CN100362666C - Package structure of light sensing chip and manufacturing method thereof - Google Patents

Abstract

The invention relates to a packaging structure of a light sensing chip and a manufacturing method thereof, wherein the packaging structure comprises: the light-transmitting substrate, the photosensitive chip and the printed circuit board also comprise a printed circuit trace layer which is attached to one side of the light-transmitting substrate and is connected with a plurality of electric connecting lugs; the photosensitive chip is provided with at least one photosensitive area and a plurality of electric connection parts, and the electric connection parts are positioned at the same side of the photosensitive chip and are electrically connected with the printed circuit trace layer; the printed circuit board is electrically connected with the electric connection lug of the printed circuit trace layer and is adjacent to one side of the photosensitive chip without the photosensitive area; when packaging, the photosensitive chip is turned over, namely the adjacent light-transmitting substrate with the photosensitive area facing downwards, so that the electric connection part is electrically connected with the printed circuit trace layer. Therefore, the invention can reduce the volume and the arrangement position of the packaging structure and simultaneously reduce the cleanliness requirement of the chip packaging environment.

Description

Packaging structure of light sensing chip and manufacturing method thereof

technical field

The present invention relates to a packaging structure of a photo-sensing chip and a manufacturing method thereof, in particular to a packaging structure of a photo-sensing chip produced by a manufacturing method of packaging.

Background technique

The known photo-sensing chip packaging structure is shown in FIG. 1 . First, a plurality of photo-sensing chips (not shown) are manufactured on a large wafer, and a dicing process is used to separate them into individual photo-sensing chips 10a, and then printing is provided. The circuit board substrate 20a is used to carry the photo-sensing chip 10a, and the support portion 30a is glued on the printed circuit board substrate 20a to form a concave portion 21a, and then the photo-sensing chip 10a is bonded to the substrate 20a by using an adhesive In the concave portion 21a of the support portion 30a, heat it to make it solidify, and then carry out wire bonding, then dot bonding agent on the support portion 30a, and then seal a glass upper cover 40a on it.

The known light sensing chip has the following disadvantages:

1. The known process is to cut a large wafer to form individual light-sensing chips, and then glue them on the substrate with the photosensitive area of the light-sensing chip facing upwards, and then perform chip packaging processes such as wire bonding and packaging. Therefore, it is easy to affect the light-sensing effect due to the particles adhering to the photosensitive area of the chip, so that the cleanliness requirement of the preparation environment must be improved, thus increasing the preparation cost.

2. The supporting part of the known photo-sensing chip packaging structure is bulky, which increases the volume of the photo-sensing chip packaging structure, thereby increasing the cost of materials and reducing the chance of being applied to small-sized devices.

Contents of the invention

One object of the present invention is to provide a packaging structure of a photo-sensing chip and a manufacturing method thereof, thereby reducing the volume of the packaging structure and its location.

The second purpose of the present invention is to provide a packaging structure of a light sensing chip and a manufacturing method thereof, by flipping the chip to bond the photosensitive chip on the printed circuit trace layer on the transparent substrate, so that the The photosensitive area on the photosensitive chip faces down to be adjacent to the light-transmitting substrate, so that particles can be prevented from falling into the photosensitive area of the photosensitive chip during the preparation process, and at the same time, the cleanliness requirements of the chip packaging environment are reduced, so the preparation process is reduced. cost.

In order to achieve the above object, the present invention provides a package structure of a photosensitive chip, which includes: a light-transmitting substrate, a photosensitive chip and a printed circuit board, and also includes a printed circuit trace layer, which is attached to the One side of the light-transmitting substrate, and connected with a plurality of electrical connection bumps; the photosensitive chip has at least one photosensitive area and a plurality of electrical connection parts, and is located on the same side of the photosensitive chip, and the electrical connection parts are electrically connected to the photosensitive chip. The printed circuit trace layer; and the printed circuit board is electrically connected to the electrical connection bump of the printed circuit trace layer, and is adjacent to the side of the non-photosensitive area of the photosensitive chip; basically, when packaging, flip the The photosensitive chip, that is, the photosensitive area facing downwards adjacent to the light-transmitting substrate, makes the electrical connection part electrically connected to the printed circuit trace layer.

According to the idea above, the packaging structure of the photosensitive chip further includes at least one protective glue, which is adhered to the surrounding of the photosensitive chip and the transparent substrate to seal the photosensitive area on the transparent substrate.

According to the idea above, the electrical connection portion of the photosensitive chip is an electrical connection bump, and is electrically connected to the printed circuit trace layer.

