CN100340962C - Touch Sensing Package Construction - Google Patents
Touch Sensing Package Construction Download PDFInfo
- Publication number
- CN100340962C CN100340962C CNB2004100487536A CN200410048753A CN100340962C CN 100340962 C CN100340962 C CN 100340962C CN B2004100487536 A CNB2004100487536 A CN B2004100487536A CN 200410048753 A CN200410048753 A CN 200410048753A CN 100340962 C CN100340962 C CN 100340962C
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- touch sensing
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- touch
- packaging structure
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Abstract
The invention relates to a touch sensing packaging structure which mainly comprises a substrate, a film, a sealing element and a plurality of touch sensors arranged on the substrate, wherein the substrate, the film and the sealing element define a closed space, and the touch sensors are arranged in the closed space. The touch sensing package structure comprises at least one grounding conductive circuit formed on the substrate and a static removing layer formed on the upper surface of the film and electrically connected to the grounding conductive circuit on the substrate. The destaticizing layer has an upper surface as a touch surface of the workpiece to be detected. The invention has a static electricity removing layer on the surface of the film as a touch surface, and the static electricity removing layer is electrically connected to the grounding conductive circuit on the substrate, so static electricity generated by touch or friction can be smoothly conducted through the static electricity removing layer, the inductor or the internal circuit of the touch sensing packaging structure can not be discharged, and irreversible damage can be avoided.
Description
Technical field
The present invention relates to a kind of touch sensing packaging structure, particularly relating to a kind of static that the surface generated of insulation material that makes can be removed smoothly, and can overcome or improve the touch sensing packaging structure of electrostatic discharge problem.
Background technology
The touch sensing packaging structure is widely used on many electronic installations, for example computer screen, slide-mouse and fingerprint identifier.Based on the requirement of this field to sensitivity and microminiaturization, the touching packaging structure has accurate and small inductor and circuit usually.The easy more influence because of external environment when electronic installation is accurate more, small (for example polluting) is impaired.For this reason, general touching packaging structure all has one deck insulation and rubber-like film, and the touch-surface when operating as the user makes the circuit of packaging structure inside and inductor be unlikely to directly to be exposed in the external environment.Yet, the film surface of this insulation material is touching or rubbing and generation static (static electricity) with other object because of the user often, the lip-deep static of this touch sensing packaging structure this moment may discharge to the circuit or the inductor of inside, and causes this inner circuit or the irreversible damage of inductor.In the device of electronics, more little and when accurate more, its susceptibility to static discharge also can increase when electronic installation, so static discharge becomes field for this reason to desire most ardently the problem of solution.
This shows that above-mentioned existing touch sensing packaging structure obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that the touch sensing packaging structure exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing touch sensing packaging structure exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel touch sensing packaging structure, can improve general existing touch sensing packaging structure, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing touch sensing packaging structure exists, and provide a kind of new touch sensing packaging structure, technical matters to be solved is that the static that the surface generated of its insulation material can be removed smoothly, and can overcome or improve the problem of static discharge, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of touch sensing packaging structure that the present invention proposes, it comprises: a substrate; One film is arranged at this substrate top; One seal is in order to be fixed in this substrate with this film, and wherein this substrate, this film and sealing part define a confined space; A plurality of touch sensors are arranged at the zone that is arranged in this confined space on this substrate; At least one ground connection conducting wire is formed on this substrate; And one go electrostatic layer (electrostatic charge dissipation layer) to be formed at the upper surface of this film and be electrically connected at this ground connection conducting wire on this substrate, and wherein this upper surface that removes electrostatic layer is the touch-surface as the work package of desire detecting.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid touch sensing packaging structure, the wherein said electrostatic layer that goes is to be formed by indium tin oxide (ITO).
Aforesaid touch sensing packaging structure, the wherein said gross thickness of electrostatic layer and this film of going is no more than 12 μ m.
Aforesaid touch sensing packaging structure, wherein said substrate have a support member (supportingelement) be erected in this touch sensor around, and this film is the support member top that is sealed in this substrate.
Aforesaid touch sensing packaging structure, the wherein said electrostatic layer that goes is the roughly whole surface that covers the upper surface of this film.
Aforesaid touch sensing packaging structure, wherein said to go to electrostatic layer and this ground connection conducting wire be to be electrically connected to each other by a conducting resinl.
Aforesaid touch sensing packaging structure, it comprises a conductive materials in addition and goes to electrostatic layer and this ground connection conducting wire in order to electrically connect this, and wherein, this ground connection conducting wire is arranged on outside this confined space, and this conductive materials is to extend outside this confined space.
