CN100345350C - Three-D low-sensitive bus-bar line and manufacturing method thereof - Google Patents
Three-D low-sensitive bus-bar line and manufacturing method thereof Download PDFInfo
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- CN100345350C CN100345350C CNB2004100470215A CN200410047021A CN100345350C CN 100345350 C CN100345350 C CN 100345350C CN B2004100470215 A CNB2004100470215 A CN B2004100470215A CN 200410047021 A CN200410047021 A CN 200410047021A CN 100345350 C CN100345350 C CN 100345350C
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- Prior art keywords
- busbar
- sensitivity
- insulating layer
- dimensional low
- insulating
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 12
- 229920001721 polyimide Polymers 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract 5
- 238000004140 cleaning Methods 0.000 claims abstract 2
- 238000009413 insulation Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 6
- 239000003522 acrylic cement Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 239000004568 cement Substances 0.000 description 4
- 238000010079 rubber tapping Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Abstract
本发明公开了一种三维低感母排及其制造方法，所述三维低感母排选用单面带丙烯酸胶的聚酰亚胺膜作绝缘层，丙烯酸胶作为胶粘剂；在母排的至少一个开孔处，加装绝缘垫；在母排的其余开孔处铆装铜套，或在母排上开沉孔。其制造工艺包括以下步骤：(1)铜板冲孔；(2)折弯；(3)去毛刺；(4)表面处理；(5)清洗；(6)层压。本发明最突出的优点是将空间位置利用最大化，对空间受限的电控产品提供结构紧凑的设计依据，且绝缘层很薄，电感很低，阻抗小，从而功率损失小，效率提高。使用本发明之方法制造三维低感母排，只需准备简单的压装模具，生产周期短，可大大节约生产成本。
The invention discloses a three-dimensional low-sensitivity busbar and a manufacturing method thereof. The three-dimensional low-sensitivity busbar uses a polyimide film with acrylic glue on one side as an insulating layer, and the acrylic glue is used as an adhesive; at least one of the busbars Install insulating pads at the openings; rivet copper sleeves at the remaining openings of the busbar, or open counterbore holes on the busbar. The manufacturing process includes the following steps: (1) copper plate punching; (2) bending; (3) deburring; (4) surface treatment; (5) cleaning; (6) laminating. The most prominent advantage of the present invention is to maximize the utilization of space and provide a compact design basis for electronic control products with limited space, and the insulating layer is very thin, the inductance is very low, and the impedance is small, so that the power loss is small and the efficiency is improved. Using the method of the present invention to manufacture three-dimensional low-sensitivity busbars only needs to prepare a simple press-fitting mold, the production cycle is short, and the production cost can be greatly saved.
Description
Technical field
The present invention relates to a kind of three-dimensional low-inductance bus and manufacture method thereof, especially relate to a kind of 3-D abnormal low-inductance bus and manufacture method thereof.
Background technology
Mostly the low-inductance bus of Sheng Chaning was the plane in the past, can't make full use of limited space, and this has seriously restricted the range of application of low-inductance bus; Make the low-inductance bus of 3D shape if desired, must open particular manufacturing craft, the production cycle is long, and the production cost height is so very uneconomical, is difficult to commercialization.
Summary of the invention
The objective of the invention is to overcome the above-mentioned defective of prior art, provide a kind of with short production cycle, three-dimensional low-inductance bus and manufacture method thereof that production cost is low.
The objective of the invention is to be achieved through the following technical solutions: this three-dimensional low-inductance bus comprises conductive layer, insulating barrier, it is characterized in that, polyimide film with the one-side band acrylate glue is made insulating barrier, gluing between insulating barrier and conductive layer with the acrylate glue adhesive, connect with the sheet insulating cement between insulating barrier and insulating barrier; At least one tapping at busbar installs insulation cushion additional, with the planarization that guarantees to press-fit; All the other tappings at busbar are equipped with copper sheathing, so that the plus or minus end of busbar stretches out, and external part are played the role of positioning.If produce in enormous quantities, then should on busbar, open counterbore, the counterbore degree of depth is determined as required, like this, can save processes such as making copper sheathing and riveting dress copper sheathing.
Its manufacturing process may further comprise the steps: (1) copper coin punching; (2) bending curves designed shape with the punching copper coin; (3) deburring; (4) surface treatment zinc-plated or other can conduct electricity and be difficult for the metal of oxidation; (5) clean; (6) lamination will make and rivet over copper sheathing copper bar or have copper bar, the polyimide film (insulating barrier) of one-side band acrylate glue, sheet insulating cement, the insulation cushion of counterbore to be superimposed together on request, press-fit with press mounting die; Because busbar is a nonplanar structure, promptly has several (at least two) gluing planes, horizontal plane and vertical plane should be taked independent respectively pressurization; In the lamination process,, the bonding plane positioning pressurization of requirements such as concentricity will be arranged earlier, will remain the plane pressurization again for the concentricity that guarantees multilayer dielectric layer and copper bar meets the requirements; Behind each lamination, should put baking-curing in the stove, generally can select to heat to 150 ℃-200 ℃ bakings 40-80 minute, wherein preferred baking temperature is 170 ℃-180 ℃, and preferred stoving time is 50-70 minute; When baking temperature was higher, stoving time should be shorter.