According to the above idea, the electrical connection bumps are made of one of gold and tin.

According to the above idea, the portion of the light-transmitting substrate corresponding to the photosensitive region has no printed circuit trace layer attached thereto.

According to the above idea, the transparent substrate is a glass plate.

Another aspect of the present invention also provides a method for manufacturing a packaging structure of an optical sensing chip, which includes the following steps:

providing a transparent substrate;

attaching a printed circuit trace layer on one side of the transparent substrate, and then welding the printed circuit trace layer with a plurality of electrical connection bumps;

A photosensitive chip is provided, which has a plurality of electrical connections and is electrically connected to the printed circuit trace layer, and the photosensitive chip has a photosensitive area adjacent to the transparent substrate;

providing a printed circuit board, which is electrically connected to the electrical connection bump, and is adjacent to one side of the non-photosensitive area of the photosensitive chip;

Based on this, during packaging, the photosensitive chip is turned over, that is, the light-sensitive area faces downward adjacent to the light-transmitting substrate, so that the photosensitive chip is electrically connected to the printed circuit trace layer through the electrical connection portion.

According to the above idea, the manufacturing method of the packaging structure of the photosensitive chip further includes adhering protective glue on the periphery of the photosensitive chip and the transparent substrate, so as to seal the photosensitive area of the photosensitive chip on the transparent substrate.

According to the above idea, the manufacturing method of the packaging structure of the photosensitive chip further includes welding a plurality of electrical connection bumps on the printed circuit trace layer around the photosensitive chip, and providing a printed circuit board on the electrical connection on the bump and adjacent to the photosensitive chip.

According to the above idea, the electrical connection part is located around the same side of the photosensitive area of the photosensitive chip.

According to the idea above, in the manufacturing method of the packaging structure of the photo-sensing chip, the light-transmitting substrate is a glass substrate.

According to the above idea, in the manufacturing method of the packaging structure of the photo-sensing chip, the printed circuit trace layer is printed on one side of the transparent substrate.

According to the above idea, in the manufacturing method of the packaging structure of the photo-sensing chip, the printed circuit trace layer is attached to one side of the transparent substrate.

According to the above idea, in the manufacturing method of the packaging structure of the photo-sensing chip, the electrical connection part is a gold electrical connection bump, and is welded on the printed circuit trace layer by thermosonic welding.

According to the idea above, in the manufacturing method of the packaging structure of the photo-sensing chip, the electrical connection part is a tin electrical connection bump, and is welded to the printed circuit trace layer by welding.

In this way, the present invention can reduce the volume of the packaging structure and its setting position, and further provide a flip chip to bond the photosensitive chip on the printed circuit trace layer on the transparent substrate, so that the photosensitive area faces downward, so During the preparation, particles can be prevented from falling into the photosensitive area, and the requirements for the shortcut degree of the chip packaging environment can be reduced, thereby reducing the preparation cost.

Description of drawings

Fig. 1 is a side view of a package structure of a known light sensing chip;

Fig. 2 is a side view of the packaging structure of the light sensing chip of the present invention;

3 is a schematic top view of a printed circuit trace layer attached to a light-transmitting substrate of the present invention;

FIG. 4A is a schematic top view of a plurality of light-sensing chips in a large wafer of the present invention;

FIG. 4B is a schematic top view of the light sensing chip of the present invention;

Fig. 5 is an upper side view of a printed circuit trace layer in which a photosensitive chip is flip-chip bonded on a light-transmitting substrate according to the present invention;

Fig. 6 is a schematic diagram of the invention using protective glue to seal the sensing area of the photosensitive chip and the electrical connection bumps on the light-transmitting substrate;

Fig. 7 is a side view of the packaging structure of the light sensing chip of the present invention;

FIG. 8 is a schematic top view of a packaging structure of a glass substrate with a plurality of photo-sensing chips according to the present invention.

Wherein, the reference signs are explained as follows:

10a-optical sensing chip; 20a-printed circuit board substrate; 21a-recessed part; 30a-supporting part;

40a-glass upper cover; 10-light-transmitting substrate; 20-printed circuit trace layer;

30-photosensitive chip; 31-electrical connection; 32-photosensitive area; 40-protective glue;

50-electrical connection bump; 60-printed circuit board; 70-big chip.

