CN100338624C

CN100338624C - Memory Card Substrate Using Spatial Misalignment to Solve Line Interference

Info

Publication number: CN100338624C
Application number: CNB031197698A
Authority: CN
Inventors: 陈健弘
Original assignee: Atech Totalsolution Co ltd; A Data Technology Co Ltd
Current assignee: Atech Totalsolution Co ltd; A Data Technology Co Ltd
Priority date: 2003-03-11
Filing date: 2003-03-11
Publication date: 2007-09-19
Anticipated expiration: 2023-03-11
Also published as: CN1530879A

Abstract

A memory card substrate for solving circuit interference by using spatial dislocation, wherein a first bonding pad set and a second bonding pad set are respectively formed on the upper/lower surfaces of one end of the memory card substrate so as to form a gold finger for external electrical connection; each welding pad in the first/second welding pad group is arranged at equal distance and forms equal interval, and the welding pads/interval are staggered between the first/second welding pad group and the first/second welding pad group in a staggered way; therefore, when the thickness of the memory card substrate is reduced, the coupling interference caused by the capacitance formed between the opposite welding pads of the golden finger can be avoided, and the simplification of the circuit layout is facilitated.

Description

Utilize spatial offset to solve the memory card substrate that circuit disturbs

Technical field

The present invention relates to a kind of spatial offset that utilizes and solve the memory card substrate that circuit disturbs, refer to that especially a kind of golden finger weld pad space kenel that changes on the memory card is to get rid of the memory card substrate of circuit coupled interference.

Background technology

In recent years, memory card exploitation is like the mushrooms after rain come out, however, unified interface specification but always never appears in memory card, each big label falls over each other to release the memory card from ordering interface specification, causes the crowding-out in market, but because market is huge, business opportunity is tempting, get involved market so be difficult to stop new memory card, its success or failure are looked closely the product quality and are competed for the result with market.In fact, the reason that causes memory card market to still have the new entrant to get involved the space is: compact is the constant development trend of most electronic products.For the memory card industry, aforesaid miniaturization and capacity extensions then are the main target of exploitation, also become one of best sharp weapon of getting involved market.

With regard to memory card, mainly be configured to housing parts and inner circuit board module (as shown in Figure 6) thereof, the circuit board module then comprise substrate and on processor, memory body etc., when being demand with the reduced volume, the density of circuit on the substrate, and even thickness all is the object of self-criticism, owing to the appearance of laminating technique, becomes the sharp weapon of substrate reduced volume and thickness.Yet, dwindling of substrate thickness is not to have no restriction, as shown in the figure, the table bottom surface of these substrate 70 front ends is formed with the golden finger 71 of symmetry, be provided as the usefulness of external electric connection, and golden finger 71 is made up of the equidistant Copper Foil weld pad of arranging 710 of majority, just existing structure, the weld pad 710 of the set golden finger 71 in substrate 70 front-end table/bottom surface aligns (as shown in Figure 7) up and down, when substrate 70 is thicker, any electrical specification of the still unlikely generation of weld pad 710 of its table bottom surface, yet when substrate 70 attenuation, 710 of the opposite soldering pads of substrate 70 table bottom surfaces promptly may form an equivalent electric capacity, thereby the problem of the coupled interference of deriving.

From the above, the substrate volume-diminished of memory card is except that considering that electrical specification that it is derived or interference problem also have to face the dimensional problem.And substrate 70 thickness of aforementioned memory card dwindle, promptly face between the golden finger weld pad to form equivalent capacity, and produce interference problem, thus need to be further reviewed, and seek feasible solution.

Summary of the invention

The technical problem to be solved in the present invention provides a kind of spatial offset that utilizes and solves the memory card substrate that circuit disturbs, change memory card on substrate golden finger weld pad space kenel to get rid of the circuit coupled interference.

