CH621811A5 - - Google Patents
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- Publication number
- CH621811A5 CH621811A5 CH774776A CH774776A CH621811A5 CH 621811 A5 CH621811 A5 CH 621811A5 CH 774776 A CH774776 A CH 774776A CH 774776 A CH774776 A CH 774776A CH 621811 A5 CH621811 A5 CH 621811A5
- Authority
- CH
- Switzerland
- Prior art keywords
- epoxy
- mixtures according
- contain
- mixtures
- formula
- Prior art date
Links
- 239000000203 mixture Substances 0.000 claims description 45
- 239000004593 Epoxy Substances 0.000 claims description 34
- 150000001875 compounds Chemical class 0.000 claims description 32
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 19
- 229930185605 Bisphenol Natural products 0.000 claims description 15
- 239000000047 product Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000000243 solution Substances 0.000 claims description 10
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000004848 polyfunctional curative Substances 0.000 claims description 8
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 4
- 150000008064 anhydrides Chemical class 0.000 claims description 4
- 239000012670 alkaline solution Substances 0.000 claims description 3
- 229920006037 cross link polymer Polymers 0.000 claims description 3
- 125000005462 imide group Chemical group 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 235000005985 organic acids Nutrition 0.000 claims description 2
- 239000000376 reactant Substances 0.000 claims description 2
- 230000005684 electric field Effects 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- -1 maleimide compound Chemical class 0.000 claims 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000768 polyamine Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005266 casting Methods 0.000 description 7
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- SOOZEQGBHHIHEF-UHFFFAOYSA-N methyltetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21C SOOZEQGBHHIHEF-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- SCZZNWQQCGSWSZ-UHFFFAOYSA-N 1-prop-2-enoxy-4-[2-(4-prop-2-enoxyphenyl)propan-2-yl]benzene Chemical compound C=1C=C(OCC=C)C=CC=1C(C)(C)C1=CC=C(OCC=C)C=C1 SCZZNWQQCGSWSZ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 101710199392 TATA-box-binding protein 1 Proteins 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- MBUAAMOJATXYKR-UHFFFAOYSA-N 4-bis(4-aminophenoxy)phosphinothioyloxyaniline Chemical compound C1=CC(N)=CC=C1OP(=S)(OC=1C=CC(N)=CC=1)OC1=CC=C(N)C=C1 MBUAAMOJATXYKR-UHFFFAOYSA-N 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000005821 Claisen rearrangement reaction Methods 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229940075614 colloidal silicon dioxide Drugs 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000006704 dehydrohalogenation reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012969 di-tertiary-butyl peroxide Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003337 fertilizer Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000004452 microanalysis Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 238000013031 physical testing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- ZYPZVOKVDNSKLP-UHFFFAOYSA-N tris(4-aminophenyl) phosphate Chemical compound C1=CC(N)=CC=C1OP(=O)(OC=1C=CC(N)=CC=1)OC1=CC=C(N)C=C1 ZYPZVOKVDNSKLP-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH774776A CH621811A5 (fi) | 1976-06-17 | 1976-06-17 | |
| US05/803,497 US4130600A (en) | 1976-06-17 | 1977-06-06 | Epoxide resin mixtures |
| DE2726821A DE2726821C2 (de) | 1976-06-17 | 1977-06-14 | Epoxidharz-Mischungen |
| CA280,579A CA1110395A (en) | 1976-06-17 | 1977-06-15 | Epoxide resin mixtures |
| IT24761/77A IT1080400B (it) | 1976-06-17 | 1977-06-16 | Miscele di resine epossidiche e procedimento per la loro preparazione |
| GB25207/77A GB1546323A (en) | 1976-06-17 | 1977-06-16 | Epoxide resin mixtures |