Detailed ways

Please refer to FIG. 2, the present invention is a package structure of a photosensitive chip, which includes a light-transmissive substrate 10 and a printed circuit trace layer 20 attached to one side of the light-transmissive substrate 10, and makes the photosensitive chip The electrical connection portion 31 of 30 is electrically connected to the printed circuit trace layer 20, and the electrical connection portion 31 on the photosensitive chip 30 is located on the same side as the photosensitive area 32, and a protective glue 40 is adhered to the photosensitive chip 30 and On the transparent substrate 10, the photosensitive chip 30 is sealed on the transparent substrate 10, and a plurality of electrical connection bumps 50 are formed on the periphery of the photosensitive chip 30 on the printed circuit trace layer 20 to electrically connect on the printed circuit board 60 .

Please refer to FIG. 3 , where a transparent substrate 10 is firstly provided, which can be a glass substrate of an unspecified shape, and then a plurality of printed circuit trace layers 20 are attached to the transparent substrate by printing or pasting. 10 to form a printed glass substrate.

Please refer to FIG. 4A and shown in FIG. 4B, wherein a large wafer (wafer) 70 is provided again, wherein there are a plurality of photosensitive chips 30 on the large wafer 70, and each photosensitive chip 30 has a photosensitive area 32 and a plurality of electrical connections The portion 31 is formed on the same side of the photosensitive chip 30, and the electrical connection portion 31 is located around the photosensitive area 32, and the plurality of electrical connection portions 31 are electrical connection bumps (bumps) on the pad of the photosensitive chip, The large wafer 70 is then diced to form individual photosensitive chips 30 , and the electrical connection bumps can be made of gold or high-temperature tin.

Please refer to Fig. 5, wherein the large wafer is cut to form a single photosensitive chip 30, and the photosensitive chip 30 is turned over to be covered on the transparent substrate 10, so that the electrical connection protrusion is used as a supporting part to support the transparent substrate 10. On the printed circuit trace layer 20, the gold electrical connection portion 31 on the photosensitive chip 30 is connected to the electrical signal transmission point of the printed circuit trace layer 20 by thermosonic processing to produce a co-gold bond , and make the photosensitive region 32 adjacent to the light-transmitting substrate 10, so the light-transmitting substrate 10 is not covered by the printed circuit trace layer 20 corresponding to the photosensitive region 32, so that the light-transmitting substrate 10 protects the light-sensitive Chip 30, so that the light passes through the light-transmitting substrate 10 and is detected by the photosensitive region 32. In addition, when the electrical connection bump on the photosensitive chip 30 is a high-temperature type tin material, it is made by means of reflow. The electrical connection bumps of the photosensitive chip 30 are reflowed on the electrical signal transmission points of the printed circuit trace layer 20 . In this preparation process, the photosensitive chip 30 is turned over, so that the photosensitive area 32 on the photosensitive chip 30 faces down to be adjacent to the light-transmitting substrate 10, so that particles can be avoided from falling during the preparation process or in subsequent preparation processes. In the photosensitive area 32 of the photosensitive chip 30 , the cleanliness requirement of the environment in the chip package is reduced, thereby reducing the manufacturing cost.

Please refer to FIG. 6 , wherein a protective glue 40 is used to adhere to the periphery of the photosensitive chip 30 and the light-transmitting substrate 10, so that the electrical connection bumps and the photosensitive region 32 are sealed on the light-transmitting substrate 10, Therefore, the entry of water vapor and particles can be avoided.

Please refer to FIG. 7 , which further uses the reflow process to form electrical connection bumps 50 at a plurality of predetermined positions of the printed circuit trace layer 20 on the periphery of the photosensitive chip 30 . Block 50 can be made of low temperature type tin material.

8 and 2, the light-transmitting substrate 10 is cut to form a single shape, and the printed circuit board 60 is connected to the printed circuit board 60 one by one using the electrical connection bumps 50, so that the printed circuit board 60 is adjacent to the photosensitive substrate. The side of the chip 30 without the photosensitive area 32 is therefore passed through the light-transmitting substrate 10 to be detected by the photosensitive area 32, and the electrical signal is transmitted to the printed circuit through the electrical connection bump on the photosensitive chip 30 The trace layer 20 transmits electrical information from the printed circuit trace layer 20 to the printed circuit board 60 through the electrical connection bump 50 .

To sum up, through the package structure of the light sensing chip and the manufacturing method thereof of the present invention, the volume of the package structure and its installation position can be reduced, and at the same time, the photosensitive chip can be bonded to the light-transmitting substrate by flipping the chip Therefore, the photosensitive area on the photosensitive chip faces down to be adjacent to the light-transmitting substrate, so that particles can be prevented from falling into the photosensitive area of the photosensitive chip during preparation, and at the same time The shortcut degree requirement of the chip packaging environment is reduced, so the preparation cost is reduced.