For this reason, the present invention solves the memory card substrate that circuit disturbs for a kind of spatial offset that utilizes, wherein: a substrate at least at one end on/lower surface forms one first weld pad group and one second weld pad group respectively, to constitute the golden finger that external electric connects usefulness, impartial gap is equidistantly arranged and formed to each weld pad in this first/the second weld pad group, wherein each weld pad in each weld pad and the second weld pad group is dislocation arrangement in the first weld pad group, the meaning promptly, each weld pad of the first weld pad group with than large tracts of land corresponding to the gap between each weld pad on the second weld pad group; Further, each weld pad of this first weld pad group forms the dislocation relation corresponding to the gap of second each adjacent welding-pad of weld pad group.

The described spatial offset that utilizes solves the memory card substrate that circuit disturbs, and wherein: the weld pad that this first/the second weld pad group is equidistantly arranged by plural number is respectively formed, and each adjacent welding-pad also forms impartial gap respectively; Wherein, each weld pad of the first weld pad group is corresponding to the gap of the second weld pad group adjacent welding-pad, and overlapping with the two adjacent weld pad parts in this gap.

The described spatial offset that utilizes solves the memory card substrate that circuit disturbs, and wherein: the area perseverance in the corresponding second weld pad group adjacent welding-pad gap of each weld pad of this first weld pad group is greater than weld pad and the overlapping area of gap adjacent welding-pad.

The described spatial offset that utilizes solves the memory card substrate that circuit disturbs, and wherein: the thickness of this substrate is less than 1.0mm.

Advantage of the present invention and characteristics are:

1. effectively get rid of the coupled interference source: the present invention mainly constitutes spatial offset relation and is able to the area that minimizing weld pad in amplitude peak ground overlaps between the levels weld pad group that constitutes golden finger, effectively avoid forming when substrate thickness is thin the coupled interference problem that equivalent capacity is derived.

2. can further dwindle the thickness of memory card substrate, be beneficial to the miniaturization of memory card: solve already because the problem of equivalent capacity is easily given birth in the substrate thickness attenuation,, be beneficial to the miniaturization of memory card so can remove the restriction that substrate dwindles gauge.

3. the configuration of substrate is easier to implement: when the levels weld pad group of golden finger on the substrate complete when overlapping, the overlapping possibility of circuit that is adjacent to weld pad group place on the substrate is promptly relatively higher, for avoiding circuit to overlap to form interference source, its configuration must be through accurate design, to reduce overlapping area; Only through using spatial offset technology of the present invention, the levels weld pad group of golden finger staggers already, and the overlapping possibility of contiguous golden finger place's circuit can reduce then relatively, and the configuration of substrate is easier to implement.

Description of drawings

Fig. 1 is the positive back appearance figure of the present invention's one specific embodiment;

Fig. 2 is a fragmentary top plan view of the present invention's one specific embodiment;

Fig. 3 is the another fragmentary top plan view of the present invention's one specific embodiment;

Fig. 4 is the present invention's one specific embodiment fragmentary top plan view again;

Fig. 5 is another local front plan view of the present invention's one specific embodiment;

Fig. 6 is the outside drawing of memory card substrate in the prior art;

Fig. 7 is the partial plan layout of memory card in the prior art.

The drawing reference numeral explanation:

10, substrate 11, the first weld pad group 110,120, weld pad

111,121, gap 12 second weld pad groups 70, substrate

71, golden finger 710, weld pad

Embodiment

A relevant specific embodiment of the present invention, see also shown in Figure 1, its left and right sides two parts disclose respectively same memory card substrate 10 on/lower surface, this memory card substrate 10 at least at one end on/lower surface forms one first weld pad group 11 and one second weld pad group 12 respectively, use to constitute the golden finger that external electric connects usefulness.

Please cooperate shown in ginseng Fig. 2,3, the weld pad 110/120 that this first/the second weld pad group 11/12 is equidistantly arranged by plural number is respectively formed, and each adjacent welding-pad 110/120 also forms impartial gap 111/121 respectively; As previously mentioned, when the thickness of memory card substrate 10 less than a certain size, below 1.0mm, and the set weld pad 110/120 relative timing of its upper and lower surface, promptly may constitute equivalent capacity, and become the source of coupled interference.