| FR7718454A FR2355049A1 (fr) | 1976-06-17 | 1977-06-16 | Melanges thermodurcissables de polyimides et d'epoxydes |
| JP7197177A JPS52154897A (en) | 1976-06-17 | 1977-06-17 | Thermosetting mixture composed of polyimide and epoxide compound and process for preparing crossslinked polymer through said mixture*s hardening |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH774776A CH621811A5 (fi) | 1976-06-17 | 1976-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH621811A5 true CH621811A5 (fi) | 1981-02-27 |
Family
ID=4329859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH774776A CH621811A5 (fi) | 1976-06-17 | 1976-06-17 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4130600A (fi) |
| JP (1) | JPS52154897A (fi) |
| CA (1) | CA1110395A (fi) |
| CH (1) | CH621811A5 (fi) |
| DE (1) | DE2726821C2 (fi) |
| FR (1) | FR2355049A1 (fi) |
| GB (1) | GB1546323A (fi) |
| IT (1) | IT1080400B (fi) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5418900A (en) * | 1977-07-13 | 1979-02-13 | Hitachi Ltd | Heat-resistant resin composition |
| JPS5556118A (en) * | 1978-10-20 | 1980-04-24 | Mitsubishi Electric Corp | Curing of epoxy resin |
| EP0013258B1 (de) * | 1978-12-29 | 1982-07-07 | Ciba-Geigy Ag | Propenylsubstituierte Phenolglycidyläther, Verfahren zu ihrer Herstellung und ihre Verwendung |
| JPS57145397A (en) * | 1981-03-04 | 1982-09-08 | Hitachi Ltd | Method of producing multilayer printed circuit board |
| US4510272A (en) * | 1983-03-16 | 1985-04-09 | Avco Corporation | Bis-maleimide-epoxy compositions and prepregs |
| CA1229196A (en) * | 1983-07-18 | 1987-11-10 | General Electric Company | Polyimide molding compositions |
| US4579916A (en) * | 1983-11-15 | 1986-04-01 | Ciba-Geigy Corporation | Curable mixtures containing an epoxide resin, an imide and a curing catalyst |
| US4557860A (en) * | 1984-07-06 | 1985-12-10 | Stauffer Chemical Company | Solventless, polyimide-modified epoxy composition |
| EP0200674B1 (de) * | 1985-02-01 | 1988-05-25 | Ciba-Geigy Ag | (Acylthiopropyl)-Polyphenole |
| EP0225174A3 (en) * | 1985-11-26 | 1989-04-12 | Sumitomo Chemical Company, Limited | Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix |
| JPS62207354A (ja) * | 1986-03-07 | 1987-09-11 | Sumitomo Chem Co Ltd | 熱硬化性樹脂組成物 |
| JPH02621A (ja) * | 1987-11-06 | 1990-01-05 | Shell Internatl Res Maatschappij Bv | ２，２−ビス−〔３−（アリルもしくはプロペニル）−４−ヒドロキシフエニル〕化合物のグリシジルエーテルおよびそれから得られる樹脂 |
| US4923928A (en) * | 1988-02-18 | 1990-05-08 | Basf Aktiengesellschaft | Thermosetting bismaleimide resin composition containing an adduct of a propenylphenol and an epoxy compound |
| US4902778A (en) * | 1988-02-18 | 1990-02-20 | Basf Aktiengesellschaft | Propenylphenoxy-terminated oligomeric tougheners and their use in toughening thermosetting bismaleimide resin compositions |
| US5189128A (en) * | 1988-06-20 | 1993-02-23 | Ciba-Geigy Corporation | Solution stable polyimide resin systems |
| US5183865A (en) * | 1988-12-27 | 1993-02-02 | Ford Motor Company | Thermosettable powder compositions of polymaleimide and allyl-functional prepolymer |
| CA1338543C (en) * | 1988-12-27 | 1996-08-20 | Mohinder S. Chattha | Thermosettable powder compositions of polymaleimide and allyl-functional prepolymer |
| US4988785A (en) * | 1989-06-30 | 1991-01-29 | Allied-Signal | Bismaleimide resin based on indane bisphenol |
| KR950005314B1 (ko) * | 1989-09-11 | 1995-05-23 | 신에쓰 가가꾸 고오교 가부시끼가이샤 | 열경화성 수지 조성물 |
| US5081167A (en) * | 1990-07-16 | 1992-01-14 | Shell Oil Company | Cyanamide-cured maleimide/epoxy resin blend |
| US5300588A (en) * | 1991-04-04 | 1994-04-05 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
| DE4118142C2 (de) * | 1991-06-03 | 1995-03-09 | Vem Elektroantriebe Gmbh | Verfahren zur Aufarbeitung von gebrauchtem Epoxidtränkharz zu einem Elektroisoliertränklack |
