacuum,
Wherein the weight part of acid anhydrides is more than the weight part of above-mentioned imidazolium compounds.
7. according to the manufacture method of the liquid epoxy resin composition of record in the claim 6, wherein, imidazoles is a 2-ethyl-4-methylimidazole.
8. the manufacture method of a liquid epoxy resin composition, wherein, bisphenol A type epoxy resin 30~50 weight parts that 90~110 weight parts had molecular-weight average 300~600, with the normal temperature that has the condensed epoxy base on the ring down for liquid alicyclic epoxy resin 50~70 parts by weight of epoxy resin and
It is that liquid acid anhydrides and normal temperature is down the solvent of the imidazolium compounds of liquid state that 90~110 weight parts have under the normal temperature,
Mix stirring, make liquid epoxy resin composition, in this method,
The weight part of above-mentioned Resins, epoxy and the weight part of above-mentioned solvent are equivalent,
The weight part of acid anhydrides is more than the weight part of above-mentioned imidazolium compounds,
For the above-mentioned Resins, epoxy that 100 weight parts are formed by alicyclic epoxy resin and bisphenol A type epoxy resin, imidazolium compounds is 2~4 weight parts.
CNB031225748A 2003-04-21 2003-04-21 mfg. method of soaking adaptable liquid epoxy resin compound, and generator thereof Expired - Lifetime CN100371403C (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101486870B (en) * 2009-02-16 2011-05-04 吴江市太湖绝缘材料厂 Solvent-free insulated paint

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JP5288150B2 (en) * 2005-10-24 2013-09-11 株式会社スリーボンド Thermosetting composition for sealing organic EL elements
CN107888043A (en) * 2017-12-28 2018-04-06 苏州泰科贝尔直驱电机有限公司 A kind of torque motor
CN112063270A (en) * 2020-09-23 2020-12-11 安徽恒磁磁电有限公司 Enameled wire insulation impregnating varnish and preparation method and application thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86100232A (en) * 1986-01-03 1986-09-10 复旦大学 An epoxy molding compound molding process for electronic device packaging
JPH02102274A (en) * 1988-10-07 1990-04-13 Somar Corp Epoxy resin powder coating suitable for slot insulation
US5049596A (en) * 1987-06-25 1991-09-17 Somar Corporation Epoxy resin based powder coating composition with mixed filler including microfine silica
JPH0433916A (en) * 1990-05-30 1992-02-05 Somar Corp Epoxy resin composition and production thereof
JPH0520918A (en) * 1991-07-14 1993-01-29 Sony Chem Corp Conductive paste

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86100232A (en) * 1986-01-03 1986-09-10 复旦大学 An epoxy molding compound molding process for electronic device packaging
US5049596A (en) * 1987-06-25 1991-09-17 Somar Corporation Epoxy resin based powder coating composition with mixed filler including microfine silica
JPH02102274A (en) * 1988-10-07 1990-04-13 Somar Corp Epoxy resin powder coating suitable for slot insulation
JPH0433916A (en) * 1990-05-30 1992-02-05 Somar Corp Epoxy resin composition and production thereof
JPH0520918A (en) * 1991-07-14 1993-01-29 Sony Chem Corp Conductive paste

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101486870B (en) * 2009-02-16 2011-05-04 吴江市太湖绝缘材料厂 Solvent-free insulated paint

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