Aforesaid touch sensing packaging structure, it comprises a conductive materials in addition and goes to electrostatic layer and this ground connection conducting wire in order to electrically connect this, and wherein, this ground connection conducting wire is arranged within this confined space, and this conductive materials is to extend within this confined space.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, according to touch sensing packaging structure of the present invention, mainly comprising a substrate, a film, a seal and a plurality of touch sensor is arranged on this substrate, wherein this substrate, this film and sealing part define a confined space, and these a plurality of touch sensors are arranged on the zone that is arranged in this confined space on this substrate.This film has the touch-surface of a upper surface as the work package of desire detecting.Touch sensing packaging structure of the present invention comprises at least one ground connection conducting wire and is formed on this substrate, and one remove the upper surface of electrostatic layer in this film by what conductive materials (for example indium tin oxide) formed, this upper surface that removes electrostatic layer is the touch-surface as the work package of desire detecting, wherein this to remove electrostatic layer be the ground connection conducting wire that is electrically connected on this substrate.Therefore, because of touching or the static that generates that rubs can go electrostatic layer to be directed at this ground connection conducting wire smoothly by this, and be unlikely to the inductor of this touch sensing packaging structure or internal circuit discharge on this touch sensing packaging structure surface to avoid irreversible damage.
In addition, can both be led in order to ensure the static that each part produced of this touch-surface, this goes electrostatic layer to be preferably the whole surface of cover film upper surface.In order to make this touch sensing packaging structure have enough sensitivity, this film and this go the gross thickness of electrostatic layer to be preferably less than 12 μ m.
In sum, the touch sensing packaging structure that the present invention is special can be removed the static that the surface generated of its insulation material smoothly, and can overcome or improve the problem of static discharge.It has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it structurally or bigger improvement all arranged on the function, have large improvement technically, and produced handy and practical effect, and more existing touch sensing packaging structure has the multinomial effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by going out a plurality of preferred embodiments, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the cut-open view of touch sensing packaging structure according to an embodiment of the invention.
Fig. 2 is the top view of touch sensing packaging structure according to another embodiment of the present invention.
Fig. 3 is along the cut-open view of section 3-3 among Fig. 2.
100: touch sensing packaging structure 102: substrate
104: touch sensor 106: film
106a: upper surface 108: seal
110: support member 112: the ground connection conducting wire
114: remove electrostatic layer 116: conductive materials
200: touch sensing packaging structure 202: the finger district
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of touch sensing packaging structure, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Seeing also shown in Figure 1ly, is the cut-open view of touch sensing packaging structure according to an embodiment of the invention.The touch sensing packaging structure 100 of one embodiment of the invention, it mainly comprises a substrate 102, a plurality of touch sensor 104 is arranged on this substrate 102 and a film 106 is fixed in this substrate 102 tops by a seal 108.Should be noted in the discussion above that this touch sensor 104 is arranged in the seal cavity that is defined by this substrate 102, this film 106 and sealing part 108 in order to protect this touch sensor 104 not to be subjected to the pollution of environment.
This substrate 102 preferably is the tabular structure of a hard material, for example a ceramic substrate or a glass substrate.In the present embodiment, this touch sensing packaging structure 100 comprises a support member 110 and is erected on this substrate 102 and around around this touch sensor 104, and this film 106 is to be sealed in this support member 110 tops.Except being provided with a plurality of touch sensors 104, also be provided with many wire lines (not being shown among the figure) and at least one ground connection conducting wire 112 on this substrate 102.
The main effect of this film 106 has two; the first is protected the inductor 104 and the circuit of these packaging structure 100 inside; another provides the interface of a passivity, with the touching of work package to be measured input referral to this inductor 104 and this film 106 itself can not impact inductor 104 (for example make inductor 104 each other bridge joint and cause short circuit).Therefore this film preferably is insulation and resilient member, for example can be available from the Mylar of E.I.Du Pont Company
The polyester film series of products.
The upper surface 106a of this film is provided with one and removes electrostatic layer 114, and this to remove the upper surface of electrostatic layer 114 are touch-surfaces as the work package (for example user's finger) of desire detecting.This removes electrostatic layer 114 is to be formed by conductive material (for example indium tin oxide ITO), and is electrically connected to the ground connection conducting wire 112 on this substrate 102 by a conductive materials 116 (a for example conducting resinl).When the nonconducting work package touching or the surface in contact of friction packaging structure 100, may produce the just so-called triboelectricity of static (triboelectricity).In an embodiment of the present invention, the static that surface in contact produced of this friction packaging structure 100 can go electrostatic layer 114 to be directed at this ground connection conducting wire 112 via this, can avoid inductor 104 and the circuit discharging of static to its inside by this.Preferably this resistance value of removing electrostatic layer 114 is to be no more than 60 ohm-Mi, so that favorable conductive character to be provided, can apace the static that is formed at this film upper surface 106a be directed at this ground connection conducting wire 112.For guaranteeing on this touch sensing packaging structure 100 can both to be led in order to the static that each part produced of the touch-surface that contacts with work package, this goes electrostatic layer 114 to be preferably the whole surface of cover film upper surface 106a.In addition, because this film 106 goes the gross thickness of electrostatic layer 114 and the sensitivity of this touch sensing packaging structure 100 to be inversely proportional to this.In order to make this touch sensing packaging structure 100 that enough good sensitivity be arranged, this film 106 goes the gross thickness of electrostatic layer 114 should not surpass 12 μ m with this.
See also shown in Figure 1, in this embodiment, this ground connection conducting wire 112 is to be arranged in the confined space that is defined by this substrate 102, this film 106, this support member 110 and sealing part 108, and is therefore extensible in this confined space in order to electrically connect this conductive materials that goes to electrostatic layer 114 and this ground connection conducting wire 112 116.
Seeing also Fig. 2, shown in Figure 3, is the synoptic diagram of touch sensing packaging structure according to another embodiment of the present invention.The touch sensing packaging structure 200 according to another embodiment of the present invention, and as shown in the figure, this ground connection conducting wire 112 also can be arranged on outside this confined space, for example on this substrate 102 in order in the finger (finger) of the external connection district.Therefore, in this embodiment, this conductive materials 116 is extensible outside this confined space, and is connected to this ground connection conducting wire 112.
Touch sensing packaging structure provided by the present invention, its film surface has electrostatic layer as touch-surface, and this to remove electrostatic layer be the ground connection conducting wire that is electrically connected on the substrate.Therefore on this touch sensing packaging structure because of touching or the static that generates of rubbing can go electrostatic layer to lead by this to be unlikely to the inductor or the internal circuit of this touch sensing packaging structure are discharged to avoid irreversible damage smoothly.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100487536A CN100340962C (en) | 2004-06-15 | 2004-06-15 | Touch Sensing Package Construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100487536A CN100340962C (en) | 2004-06-15 | 2004-06-15 | Touch Sensing Package Construction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1713213A CN1713213A (en) | 2005-12-28 |
| CN100340962C true CN100340962C (en) | 2007-10-03 |
Family
ID=35718813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100487536A Expired - Lifetime CN100340962C (en) | 2004-06-15 | 2004-06-15 | Touch Sensing Package Construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100340962C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106062951B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Bio-sensing module, bio-sensing chip and electronic equipment |
| WO2017206034A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing chip and electronic device |
| CN106972007A (en) * | 2016-12-23 | 2017-07-21 | 创智能科技股份有限公司 | Fingerprint sensing and identifying device with antistatic structure |
| CN106803079B (en) * | 2017-01-20 | 2020-08-21 | Oppo广东移动通信有限公司 | Fingerprint module and mobile terminal |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1181618A (en) * | 1996-10-29 | 1998-05-13 | Lg半导体株式会社 | External terminal fabrication method for ball grid array package |
| CN1237791A (en) * | 1998-06-02 | 1999-12-08 | 三菱电机株式会社 | Semiconductor device |
| EP1030333A1 (en) * | 1997-10-09 | 2000-08-23 | Nissha Printing Co., Ltd. | High strength touch panel and method of manufacturing the same |
| CN1385054A (en) * | 1999-10-28 | 2002-12-11 | 艾利森公司 | Electric module structure formed with polymer shrunk material |
| CN1419215A (en) * | 2001-11-14 | 2003-05-21 | Lg.飞利浦Lcd有限公司 | Contact panel |
-
2004
- 2004-06-15 CN CNB2004100487536A patent/CN100340962C/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1181618A (en) * | 1996-10-29 | 1998-05-13 | Lg半导体株式会社 | External terminal fabrication method for ball grid array package |
| EP1030333A1 (en) * | 1997-10-09 | 2000-08-23 | Nissha Printing Co., Ltd. | High strength touch panel and method of manufacturing the same |
| US6380497B1 (en) * | 1997-10-09 | 2002-04-30 | Nissha Printing Co., Ltd. | High strength touch panel and method of manufacturing the same |
| CN1237791A (en) * | 1998-06-02 | 1999-12-08 | 三菱电机株式会社 | Semiconductor device |
| CN1385054A (en) * | 1999-10-28 | 2002-12-11 | 艾利森公司 | Electric module structure formed with polymer shrunk material |
| CN1419215A (en) * | 2001-11-14 | 2003-05-21 | Lg.飞利浦Lcd有限公司 | Contact panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1713213A (en) | 2005-12-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20071003 |