The above descriptions are only preferred feasible embodiments of the present invention, and therefore do not limit the patent scope of the present invention. Therefore, all equivalent structural changes made by using the description and accompanying drawings of the present invention should be included in the protection of the present invention. within range.

Claims (15)

1. A packaging structure for a photosensitive chip, comprising: a light-transmitting substrate, a photosensitive chip and a printed circuit board, characterized in that it also includes A printed circuit trace layer, which is attached to one side of the light-transmitting substrate and connected with a plurality of electrical connection bumps; The photosensitive chip has at least one photosensitive area and a plurality of electrical connection parts located on the same side of the photosensitive chip, the electrical connection part is electrically connected to the printed circuit trace layer, and the printed circuit board is electrically connected to the printed circuit board. The electrical connection bump of the circuit trace layer is adjacent to the side of the non-photosensitive area of the photosensitive chip; Based on this, during packaging, the photosensitive chip is turned over, that is, the light-sensitive area faces downward adjacent to the light-transmitting substrate, so that the electrical connection part is electrically connected to the printed circuit trace layer. 2. The packaging structure of the photosensitive chip according to claim 1, further comprising at least one protective glue, which is adhered to the periphery of the photosensitive chip and the transparent substrate, so as to seal the photosensitive area on the transparent substrate superior. 3 . The packaging structure of the photosensitive chip as claimed in claim 1 , wherein the electrical connection portion of the photosensitive chip is an electrical connection bump, and is electrically connected to the printed circuit trace layer. 4 . 4. The packaging structure of the photo-sensing chip as claimed in claim 3, wherein the electrical connection bumps are made of one of gold and tin. 5 . The packaging structure of the photo-sensing chip as claimed in claim 1 , wherein a portion of the light-transmitting substrate corresponding to the photosensitive area is not attached with a printed circuit trace layer. 6 . 6. The package structure of light sensing chips as claimed in claim 1, wherein the transparent substrate is a glass plate. 7. A method for manufacturing a package structure of an optical sensing chip, comprising the following steps: providing a transparent substrate; attaching a printed circuit trace layer on one side of the transparent substrate, and then welding the printed circuit trace layer with a plurality of electrical connection bumps; A photosensitive chip is provided, which has a plurality of electrical connections and is electrically connected to the printed circuit trace layer, and the photosensitive chip has a photosensitive area adjacent to the transparent substrate; providing a printed circuit board, which is electrically connected to the electrical connection bump, and is adjacent to one side of the non-photosensitive area of the photosensitive chip; Based on this, during packaging, the photosensitive chip is turned over, that is, the light-sensitive area faces downward adjacent to the light-transmitting substrate, so that the photosensitive chip is electrically connected to the printed circuit trace layer through the electrical connection portion. 8. The manufacturing method of the packaging structure of the photosensitive chip as claimed in claim 7, further comprising adhering a protective glue on the periphery of the photosensitive chip and the transparent substrate, so as to seal the photosensitive area of the photosensitive chip on the transparent substrate. on the substrate. 9. The manufacturing method of the packaging structure of the photosensitive chip as claimed in claim 8, further comprising welding a plurality of electrical connection bumps on the printed circuit trace layer on the periphery of the photosensitive chip, and providing a The printed circuit board is on the electrical connection bump and adjacent to the photosensitive chip. 10 . The method for manufacturing the packaging structure of the photosensitive chip according to claim 9 , wherein the electrical connection part is located around the same side of the photosensitive area of the photosensitive chip. 11 . 11. The method for manufacturing the packaging structure of the light sensing chip as claimed in claim 7, wherein the transparent substrate is a glass substrate. 12 . The method for manufacturing the packaging structure of the photo-sensing chip as claimed in claim 7 , wherein the printed circuit trace layer is printed on one side of the light-transmitting substrate. 13 . 13 . The method for manufacturing the packaging structure of the photo-sensing chip as claimed in claim 7 , wherein the printed circuit trace layer is attached to one side of the light-transmitting substrate. 14 . 14. The manufacturing method of the packaging structure of the light sensing chip as claimed in claim 7, wherein the electrical connection part is a gold electrical connection bump, and is welded to the printed circuit trace by means of thermosonic welding layer. 15. The manufacturing method of the packaging structure of the light sensing chip as claimed in claim 7, wherein the electrical connection part is a tin electrical connection bump, and is welded to the printed circuit trace layer by welding .

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