| US5637387A (en) * | 1991-06-03 | 1997-06-10 | Ciba-Geigy Corporation | Storage-stable advanced polymaleimide compositions |
| JP2669247B2 (ja) * | 1992-02-13 | 1997-10-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
| US5393887A (en) * | 1993-10-04 | 1995-02-28 | Monsanto Company | Bisimide compositions |
| US5302723A (en) * | 1993-10-04 | 1994-04-12 | Monsanto Company | Process for preparing flame retardant bisimide compositions |
| US20010020071A1 (en) | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| JP3184485B2 (ja) * | 1997-11-06 | 2001-07-09 | 三井金属鉱業株式会社 | 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板 |
| WO2000071614A1 (en) * | 1999-05-21 | 2000-11-30 | Miguel Albert Capote | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| AU5150100A (en) * | 1999-05-21 | 2000-12-12 | Miguel Albert Capote | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| WO2004037878A2 (en) * | 2002-10-22 | 2004-05-06 | Henkel Corporation | Co-curable compositions |
| US7204574B2 (en) * | 2004-06-30 | 2007-04-17 | Lexmark International, Inc. | Polyimide thickfilm flow feature photoresist and method of applying same |
| JP4862543B2 (ja) * | 2006-08-02 | 2012-01-25 | 株式会社明電舎 | 絶縁性高分子材料組成物 |
| JP4862544B2 (ja) * | 2006-08-02 | 2012-01-25 | 株式会社明電舎 | 絶縁性高分子材料組成物 |
| CN105473668B (zh) | 2013-06-26 | 2018-12-11 | 迈图高新材料集团 | 光固化涂料组合物及其应用 |
| CN103524739A (zh) * | 2013-10-09 | 2014-01-22 | 胶州市精细化工有限公司 | 烯丙基/环氧基醚化酚醛改性双马来酰亚胺树脂及其制备方法 |
| CN103555245B (zh) * | 2013-11-18 | 2015-01-14 | 湖南固特邦土木技术发展有限公司 | 一种铰缝修复加固用环氧胶粘剂及其应用 |
| CN105400377B (zh) * | 2015-12-23 | 2017-12-19 | 南通南京大学材料工程技术研究院 | 一种具有自我修复功能的环氧粉末涂料及其制备方法 |
| CN115565717B (zh) * | 2022-09-02 | 2024-09-24 | 深圳先进技术研究院 | 应用于半导体系统级封装用的环氧树脂胶膜材料 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL125349C (fi) * | 1965-02-04 | 1900-01-01 | ||
| JPS4912600B1 (fi) * | 1970-05-13 | 1974-03-26 | ||
| FR2142742B1 (fi) * | 1971-06-24 | 1974-04-26 | Rhone Poulenc Sa | |
| DE2118690A1 (de) * | 1971-04-17 | 1973-02-01 | Reichhold Albert Chemie Ag | Verfahren zur herstellung von polyimiden |
| FR2142741B1 (fi) * | 1971-06-24 | 1973-06-29 | Rhone Poulenc Sa | |
| US4005154A (en) * | 1971-06-24 | 1977-01-25 | Rhone-Poulenc S.A. | Curing 1,2-epoxy with prepolymer based on polyamines and oligomers possessing imide groups |
| BE790595A (fr) * | 1971-11-19 | 1973-02-15 | Gen Electric | Compositions polymeres preparees a partir de melanges d'epoxydes et d'imides |
| FR2204655B1 (fi) * | 1972-10-31 | 1976-01-30 | Rhone Poulenc Ind Fr | |
| US3962182A (en) * | 1972-11-21 | 1976-06-08 | Aerojet-General Corporation | Imide oxirane reactions |
| JPS5216515B2 (fi) * | 1973-11-14 | 1977-05-10 | ||
| US3920768A (en) * | 1974-01-14 | 1975-11-18 | Union Carbide Corp | Arylimide-epoxy resin composites |
| FR2259860B1 (fi) * | 1974-02-04 | 1976-12-03 | Rhone Poulenc Ind | |
| JPS535920B2 (fi) * | 1974-06-03 | 1978-03-02 |
-
1976
- 1976-06-17 CH CH774776A patent/CH621811A5/de not_active IP Right Cessation
-
1977
- 1977-06-06 US US05/803,497 patent/US4130600A/en not_active Expired - Lifetime
- 1977-06-14 DE DE2726821A patent/DE2726821C2/de not_active Expired
- 1977-06-15 CA CA280,579A patent/CA1110395A/en not_active Expired
- 1977-06-16 FR FR7718454A patent/FR2355049A1/fr active Granted
- 1977-06-16 IT IT24761/77A patent/IT1080400B/it active
- 1977-06-16 GB GB25207/77A patent/GB1546323A/en not_active Expired
- 1977-06-17 JP JP7197177A patent/JPS52154897A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB1546323A (en) | 1979-05-23 |
| FR2355049B1 (fi) | 1981-10-09 |
| DE2726821C2 (de) | 1986-11-20 |
| CA1110395A (en) | 1981-10-06 |
| IT1080400B (it) | 1985-05-16 |
| JPS52154897A (en) | 1977-12-22 |
| DE2726821A1 (de) | 1977-12-29 |
| JPS5728417B2 (fi) | 1982-06-16 |
| US4130600A (en) | 1978-12-19 |
| FR2355049A1 (fr) | 1978-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |