CN100346198C - Repairable wire structure - Google Patents

Abstract

A repairable conducting wire structure comprises at least two outer conducting parts and an inner conducting part arranged between the outer conducting parts. The external conductive part and the internal conductive part are separated by two grooves respectively, and at least one connecting part is arranged corresponding to each groove and is used for connecting the external conductive part and the internal conductive part which are adjacent to the grooves.

Description

Repairable wire structure

technical field

The invention relates to a construction technology of an integrated circuit, in particular to a construction technology applied between an integrated circuit and a display.

Background technique

Liquid crystal display (liquid crystal display, hereinafter referred to as LCD) is the mainstream of the development of flat-panel displays at present. Its display principle is to make use of the dielectric anisotropy and conductive anisotropy of liquid crystal molecules to make the arrangement of liquid crystal molecules The state transition causes the liquid crystal film to produce various photoelectric effects. The panel structure of a liquid crystal display is generally formed by laminating two substrates, leaving a certain distance in the middle for filling liquid crystals, and corresponding electrodes are formed on the upper and lower substrates to control the direction and arrangement of liquid crystal molecules. The arrangement of the liquid crystal molecules is controlled by the change of the electric field, resulting in shading or transparency of light, forming bright dots or dark dots, and forming images and displaying colors on the screen.

The LCD is white and bright when it is not powered on, and it can display colors and patterns after it is powered on. LCD is divided into two types: passive matrix LCD (passive matrix LCD) and active matrix LCD (activematrix LCD). In terms of passive matrix LCD, the display of each pixel (pixel) is determined by the current of the transistor at the end of each column and the transistor at the beginning of each row. The advantages are cheap, small size, and the disadvantages are slow scanning speed and Viewing angles are minimal. In terms of active matrix LCD, each pixel can be switched independently, and the scanning speed is fast.

The liquid crystal panel of the active matrix LCD is composed of more than one million transistor components, and many liquid crystal display units are arranged to form a plane, and a display unit is composed of three sub-display units <R.G.B>.

The LCD requires a plurality of integrated circuits (ICs) respectively connected to data lines and gate lines to drive and control the LCD, and the above-mentioned integrated circuits are located between the liquid crystal display panel and the flexible circuit board. The assembly technology between the integrated circuit and the display panel includes tape automatic bonding (hereinafter referred to as TAB) and flexible printed circuit board (hereinafter referred to as FPC).

Referring to FIG. 1 , if a particle 106 falls between two adjacent wires 102 , 104 , the adjacent wires 102 , 104 may be short-circuited, causing abnormal operation of components related to the wires 102 , 104 . The existing technologies generally used to solve the above problems include the following two methods: The first method is to replace the wires 102 and 104 with new ones to remove the particles 106 between adjacent wires. The second method is to pulverize the above-mentioned particles 106 with a laser. However, the step of replacing the wires with new ones is expensive and takes a longer manufacturing process time. Additionally, the method of laser crushing particles is not really effective in removing larger particles 106 .

In addition, as shown in FIG. 2, during the bonding process, if misalignment occurs between the wires 202, 204 on the display panel and the bonding wire 208 on the circuit board, due to the misalignment between the wires 202, 204 and the phase The distance between adjacent bonding wires 208 is reduced, and the above-mentioned conductive wires 202 and bonding wires 208 are likely to be conducted through the conductive particles 206 of the anisotropic conductive adhesive, thereby causing a short circuit phenomenon.

Contents of the invention

In view of this, in order to solve the above-mentioned problems, the object of the present invention is to provide a repairable wire structure, if particles fall between two adjacent wires, or misalignment occurs during bonding, all can be repaired. Use a laser to repair shorted wires in simple steps.

To achieve the above object, the present invention provides a repairable wire structure, which includes at least two outer conductive parts and an inner conductive part disposed between the outer conductive parts. There is a groove between each outer conductive part and the inner conductive part, and corresponding to each groove, at least one conductive connection part connects the outer conductive part and the inner conductive part adjacent to the groove.

The present invention also provides a repairable wire structure, comprising: a first conductive layer, including at least two outer conductive parts and an inner conductive part arranged between the outer conductive parts, wherein each of the outer conductive parts is connected to There is a groove between the inner conductive parts, and the first conductive layer also includes at least one connecting part, corresponding to each groove, for connecting adjacent outer conductive parts and the inner conductive part; a dielectric layer , disposed on the first conductive layer, wherein the dielectric layer does not cover the grooves and the connecting parts; a second conductive layer, disposed on the dielectric layer, wherein the second conductive layer does not cover the each groove and each connecting portion; and a third conductive layer disposed on the second conductive layer, wherein the third conductive layer does not cover the grooves.

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, and in conjunction with the attached drawings, the detailed description is as follows:

Description of drawings

Fig. 1 is the plan view that existing wire comprises a particle between two wires;

Fig. 2 is a plan view of an alignment error generated during the bonding process of existing wires;

Fig. 3 is the plane view of the wire structure of the first embodiment of the present invention;

4 is a plan view of the first embodiment of the present invention including a particle located between two wires;

Fig. 5 is a plan view of the alignment error generated during the bonding process according to the first embodiment of the present invention;

6A is a plan view of the wire structure of the second embodiment of the present invention;

6B is a plan view of another wire structure of the second embodiment of the present invention;

7A is a plan view of the wire structure of the third embodiment of the present invention;

Figure 7B is a cross-sectional view along the section line 7B-7B' of Figure 7A;

Fig. 7C is a cross-sectional view along the section line 7C-7C' of Fig. 7A.

Detailed ways

first embodiment

As shown in FIG. 3 , the wire 312 of this embodiment includes two outer conductive portions 302 and an inner conductive portion 304 between the two outer conductive portions 302 . The aforementioned outer conductive portion 302 and inner conductive portion 304 are separated from each other by a trench 306 extending along the wire. In addition, corresponding to each trench 306 there is at least one connecting portion connecting the outer conductive portion 302 and the inner conductive portion 304 of the adjacent trench 306 .

In this embodiment, the aforementioned connecting portion may include a first connecting portion 308 and a second connecting portion 310 , wherein the first connecting portion 308 is at one end of the wire, and the second connecting portion 310 is at the other end of the wire. In addition, the outer conductive part 302 and the inner conductive part 304 can also be connected to each other through a plurality of connecting wires 311 at one end, and the above connecting wires 311 can be made of tantalum, tungsten, chromium, aluminum, indium tin oxide (ITO), or a combination of the above.

In this embodiment, the aforementioned wires 312 are preferably disposed on the display panel, but not limited thereto. The thickness of the first connecting portion 308 and the second connecting portion 310 is preferably thinner than that of the outer conductive portion 302 and the inner conductive portion 304 , so the connecting portions 308 , 310 can be cut off more easily by laser irradiation. In addition, in this embodiment, preferably, the width of the inner conductive portion 304 is wider than that of the outer conductive portion 302 , so that the wire 312 as a whole can maintain a lower impedance value.

Referring to FIG. 4 , if a particle 408 falls between the first wire 402 and the second wire 404 , causing a short circuit between the first wire 402 and the second wire 404 . The first wire 402 and the second wire 404 can be repaired by cutting the connecting portion 406 of the wires 402 , 404 adjacent to the particle 408 with a laser. In this way, the outer conductive portion 410 of the two wires 402 , 404 adjoining the particle 408 is electrically insulated from the remaining portion 412 , and the short circuit of the two wires 402 , 404 is repaired.

Please refer to FIG. 5 , if a misalignment (misalignment) occurs between the wire 504 and the bonding wire 502 on the circuit board in this embodiment, since the distance between the wire 504 and the adjacent bonding wire 502 is reduced, the above-mentioned two wires 502, 504 conducts through the conductive particles 506 of the anisotropic conductive adhesive, and then a short circuit occurs. At this time, the wire 504 can be repaired by cutting the connection portion 508 between the outer conductive part and the inner conductive part of the wire 504 adjacent to the conductive particles 506 by laser. Therefore, the remaining portion 512 of the wire 504 after cutting and the bonding wire 502 are electrically insulated from each other to solve the short circuit problem.