For solving foregoing problems, the present invention makes the first weld pad group 11 that is positioned at upper surface on the memory card substrate 10, its each weld pad 110 and each weld pad 120 that is positioned at the lower surface second weld pad group 12 form the relative pass of spatial offsets, more particularly, each weld pad 110 that the present invention makes the first weld pad group 11 produces the dislocation relation with respect to the gap 121 of 120 of adjacent welding-pads on the second weld pad group 12, as shown in Figure 4.

For specifying aforementioned corresponding relation, sincerely further be illustrated with the physical size size, see also shown in Figure 5.

Suppose on the aforesaid base plate 10/each weld pad 110,120 width of set the first/the second weld pad group 11/12 of lower surface are 0.4mm, the gap 111,121 that adjacent welding-pad is 110/120 is 0.2mm;

And the first weld pad group 11 that is positioned at substrate 10 upper surfaces is fitted the 0.3mm that stagger with the second weld pad group 12 that is positioned at lower surface, under this situation, the first weld pad group, 11 each weld pad 110 are with the gap 121 of maximum area corresponding to 120 of the second weld pad group, 12 adjacent welding-pads, these weld pad 110 two ends promptly only have the two adjacent weld pads 120 in 0.1mm and corresponding gap 121 overlapping, because the first/the second weld pad group, 11/12 each weld pad 110/120 overlapping area significantly dwindles, so can effectively get rid of the formation of equivalent capacity.

In the previous embodiment, though first/the second weld pad group 11/12 staggers mutually, only each weld pad 110/120 still has local overlapping situation, it mainly considers to keep the weld pad of golden finger more than certain density, when the considering of the first/the second weld pad group, 11/12 no weld pad 110/120 density, gap 111/121 width that adjacent welding-pad is 110/120 can equal weld pad 110/120 width, thereby the first weld pad group, 11 each weld pads 110 can be fully corresponding to the gap 121 of 120 of the second weld pad group, 12 adjacent welding-pads, meaning is that weld pad 110/120 will stagger fully, and gets rid of memory card produces the coupled interference source at the golden finger place possibility fully.

The mat aforementioned manner can see through the spatial offset of levels weld pad, reduces the area of its overlapping with amplitude peak ground, and effectively avoid forming the coupled interference problem that equivalent capacity is derived when substrate thickness is thin; In addition, because the dislocation of levels weld pad design reduces the overlapping possibility of circuit on each lamination of substrate relatively, and make configuration be easier to implement.

In sum, take off described every advantage before the present invention has really possessed, it has practicality on the industry, novelty and creativeness concurrently, and meets the patent of invention important document, and application is mentioned in the whence in accordance with the law.Only the above only is specific embodiments of the invention, when can not with qualification scope of the invention process, i.e. equivalent variations and the modification of doing according to scope of patent protection of the present invention generally all should still belong within the scope that patent of the present invention contains.

Claims

1, a kind of spatial offset that utilizes solves the memory card substrate that circuit disturbs, it is characterized in that: a substrate at least at one end on/lower surface forms one first weld pad group and one second weld pad group respectively, to constitute the golden finger that external electric connects usefulness, each weld pad of this first weld pad group forms the dislocation relation corresponding to the gap of second each adjacent welding-pad of weld pad group; The thickness of this substrate is less than 1.0mm.

2, the spatial offset that utilizes as claimed in claim 1 solves the memory card substrate that circuit disturbs, and it is characterized in that: the weld pad that this first/the second weld pad group is equidistantly arranged by plural number is respectively formed, and each adjacent welding-pad also forms impartial gap respectively; Wherein, each weld pad of the first weld pad group is corresponding to the gap of the second weld pad group adjacent welding-pad, and overlapping with the two adjacent weld pad parts in this gap.

3, the spatial offset that utilizes as claimed in claim 2 solves the memory card substrate that circuit disturbs, and it is characterized in that: the area perseverance in the corresponding second weld pad group adjacent welding-pad gap of each weld pad of this first weld pad group is greater than weld pad and the overlapping area of gap adjacent welding-pad.