Above-mentioned (1)-(5) step all has known technology can support utilization.
The present invention's three-dimensional low-inductance bus can be made corresponding shape according to the design needs.Its most outstanding advantage is that the locus is utilized maximization, the design considerations that provides structure tightly to play to the automatically controlled product of limited space, and insulating barrier is very thin, and inductance is very low, and impedance is little, thus power loss is little, and efficient improves.Use the present invention's method to make three-dimensional low-inductance bus, only need to prepare simple press mounting die, with short production cycle, can save production cost greatly.
Description of drawings
Fig. 1 is the perspective view of the present invention's three-dimensional low-inductance bus one embodiment;
Fig. 2 is the enlarged drawing of I part embodiment illustrated in fig. 1;
Fig. 3 is a front view embodiment illustrated in fig. 1;
Fig. 4 is a left view embodiment illustrated in fig. 1.
Among the figure: the last insulating barrier of 1-, 2-bears busbar, insulating barrier among the 3-, 4-copper sheathing, insulating barrier under the 5-, the positive busbar of 6-, 7-insulation cushion, 8-sheet insulating cement.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
With reference to accompanying drawing, present embodiment is three folding low-inductance bus.Between polyimide (PI) film insulating barrier 1 and middle polyimide film insulating barrier 3, be negative busbar 2 (being copper coin conductive layer 2), between middle polyimide film insulating barrier 3 and following polyimide film insulating barrier 5, be positive busbar 6 (being copper coin conductive layer 6); The part tapping of busbar adds insulation cushion 7; Copper sheathing 4 is equipped with in all the other tapping rivetings at busbar.
Its manufacturing process flow may further comprise the steps: (1) copper coin punching; (2) bending curves as shown in the figure shape with the punching copper coin; (3) deburring; (4) zinc-plated; (5) clean; (6) lamination will make and rivet over copper bar, the polyimide film (insulating barrier) of one-side band acrylate glue, insulating cement (sheet), the insulation cushion of copper sheathing is superimposed together on request, press-fit upper and lower two planes with press mounting die, put into oven then and heat, toasted about 1 hour to 175 ℃.Repeat aforesaid operations and press-fit vertical plane again.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100470215A CN100345350C (en) | 2004-12-08 | 2004-12-08 | Three-D low-sensitive bus-bar line and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100470215A CN100345350C (en) | 2004-12-08 | 2004-12-08 | Three-D low-sensitive bus-bar line and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1625007A CN1625007A (en) | 2005-06-08 |
| CN100345350C true CN100345350C (en) | 2007-10-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100470215A Expired - Fee Related CN100345350C (en) | 2004-12-08 | 2004-12-08 | Three-D low-sensitive bus-bar line and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100345350C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101222173B (en) * | 2008-01-02 | 2010-06-02 | 株洲南车时代电气股份有限公司 | High pressure IGBT current transformer module |
| CN102361296A (en) * | 2011-07-24 | 2012-02-22 | 江苏江城电气有限公司 | Bus duct in high-temperature environment |
| CN107498271A (en) * | 2017-10-17 | 2017-12-22 | 龙逸电科（天津）技术有限公司 | A kind of low voltage distribution cabinet bus-bar manufacturing process |
| CN107900610B (en) * | 2017-11-01 | 2019-10-01 | 广东南华西电气有限公司 | Comb shape arranges production technology |
| CN109192397B (en) * | 2018-10-08 | 2020-05-22 | 阳光电源股份有限公司 | Method for processing bent and pressed bus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071003A1 (en) * | 1981-07-30 | 1983-02-09 | PREH, Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. | Method of manufacturing printed circuits |
| CN2454983Y (en) * | 2000-10-26 | 2001-10-17 | 铁道部株洲电力机车研究所 | Low-inductive bus bar for inverter |
| CN1351396A (en) * | 2000-10-26 | 2002-05-29 | 铁道部株洲市电力机车研究所 | Design and manufacture of low-inductance bus |
-
2004
- 2004-12-08 CN CNB2004100470215A patent/CN100345350C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071003A1 (en) * | 1981-07-30 | 1983-02-09 | PREH, Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. | Method of manufacturing printed circuits |
| CN2454983Y (en) * | 2000-10-26 | 2001-10-17 | 铁道部株洲电力机车研究所 | Low-inductive bus bar for inverter |
| CN1351396A (en) * | 2000-10-26 | 2002-05-29 | 铁道部株洲市电力机车研究所 | Design and manufacture of low-inductance bus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1625007A (en) | 2005-06-08 |
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Owner name: SOUTH ZHUZHOU ELECTRIC LOCOMOTIVE INSTITUTE CO., L Free format text: FORMER NAME OR ADDRESS: ZHUZHOU ELECTRIC LOCOMOTIVE INST., CHINA NANCHE GROUP |
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Address after: The era of Zhuzhou city of Hunan Province Lu Shifeng District Patentee after: CSR ZHUZHOU ELECTRIC LOCOMOTIVE RESEARCH INSTITUTE Co.,Ltd. Address before: The era of Zhuzhou city of Hunan Province Lu Shifeng District Patentee before: CSR Zhuzhou Electric Locomotive Research Institute |
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Granted publication date: 20071024 |