second embodiment

The structure of this embodiment is similar to that of the first embodiment, the only difference is that there is only one connecting part corresponding to each groove to connect the outer conductive part and the inner conductive part of the wire, and the connecting part can be connected by any part of the corresponding groove The outer and inner conductive parts of a wire. For example, as shown in FIG. 6A, the wire 600 includes an inner conductive portion 604 and two outer conductive portions 602, 606 located on both sides of the inner conductive portion 604, wherein the inner conductive portion 604 and the two outer conductive portions 602 are formed by two grooves respectively. separated from each other. The first connecting portion 601 connecting the inner conductive portion 604 of the wire 600 and an outer conductive portion 602 is located at one end of the wire, and the second connecting portion 603 connecting the inner conductive portion 604 of the wire and another outer conductive portion 606 is located at the end of the wire 600. the other end of the .

In addition, as shown in FIG. 6B , another variation of this embodiment is that the first connection portion 605 and the second connection portion 607 of the wire are located in the middle of the wire 600 . Therefore, if a particle falls between two adjacent wires in FIG. 6A and FIG. 6B to cause a short circuit, only the external conductive part corresponding to the connection of the adjacent particle 612 of the wire 600 or its adjacent connection part needs to be used as a pre-cut part 610 can be cut to solve the problem of wire short circuit between the two wires when particles 612 fall in FIG. 6A and FIG. 6B .

third embodiment

Fig. 7A is a top view of this embodiment. 7B is a cross-sectional view along section line 7B-7B' of FIG. 7A , and FIG. 7C is a cross-sectional view along section line 7C-7C' of FIG. 7A . Please refer to FIG. 7A, FIG. 7B and FIG. 7C, a conductive layer includes an inner conductive portion 704, an outer conductive portion 706 located on both sides of the inner conductive portion 704, and a connecting portion 710 connecting the inner conductive portion 704 and the outer conductive portion 706, 712. The two outer conductive portions 706 and the inner conductive portion 704 of the wire are separated by corresponding grooves 708 parallel to the wire. In addition, corresponding to each groove 708, there is at least one connecting portion (this embodiment includes two connecting portions 710, 712 located at the upper and lower ends of the wire) to connect the outer conductive portion 706 and the inner conductive portion 704 of the wire on both sides of the groove. . In this embodiment, the above-mentioned first conductive layer 702 can be formed simultaneously with the gate electrode layer 752 of the thin film transistor of the liquid crystal display panel (as shown in FIG. 7B ). In addition, the first conductive layer 702 can be made of tantalum, tungsten, chromium , aluminum, indium tin oxide (ITO), or a combination of the above.

A dielectric layer 714 is located on the above-mentioned first conductive layer 702, wherein the dielectric layer 714 does not cover the trench 708 separating the outer conductive portion 706 and the inner conductive portion 704 of the first conductive layer, and the connection of the first conductive layer 702 Sections 710, 712. In addition, the dielectric layer 714 can be formed simultaneously with the gate dielectric layer 754 of the TFT, and the dielectric layer 714 is preferably composed of silicon nitride.

A second conductive layer 716 is disposed on the dielectric layer 714, wherein the second conductive layer 716 also does not cover the trench 708 separating the outer conductive portion 706 and the inner conductive portion 704 of the first conductive layer, and the connection of the first conductive layer Sections 710, 712. The second conductive layer 716 can be formed of tantalum, tungsten, chromium, aluminum, indium tin oxide (ITO), or a combination thereof, and can be formed simultaneously with the source/drain electrodes 756 of the TFT.

A third conductive layer 718 is disposed on the second conductive layer 716, wherein the third conductive layer 718 also does not cover the trench 708 separating the outer conductive portion 706 and the inner conductive portion 704 of the first conductive layer, however the third conductive layer 718 The connection portions 710, 712 of the first conductive layer are covered. The third conductive layer 718 can be formed simultaneously with the pixel electrode 758 of the liquid crystal display panel, so the third conductive layer 718 is preferably formed of a transparent conductive material such as ITO. A passivation layer 720 is disposed on the sidewalls of the first conductive layer 702 and the second conductive layer 714 , and the passivation layer 720 may be formed simultaneously with the gate passivation layer 760 of the TFT.

In this embodiment, the above-mentioned wires may be wires used for the liquid crystal display to be bonded to the circuit board. Therefore, if two adjacent wires are short-circuited due to the falling of particles, or in the bonding process, misalignment occurs between the wires on the display panel and the bonding wires on the circuit board, resulting in misalignment between the wires and the adjacent wires. The bonding wire is conducted through the conductive particles of the anisotropic conductive adhesive, and if a short circuit occurs, the connecting part of the wire can be cut off by laser to solve the short circuit problem.

Although the present invention has been disclosed in conjunction with the above preferred embodiments, it is not intended to limit the present invention. For example, the present invention is not limited to the wires on the liquid crystal display. The present invention can also be applied to the wires of integrated circuits, or flexible circuits. As for the lead wire of the board, any person familiar with this technology can make some changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention should be defined by the claims as the criterion.

Claims (20)

1. A repairable wire structure comprising: at least two external conductive parts; an inner conductive portion disposed between the outer conductive portions, each of which has a trench between the outer conductive portion and the inner conductive portion; and At least one conductive connecting portion corresponds to each groove and is used for connecting the corresponding outer conductive portion adjacent to the groove with the inner conductive portion. 2. The repairable lead structure as claimed in claim 1, wherein the connection portion is thinner than the outer conductive portion and the inner conductive portion. 3. The repairable wire structure as claimed in claim 1, wherein the repairable wire structure is disposed on a liquid crystal display panel. 4. The repairable lead structure as claimed in claim 1, wherein each of the outer conductive parts, the inner conductive part and the connecting part is composed of conductive material. 5. The repairable wire structure of claim 4, wherein the conductive material is selected from the group consisting of the following elements or compounds: tantalum, tungsten, chromium, aluminum, indium tin oxide (ITO), and combinations thereof. 6. The repairable lead structure as claimed in claim 1, wherein the width of the inner conductive portion is wider than the width of each outer conductive portion. 7. The repairable lead structure as claimed in claim 1, wherein the connecting portion is disposed at an end of the repairable lead. 8. The repairable lead structure as claimed in claim 1, wherein the connecting portion is disposed at a middle portion of the repairable lead. 9. A repairable wire structure comprising: A first conductive layer, including at least two outer conductive parts and an inner conductive part disposed between the outer conductive parts, wherein a groove is provided between each outer conductive part and the inner conductive part, the first A conductive layer further includes at least one connecting portion, corresponding to each groove, for connecting the adjacent outer conductive portion and the inner conductive portion; a dielectric layer disposed on the first conductive layer, wherein the dielectric layer does not cover the trenches and the connection portions; a second conductive layer disposed on the dielectric layer, wherein the second conductive layer does not cover the trenches and the connection portions; and A third conductive layer is disposed on the second conductive layer, wherein the third conductive layer does not cover the grooves. 10. The repairable wire structure as claimed in claim 9, wherein the repairable wire structure is disposed on a liquid crystal display panel. 11. The repairable wire structure as claimed in claim 9, wherein the third conductive layer is formed of a transparent conductive material. 12. The repairable lead structure as claimed in claim 9, wherein the width of each inner conductive portion is wider than the width of the outer conductive portion. 13. The repairable wiring structure of claim 9, wherein the dielectric layer is silicon nitride. 14. The repairable wire structure of claim 9, wherein the first conductive layer and the second conductive layer are formed of conductive materials. 15. The repairable wire structure of claim 14, wherein the conductive material is selected from the group consisting of the following elements or compounds: tantalum, tungsten, chromium, aluminum, indium tin oxide (ITO), and combinations thereof. 16. The repairable wire structure as claimed in claim 10, wherein the first conductive layer and a gate electrode layer of a thin film transistor of the liquid crystal display panel are formed simultaneously. 17. The repairable wire structure of claim 10, wherein the dielectric layer and a gate dielectric layer of the thin film transistor are formed simultaneously. 18. The repairable wire structure as claimed in claim 10, wherein the second conductive layer and the source/drain electrodes of the TFT are formed simultaneously. 19. The repairable wire structure as claimed in claim 10, wherein the third conductive layer and the pixel electrodes of the liquid crystal display panel are formed simultaneously. 20. The repairable wire structure as claimed in claim 11, wherein the transparent conductive material is ITO.

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